CN104810318A - 用于led芯片工艺的夹具 - Google Patents

用于led芯片工艺的夹具 Download PDF

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Publication number
CN104810318A
CN104810318A CN201510146966.0A CN201510146966A CN104810318A CN 104810318 A CN104810318 A CN 104810318A CN 201510146966 A CN201510146966 A CN 201510146966A CN 104810318 A CN104810318 A CN 104810318A
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Prior art keywords
rod
handle
led chip
snap ring
clamp
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CN201510146966.0A
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Inventor
李莎莎
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Shanxi Southern Ye Li Acer Photoelectric Co Ltd
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Shanxi Southern Ye Li Acer Photoelectric Co Ltd
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Priority to CN201510146966.0A priority Critical patent/CN104810318A/zh
Publication of CN104810318A publication Critical patent/CN104810318A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Dental Tools And Instruments Or Auxiliary Dental Instruments (AREA)

Abstract

本发明用于LED芯片工艺的夹具，属于LED芯片处理的技术领域；所要解决的技术问题是提供一种夹持LED芯片的夹具，用于LED芯片工艺段在化学药液中的作业，避免了化学药水对操作人员的健康造成损伤；采用的技术方案是：用于LED芯片工艺的夹具，包括把手、杆体、卡环、弹性夹垫，杆体的一端套有橡胶材料的把手，杆体的另一端固定安装有卡环，所述卡环的内表面上固定安装有弹性夹垫，所述弹性夹垫的中心设有卡口，所述的杆体为可伸缩的套管，所述套管的主杆端部套有把手，副杆的端部与卡环固定连接，副杆套装在主杆内部；本发明的卡口卡住现有LED治具的手柄处，操作人员手持把手即可进行工作。

Description

用于LED芯片工艺的夹具
技术领域
本发明用于LED芯片工艺的夹具，属于LED芯片处理的技术领域。
背景技术
LED芯片工艺流程中，经常会将芯片浸泡到化学药水中进行作业，而这些药水大部分是经过加热的强酸、强碱等具有高腐蚀性和挥发性的化学药液。实际工作中，经常要工人拿着治具在药水中进行作业，尤其是工程师进行工程试验，经常需要反复的在化学药液中进行作业。目前，工作中使用的治具手持部分设计并不合理，操作人员作业时，会导致手以及手腕部位暴露于化学药液的正上方，从而出现工作中化学药液附着于手上，对操作人员造成人身损害，长期工作下来，可能会导致其他严重的伤病。
发明内容
本发明克服现有技术存在的不足，所要解决的技术问题是提供一种夹持LED芯片的夹具，用于LED芯片工艺段在化学药液中的作业，避免了化学药水对操作人员的健康造成损伤。
为了解决上述技术问题，本发明所采用的技术方案是：用于LED芯片工艺的夹具，包括把手、杆体、卡环、弹性夹垫，杆体的一端套有橡胶材料的把手，杆体的另一端固定安装有卡环，所述卡环的内表面上固定安装有弹性夹垫，所述弹性夹垫的中心设有卡口。
所述的杆体为可伸缩的套管，所述套管的主杆端部套有把手，副杆的端部与卡环固定连接，副杆套装在主杆内部。
所述的弹性夹垫为具有弹性的高分子耐腐蚀材料制作。
本发明同现有技术相比所具有的有益效果是：将现有LED治具的手柄处卡入本发明的卡口中，操作人员手持把手即可进行工作，使得作业过程中操作人员的手及手腕不会直接暴露于化学药液的正上方，避免了化学药液对工作人员造成损伤；卡环内表面设计有弹性夹垫，其使用有弹性的高分子耐腐蚀材料制作，适用于化学领域试验使用，可用于不同粗细的LED治具手柄，并且保证了夹紧度；杆体使用套管，可调节长短，适用于不同的操作台和操作人员。
附图说明
下面结合附图对本发明作进一步说明。
图1为本发明的结构示意图。
图中：1为把手，2为杆体，3为卡环，4为弹性夹垫，5为卡口。
具体实施方式
如图1所示，本发明用于LED芯片工艺的夹具，包括把手1、杆体2、卡环3、弹性夹垫4，杆体2的一端套有橡胶材料的把手1，杆体2的另一端固定安装有卡环3，所述卡环3的内表面上固定安装有弹性夹垫4，所述弹性夹垫4的中心设有卡口5。
所述的杆体2为可伸缩的套管，所述套管的主杆端部套有把手1，副杆的端部与卡环3固定连接，副杆套装在主杆内部。
所述的弹性夹垫4为具有弹性的高分子耐腐蚀材料制作。
本发明卡环3内侧设计的弹性夹垫4是使用弹性耐腐蚀材料制作，可保证将LED治具（花篮）的手柄卡紧，并适用于化学药液上方操作使用。
使用时将LED治具（花篮）的手柄从卡口5处穿入，调节好副杆的长短即可手握把手1进行作业。副杆伸缩安装于主杆内部，可根据工作台或工作人员的使用情况调节长短。

Claims (3)

1.用于LED芯片工艺的夹具，其特征在于：包括把手（1）、杆体（2）、卡环（3）、弹性夹垫（4），杆体（2）的一端套有橡胶材料的把手（1），杆体（2）的另一端固定安装有卡环（3），所述卡环（3）的内表面上固定安装有弹性夹垫（4），所述弹性夹垫（4）的中心设有卡口（5）。
2.根据权利要求1所述的用于LED芯片工艺的夹具，其特征在于：所述的杆体（2）为可伸缩的套管，所述套管的主杆端部套有把手（1），副杆的端部与卡环（3）固定连接，副杆套装在主杆内部。
3.根据权利要求1或2所述的用于LED芯片工艺的夹具，其特征在于：所述的弹性夹垫（4）为具有弹性的高分子耐腐蚀材料制作。
CN201510146966.0A 2015-03-31 2015-03-31 用于led芯片工艺的夹具 Pending CN104810318A (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02208950A (ja) * 1989-02-08 1990-08-20 Hitachi Cable Ltd 発光ダイオードウエハの特性評価方法
CN202290119U (zh) * 2011-11-02 2012-07-04 赵甜甜 组合式试管夹
CN103985793A (zh) * 2014-05-27 2014-08-13 徐州东力锻压机械有限公司 一种用于放置led芯片的治具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02208950A (ja) * 1989-02-08 1990-08-20 Hitachi Cable Ltd 発光ダイオードウエハの特性評価方法
CN202290119U (zh) * 2011-11-02 2012-07-04 赵甜甜 组合式试管夹
CN103985793A (zh) * 2014-05-27 2014-08-13 徐州东力锻压机械有限公司 一种用于放置led芯片的治具

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Application publication date: 20150729