CN104779216B - A kind of battery protecting plate and electronic equipment - Google Patents
A kind of battery protecting plate and electronic equipment Download PDFInfo
- Publication number
- CN104779216B CN104779216B CN201510166916.9A CN201510166916A CN104779216B CN 104779216 B CN104779216 B CN 104779216B CN 201510166916 A CN201510166916 A CN 201510166916A CN 104779216 B CN104779216 B CN 104779216B
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- groove
- power device
- conductive layer
- inwall
- protecting plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Connection Of Batteries Or Terminals (AREA)
Abstract
A kind of battery protecting plate, in a specific embodiment, battery protecting plate includes：The groove opened up in one surface；First conductive layer is set on the first inwall of groove, the second conductive layer and the 3rd conductive layer are set on the second inwall of groove, the first inwall is oppositely arranged with the second inwall, spaced between the second conductive layer and the 3rd conductive layer；The drain electrode of first conductive layer and power device is in electrical contact；The source class of second conductive layer and power device is in electrical contact, and the control terminal of the 3rd conductive layer and power device is in electrical contact.
Description
Technical field
The present invention relates to battery protection field, more particularly to a kind of battery protecting plate and electronic equipment.
Background technology
Traditional printed circuit board (PCB) is surface wiring mode, device and chip be installed in printed circuit board (PCB) upper surface or
Lower surface.As circuit engineering develops, the conducting resistance of power switch is less and less, and many application scenario electric currents are increasing,
Current printed circuit board arrangement has resulted in larger dead resistance, limits the connection resistance of actual connection power switch.
Fig. 1 is a kind of encapsulating structure schematic diagram of power device of the prior art, and it is three terminal device, that is, has three pipes
Pin:D、S、G.D is the drain electrode of power device, and S is the source electrode of power device, and G is the control terminal (grid) of power device.In Fig. 1,
Pin outside plastic packaging body (solid box Figure 10) is respectively drawing for the drain electrode of power device, grid and three terminals of source class
Pin, pin are generally metal, are electrically connected for power device by being formed between the metal wire on scolding tin and printed circuit board (PCB).
Drain pin forms a metal framework entirety into packaging body with metal framework 20 (big dotted line frame), is formed therebetween good
Electric conductivity.Chip 30 (i.e. the chip of power device) is encapsulated in packaging body, chip 30 is placed on the metal of connection drain electrode
On framework 20.The active extreme pressure welding zone 301 in the upper surface of chip 30 and control terminal (grid) pressure welding area 302.Minimum solid box is control
End (grid) pressure welding area 302 processed, because it need not flow through high current, without less impedance, so typically small.Chip upper table
Polygon solid box of the face in addition to control terminal (grid) pressure welding area 302 is source electrode pressure welding area 301.The drain electrode of chip 30 is towards decentralization
Put, chip is drained by conducting resinl during encapsulation pressure welding area and be connected the metal framework 20 of drain electrode and be connected, and general its connects electric
Resistance is smaller.And the source electrode pressure welding area of chip 30 passes through metal framework of the packaging conductive wire (generally gold thread or copper cash) with being connected source electrode
(metal framework of connection source electrode is located at package interior, as shown in the small dotted line frame 40 in Fig. 1) is connected.The envelope of this connection source electrode
Larger dead resistance be present in dress wire.Connect control terminal (grid) pin (G) and the small dotted line frame 50 in packaging body is
Connect the metal framework of control terminal pin.By packaging conductive wire by the grid pressure welding area on chip 30 with being connected control terminal (grid)
The metal framework of pin is connected.And packaging conductive wire can equally have larger dead resistance, packaging body is generally plastics.Therefore,
Power device will produce very big dead resistance in encapsulation process.
In addition, Fig. 2 is a kind of structural representation of power device installation of the prior art on a printed circuit board, scheming
The situation that power chip is installed in printed circuit board surface is described in 2.Solid box Figure 20 is printed circuit board, printed circuit
Printed the metal wire for being electrically connected on plate 20, generally copper cash, in order to realize relatively thin effect, general copper layer thickness compared with
It is small.PCB drain electrode lines 201, for will be carried out between drain electrode (D) pin on the power device 204 in printed circuit board and Fig. 2
Electrical connection；PCB source class line 202 is used to be electrically connected between source class (S) pin on power device 204；PCB is controlled
End line 203 processed is used to be electrically connected with control terminal (grid, G) pin on power device 204.And these PCB lines
Among drain electrode line and source electrode line can equally have larger dead resistance.
Therefore, in order to reduce or eliminate these dead resistances, it is therefore necessary to improve existing printed circuit board (PCB) and power
Device connects the dead resistance of power switch to reduce.
The content of the invention
The present invention proposes a kind of battery protecting plate and electronic equipment, by designing a groove to battery protecting plate, and
And conductive layer is set in the trench, increase the cross-sectional area of dead resistance, reduce the resistance of dead resistance.Meanwhile in the trench
After increasing conductive layer, then power device is embedded into groove.Power device avoids power device and existed without being packaged again
Caused larger dead resistance in encapsulation process, and between power device and battery protecting plate, directly pass through power device
Pressure welding area is welded with conductive layer, and without being electrically connected by wire, this also significantly reduces the resistance of dead resistance.
In a first aspect, the embodiments of the invention provide a kind of battery protecting plate, the battery protecting plate includes：In one table
The groove opened up on face；
First conductive layer is set on the first inwall of groove, sets the second conductive layer and the 3rd to lead on the second inwall of groove
Electric layer, the first inwall are oppositely arranged with the second inwall, spaced between the second conductive layer and the 3rd conductive layer；
The drain electrode of first conductive layer and power device is in electrical contact；
The source class of second conductive layer and power device is in electrical contact；
The control terminal of 3rd conductive layer and power device is in electrical contact.
Preferably, the first conductive layer is strip, and it grows 3/4 of the length more than or equal to the first inwall, and it is wider than
Or wide 3/4 equal to the first inwall；
Second conductive layer is strip, and it grows 1/2 of the length more than or equal to the first inwall, and it is wider than or is equal to
Wide 3/4 of second inwall.
Preferably, the section of groove includes rectangle or trapezoidal；
When the section of groove is trapezoidal, the width of the top surface of groove is more than the width of its bottom surface.
Preferably, the length of groove is more than the width of groove, the first inwall and relative two that the second inwall is groove
Strip side wall.
Second aspect, the embodiments of the invention provide a kind of electronic equipment, including the battery protecting plate introduced as described above and
Power device；
Power device is manufactured using vertical process；
Wherein, power device is shaped as cuboid.
Preferably, the height of power device is less than or equal to the width of groove, and the width of power device is less than groove
Depth, wherein, groove is the groove opened up on a surface of battery protecting plate.
Preferably, power device is unencapsulated chip.
Preferably, the top surface of power device and bottom surface set drain electrode pressure welding area, source class pressure welding area and control side pressure respectively
Welding zone；Drain electrode pressure welding area is oppositely arranged with source class pressure welding area and control terminal pressure welding area.
It is further preferred that three pressure welding areas of power device are implanted metal ball respectively, crowning is formed, for power
Electrical connection between the conductive layer that the inwall of each terminal and groove of device is set.
Preferably, power device is positioned in groove, the bottom wall of a side of power device close to groove；Another phase
To side and the surface of battery protecting plate be substantially flush.
Battery protecting plate and electronic equipment provided by the invention, by battery protecting plate design a groove, and
Conductive layer is set in groove, increases the cross-sectional area of dead resistance, reduces the resistance of dead resistance.Meanwhile increase in the trench
After conductive layer, then power device is embedded into groove.Power device avoids power device and encapsulated without being packaged again
During caused larger dead resistance, and between power device and battery protecting plate, directly pass through the pressure welding of power device
Area is welded with conductive layer, and without being electrically connected by wire, this also significantly reduces the resistance of dead resistance.
Brief description of the drawings
Fig. 1 is a kind of power device packaging structure schematic diagram of the prior art；
Fig. 2 is a kind of structural representation of power device installation of the prior art on a printed circuit board；
Fig. 3 is a kind of structural representation of the battery protecting plate of square trench provided in an embodiment of the present invention；
Fig. 4 is the structural representation of the power device in a kind of electronic equipment provided in an embodiment of the present invention；
Fig. 5 is a kind of structural representation of the battery protecting plate of trapezoidal groove provided in an embodiment of the present invention.
Embodiment
Below by drawings and examples, technical scheme is described in further detail.
Fig. 3 is a kind of structural representation of the battery protecting plate of square trench provided in an embodiment of the present invention；Fig. 4 is this hair
The structural representation of power device in a kind of electronic equipment that bright embodiment provides.
As shown in figure 3, battery protecting plate includes：The groove opened up in one surface.Optionally, section of groove
Face includes square or trapezoidal.The groove of battery protecting plate as shown in Figure 3 is the groove of square-section.In the first of groove
Wall sets the first conductive layer；The second conductive layer and the 3rd conductive layer are set on second inwall of groove.In first inwall and second
Wall is oppositely arranged, spaced between the second conductive layer and the 3rd conductive layer.Preferably, the first conductive layer is strip, and it is grown
More than or equal to the 3/4 of the length of the first inwall, it is wider than or wide 3/4 equal to the first inwall；Second conductive layer is
Strip, it grows 1/2 of the length more than or equal to the first inwall, and it is wider than or wide 3/4 equal to the second inwall.
The drain electrode of the first conductive layer and the power device in Fig. 4 on first inwall of groove is in electrical contact, and the work(
The conductive layer on the first inwall of groove is close in the drain electrode of rate device；The second conductive layer and power device on second inwall of groove
The source class of part is in electrical contact, and the control terminal of the 3rd conductive layer and power device is in electrical contact.And source class and the control of power device
It is close to the second conductive layer and the 3rd conductive layer respectively in end processed.Preferably, the material of conductive layer can be metallic copper.
A kind of electronic equipment, including battery protecting plate as presented above, and a power device.Wherein power device
Manufactured using vertical process, the wafer being characterized in where power device or a surface (being, for example, lower surface) for chip are
Drain electrode, then includes source class and control terminal in another side (such as upper surface).Wherein, control terminal can be the grid of power device
Or liner body.In the present embodiment, the control terminal is grid.
Power device is the chip without encapsulation process, and the top surface of the power device and bottom surface set drain electrode respectively
Pressure welding area, source class pressure welding area and control terminal pressure welding area；The pressure welding area that drains is relative with source class pressure welding area and control terminal pressure welding area
Set.For chip, pressure welding area is the metallic region of exposure, the electrical connection for chip port.Preferably, drain level
The cross-sectional area of pressure welding area can be equal with the cross-sectional area of the first conductive layer on the first inwall of groove；Similar, source class
The cross-sectional area of pressure welding area is equal with the cross-sectional area of the second conductive layer on the second inwall of groove；The horizontal stroke of control terminal pressure welding area
Sectional area is equal with the cross-sectional area of the 3rd conductive layer on the second inwall of groove.Make it possible to utilize pressure welding to greatest extent
Electric connecting relation between area and conductive layer.
In addition, three pressure welding areas of power device are also implanted metal ball respectively, crowning is formed, for power device
Electrical connection between the conductive layer that the inwall of each terminal and groove is set.
Preferably, power device is shaped as cuboid, and the height of power device is less than or equal to the width of groove, work(
The width of rate device is less than the depth of groove, wherein, groove is the groove opened up on a surface of battery protecting plate.And then side
Just power device is embedded into the groove that battery protection plate surface is opened up.Also, a side of power device is close to ditch
The bottom wall of groove；Another relative side and the surface of battery protecting plate are substantially flush.Due to increasing in the groove of battery protecting plate
Added conductive layer, three terminals (drain electrode, source class and control terminal) of power device between the conductive layer on battery protecting plate directly
Capable welding is tapped into, therebetween without being electrically connected again by lead-in conductor, so as to avoid generation dead resistance.And work(
Rate device is eliminated in encapsulation process without being packaged, and has larger post between pressure welding area and the terminal of power device
The line of raw resistance, reduce further the resistance of dead resistance.
In addition, it can be seen from the calculation formula of resistance：
Wherein, R is the resistance of resistance, and ρ is the resistivity of resistance material, and l is the length of resistive element, and S is then resistive element
Cross-sectional area.
And calculating dead resistance, (dead resistance here specifically includes in the present embodiment：It is caused when welding conductive layer
Carry out welding caused dead resistance between dead resistance and power device and conductive layer) resistance when, ρ is dead resistance
The resistivity of material, l are the length of dead resistance, it is understood that it is circulation path length of the electric current in external circuit, and
The cross-sectional area S of dead resistance then for conductive layer depth (conductive layer is arranged on the inwall of groove, and its shape is also strip,
The depth of conductive layer is the height of conductive layer) product with the length of groove.
After trench interiors set conductive layer, due to the depth and power device that the cross-sectional area of dead resistance is conductive layer
The product of length, so, it is public according to the calculating of resistance equivalent to the cross-sectional area for adding dead resistance after conductive layer increase
Formula (1-1) understands that the cross-sectional area of dead resistance increases, then the resistance of dead resistance reduces.Further, the conductive layer is filled
After groove, allow current to it is enough it is parallel on circuit boards flow through, circulation path of the electric current in external circuit is shortened, equivalent to electricity
The l hindered in formula (1-1) reduces, and reduce further the resistance value of dead resistance.
A kind of Fig. 5 structural representations of the battery protecting plate of trapezoidal groove provided in an embodiment of the present invention.It can be seen by Fig. 5
Go out, the width of the top surface of groove is more than the width of its bottom surface.The groove is only the square trench constructively introduced with Fig. 1
Difference, need also exist for setting conductive layer in the inwall of groove when in use.Other functions and the work(of the square trench of above-mentioned introduction
Can be identical.But trapezoidal groove has a clear advantage compared to square trench：The area of trapezoidal groove bottom is smaller, and
Groove top area is larger, and such strabismus inwall more contributes to fill welding material (such as the welding metal material such as scolding tin
Material) and increase conductive layer etc..
It should be noted that in the present invention in addition to trench region, other positions can be in upper surface or lower surface or centre
Layer is connected up, and forms the electrical connection of various circuits, device.Except power device is disposed in inside and outside groove, other need not
The various circuits and device for flowing through high current are disposed in the upper surface or lower surface of printed circuit board (PCB).
Battery protecting plate and electronic equipment provided by the invention, by battery protecting plate design a groove, and
Conductive layer is set in groove, increases the cross-sectional area of dead resistance, reduces the resistance of dead resistance.Meanwhile increase in the trench
After conductive layer, then power device is embedded into groove.Power device avoids power device and encapsulated without being packaged again
During caused larger dead resistance, and between power device and battery protecting plate, directly pass through the pressure welding of power device
Area is welded with conductive layer, and without being electrically connected by wire, this also significantly reduces the resistance of dead resistance.
Professional should further appreciate that, each example described with reference to the embodiments described herein
Unit and method and step, it can be realized with electronic hardware, in the above description be generally described respectively according to function
The composition and step of example.Described function realized using distinct methods to each specific application, but this reality
Show the scope it is not considered that beyond the embodiment of the present invention.
The method that is described with reference to the embodiments described herein can use hardware, computing device the step of algorithm
Software module, or the two combination are implemented.Software module can be placed in random access memory (RAM), internal memory, read-only storage
(ROM), electrically programmable ROM, electrically erasable ROM, register, hard disk, moveable magnetic disc, CD-ROM or technical field
In any other form of storage medium well known to interior.
Above-described embodiment, the purpose, technical scheme and beneficial effect of the embodiment of the present invention are carried out
It is further described, should be understood that the embodiment that the foregoing is only the embodiment of the present invention, and do not have to
It is all within the spirit and principle of the embodiment of the present invention in the protection domain for limiting the embodiment of the present invention, any modification for being made,
Equivalent substitution, improvement etc., should be included within the protection domain of the embodiment of the present invention.
Claims (6)
1. a kind of battery protecting plate, it is characterised in that the battery protecting plate includes：The ditch opened up in one surface
Groove；
First conductive layer is set on the first inwall of the groove, the second conductive layer and are set on second inwall of the groove
Three conductive layers, the first inwall are oppositely arranged with the second inwall, spaced between the second conductive layer and the 3rd conductive layer；
First conductive layer directly contacts with the drain electrode of power device；
Second conductive layer directly contacts with the source electrode of the power device；
3rd conductive layer directly contacts with the control terminal of the power device；
First conductive layer is strip, its grow more than or equal to first inwall length 3/4, its be wider than or
Equal to wide 3/4 of first inwall；
Second conductive layer is strip, its grow more than or equal to first inwall length 1/2, its be wider than or
Equal to wide 3/4 of second inwall；
The section of the groove includes rectangle or trapezoidal；
When the section of the groove is trapezoidal, the width of the top surface of the groove is more than the width of its bottom surface.
2. battery protecting plate according to claim 1, it is characterised in that the length of the groove is more than the width of the groove
Degree, first inwall and second inwall are the relative two strip side wall of the groove.
3. a kind of electronic equipment, including battery protecting plate and power device as described in one of claim 1 or 2；
The power device is manufactured using vertical process；
Wherein, the power device is shaped as cuboid；
The top surface of the power device and bottom surface set drain electrode pressure welding area, source electrode pressure welding area and control terminal pressure welding area respectively；Institute
Drain electrode pressure welding area is stated to be oppositely arranged with source electrode pressure welding area and control terminal pressure welding area；
Three pressure welding areas of the power device are implanted metal ball respectively, crowning are formed, for each of the power device
Electrical connection between the conductive layer that the inwall of terminal and the groove is set.
4. electronic equipment according to claim 3, it is characterised in that the height of the power device is less than or equal to ditch
The width of groove, the width of the power device are less than the depth of groove, wherein, the groove is the one of the battery protecting plate
The groove that individual surface opens up.
5. electronic equipment according to claim 3, it is characterised in that the power device is unencapsulated chip.
6. electronic equipment according to claim 3, it is characterised in that the power device is positioned in the groove, institute
State bottom wall of the side close to the groove of power device；Another relative side and the surface of the battery protecting plate
Concordantly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510166916.9A CN104779216B (en) | 2015-04-09 | 2015-04-09 | A kind of battery protecting plate and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510166916.9A CN104779216B (en) | 2015-04-09 | 2015-04-09 | A kind of battery protecting plate and electronic equipment |
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| Publication Number | Publication Date |
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| CN104779216A CN104779216A (en) | 2015-07-15 |
| CN104779216B true CN104779216B (en) | 2018-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510166916.9A Active CN104779216B (en) | 2015-04-09 | 2015-04-09 | A kind of battery protecting plate and electronic equipment |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107634159A (en) * | 2017-08-10 | 2018-01-26 | 卧龙电气集团股份有限公司 | A kind of lithium battery group for treasured doubleway output of waiting |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2742539Y (en) * | 2004-04-06 | 2005-11-23 | 台北沛波电子股份有限公司 | Adhesive structure for inductor surface |
| CN101207229A (en) * | 2006-12-20 | 2008-06-25 | 株式会社东芝 | Electronic apparatus |
| CN203013705U (en) * | 2012-12-28 | 2013-06-19 | 矽格微电子(无锡)有限公司 | Thin integrated circuit packaging structure based on silicon substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8101868B2 (en) * | 2005-10-14 | 2012-01-24 | Ibiden Co., Ltd. | Multilayered printed circuit board and method for manufacturing the same |
-
2015
- 2015-04-09 CN CN201510166916.9A patent/CN104779216B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2742539Y (en) * | 2004-04-06 | 2005-11-23 | 台北沛波电子股份有限公司 | Adhesive structure for inductor surface |
| CN101207229A (en) * | 2006-12-20 | 2008-06-25 | 株式会社东芝 | Electronic apparatus |
| CN203013705U (en) * | 2012-12-28 | 2013-06-19 | 矽格微电子(无锡)有限公司 | Thin integrated circuit packaging structure based on silicon substrate |
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| CN104779216A (en) | 2015-07-15 |
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Address after: Wuxi District of Jiangsu city of Wuxi province Qingyuan Road 214135 No. 18 Taihu International Science Park sensor network university science and Technology Park 530 building A1001 Applicant after: WUXI ZHONGGAN MICROELECTRONIC CO., LTD. Address before: A 530 Taihu international science and Technology Park building 214135 Qingyuan Road in Jiangsu province Wuxi City District 10 layer Applicant before: Wuxi Vimicro Co., Ltd. |
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