CN104759764A - Laser drilling method for glass - Google Patents
Laser drilling method for glass Download PDFInfo
- Publication number
- CN104759764A CN104759764A CN201510145983.2A CN201510145983A CN104759764A CN 104759764 A CN104759764 A CN 104759764A CN 201510145983 A CN201510145983 A CN 201510145983A CN 104759764 A CN104759764 A CN 104759764A
- Authority
- CN
- China
- Prior art keywords
- laser
- glass
- drilling holes
- hole
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention is applicable to the drilling filed of a hard and crisp material, and provides a laser drilling method for glass. The laser drilling method for the glass comprises the steps of dividing a through hole to be laser drilled into a plurality of processing layers, and processing the glass layer by layer by the laser, wherein the process path of each processing layer is an inner cycloidal path. According to the laser drilling method for the glass, the through hole to be laser drilled is divided into the plurality of processing layers, and the process path of each processing layer is the inner cycloidal path, therefore the operation of frequently turning on or off the laser can be reduced, and the blast points at the drilling place or the glass crisp caused by the sudden change of the first and last pulse delay or power of a laser device can be prevented; meanwhile, and the laser drilling efficiency can be greatly improved due to the operation of reducing turning on or off the laser.
Description
Technical field
The invention belongs to hard brittle material boring field, particularly relate to a kind of method for drilling holes of glass.
Background technology
Along with industrial expansion, the diversity of materials processing, a lot of industry all needs to use hard brittle material, and the boring to hard brittle material, but become the difficult point of technique and manufacture, due to hard brittle material in the borehole, easy embrittlement, as traditional machining bore mode, is the hard way of contact, be very easy to make whole material apart, the shortcoming such as produce that yield rate reduces relatively, auxiliary consumptive material consumption is serious, seriously polluted and machining accuracy is poor; And although Laser Processing has become the main flow processing mode of manufacturing, the existing laser that utilizes has been holed to glass, there is many defects equally, as laser power is too large, produces fuel factor, glass is burst apart; Or design multiple processing section, reduce fuel factor, but need open and close laser frequently, the quick-fried point or cracked of inside glass can be caused equally.
Summary of the invention
The object of the embodiment of the present invention is the method for drilling holes providing a kind of glass, to solve the problem that existing laser drill easily produces quick-fried point or embrittlement.
The embodiment of the present invention is achieved in that a kind of method for drilling holes of glass, and through hole to be drilled for laser is divided into multiple machined layer, and laser is successively processed, and the machining locus of each machined layer is hypocycloid track.
Further, successively hole from the lower surface of glass toward upper surface, while boring, the Focal Point Shift of laser is to corresponding machined layer.
Further, the range of work of each machined layer is the inside annulus in the edge of described through hole, and described annulus is processed to form by multiple continuous print circle, and each circle is processed according to hypocycloid track.
Further, overlap between two adjacent circles processing.
Further, the generator of described laser is green glow nanosecond laser.
Further, the pulsewidth of laser is less than 15ns.
Further, the power of laser is greater than 8W.
Further, wall is provided with between multiple processing.
Further, described hypocycloid track is tricuspid valve line tracking or four cusp line trackings.
Further, the bottom of described glass is provided with dust collect plant.
Embodiments provide a kind of method for drilling holes of glass, by treating that holes drilled through is laterally divided into multiple machined layer, the machining locus of each machined layer adopts hypocycloid track, reduce the frequent switch light operation of laser volume, avoid and cause the quick-fried point of drill hole or the embrittlement of glass because of the first and last pulse daley of laser instrument or the cataclysm of power, simultaneously owing to reducing the operation of switch light, improve the efficiency of laser drill greatly; Meanwhile, owing to adopting hypocycloid track processing mode, make through-hole wall can be processed uniformly, its surface be more smooth.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the hypocycloid trajectory diagram of the single machined layer that the embodiment of the present invention provides;
Fig. 2 is the machining locus figure of the single machined layer that another embodiment of the present invention provides.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
When adopting the laser drill of prior art to glass, track due to its processing generally adopts the mode of concentric circles or multiple straightway, need to carry out open and close to laser frequently, the moment opened or closed is carried out at laser, the pulse accumulation of laser, power is suddenly large, or the delay of pulse, makes processing place form point of burst or crackle or whole glass embrittlement.And due to laser switch action repeatedly, the time of processing increases, and working (machining) efficiency reduces.
The embodiment of the present invention provides a kind of method for drilling holes of glass, and through hole to be drilled for laser is divided into multiple machined layer 11, and laser is successively processed, and the machining locus of each machined layer 11 is hypocycloid track 12.
Described hypocycloid is that a dynamic circle is inscribed within a fixed circle and does nonslipping rolling, and dynamic circle is the track that marks when rolling of a fixed point circumferentially.
Because described hypocycloid track is continuous print, each machined layer just exists at the whole story 2 of hypocycloid track and opens or closes laser operations, has greatly saved the time of processing, has reduced the risk of quick-fried point of knowing clearly simultaneously as much as possible, make bored through-hole surfaces smooth.
As shown in Figure 1, the hypocycloid track 12 in the present embodiment is tricuspid valve line tracking, and certain described hypocycloid track also can be other astroid tracks, as four cusp line trackings.
Further, the method for drilling holes of the present embodiment is successively holed from the lower surface of glass toward upper surface, and while boring, the Focal Point Shift of laser is to corresponding machined layer.
Concrete, the generator of described laser is adopted as green glow nanosecond laser, and wavelength is 532nm, and the pulsewidth of laser is less than 15ns, and the power of laser is not less than 8W, is preferably 8-15W in the present embodiment.In other embodiments, wall is provided with between multiple machined layer 11.Because laser spot has certain depth of focus, the wall of certain distance is set between each machined layer, make described wall and machined layer all just in the range of work of laser spot, in practical operation, the concrete distance of described wall sets according to the actual size of hot spot.
Further, described laser through hole to be drilled is the through hole of any shape, and through hole described in the present embodiment is circular hole.
As shown in Figure 2, in other embodiments, when the aperture of laser through hole to be processed is larger, also can all parts in aperture all be processed, and only need process the external diameter circulus equal with described through hole radius, unprocessed part is formed by departing from through hole.
Concrete, in the present embodiment, the range of work of each machined layer is the inside annulus 21 in the edge of described through hole, and described annulus 21 is processed to form by multiple continuous print circle 22, and each circle 22 is walked according to hypocycloid track.
Further, exist between two adjacent circles and partly overlap, when the difference avoiding working as processed annulus internal-and external diameter is larger, completely the edge of through hole cannot be worked into, makes through-hole wall uneven.Concrete, circle is how many relevant with speed with the concrete range of work with the overlap of circle, can regulate as required.Certainly in other embodiments, if when the difference of the internal-and external diameter of annulus is less, also can be overlapping between multiple circle.
By the processing mode of ring-type, save the time of processing greatly, simultaneously, processed according to hypocycloidal track walking manner by multiple continuous print circle, save the operation of laser repeatedly open and close, avoid equally because moment of opening or closing the changed power that causes, or the delay of laser, the not round and smooth and glass of the interface making to process tie point produces explosion, crackle etc.
In other embodiments, the bottom of described glass is provided with dust collect plant, and when laser is to glass drilling, the dust of generation and waste residue are by described dust collect plant real-time collecting, ensure the absorption of dust granules to laser energy of the cleanliness factor of glass and reduction, improve machining accuracy.
The method for drilling holes that the present embodiment provides, by treating that holes drilled through is laterally divided into multiple machined layer, the machining locus of each machined layer adopts hypocycloid track, reduce the frequent switch light operation of laser volume, avoid the embrittlement causing the quick-fried point of drill hole or glass because of the first and last pulse daley of laser instrument or the cataclysm of power, simultaneously owing to reducing the operation of switch light, improve the efficiency of laser drill greatly.
Above content is in conjunction with concrete preferred embodiment further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention; make some equivalent alternative or obvious modification without departing from the inventive concept of the premise; and performance or purposes identical, all should be considered as belonging to the scope of patent protection that the present invention is determined by submitted to claims.
Claims (10)
1. a method for drilling holes for glass, is characterized in that, through hole to be drilled for laser is divided into multiple machined layer, and laser is successively processed, and the machining locus of each machined layer is hypocycloid track.
2. method for drilling holes as claimed in claim 1, is characterized in that, successively hole from the lower surface of glass toward upper surface, and while boring, the Focal Point Shift of laser is to corresponding machined layer.
3. method for drilling holes as claimed in claim 1, it is characterized in that, the range of work of each machined layer is the inside annulus in the edge of described through hole, and described annulus is processed to form by multiple continuous print circle, and each circle is processed according to hypocycloid track.
4. method for drilling holes as claimed in claim 3, it is characterized in that, overlap between two adjacent circles processing.
5. method for drilling holes as claimed in claim 1, it is characterized in that, the generator of described laser is green glow nanosecond laser.
6. method for drilling holes as claimed in claim 5, it is characterized in that, the pulsewidth of laser is less than 15ns.
7. method for drilling holes as claimed in claim 5, it is characterized in that, the power of laser is greater than 8W.
8. method for drilling holes as claimed in claim 1, is characterized in that, be provided with wall between multiple processing.
9. method for drilling holes as claimed in claim 1, it is characterized in that, described hypocycloid track is tricuspid valve line tracking or four cusp line trackings.
10. method for drilling holes as claimed in claim 1, it is characterized in that, the bottom of described glass is provided with dust collect plant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510145983.2A CN104759764B (en) | 2015-03-28 | 2015-03-28 | A kind of method for drilling holes of glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510145983.2A CN104759764B (en) | 2015-03-28 | 2015-03-28 | A kind of method for drilling holes of glass |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104759764A true CN104759764A (en) | 2015-07-08 |
| CN104759764B CN104759764B (en) | 2018-02-02 |
Family
ID=53642036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510145983.2A Active CN104759764B (en) | 2015-03-28 | 2015-03-28 | A kind of method for drilling holes of glass |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104759764B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891092A (en) * | 2015-12-15 | 2017-06-27 | 航天科工惯性技术有限公司 | A kind of silica micro structure processing method |
| CN107498189A (en) * | 2017-08-28 | 2017-12-22 | 大族激光科技产业集团股份有限公司 | A kind of laser processing of metal surface three-dimensional V-shaped groove structure |
| CN107662055A (en) * | 2016-07-29 | 2018-02-06 | 三星钻石工业株式会社 | The laser processing and laser processing device of brittle substrate |
| CN108971775A (en) * | 2017-06-02 | 2018-12-11 | 大族激光科技产业集团股份有限公司 | A kind of laser boring method and equipment for metal |
| CN110091078A (en) * | 2019-05-31 | 2019-08-06 | 华中科技大学 | A kind of three-dimensional column hole laser cutting method for glass |
| CN114269509A (en) * | 2019-07-26 | 2022-04-01 | 柯马杜股份有限公司 | Single crystal mineral gemstone provided with a cone for re-centering a pivot and method for making same |
| CN114367751A (en) * | 2020-10-14 | 2022-04-19 | 大族激光科技产业集团股份有限公司 | Method, device, equipment and medium for laser drilling of glass ceramics |
| CN114682932A (en) * | 2022-04-14 | 2022-07-01 | 强一半导体（苏州）有限公司 | Method for laser processing through hole suitable for green ceramic chip |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI816897B (en) * | 2018-10-08 | 2023-10-01 | 美商伊雷克托科學工業股份有限公司 | Methods for forming a through-via in a substrate |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4266619A (en) * | 1979-08-06 | 1981-05-12 | Bodine Albert G | Down hole cycloidal drill drive |
| CN1392829A (en) * | 2000-10-11 | 2003-01-22 | 松下电器产业株式会社 | Circuit board production method and circuit board production data |
| CN1636426A (en) * | 2002-02-21 | 2005-07-06 | 西门子公司 | Method for drilling holes in a substrate, in particular in circuit substrate |
| JP2011110598A (en) * | 2009-11-30 | 2011-06-09 | Panasonic Corp | Laser machining method and laser machining device |
| CN102489885A (en) * | 2011-12-20 | 2012-06-13 | 深圳市木森科技有限公司 | Method and device for boring taper hole by using laser |
| CN103831539A (en) * | 2014-01-10 | 2014-06-04 | 合肥鑫晟光电科技有限公司 | Laser drilling method and laser drilling system |
| CN104326649A (en) * | 2013-07-22 | 2015-02-04 | 大量科技股份有限公司 | Composite glass hole cutting method |
-
2015
- 2015-03-28 CN CN201510145983.2A patent/CN104759764B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4266619A (en) * | 1979-08-06 | 1981-05-12 | Bodine Albert G | Down hole cycloidal drill drive |
| CN1392829A (en) * | 2000-10-11 | 2003-01-22 | 松下电器产业株式会社 | Circuit board production method and circuit board production data |
| CN1636426A (en) * | 2002-02-21 | 2005-07-06 | 西门子公司 | Method for drilling holes in a substrate, in particular in circuit substrate |
| JP2011110598A (en) * | 2009-11-30 | 2011-06-09 | Panasonic Corp | Laser machining method and laser machining device |
| CN102489885A (en) * | 2011-12-20 | 2012-06-13 | 深圳市木森科技有限公司 | Method and device for boring taper hole by using laser |
| CN104326649A (en) * | 2013-07-22 | 2015-02-04 | 大量科技股份有限公司 | Composite glass hole cutting method |
| CN103831539A (en) * | 2014-01-10 | 2014-06-04 | 合肥鑫晟光电科技有限公司 | Laser drilling method and laser drilling system |
Non-Patent Citations (1)
| Title |
|---|
| 熊越东等: "基于多开发平台的内摆线加工仿真", 《组合机床与自动化加工技术》 * |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106891092A (en) * | 2015-12-15 | 2017-06-27 | 航天科工惯性技术有限公司 | A kind of silica micro structure processing method |
| CN106891092B (en) * | 2015-12-15 | 2018-10-26 | 航天科工惯性技术有限公司 | A kind of silica micro structure processing method |
| CN107662055A (en) * | 2016-07-29 | 2018-02-06 | 三星钻石工业株式会社 | The laser processing and laser processing device of brittle substrate |
| CN107662055B (en) * | 2016-07-29 | 2021-04-13 | 三星钻石工业株式会社 | Laser processing method and laser processing device for brittle material substrate |
| CN108971775A (en) * | 2017-06-02 | 2018-12-11 | 大族激光科技产业集团股份有限公司 | A kind of laser boring method and equipment for metal |
| CN107498189A (en) * | 2017-08-28 | 2017-12-22 | 大族激光科技产业集团股份有限公司 | A kind of laser processing of metal surface three-dimensional V-shaped groove structure |
| CN110091078A (en) * | 2019-05-31 | 2019-08-06 | 华中科技大学 | A kind of three-dimensional column hole laser cutting method for glass |
| CN114269509A (en) * | 2019-07-26 | 2022-04-01 | 柯马杜股份有限公司 | Single crystal mineral gemstone provided with a cone for re-centering a pivot and method for making same |
| CN114367751A (en) * | 2020-10-14 | 2022-04-19 | 大族激光科技产业集团股份有限公司 | Method, device, equipment and medium for laser drilling of glass ceramics |
| CN114682932A (en) * | 2022-04-14 | 2022-07-01 | 强一半导体（苏州）有限公司 | Method for laser processing through hole suitable for green ceramic chip |
| CN114682932B (en) * | 2022-04-14 | 2024-02-09 | 强一半导体(苏州)股份有限公司 | Method for laser processing through holes suitable for green ceramic chips |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104759764B (en) | 2018-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104759764B (en) | A kind of method for drilling holes of glass | |
| CN104759759A (en) | Laser drilling method of glass substrate with chamfered through hole | |
| CN104722932B (en) | A kind of method for drilling holes of amorphous silicon solar cell substrate of glass | |
| WO2016188120A1 (en) | Full-laser grooving and scribing method of large-area copper indium gallium selenide thin-film solar cell module | |
| CN104741799B (en) | The method for drilling holes of hard brittle material | |
| CN107795282B (en) | Double control channel pulse jet ball tooth drill bit | |
| CN103056520A (en) | Laser drilling method | |
| CN110318677B (en) | Dry-hot rock high-energy hydraulic down-the-hole hammer jet reaming device | |
| CN102145448B (en) | Method for machining blind holes on high-hardness metal material in batches | |
| CN107829688B (en) | Jet-type PDC drill bit with rotary impact and vibration | |
| CN205464478U (en) | Removable drill bit of tool bit | |
| CN203470995U (en) | Drilling and broaching integrated polycrystalline diamond drill bit | |
| CN106825697A (en) | The two-way chamfering gang tool of one kind drilling and its method of work | |
| CN208396663U (en) | A kind of anti-return drilling rod with mechanical pressure sealing | |
| CN204533565U (en) | The hard seal butterfly valve of valve with changeable valve seat | |
| CN206605075U (en) | The two-way chamfering gang tool of one kind drilling | |
| CN204108420U (en) | Staight shank lengthens fluted drill | |
| CN208633787U (en) | A kind of unsymmetrical section spiral groove drilling rod | |
| CN219746640U (en) | Dust extraction mechanism for laser cutting machine | |
| CN203371087U (en) | Twist drill | |
| CN102287217B (en) | Hydraulic seam cutting porous slag discharge method | |
| CN207178731U (en) | A kind of gas ratio valve seals auxiliary structure | |
| CN206326165U (en) | A kind of chmfer bit | |
| CN104972163A (en) | Machining composite drill bit for riveting structure | |
| CN202180537U (en) | Thin wall drill |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |