CN104788927A - 一种用于电子产品的导电塑料 - Google Patents

一种用于电子产品的导电塑料 Download PDF

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Publication number
CN104788927A
CN104788927A CN201510186669.9A CN201510186669A CN104788927A CN 104788927 A CN104788927 A CN 104788927A CN 201510186669 A CN201510186669 A CN 201510186669A CN 104788927 A CN104788927 A CN 104788927A
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parts
conductive plastic
electronic product
oxide
conductive
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张竹香
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Qingdao Chengtian Weiye Machinery Manufacturing Co Ltd
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Qingdao Chengtian Weiye Machinery Manufacturing Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02Organic and inorganic ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/30Sulfur-, selenium- or tellurium-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098Metal salts of carboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/10Esters; Ether-esters
    • C08K5/101Esters; Ether-esters of monocarboxylic acids
    • C08K5/103Esters; Ether-esters of monocarboxylic acids with polyalcohols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41Compounds containing sulfur bound to oxygen
    • C08K5/42Sulfonic acids; Derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/521Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2206Oxides; Hydroxides of metals of calcium, strontium or barium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/30Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3009Sulfides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/04Antistatic

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

一种用于电子产品的导电塑料,其由以下重量份数的原料制成:聚碳酸酯9-17份,偶联剂1-3份,氧化钾3-5份,氧化锶1-3份,磷酸三甲苯酯7-11份,烷基苯磺酸酯6-10份,氧化钙2-4份,硅微粉3-6份,二硫化钼1-5份,抗氧剂2-5份,磷酸二氢盐4-9份,醋酸酯2-8份,硬脂酸钙5-9份,增塑剂2-7份,三硬脂酸甘油酯6-8份。本发明的有益效果是:本发明的导电塑料,导电效果好,能够很好的保护电器元件,同时具有一定的防辐射作用。

Description

一种用于电子产品的导电塑料
技术领域
本发明涉及一种用于电子产品的导电塑料。
背景技术
随着现代电子工业和信息产业的发展,各种工业自动化设备、微电脑、家用电器及电子产品进入国民经济的各个领域和人们工作生活环境之中。导电塑料不仅在抗静电添加剂、计算机抗电磁屏幕和智能窗等方面的应用已快速的发展,但其导电率并不能够满足人们的使用要求,且不具有防射线的功能,同时成本较高。
发明内容
针对现有技术的不足,本发明要解决的问题是,提供一种导电塑料,导电效果好,能够很好的保护电器元件,同时具有一定的防辐射作用。
为解决现有技术问题,本发明提供的技术方案是,一种用于电子产品的导电塑料,其由以下重量份数的原料制成:
聚碳酸酯9-17份,偶联剂1-3份,氧化钾3-5份,氧化锶1-3份,磷酸三甲苯酯7-11份,烷基苯磺酸酯6-10份,氧化钙2-4份,硅微粉3-6份,二硫化钼1-5份,抗氧剂2-5份,磷酸二氢盐4-9份,醋酸酯2-8份,硬脂酸钙5-9份,增塑剂2-7份,三硬脂酸甘油酯6-8份。
本发明的有益效果是:本发明的导电塑料,导电效果好,能够很好的保护电器元件,同时具有一定的防辐射作用。
具体实施方式
实施例1
一种用于电子产品的导电塑料,其由以下重量份数的原料制成:
聚碳酸酯9份,偶联剂1份,氧化钾3份,氧化锶1份,磷酸三甲苯酯7份,烷基苯磺酸酯6份,氧化钙2份,硅微粉3份,二硫化钼1份,抗氧剂2份,磷酸二氢盐4份,醋酸酯2份,硬脂酸钙5份,增塑剂2份,三硬脂酸甘油酯6份。
实施例2
一种用于电子产品的导电塑料,其由以下重量份数的原料制成:
聚碳酸酯17份,偶联剂3份,氧化钾5份,氧化锶3份,磷酸三甲苯酯11份,烷基苯磺酸酯10份,氧化钙4份,硅微粉6份,二硫化钼5份,抗氧剂5份,磷酸二氢盐9份,醋酸酯8份,硬脂酸钙9份,增塑剂7份,三硬脂酸甘油酯8份。

Claims (1)

1.一种用于电子产品的导电塑料,其特征在于:其由以下重量份数的原料制成:
聚碳酸酯9-17份,偶联剂1-3份,氧化钾3-5份,氧化锶1-3份,磷酸三甲苯酯7-11份,烷基苯磺酸酯6-10份,氧化钙2-4份,硅微粉3-6份,二硫化钼1-5份,抗氧剂2-5份,磷酸二氢盐4-9份,醋酸酯2-8份,硬脂酸钙5-9份,增塑剂2-7份,三硬脂酸甘油酯6-8份。
CN201510186669.9A 2015-04-18 2015-04-18 一种用于电子产品的导电塑料 Pending CN104788927A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105504678A (zh) * 2015-10-25 2016-04-20 国网山东省电力公司临沂供电公司 一种耐腐蚀的导电材料及其应用
CN105504765A (zh) * 2015-08-21 2016-04-20 国网山东省电力公司临沂供电公司 一种新型导电塑料

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105504765A (zh) * 2015-08-21 2016-04-20 国网山东省电力公司临沂供电公司 一种新型导电塑料
CN105504765B (zh) * 2015-08-21 2018-03-23 国网山东省电力公司临沂供电公司 一种导电塑料
CN105504678A (zh) * 2015-10-25 2016-04-20 国网山东省电力公司临沂供电公司 一种耐腐蚀的导电材料及其应用

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Application publication date: 20150722