CN104752590B - Has the solid luminous device of photoluminescence wavelength conversion - Google Patents
Has the solid luminous device of photoluminescence wavelength conversion Download PDFInfo
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- CN104752590B CN104752590B CN201410834944.9A CN201410834944A CN104752590B CN 104752590 B CN104752590 B CN 104752590B CN 201410834944 A CN201410834944 A CN 201410834944A CN 104752590 B CN104752590 B CN 104752590B
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Present application discloses the solid luminous device with photoluminescence wavelength conversion.A kind of solid luminous device includes: light transmission heat-conduction circuit board；Solid-state light emitters LED array is mounted at least one face of the circuit board and is electrically connected at least one described face of the circuit board；And photoluminescence wavelength transition components.The photoluminescence wavelength transition components include the mixture of the particle of at least one embedded photoluminescent material (phosphor) and the particle of light reflecting material.The transmitting product of described device includes the group light combination generated by the LED and the embedded photoluminescent material.The wavelength conversion component may include the layer that the particle of the phosphor material and light reflecting material of the LED array is directly applied in the form of encapsulant.Alternatively, the photoluminescent component is the independent assembly such as the tubular assembly around the LED, and it is located at the distant place of the LED array.
Description
The cross reference of related application
Present application is " the solid luminescent dress with photoluminescence wavelength conversion entitled filed on December 16th, 2013
It sets and label (" Solid-State Light Emitting Devices and Signage with
Photoluminescence Wavelength Conversion) " No. 14/108,163 U.S. patent application case part
It connects, the U.S. patent application case is the " solid-state with photoluminescence wavelength conversion entitled filed on October 4th, 2011
Light emitting device and label (Solid-State Light Emitting Devices and Signage with
Photoluminescence Wavelength Conversion) " No. 13/253,031 U.S. patent application case (now issue
Cloth is the 8th, 610, No. 340 United States Patent (USP)) connecting, the U.S. patent application case advocates mark filed on October 5th, 2010
Entitled " solid luminous device and label (Solid-State Light Emitting with photoluminescence wavelength conversion
Devices and Signage with Photoluminescence Wavelength Conversion) " the 61/390th,
The senior interests of No. 091 U.S. provisional patent application cases and advocate entitled filed on December 27th, 2010 " there is long-range phosphorus
Solid luminous device (the Solid-State Light Emitting Devices with Remote of body of light wavelength conversion component
Phosphor Wavelength Conversion Component) " No. 61/427,411 U.S. provisional patent application cases
Senior interest, all these application cases are incorporated to hereby with what is be cited in full text.
Technical field
The embodiment of the present invention is related to solid luminous device, is converted using photoluminescence wavelength with will be by solid-state light emitters
The light that (usually LED (light emitting diode)) generates is converted to the light of required color.
Background technique
White luminous LED (" White LED ") is known in technique and is relatively more recent innovation.It is attributed to it
Long operation lifetime desired value (> 50,000 hour) and high-luminous-efficiency (every watt of 70 lumens and higher), use more and more
High brightness White LED substitutes conventional fluorescent light source, small fluorescent light source and incandescent source.
Until developing the LED emitted in the blue/UV line part of electromagnetic spectrum, LED based white light source is developed
Just become practical.It is such as taught in such as the 5th, 998, No. 925 United States Patent (USP), White LED includes one or more luminescence generated by lights
Material (for example, phosphor material) is absorbed and is radiated by a part that the LED emits, and re-emits different color (wave
It is long) radiation.In general, LED chip or bare die generate blue light, and the phosphor absorbs the blue light of certain percentage, and again
Emit the combination of yellow light or green light and feux rouges, green light and yellow light, green light and orange light or yellow light and feux rouges.It is generated by the LED
It is not combined by the blue light components that the phosphor absorbs with the light by the phosphor emission, provides and human eye is rendered as approaching
The light of white.
The light emitted by the phosphor material is depended greatly on by the definite color that the LED light generates
Amount, this is because the combination of the amount (and wavelength) of the blue light of the amount (and wavelength) of the light of the phosphor emission and remnants determines institute
Obtain the color of light.Therefore, the phosphor of sufficient amount will be needed correctly to transport based on the LED matrix of phosphor for generate white light
Make, because the LED matrix based on phosphor for not having the phosphor material of sufficient amount, which will be unable to generate, is rendered as white
Light.
Problem is that phosphor material is relatively expensive, and therefore corresponds to the cost of LED matrix of the production based on phosphor
Major part.In general, the phosphor material and light transmitting material (such as silicone or epoxide resin material) in LED light are mixed
It closes, and the mixture directly applies to the light-emitting area of LED bare.This leads to be placed directly within the phosphor material in LED bare
The smaller footprint area layer of material, but it is still expensive in production, and this is partly due to the phosphor material it is high at
This.
As disclosed in U.S. patent application case US 200,8/0,218,992 A1 for giving Li, it is also known that by phosphor material
Expect the layer that is provided as on optical module, or phosphor material is merged in optical module, the optical module physically position
It is long-range in LED bare.This typically results in one layer of phosphorescence with the footprint area more much larger than method described in aforementioned paragraphs
Body material.Because of its larger size, it usually needs a greater amount of phosphors is to manufacture such " remote phosphors " LED matrix.Cause
This, it is also corresponding bigger to provide the cost of phosphor material of incrementss required for such remote phosphors LED matrix.Example
Such as, the 7th, 937, No. 865 United States Patent (USP) teaches solid luminescent mark, wherein the blue light from LED is for exciting luminescence scutcheon table
Phosphor material on face, to generate the light of required color.Typically must be present a large amount of phosphor materials could load the hair
The broad surfaces of cursor board, so that described device generates appropriate color for its be intended to exhibiting optical function.
Therefore, it is necessary to implement the improved method of LED illumination equipment, the required color attributes of device are maintained, but are not needed
Use a large amount of embedded photoluminescent materials (for example, phosphor material) needed in the conventional method.
The purpose of some embodiments of the present invention is to provide light emitting device, luminous sign, photoluminescence wavelength transition components
And luminescence generated by light sign surface, at least partly overcome the limitation of known devices.
Summary of the invention
The embodiment of the present invention is related to solid luminous device comprising solid-state light emitters (usually LED) array can be grasped
Make to generate exciting light (usually blue), the exciting light is for exciting luminescence generated by light wavelength conversion component, the photic hair
Light wavelength conversion component contains the particle that can excite the luminescence generated by light (for example, phosphor material) of blue light and light reflecting material (this
The mixture of particle in text also known as " light-scattering material ").The particle of light reflecting material is merged with phosphor material to be increased
The light of the luminescence generated by light of phosphor material is added to generate.It is believed that the light of increased luminescence generated by light, which generates, is originated from light reflecting material increase light
A possibility that collision of son and the particle of phosphor material.In some embodiments, it can be directed to and give comprising the light reflecting material
Surely emit product color and intensity the use of phosphor material is potentially reduced 33% and at most reduces 50%.
According to the one aspect of an embodiment, a kind of light emitting device includes: light transmission circuit board；First solid-state light emitters battle array
Column, are mounted on the first face of the light transmission circuit board and are electrically connected to the first face of the light transmission circuit board；And light
Photoluminescence wavelength conversion component comprising the mixing of the particle of the particle and light reflecting material of at least one embedded photoluminescent material
Object.The advantages of solid-state light emitters are mounted on light transmission circuit board are as follows: this realize from the front of the circuit board and below with
And the light emitting at the edge of circuit board, so that described device has generally theaomni-directional transmission characteristic.This emission characteristics is for wishing
Device for substituting incandescent lamp bulb is desirable.In certain aspects, described device further comprises the second solid-state light emitters
Array is mounted on the second face of light transmission circuit board and is electrically connected to the second face of light transmission circuit board.In general, illuminator
It is mounted on the opposite face of circuit board and is oriented with its main direction of the launch in the opposite direction.
For the heat that auxiliary dissipation is generated by luminous body array, light transmission circuit board preferably additionally has thermal conductivity.It is described to lead
Heater circuit plate be it is especially advantageous, wherein wavelength conversion component include directly apply to and cover the luminous body array or each
At least one luminescence generated by light of illuminator and the encapsulant of light-scattering material.To increase mechanical strength, the circuit board may include
Laminar structure with the thermally conductive light-transmitting layer for installing illuminator thereon, is supported on light-transmitting layer.In some embodiments,
At least part of light transmission circuit board includes translucency magnesia, sapphire, aluminium oxide, quartz glass, aluminium nitride or Buddha's warrior attendant
Stone.In addition to the heat that dissipation is generated by illuminator, the circuit board also provides for electric power to operate illuminator.In some realities
It applies in example, substrate further comprises the circuit being made of the pattern for providing the conductor rail on the face of substrate.For example, such
Rail can be made of copper, gold, silver or other good conductive materials.Imagining conductor rail in other embodiments includes light transmission conduction material
Material, such as tin indium oxide (ITO) or the like.
Photoluminescent component may include the luminescence generated by light for applying to the solid luminescence volume array or each solid-state light emitters
The mixture of the particle of material and light reflecting material.In general, photoluminescent component is in covering solid-state light emitters in such arrangement
The form of the encapsulant of array.
In other embodiments and for reduce from luminous body array to phosphor material heat transmitting, photoluminescent component with
Solid luminescent volume array or each solid-state light emitters separation and be located at solid luminescent volume array or each solid-state light emitters it is long-range.?
In present application, " long-range " and " remotely " indicates to be physically isolated by (for example) the air gap or light transmission medium.
Its arrangement shape directly contacted with integral part and phosphor material that wherein wavelength conversion component is device with solid-state light emitters
In contrast with.In remote phosphors arrangement, phosphor material is distributed in more much bigger than the area of the light-emitting area of luminous body array
Area on.This arrangement ensures that the light of color more evenly generates.The phosphor material is separated with the solid-state emitters and is subtracted
The heat transmitting of the phosphor material is arrived less, and reduces the thermal degradation of the phosphor material, and the surface of wavelength conversion component has
Sharp ground can be positioned at away from the solid luminescent volume array at least distance of 5mm.In such aspect, wavelength conversion component can be wrapped
The mixture for including embedded photoluminescent material thereon and light reflecting material is provided as the Light-transmissive substrate of at least one layer.In another arrangement
In, the wavelength conversion component includes the mixture with the phosphor and light reflecting material being evenly distributed throughout its volume
Light-transmissive substrate.Preferably, the Light-transmissive substrate includes thermoplastic material, the thermoplastic material include polycarbonate,
Acrylic acid, PVC (polyvinyl chloride), nylon, HDPE (high density poly propylene), polyethylene, PET (polyethylene terephthalate) or
POM (polyformaldehyde).Alternatively, it may include epoxy resin, silicone or glass.In some embodiments, photoluminescent component includes
Pipe substantially cylindrical in shape, wherein luminous body array is positioned along the axis of component.This component preferably passes through injection-molded extrusion
Manufacture.It, can be by silk-screen printing by the mixing in the case where the mixture of phosphor and light reflecting material is formed by one layer
Object applies to the surface of substrate.It will be described mixed alternatively, (dotor blading) can be coated by ink jet printing, spin coating or scraper
Object is closed to be deposited on substrate.When the component is by squeezing out manufacture, phosphor/light reflecting material can be squeezed out jointly.
In some embodiments, light reflection/scattering material in the wavelength conversion component has and is selected so that
Compared with the shorter-wavelength light that the particle is generated scattering by the phosphor material, by scattering phase to more longer wavelengths
The granularity of blue excitation light.For example, the optical reflection particle size, which may be selected so that, will scatter compared with the particle by described
The light that at least one phosphor material generates, by scattering phase to the blue light of at least twice.This ensures to scatter from the wavelength
The higher proportion of blue light of conversion layer transmitting, to increase a possibility that photon is interacted with phosphor material particle, and causes to produce
The light of third contact of a total solar or lunar eclipse photoluminescence.Meanwhile light can be by being scattered a possibility that phosphor generates, is lower.The particle of light reflecting material
The light generated relative to luminescence generated by light scatters the degree of exciting light depending on granular size.It for example, include indigo plant in exciting light
In the case that light and luminescence generated by light include green-yellow light, light reflecting material advantageously has at 0.01 μm to the particle in 10 μ ms
Size.It is highly preferred that light reflecting material has in 0.01 μm to 0.1 μm and more preferably in 0.1 μm to 1 μm of range
Grain size.
Preferably, light reflecting material is loaded in 0.01% to the weight percent of at least one embedded photoluminescent material and arrives
10%；0.01% to 1%；In 0.1% to 1% and 0.5% to 1% range.
Phosphor material in some embodiments preferably have in the range from 2 μm to 60 μm and usually 10 μm to
Granular size in 20 μm of range.It is believed that in some embodiments, the granular size of the light reflecting material is preferably smaller than institute
At least 10 times of granular size for stating phosphor material are advantageous.
To improve visual appearance of the wavelength conversion component in " off state ", light emitting device can further comprise adjacent to
The light diffusion layer of photoluminescence wavelength transition components.Light diffusion layer is conventionally positioned at observer and photoluminescence wavelength transition material
Between.Such as the optical reflection particle merged with phosphor, light diffusion layer may include the particle of light reflecting material, and the particle has
Granularity to reflect the light that is generated by least one embedded photoluminescent material compared with the particle, scattering phase is to more by solid
The excitation light that state illuminator generates.In such embodiments, light reflecting material has the particle in 100nm to 150nm range
Size.
In some embodiments, the solid-state light emitters include LED, and the LED can be operated to generate to have and arrive in 440nm
The blue light of peak wavelength in the wave-length coverage of 480nm.Alternatively, the solid-state light emitters may include two pole of laser or laser
Pipe.
Detailed description of the invention
To more fully understand the present invention, and lets us now refer to the figures and only describe consolidating for embodiment according to the present invention as example
State light emitting device and mark, in the accompanying drawings:
Fig. 1 is schematically showing according to the LED based light emitting device of the embodiment of the present invention；
Fig. 2 is the schematic diagram for illustrating the operating principle of known luminescence device；
Fig. 3 is the schematic diagram of the operating principle of the light emitting device of explanatory diagram 1；
Fig. 4 is the light reflecting material that LED based light emitting device according to the present invention loads different weight percentage
Emissive porwer to the plot (plot) of coloration (chromaticity) CIE x；
Fig. 5 is schematically showing for the LED based light emitting device of alternate embodiment according to the present invention；
Fig. 6 is schematically showing according to the LED based light emitting device of another embodiment of the present invention；
Fig. 7 is schematically showing according to the LED based light emitting device of further embodiment of the present invention；
Fig. 8 is the schematic diagram of the operating principle of the light emitting device of explanatory diagram 7；
Fig. 9 is the schematic diagram according to the phosphor wavelength transition components of the embodiment of the present invention；
Figure 10 is the schematic diagram according to the phosphor wavelength transition components of another embodiment of the present invention；
Figure 11 shows plot of the scattering of light relatively for optical diffraction granular size (nm) of feux rouges, green light and blue light；
Figure 12 illustrates LED based light emitting device according to a further embodiment of the invention；
Figure 13 illustrates the cross-sectional view of the LED based light emitting device of Figure 12 according to a further embodiment of the invention；
Figure 14 illustrates the schematic cross-sectional A-A of omnidirectional's LED based light emitting device according to another embodiment of the present invention
Side view and partial cross plan view；
Figure 15 a and 15b illustrate the side partial cross sectional B-B of the LED based light bulb of the light emitting device using Figure 14 respectively
View and plan view；
Figure 16 a and 16b illustrate the side partial cross sectional C-C of the LED based light bulb of the light emitting device using Figure 14 respectively
View and plan view；
Figure 17 a, 17b and 17c illustrate the partial cross sectional D- of the LED based light bulb of the light emitting device using Figure 14 respectively
D side view, partial cross sectional E-E side view and plan view；
Figure 18 illustrates the schematic cross-sectional F-F of omnidirectional's LED based light emitting device according to another embodiment of the present invention
Side view and partial cross plan view；
Figure 19 a and 19b show omnidirectional's base according to another embodiment of the present invention of the light engine using Figure 19 respectively
In the decomposition perspective view and cross section G-G view of the light emitting device of LED；
Figure 20 illustrates the diagrammatic side view and plan view of LED based light engine；And
Figure 21 is the partial cross sectional view using the LED based light bulb of the light emitting device of Figure 19 a and 19b.
Specific embodiment
The embodiment of the present invention is to be directed to the solid luminous device including multiple solid-state light emitters (usually LED), described
Multiple solid-state light emitters can be operated to generate exciting light (usually blue light), be used for excite containing embedded photoluminescent material (such as
The phosphor material of blue light can be excited) particle wavelength conversion component.In addition, the wavelength conversion component includes with mixture
The particle of light reflecting material (also referred to as " light-scattering material ") that merges with the phosphor material of form, to increase
The light of the luminescence generated by light carried out by the phosphor material by force generates.It is believed that the light of enhancing, which generates, is originated from (result from) institute
State the number that light reflecting material increases the particles collision of excitation photon and the phosphor material.Final result is reduced for having
The phosphor material of the light emitting device for the transmitting color being allowed a choice uses.
For illustration purposes only, it is described below with reference to the embedded photoluminescent material for being embodied as phosphor material.So
And it present invention can be suitably applied to any kind of embedded photoluminescent material, such as phosphor material or quantum dot.Quantum dot is substance
A part of (for example, semiconductor), exciton are limited in all three Spatial Dimensions, and the exciton can be by radiation energy
Amount is excited to emit the light of specific wavelength or wave-length coverage.Thus, except the non-claimed wavelength conversion component based on phosphor, otherwise
The present invention is not limited to the wavelength conversion components based on phosphor.In addition, in the specification, same reference numbers are used for
Indicate same section.
Fig. 1 shows schematically showing for the LED based white light emitting device 10 of embodiment according to the present invention.Device 10
Including blue-light-emitting LED 12 and the photoluminescence wavelength transition components 14 long-range positioned at the LED.As demonstrated, wavelength convert
Component 14 may include light-transmissive window (substrate) 16, have phosphor converted layer 18 at least one side.Phosphor converted layer
18 include that can excite the particle of the phosphor material 20 of blue light, the particle of light reflecting material 22 and light transmission adhesive material 24
Mixture.Light-transmissive window 16 may include any light transmitting material, such as polymer material, for example, polycarbonate, acrylic acid, silicon
Ketone or epoxy resin or glass (such as quartz glass).In general, light-transmissive window 16 is plane, usually in order to easy to manufacture
Discoidal shape, but its may depend on to be applied and be square, rectangle or other shapes.In the light-transmissive window one
It is in discoidal situation in a little embodiments, diameter can be area in 0.8cm between about 1cm and 10cm2With 80cm2Between
Optical aperture.In alternative embodiments, it is contemplated that light-transmissive window 16 includes with the optical module of selected direction guidance light, example
Such as convex lens or concavees lens.To reduce the heat transmitting from LED 12 to wavelength conversion component 14, the phosphor material is especially arrived
Heat transmitting, it is long-range that the wavelength conversion component is located at the LED, is physically separated the distance L of at least 5mm.Reality of the invention
Example is applied to be related to wherein remotely providing the wavelength conversion component and (more importantly) dress of the phosphor material in the LED
It sets, to reduce the heat transmitting from the illuminator to the phosphor material.In the context of present application, remote table example
Such as it is physically isolated with the air gap or light transmission medium.It will be appreciated that, in remote phosphorescence body device, the phosphor material
Material is distributed in the area of the light-emitting area than the LED (for example, 0.03cm2) on much larger area (for example, 0.8cm2
To 80cm2).In general, the phosphor material is distributed at least 50 times (typically at least 100 of the light-emitting area of the LED
On area again).
Blue led 12 may include the LED based on GaN (based on gallium nitride), can operate to generate to have and arrive in 440nm
The peak wavelength λ of (usually 465nm) in the wave-length coverage of 480nm1Blue light 26.Blue led 12 is configured to be swashed with blue
Shine 26 illumination wavelength transition components 14, absorbs certain proportion by phosphor material 20, and emit different wave length in response
λ2Light 28, generally for cool white light emitting device be it is yellow-green.(it is configured to be rendered as the transmitting product 30 of device 10
White) include light emitted by the LED 26 with the light 28 generated by phosphor material 20 combination.
Phosphor material 20 and light reflecting material 22 (it is in powder type) are by known proportion and light transmission adhesive material
24 are thoroughly mixed, and light transmission adhesive material 24 is, for example, polymer material (for example, heat solidifiable or UV curable silicone or ring
Oxygen resin material) or transparent ink, such asThe transparent over print PSLC-294 of the curable stone plate of UV.The mixture is made
The face of window 16 is applied to for one or more layers with uniform thickness.In a preferred embodiment, the mixture passes through silk screen
It prints and applies to the light-transmissive window, and the thickness t of the layer is controlled by print pass.As will be for fields
Technical staff it is clear that other methods can be used to apply for the mixture of the phosphor/reflecting material covers, comprising ink jet printing,
Spin coating, or swept away the mixture in (for example, blade coating) on the surface using scraper (such as scraper plate).
In a further embodiment, it is contemplated that close the mixture of phosphor and light reflecting material in the light-transmissive window
And.For example, the phosphor and light reflecting material mixture can be with light transmission mixed with polymers, and the polymer/phosphors
Mixture is extruded or injection-molded, with formed there is the volume throughout the component and the phosphor that is evenly distributed and
The wavelength conversion component 14 of light reflecting material.
So that the phosphor material is located at the LED and many advantages are provided at a distance, such as reduces the phosphor material
Thermal degradation.In addition, directly contacting the light-emitting area of the LED bare in contrast to the wherein phosphor material and the dress that provides
It sets, the phosphor material is provided at a distance and reduces the light absorbed by the LED bare backscatter.In addition, making the phosphorescence
Body is remotely located to realize the light for generating more consistent color and/or CCT, because described in contrast to the phosphor to be provided directly in
On the light-emitting area of LED bare, the phosphor material is to provide on much bigger area.
The phosphor material may include inorganic or organic phosphor, such as ordinary compositions A3Si(O,D)5Or A2Si(O,
D)4The phosphor based on silicate, wherein Si is silicon, and O is oxygen, and A includes strontium (Sr), barium (Ba), magnesium (Mg) or calcium (Ca), and
D includes chlorine (Cl), fluorine (F), nitrogen (N) or sulphur (S).The example of phosphor based on silicate is disclosed in following United States Patent (USP):
" europkium-activated green phosphor (the Europium activated silicate-based based on silicate of US 7,575,697
Green phosphor) " (Intematix Corp. is given in transference)；" the yellow phosphorus based on silicate of two-phase of US 7,601,276
Body of light (Two phase silicate-based yellow phosphor) " (Intematix Corp. is given in transference)；US 7,
601,276 " orange phosphors (Silicate-based orange phosphor) based on silicate " (give by transference
Intematix Corp.) and " yellow-green phosphor (Silicate-based based on silicate of US 7,311,858
Yellow-green phosphor) " (Intematix Corp. is given in transference).The phosphor may also include based on aluminate
Material (such as we are the same as the US2006/0158090 patent application case " green phosphor based on aluminate in application
No. 7,390,437 patent " blue phosphorescents based on aluminate of (Aluminate-based green phosphor) " and US
Is taught in body (Aluminate-based blue phosphor) " (transference give Intematix Corp.)), alumina silicate phosphorescence
Body is (such as with the US2008/0111472 application case " orange red phosphor (Aluminum- of alumina silicate in application
Silicate orange-red phosphor) " in teaching) or based on nitride red phosphor material (such as the 8th,
It is taught in No. 274,215 United States Patent (USP)s).It will be appreciated that, the phosphor material is not limited to example described herein, and can
Including any phosphor material, comprising nitride and/or sulfate phosphor materials, oxynitride and oxygen sulfate phosphor or
Garnet material (YAG).
The phosphor material includes substantially having 10 μm to 20 μm and the usually ball of the diameter of 15 μm of orders of magnitude
The particle of shape shape.The phosphor material may include the particle of 2 μm to 60 μm of size.
Light reflecting material 22 includes the dusty material with high reflectance (usually 0.9 or higher reflection coefficient).
The granular size of the light reflecting material is usually in 0.1 μm to 10 μm of range, and in a preferred embodiment at 0.1 μm to 10
μm range in.Light reflecting material is loaded in 0.1% to 10% range the weight percent of phosphor material, and excellent
It selects in embodiment in 1% to 2% range.The example of light reflecting material includes magnesia (MgO), titanium dioxide (TiO2)、
Barium sulfate (BaSO4) and combinations thereof.The light reflecting material may also include white ink, such as Norcote
The super white ink GN-027SA of International Inc. has included height light reflecting material (usually TiO2)
Particle.
Before the operation of description the device of the invention, reference Fig. 2 is described to the operation of known luminescence device, Fig. 2 is shown
Utilize the schematic diagram of the light emitting device based on cool white LED of phosphor wavelength conversion.As the device of the invention, it is described
Know that device includes wavelength conversion component 18, the equally distributed phosphor material it includes the volume throughout light transmission adhesive 24
Particle 20.Different from the device of the invention, the known devices and the particle for not including light reflecting material.In operation, it comes from
The blue light 26 of the LED is transmitted by light transmission adhesive 24, until it hits the particle of phosphor material.It is believed that photon and phosphorescence
The interaction of body material granule averagely only have a ten thousandth cause luminescence generated by light light absorption and generation.Photon and phosphor particles
The major part (about 99.99%) of interaction lead to the scattering of the photon.It is attributed to the isotropism essence of scattering process, it is average
The scattered photon of half will be in the direction back towards the LED.About the 10% of the usually whole incident blue lights of test instruction exists
It scatters and emits from the wavelength conversion component back towards in the direction of the LED.For cool white light emitting device, phosphor
The amount of material is selected to allow about the 10% of whole incident blue lights to be transmitted through the window, and facilitates the shape of transmitting product
At.The light 28 that the major part (about 80%) of the incident light is absorbed by the phosphor material, and re-emitted as luminescence generated by light.
It is attributed to the isotropism essence that the light of luminescence generated by light generates, the light 28 of about half generated by the phosphor material will be in court
Emit into the direction of the LED.As a result, at most (↑) 40% of whole incident lights will be emitted as wavelength X2Light 28, and facilitate
Emit the formation of product 30, and at most (↑) 40% of whole incident lights will be emitted as wave in the direction back towards the LED
Long λ2Light 28.In general, being rebooted towards the light that the LED emits by reflecting mirror (not shown), to increase described device
Overall efficiency.
Referring now to the operation of the cool white light emitting device 10 of Fig. 3 description according to some embodiments of the present invention, Fig. 3 display diagram
The schematic diagram of the operation of 1 device.The operation of the device of the invention is similar to the operation of Fig. 2, but extraly comprising by the light
The reflection of reflection/scattering material particle or scattering light (wavelength λ1And λ2).By the inclusion of light reflecting material and the phosphor
The particle of material, the amount of phosphor material needed for this can reduce the transmitting product of the given color of generation, for example, in some implementations
Up to 33% is reduced in example.It is believed that the particle of light reflecting material increases a possibility that particle of photon strikes phosphor material, and
Therefore for the transmitting product of given color, less phosphor material is needed.
Fig. 4 be according to the light emitting devices of some embodiments of the present invention for ◆ -0%, ■ -0.4%, ▲ -1.1% and
● plot of the emissive porwer that the weight percent of -2% light reflecting material loads to chrominance C IE x.Data are for silk
Wire mark brush phosphor converted layer, wherein adhesive material includeThe transparent over print PSLC-294 of the curable stone plate of UV, and
The phosphor material includes the phosphor EY4453 of Intematix company, with 15 μm of mean particle size.Phosphor
Material is 2:1 to the weight ratio of transparent ink.The light reflecting material includes Norcote International Inc.
Super white ink GN-027SA.The number for loading light reflecting material refers to super white ink to the weight percent of transparent ink
Than.Smaller reference number relevant to each data point indicates to form the number of print pass used in the phosphor layer
"n".It will be appreciated that, the number of print pass is directly proportional to the quantity of the thickness of phosphor layer 18 and phosphor.Ellipse 32,34,36,
38 for drawing a circle to approve the data point of the transmitting product with substantially the same intensity and CIE x value.For example, instruction similar strength and color
The ellipse 32 of color transmitting product can be generated for the phosphor converted layer 18 including following items: i) in no light reflecting material
In the case where, print 3 times and ii) in the case where the light reflecting material that 2% loads, it prints 2 times.The instruction of these data passes through
Comprising the light reflecting material that 2% weight loads, can be used includes that about the phosphor converted layer 18 of 33% phosphor material produces less
The light of raw same hue and intensity.Indicate that the ellipse 34 of the transmitting product of same intensity and color is directed to the phosphorus including following items
Body of light is converted and is generated: i) in the case where no light reflecting material, being printed 4 times and ii) in the light reflecting material of 0.4% loading
In the case where material, print 3 times.The instruction of these data is for this embodiment, the light reflecting material loaded by the inclusion of 0.4% weight
Material, can be used includes that the phosphor converted layer for the phosphor for about lacking 25% generates the light of same hue and intensity.It indicates identical strong
The ellipse 36 of the transmitting product of degree and color is directed to the phosphor converted layer including following items and generates: i) having light reflecting material
In the case where material, print 4 times and ii) in the case where the light reflecting material that 1.1% loads, it prints 3 times.The instruction of these data,
By the inclusion of the light reflecting material that 1.1% weight loads, can be used includes that about the phosphor converted layer of 25% phosphor produces less
The light of raw same hue and intensity.Indicate that the ellipse 38 of the transmitting product of same intensity and color is directed to the phosphorus including following items
Body of light conversion layer generates: i) in the case where the light reflecting material that 0.4% weight loads, printing 4 times and ii) it is filled in 2% weight
In the case where the light reflecting material of load, print 3 times.The instruction of these data, the light reflecting material loaded by the inclusion of 0.4% weight
Material, can be used includes that the phosphor converted layer for the phosphor for about lacking 25% generates the light of same hue and intensity.Point 40 (n=4,
1.1% loads) and 42 (n=4,2% load) imply the presence of full chalaza, be more than the full chalaza, the increasing that light reflecting material loads
Add the reduction for leading to emissive porwer and minimum to influence of color.
Fig. 5 is schematically showing for LED based white light emitting device 10 according to another embodiment of the present invention.Herein
In embodiment, Light-transmissive substrate 16 is configured to light guide (waveguide), and phosphor converted layer 18 is provided in a face of the substrate
On (light-emitting surface).In general, substrate 16 is substantially planar, and depending on application can be disc, square, rectangle or other
Shape.In the case where the substrate is discoidal situation, the diameter can correspond to about 20cm usually between about 5cm and 30cm2
With about 700cm2Between area light-emitting surface.It is square in the substrate shape or in the case where rectangle, each side can be usual
Between about 5cm and 40cm, correspond to about 80cm2With about 5000cm2Between light-emitting surface.In the non-luminescent face of substrate 16 (such as institute
The underlying surfaces of explanation) on, it is possible to provide one layer of light reflecting material 44 is to prevent the light emitting from described device rear.Reflecting material
Material 44 may include metal coating, such as chromium or glossiness white material, such as plastic material or paper.To make from the substrate
The light of edge-emission minimizes, and the edge of the substrate preferably includes light reflective surface (not shown).One or more blue leds
12 are configured to for blue light 26 being coupled in one or more edges of substrate 16.In operation, the light 26 being coupled in substrate 16
The whole volume throughout substrate 16 is guided by total internal reflection.Shining for the substrate is hit to be greater than the angle of critical angle
The light 26 in face will be transmitted through the light-emitting surface, and enter in phosphor wavelength conversion layer 18.The operation and ginseng of described device
The operation for examining Fig. 3 description is identical.As indicated in figure 5, to leave the light that the phosphor of the direction transmitting of the light-emitting surface generates
46 can reenter substrate 16, and finally will be emitted through light-emitting surface due to the reflection of reflection layer 44.It is sent out from described device
The final illumination product 30 penetrated is the blue light 26 generated by the LED and the wavelength generated by the phosphor wavelength conversion layer 18
The combination of the light 28 of conversion.
Fig. 6 is the schematic diagram of the LED based white light emitting device 10 of substitution, and wherein Light-transmissive substrate 16 is configured to light guide
(waveguide).In this embodiment, phosphor converted layer 18 is provided on the face opposite with light-emitting surface of the substrate, and light reflects
Layer 44 is provided on phosphor converted layer 18.
Fig. 7 shows the schematic diagram of LED based white light emitting device 10 according to a further embodiment of the invention.Herein
In embodiment, wavelength conversion component 14 is light reflection, and including light reflective surface 48, applies cover phosphor converted layer 18 thereon.
As demonstrated, light reflective surface 48 may include parabolic surface, but it may also include any surface, include plane, convex surface and recessed
Face.To make to maximize from the light emitting of described device, the light reflective surface has reflectivity as far as possible, and preferably has at least
0.9 reflection coefficient.The light reflective surface can include: polished metal surface, such as silver, aluminium, chromium；Light reflective polymer；Light
Reflecting paper or light reflection coating.To help the dissipation of heat, the light reflective surface is preferably thermally conductive.
The operation of the light emitting device of Fig. 7 is illustrated in Figure 8, and because of the operation that it is similar to Fig. 3, so being not described in detail.
It will be appreciated, however, that because the LED light 26 of average up to half will propagate through the phosphor converted layer twice, phosphorescence
The thickness of body conversion layer 18 can in contrast to the arrangement (Fig. 1 and 5) with light transmission wavelength conversion component and at most half, that is,
t/2.Due to providing the phosphor material on light reflective surface, so can be on phosphor material uses with up to about
The transmitting product of same hue is realized in 50% further potential reduction.It will be appreciated that, the embodiment of Fig. 6 is operationally with Fig. 7's
Operate similar, Light-transmissive substrate 16 is used to LED light 26 being directed to phosphor converted layer 18.
Although the present invention is described about light emitting device, the principle of the present invention applies also for utilizing luminescence generated by light wave
It is long to convert to generate the solid luminescent label of the transmitting light of required color, such as with the 7th, 937, No. 865 U.S. in application
Disclosed in patent, content is incorporated herein by reference.It will be appreciated that, in such luminous sign, wavelength convert group
Part 14 can be used as the luminescence generated by light sign surface, to generate the signage information of required color.Phosphor material and light reflecting material
The mixture of material can be configured to pattern, to define image, picture, letter, number, device, pattern in the Light-transmissive substrate
Or other signage informations.Alternatively, the shape of the sign surface is (that is, the light transmission for example, required for cutting type text
Substrate) it can be configured to define signage information.The present invention is in the label application that the area of sign surface is several hundred square centimeters
Especially advantageous, this requires the phosphor material to be distributed in 100cm2Minimum area on (10cm × 10cm), and it is more generally super
Cross several hundred square centimeters or even thousands of square centimeters.
The mark can be backlight, that is, after the LED is located at the sign surface in such as lamp box, and the sign surface
It covers the lamp box opening and provides.In general, the sign surface is located at away from the LED at least about distance of 5mm.Alternatively,
The mark can be for edge-illuminated, and the Light-transmissive substrate is configured to light guide, and phosphor material and light reflecting material
Mixture is provided at least part of the light-emitting surface of the light guide.
In some embodiments, the light reflecting material includes titanium dioxide (TiO2), but it may also comprise other materials,
Such as barium sulfate (BaSO4), magnesia (MgO), silica (SiO2) or aluminium oxide (Al2O3).In some embodiments, institute
Stating light reflecting material has the mean particle size in 1 μm to 50 μm of range, and more preferably in 10 μm to 20 μm of model
In enclosing.
In some embodiments, the granular size having for light reflection/scattering material in the wavelength conversion component
The light for generating scattering by the luminescence generated by light (phosphor) material compared with the particle is selected so that, by scattering phase to more
More excitation (usually blue) light.For example, the optical reflection particle size may be selected so that compared with the particle will scatter by
The light that at least one described phosphor material generates, by scattering phase to the exciting light of at least twice.This ensures to scatter higher
The blue excitation light of ratio to increase a possibility that photon is interacted with phosphor material particle, and causes to generate luminescence generated by light
Light.Meanwhile light can be by being scattered a possibility that phosphor generates, is lower.
Because the method can further increase a possibility that blue photons are interacted with phosphor material particle, it is therefore desirable to compared with
Few phosphor material is to generate selection transmitting color.This arranges the luminous efficiency that can also increase the wavelength conversion component/device.
In some embodiments using blue (400nm to 480nm) exciting light, the light reflecting material has less than about 150nm's
Mean particle size, and usually there is the mean particle size in the range of 100nm to 150nm.
Light reflection/the scattering material (that is, for preferentially scattering blue light) can be in material identical with the phosphor material
It is embodied in the bed of material.
Alternatively, the light reflection/scattering material can be placed in point adjacent to or close to the layer with the phosphor material
On absciss layer.For example, wavelength conversion component 136 includes light in order according to some embodiments of the present invention and as demonstrated in Figure 9
Transmissive substrate 142；Reflection layer 144, contains optical reflection particle；And wavelength conversion layer 146, contain one or more phosphors
The mixture of (luminescence generated by light) and light reflecting material.As shown in Figure 9, wavelength conversion component 136 is arranged such that in operation,
Wavelength conversion layer 146 faces the LED.According to some embodiments of the present invention, wavelength conversion component 136 can include light in order
Transmissive substrate 142；Reflection layer 144, contains optical reflection particle；And wavelength conversion layer 146, contain one or more phosphors
(luminescence generated by light) material.
Light-transmissive substrate 142 can be any material substantially transmitted to the light in the wave-length coverage of 380nm to 740nm,
It and may include light transmission polymer (such as polycarbonate or acrylic acid) or glass (such as borosilicate glass).In some implementations
In example, substrate 142 is including diameterAnd thickness t1The usually plane disc of 0.5mm to 3mm.In other embodiments
In, the substrate may include other geometries, such as protrusion or recessed shape, such as cheese or cylinder.
Light diffusion layer 144 includes light reflecting material (preferably titanium dioxide (TiO2)) particle uniform layer.
In alternative arrangement, the light reflecting material may include barium sulfate (BaSO4), magnesia (MgO), silica (SiO2), oxidation
Aluminium (Al2O3) or dusty material with as high as possible reflectivity (usually 0.9 or higher reflection coefficient).The light is anti-
It penetrates material powder to be thoroughly mixed with known proportion and light transmission liquid adhesive agent material, to form suspension, and resulting mixing
Object is preferably deposited on the face of substrate 142 by silk-screen printing, to form the thickness t for the entire surface for covering the substrate2
The conforming layer of (usually in 10 μm to 75 μm of range).In light diffusion layer 144, the amount of the optical diffraction material of per unit area
It will be usually in 10 μ g.cm-2To 5mg.cm-2Range in.
Although silk-screen printing is the preferred method for depositing light diffusion layer 144, also other technologies can be used to deposit for it, such as
Cutter painting is scraped in trough pattern coating (slot die coating), spin coating, roller coating, pull-down coating (drawdown coating)
It applies.Described adhesive material may include curable liquid polymer, such as fluoropolymer resin, monomer resin, acrylic acid, asphalt mixtures modified by epoxy resin
Rouge (polyepoxide), silicone or fluorinated polymer.Described adhesive material is in its solid state to by the phosphor material
The light for all wavelengths that material and the LED are generated, which substantially transmits, to be important, and (380nm is arrived preferably for visible spectrum
800nm) there is at least 0.9 transmission coefficient.Described adhesive material is preferably UV curable, but it can also be for can thermosetting
Changing, solvent-based or combinations thereof.UV curable or the adhesive of heat cure can be preferably as being different from based on solvent
Material, not during polymerization " outgassing (outgas) ".In one arrangement, average of the optical diffraction material
Grain size is in 5 μm to 15 μm of range, but as described above, can also be in the nanometer range (nm), and preferably arrives in 100nm
In the range of 150nm.Light reflecting material loads usually in 7% to 35% range the weight percent of liquid adhesive.
Wavelength conversion layer 146 is directly contacted with light diffusion layer 144 and is deposited, i.e., no any intermediary layer or the air gap.
The phosphor material (it is in powder type) is thoroughly mixed with known proportion and liquid light transmission adhesive material, outstanding to be formed
Supernatant liquid, and resulting phosphor composition (" phosphor inks ") is deposited directly on reflecting layer 144.The wavelength conversion layer is excellent
Selection of land is deposited by silk-screen printing, but other deposition techniques can also be used, such as trough pattern coating, spin coating or blade coating.
To eliminate the optical interface between wavelength conversion layer 146 and reflecting layer 144, and maximize the light transmission between this two layers, it is excellent
Selection of land manufactures two layers using same liquid adhesive material；That is, fluoropolymer resin, monomer resin, acrylic acid, epoxy resin,
Silicone or fluorinated polymer.
The further example of phosphor wavelength transition components 136 according to the present invention is illustrated in Figure 10.With the wavelength of Fig. 9
Transition components are the same, and the component includes Light-transmissive substrate 142, light diffusion layer 144 and wavelength conversion layer 146.According to the present invention,
Light diffusion layer 144 and wavelength conversion layer 146 are in direct contact with one another and deposit.Similarly, in operation, the component is configured and makes
Obtaining the wavelength conversion component is arranged such that wavelength conversion layer 146 in face of the LED.
In operation, the blue excitation light 128 generated by the LED propagates through wavelength conversion layer 146, until its shock
The particle of phosphor material.It is believed that the interaction of photon and phosphor material particle averagely only has a ten thousandth to lead to luminescence generated by light
The absorption and generation of light 138.The major part (about 99.99%) of the interaction of photon and phosphor particles leads to dissipating for the photon
It penetrates.It is attributed to the isotropism essence of scattering process, the photon of average half will dissipate in the direction back towards the LED
It penetrates.About the 10% of the usually whole incident blue lights 128 of test instruction is in the direction back towards the LED from wavelength conversion component
136 scatterings and transmitting.For cool white light emitting device, the amount of phosphor material is selected to allow the pact of whole incident blue lights
10% emits from the wavelength conversion component, and facilitates the formation of transmitting product 140.The major part (about 80%) of the incident light
The light 138 for being absorbed, and being re-emitted as luminescence generated by light by the phosphor material.It is attributed to the isotropism that luminescence generated by light generates
The light 138 of essence, about half generated by the phosphor material will be launched in the direction towards the LED.As a result, complete
Portion's incident light only at most about 40% will be emitted as wavelength X2Light 138, and facilitate transmitting product 138, wherein whole incident light
Remainder (at most about 40%) wavelength X will be emitted as in the direction back towards the LED2Light 138.Turn from wavelength
It changes component 136 to be rebooted towards the light that the LED emits by the light reflective surface of reflective chamber, to facilitate the transmitting product
Formation, and increase described device overall efficiency.
The hair for generating selected color can be substantially reduced by adding the light diffusion layer 144 being made of the particle of light reflecting material
The amount of phosphor material needed for penetrating light.Diffusion layer 144, which will increase photon and reflecting light back into wavelength conversion layer 146, to lead
Cause a possibility that generating the light of luminescence generated by light.It is given that reflecting layer comprising directly contacting with the wavelength conversion layer can reduce generation
The amount of phosphor material needed for the transmitting product of color, such as up to 40% is reduced in some embodiments.
It is therefore contemplated that configuration light diffusion layer, so that scattering the light generated by the phosphor material, selectivity compared with it
Ground scatters the blue excitation light more generated by the LED.This light diffusion layer ensures to emit from the wavelength conversion layer higher
The blue light of ratio will be scattered, and be led back in the wavelength conversion layer by the light reflecting material, to increase the photon
A possibility that being interacted with phosphor material particle, and lead to the light for generating luminescence generated by light.Meanwhile the light that phosphor generates can be by
The lower possibility of scattering passes through the diffusion layer.It is interacted because the diffusion layer increases blue photons with phosphor material particle
A possibility that, therefore generate selected transmitting color and need less phosphor material.
In addition, this arrangement can also increase the luminous efficiency of the wavelength conversion component/device.By proper choice of the light
The mean particle size of scattering material can configure the light diffusion layer and it made to scatter blue light than scattering other colors (i.e. green
And red) be easier.Figure 11 shows the scattering control of the light relatively TiO of feux rouges, green light and blue light2The mark of mean particle size (nm)
It draws.Such as can be seen from figure 11 that, there is the TiO of the mean particle size of 100nm to 150nm2Particle will scatter green light compared with it
(510nm to 550nm) or feux rouges (630nm to 740nm), scattering blue light (450nm to 480nm) can exceed that twice.For example, tool
There is the TiO of the mean particle size of 100nm2Particle will scatter green light or feux rouges compared with it, will be with nearly three times of (2.9=0.97/
0.33) more blue lights are scattered.For the TiO of the mean particle size with 200nm2Particle, will scattering green light or red compared with it
Light, the blue light by scattering more than twice (2.3=1.6/0.7).According to some embodiments of the present invention, the optical diffraction particle
Size is preferably selected so that the relatively more at least twice of light that the particle is generated scattering ratio by the phosphor material
Blue light.Comprising by optical reflection particle (compared with the light of the wavelength generated by the phosphor material, preferential scattering correspond to by
The light for the wavelength that the LED is generated) concept of wavelength conversion component of reflection layer of composition is objectively considered to be invention
's.
Therefore, the light reflection/scattering material can adjacent to or close to one layer of the list comprising the phosphor material
Only layer embodies.The independent reflection layer, which can be used for substituting, is mixed into light reflection/scattering material and the phosphor material phase
With layer in, and/or in addition to light is reflected/scattering material be mixed into layer identical with the phosphor material other than and make
With.The reflection that can be used the light reflecting material mixed with the phosphor material identical or different in individual reflection layer
Material.
Inventive concepts disclosed herein can be applicable to the wavelength conversion component for covering any suitable shape.For example, examining
Consider the LED light device 200 illustrated in Figure 12 and 13, shows the Solid-state light bulb of substitution incandescent lamp bulb.
LED light device 200 includes illumination base 204, and it includes screw bases 206.Screw base 206 is configured to pacify
In standard light bulb sockets, such as it is embodied as standard Edison screw pedestal (Edison screw base).Encasing 208
It can extend around the upper section of LED light device 200.Encasing 208 is light transmitting material (for example, glass or plastics), right
LED light device 200 provides protection and/or scattering nature.
LED light device 200 includes wavelength conversion component 202, and wavelength conversion component 202 has prolongs from illumination base 204
The elongation cheese stretched.Blue LED arrangement 12 is located on the top surface of illumination base 204, under wavelength conversion component 202.Wave
The three-dimensional nature of long transition components 202, which is established, surrounds volume surrounding and the relatively large shape above LED 12.It is filled in illumination
Setting in 200 allows certain functional advantages using 3D shape to wavelength conversion component 202, such as sends out by lighting device 200
The light penetrated executes the ability of light moulding.
Turn however, the 3D shape of these types of wavelength conversion component 202 also corresponds to relatively large volume of wavelength
Component is changed, needs to be loaded with the phosphor material of sufficient amount.In the case where art methods, thus will need obviously compared with
A large amount of phosphor material, to manufacture such wavelength conversion component 202.It is such to reduce manufacture using the embodiment of the present invention
The amount of phosphor needed for wavelength conversion component 202.In particular, wavelength conversion component 202 includes phosphor and reflecting material
Mixture.Because the reflective material in wavelength conversion component 202 has the property of scattering light, this, which is reduced, is used for wavelength
The amount of phosphor needed for transition components 202.
In some embodiments, light diffusion layer (not shown) can be added to wavelength conversion component 202 (in addition to the phosphorus
Outside the reflecting material of body of light mixing, and/or the reflecting material of substitution and the phosphor blend), to reduce manufacture wavelength convert
The amount of phosphor material needed for component 202.The light reflecting material can utilize any appropriate materials, such as chosen is enough
Small optical scatter, to be more likely to scattering blue light.
Therefore, it has described for implementing LED based lighting device and/or reducing needed for manufacture such device and component
The improved method of the wavelength conversion component of the amount of embedded photoluminescent material.
Omnidirectional's LED based light emitting device
Many applications (such as energy saving substitute for incandescent lamp (light bulb)) need substantially omnidirectional emission characteristics.It is such
Lamp is available in many forms, and is usually referred to by letter with number combinatorics on words come study plot.The letter designation of lamp typically refers to
The specific shape type of the lamp, such as general (A, mushroom-shaped), high watt generic service (PS- pyriform), decorative (B- wax
Candle, CA- twisted candle, BA- bent tip candle, F- flame, P- fancy is round, and G- is spherical), reflecting mirror (R), parabola aluminizes
Reflecting mirror (PAR) and polygonal mirror (MR).Number mark refers to the size of lamp, usually by with eight/several inches of unit
Carry out the diameter of indicator light.Therefore, the lamp of A-19 type refers to its shape by the utility lamp (light bulb) of alphabetical " A " reference and has two
3/8ths inches of maximum gauge again.Most common household " light bulb " is the lamp with A-19 encasing, usual in the U.S.
It is sold together with E26 screw base.
It is produced according to its authorised manufacturer using the mark label illumination of these canonical references in the presence of definite specification is provided with defining
The standardization body and administrative department of the standard of product.About the physical size of lamp, ANSI, which is provided, summarizes required size and shape
The specification (ANSI C78.20-2003) of shape will carry out authorised manufacturer in licensed-in situation for beacon light according to the specification
It is denoted as A-19 type lamp.Other than the physical size of lamp and shape, the performance for being related to lamp and functional additional also may be present
Specification and standard.For example, in the U.S., Environmental Protection Agency (EPA) announces together with U.S. Department of Energy (DOE) can be according to it by lamp
It is denoted as meeting the lamp of the product of " Energy Star (ENERGY STAR) ", such as identification electricity usage requirement, minimum lamp output are wanted
It asks, luminous intensity Spreading requirements, luminous efficiency require and life expectancy.
For example, about the luminous intensity distribution standard in Energy Star specification, to make LED based alternative lamp by energy
The star in source authorizes the qualification of A-19 substitute, must show 270 degree or more it is average (+/- 20%) light emitting and 270 with
On minimum 5% light emitting.The problem of LED based device is that LED is inherently usually less than 90 degree relatively narrow
Luminous intensity distribution.
The 4 omnidirectional's LED based light emitting device 300 for describing embodiment according to the present invention referring now to figure 1, Figure 14 show institute
State the cross-sectional side view and partial cross plane across A-A of device.Light emitting device 300 includes light transmission circuit board (substrate)
310, there is the array for blue-light-emitting (465nm) the unencapsulated LED chip (bare die) 320 for being mounted directly to a face.Institute
In the embodiment of explanation, circuit board 310 be plane and have elongated shape (bar shaped), wherein LED chip 320 be configured to along
The linear array of the length of substrate.As will be described, when device 300 is used as a part of energy-saving bulb, slender array can be preferred
, this is because the appearance and emission characteristics of described device are more closely similar to the traditional filament of incandescent lamp bulb.Depending on application, circuit
Plate may include other shapes, such as be square or round, and LED chip is configured to other arrays or configuration.It should be noted that LED
Chip 320 is mounted directly to circuit board 310 and unencapsulated.This encapsulation will block in the backward directions towards circuit board originally
Light emitting.
Circuit board 310 may include any light transmitting material, and the light transmitting material is at least translucent and preferably to visible
Light has 50% or bigger transmission coefficient.Therefore, circuit board may include glass or plastic material, for example, polypropylene, silicone or
Acrylic acid.To help to dissipate the heat generated by LED chip 320, circuit board 310 is not only light transmissive but also advantageously
Thermally conductive.The example of suitable light transmission Heat Conduction Material includes: magnesia, sapphire, aluminium oxide, quartz glass, aluminium nitride and gold
Hard rock.The transmission coefficient of heat-conduction circuit board can be increased by keeping circuit board relatively thin.To increase mechanical strength, circuit board may include
Laminar structure, wherein heat-conducting layer is placed on light transmission supporter (such as glass or plastic material).
Circuit board 310 further comprises conductor rail 330, is configured with required circuit configuration to be electrically connected LED chip
320.As described, it is a string that LED chip 320, which is connected in series, but will be appreciated that and other circuit configurations can be used.Conductor rail 330 is logical
It often include copper, silver or other metals or transparent electrical conductors, such as tin indium oxide (ITO).As described, usually using joint wire
LED chip 320 is electrically connected to conductor rail 330 by 340.In other embodiments, LED chip may include that surface is mountable or upside-down mounting
Chip apparatus.Can by welding, heat-conductive bonding agent or by those skilled in the art will understand that other fixing means will
LED chip 320 is installed to circuit board.In the case where light transmission circuit board 310 includes Heat Conduction Material, LED chip 320 is advantageously
It is mounted to and circuit board thermal communication.Heat sink compound (for example, beryllium oxide) can be used for helping LED chip being thermally coupled to circuit
Plate.
Light emitting device 300 further comprises photoluminescence wavelength transition components 350 comprising at least one luminescence generated by light material
The mixture of material and the particle of light reflecting material, the mixture directly apply to LED chip 320 in the form of being encapsulated layer.It is logical
Often, at least one embedded photoluminescent material includes yellow green light-emitting phosphor material.To increase the light generated by described device
CRI (colour rendering index), photoluminescence wavelength transition components can further comprise orange red light emitting phosphor.In alternate embodiment
In, described device may include emitting red light ELD chip to increase the CRI of the transmitting product of described device.To help to be formed uniformly
Emit color, emitting red light LED can also be covered by photoluminescence wavelength transition components.
In operation, the light of more long wavelength is generated by the blue excitation phot-luminescence electroluminescent material that LED chip 320 generates
The light (in general, color is yellow green) of photoluminescence.The transmitting product for being rendered as color white of device includes combined photic
Luminous light and non-transformation of blue LED light.As described previously, because luminescence generated by light light generate process be it is isotropic,
So equably generating phosphor light in all directions and the light that emits on the direction towards circuit board may pass through circuit board
And emit from the rear of described device.Similarly, due to it is essential by the isotropism of the light scattering of optical reflection particle progress, not
The blue excitation light of conversion will also on the direction towards circuit board scattering and this equally may pass through circuit board and from described device
Rear transmitting.It will be appreciated that, enabling the device to realize the transmitting of generally omnidirectional using light transmission circuit board (substrate)
Characteristic.In contrast, LED chip encapsulates or is mounted on the device on conventional non-transmissive (usually reflexive) circuit board wherein
In, emission characteristics is consistently less than 180 degree.As described previously, by merging the particle and phosphor of light reflecting material, this reduction
The amount of phosphor needed for generating given transmitting product color.
Figure 15 a and 15b illustrate respectively the LED based lamp (light bulb) 400 of the light emitting device using Figure 14 across B-B
Partial cross sectional side view and partial cross plan view.Lamp 400 wish as be used for white heat A-19 light bulb energy saving substitute and
With the emission characteristics for meeting Energy Star requirement, i.e., it has 270 degree or more uniform (+/- 20%) light emitting and 270 degree
The light emitting of above minimum 5%.
In some embodiments, lamp 400 is configured to using 110V (r.m.s.) AC (60Hz) main electricity as being used for North America
Power power supply unit is operated.Lamp 400 includes substantially conical thermally conductive main body 410.The outer surface of main body 410 is substantially similar
In the frustum of cone；That is, its vertex (tip) is parallel to cone that the plane of pedestal is clipped (that is, frustum of a cone
Shape).Main body 410 is by (being typically larger than equal to 150Wm with high thermal conductivity-1K-1, preferably greater than or equal to 200Wm-1K-1) material
(for example, aluminium (is approximately equal to 250Wm-1K-1), the alloy of aluminium, magnesium alloy, metal load plastic material (for example, polymer, (such as
Epoxy resin))) it is made.Advantageously, when main body 410 includes metal alloy, it can be molded, or when main body 410 includes metal
It can be moulded by (for example) injection-molded when loading polymer.
As illustrated in Figure 15 a, main body 410 can further wrap multiple lateral heat radiation fins (texture) radially extended
420, the outside sweep surface around main body 410 is circumferentially spaced.Because lamp wishes to substitute conventional incandescent A-19 light bulb,
The size of lamp is selected to ensure that it will meet ansi standard, so that lamp cooperates conventional light fixture.Main body 410 can be wrapped further
Coaxial cylindrical chamber (not shown) is included, the rectification accommodated for operating lamp is extended in main body from the main body for being truncated vertex
Device or other driving circuits.The light that main body 410 can further include the frustum of a cone extended from the pedestal of main body reflects pedestal
Part 430.Base frame section 430 is formed as the integral part of main body 410 or is formed as independent assembly.When it is fabricated to independent group
When part, the pedestal is installed to the main body with thermal communication configuration.
Lamp 400 further comprises E26 connector base (Edison screw lamp holders) 440, and lamp is made to be able to use standard
Electric lighting threaded socket is directly connected to main electric supply.It will be appreciated that, depending on expected application, other connectors can be used
Pedestal, for example, as is common for the double-contact in Britain, Ireland, Australia, New Zealand and British various pieces
Bayonet connector (that is, B22d or BC) or the E27 screw base (Edison screw lamp holders) as being used for Europe.Connector base
440 be installed to main body 410 through clipping vertex.
Lamp 400 can further comprise the light transmission encasing or the cover 450 for being installed to the pedestal of main body 410.The cover 450 can
Including glass or light transmission polymer, such as polycarbonate, acrylic acid, PET or PVC.The housing additionally can incorporate or have
There is one layer of light diffusion (scattering) material, for example, zinc oxide (ZnO), titanium oxide (TiO2), barium sulfate (BaSO4), magnesia
(MgO), silica (SiO2) or aluminium oxide (Al2O3) particle.
Lamp 400 can further comprise omnidirectional's LED based of omnidirectional's LED based light emitting device for example illustrated in fig. 14
Light emitting device 300a to 300d.Each of device 300a to 300d is oriented with its circuit board 310 and is being substantially parallel to
The side of the axis 460 of light bulb 400 upwardly extends.Device 300a to 300d is circumferentially equably spaced around pedestal 430, wherein often
The first end of heat-conduction circuit board 310a to the 310d of one device 300a to 300d is mounted on the slit in the conical surface of pedestal 430
In.The first end of the thermally conductive circuit 310 of each device be mounted to thermally conductive 430 thermal communication of pedestal so that by LED chip
320 heats generated can be transmitted to pedestal by circuit board and are transmitted in main body 410.The electricity of operating device 300a to 300d
Power can be provided by the electric connector in each slit (not shown).As shown in Figure 15 a, each light emitting device 300a to 300d with
About 30 degree of angle formed by axis 460 with lamp 400 is installed to pedestal 430 and the form configuration with cone arrangement.
It will be appreciated that, the number of light emitting device 300 and configuration may depend on wanted emission characteristics and/or the application of lamp 400 becomes
Change.For example, what Figure 16 a and 16b illustrated LED based lamp 400 according to a further embodiment of the invention respectively passes through C-C
The partial cross sectional side view and plan view of side.Such as the embodiment of Figure 15 a and 15b, the lamp wishes to become white heat A-19 lamp
The energy saving substitute of bubble and have meet Energy Star requirement emission characteristics.
Substantially, the lamp of Figure 16 a and 16b is identical as the lamp of Figure 15 a and 15b and same reference numbers are used to indicate identical portions
Point.In this embodiment, four light emitting device 300a to 300d are to be configured to extend the sawtooth of (Figure 16 b) along the diameter of lamp
Pattern (Figure 16 a) configuration.The first end of circuit board 310a, 310d of outside two light emitting device 300a, 300b are attached to and phase
Answer the first end thermal communication of heating column 470a, 470b.The second end of each column 470a, 470b are mounted to the circular cone with pedestal 430
Shape surface thermal communication.In addition to provide for by heat from light emitting device 300a, 300d be transmitted to main body 410 thermally conductive pathways it
Outside, heating column 470a, 470b extraly can provide electric power to light emitting device.The second end of first light emitting device 300a, 300d is adjacent
It is bordering on the top surface (through clipping vertex) of pedestal 430 and is mounted in the slit in the conical surface of pedestal 430.The hair of the inside two
The first end of the circuit board 310 of electro-optical device 300b, 300c is mounted adjacent to of the corresponding person in light emitting device 300a, 300d
In slit in the top surface of the pedestal 430 at two ends.Light emitting device 300b, 300c are arranged such that its second end is in place for the inside two
It meets in the apex on lamp axis 460 and is combined by thermally conductive 480 thermal communication of cap.
Figure 17 a to 17c illustrate respectively LED based lamp 400 according to a further embodiment of the invention across D-D
Partial cross sectional side view, partial cross sectional view side view and plan view across E-E.Such as the embodiment of Figure 15 and 16, institute
Lamp is stated to wish the energy saving substitute as white heat A-19 light bulb and there is the emission characteristics for meeting Energy Star requirement.
In this embodiment, lamp 400 includes single light emitting device 300, is oriented so that circuit board 310 along the straight of lamp
Diameter extends.The bottom side face of LED chip (that is, do not contain) of the circuit board 310 of described device be mounted to from conical butt base
490 thermal communication of heat conduction support part that the top surface (through clipping vertex) of frame 430 extends.To maximize from circuit board 310 to support
The heat transfer of component, as indicated, component 490 can substantial extension circuit plate length.In other embodiments, support member
It may include other geometries, such as one or more columns.Electric power for operating LED chip can be by extending through supporter
Inside in channel lead (not shown) provide.To help light emitting, support member may include thermally conductive light transmitting material.
Figure 18 shows the section side across F-F of omnidirectional's LED based light emitting device 500 of embodiment according to the present invention
View and partial cross plan view.Substantially, light emitting device 500 is identical as the light emitting device of Figure 14 and same reference numbers are used for
Indicate same section.In this embodiment, the corresponding linear array of LED chip 320a, 320b is provided in light transmission circuit board 310
Opposite face on.As demonstrated, every an array of LED chip 320a, 320b is by including at least one embedded photoluminescent material and light
Corresponding luminescence generated by light wavelength conversion component 350a, 350b of the mixture of the particle of reflecting material is directly encapsulated.As indicated,
LED chip 320a, 320b is installed such that every LED and the corresponding LED chip on the opposite face of circuit board 310 are opposed, that is,
In manufacturing tolerance, every LED on a face be in at the identical position of corresponding LED chip on opposite face.Alternatively, opposite
LED chip 320a, 320b array on face can deviate.Its pedestal (that is, surface with circuit board contacts) is passed through for transmitting light
LED chip, this configuration can the light absorption of LED chip on the opposite face by reducing circuit board increase from described device
Shine.The operation of light emitting device 500 and the light emitting device of Figure 14 are identical.
It shines and fills referring now to alternative omnidirectional's LED based that Figure 19 a, 19b describe embodiment according to the present invention
It sets 600, Figure 19 a, 19b and shows the decomposition perspective view of device 600 and the cross-sectional view across G-G respectively.In this embodiment, it sends out
Electro-optical device 600 includes two parts, that is, the LED based light engine 610 and long-range photoluminescence wavelength being illustrated in Figure 20 turn
Change component 620.
Figure 20 shows the diagrammatic side view and schematic plan view of LED based light engine 610, LED based light engine 610
Identical as the light emitting device 300 of Figure 14, difference is only that it does not include photoluminescence wavelength transition components 350.Same reference number
Word is used to indicate the same section of device 600 and device 300.Therefore, light engine 610 includes light transmission circuit board 310, is had
It is mounted on the circuit board and is connected to the array of the unencapsulated LED chip 320 of blue-light-emitting of the circuit board.As described in
Bright, the shape of circuit board 310 can be configured to the linear array of the length along circuit board for elongated and LED chip 320.Depend on
In application, circuit board may include other shapes, such as be square or round and LED chip is configured to other arrays or configuration.
Circuit board 310 preferably include the material for having both transmitance and thermal conductivity and may include (for example) magnesia, sapphire,
Aluminium oxide, quartz glass, aluminium nitride or diamond.
With reference to Figure 19 a and 19b, omnidirectional's LED based light emitting device 600 includes light engine 610 and long-range luminescence generated by light wave
Long transition components 620.It is indicated in such as figure, photoluminescence wavelength transition components 620 may include tubular assembly, wherein light engine 610
It is mounted in the drilling of component.It will be appreciated that, the wall of component 620 surrounds light engine 610.Wavelength conversion component incorporates at least one
The mixture of embedded photoluminescent material and the particle throughout the equally distributed light reflecting material of component.In general, at least one light
Electroluminescent material includes yellow green light-emitting phosphor material and can be additionally comprising orange red phosphor to increase CRI and/or reduction
The colour temperature of the transmitting product of described device.In alternative embodiments, the mixing of the particle of embedded photoluminescent material and light reflecting material
Object may include the separating layer in wavelength conversion component 620.It preferably, the use of light transmission thermoplastic material (include polycarbonate, third
Olefin(e) acid, PVC (polyvinyl chloride), nylon, HDPE (high density poly propylene), polyethylene, PET (polyethylene terephthalate) or POM
(polyformaldehyde)) by squeezing out or injection-molded manufacturing wavelength conversion component 620.
To prevent shining for the end from component, described device can further comprise covering the end cap of the open end of component
630,640.End cap 630,640 may include light reflecting material or material identical with component 620 and include embedded photoluminescent material with
The mixture of the particle of light reflecting material.As demonstrated, component opening is completely covered in a nut cap 630 (upper cap in figure),
And another nut cap 640 (lower cover cap in figure) includes aperture 650 (connected pathways), the circuit board 310 of light engine 610 passes through aperture
650。
Figure 21 illustrates the partial cross sectional side view of the LED based lamp (light bulb) 400 of the light emitting device 600 using Figure 19
Figure.Lamp 400 wish become white heat A-19 light bulb energy saving substitute and have meets Energy Star require emission characteristics, i.e., its
With 270 degree or more of the uniform (light emitting of the minimum 5% of +/- 20%) light emitting and 270 degree or more.
Substantially, and the lamp of Figure 15, Figure 16 and Figure 17 are identical and same reference numbers are used to indicate identical portions for the lamp of Figure 21
Point.In this embodiment, lamp 400 includes three light emitting devices 600a, 600b and 600c, and each of them is in the axis for being parallel to lamp
460 side is upwardly-directed.The first end of the circuit board 310 of each light emitting device 600a to 600c is mounted to and conical pedestal
430 upper flat surfaces (through truncation point) thermal communication and when along lamp axis observation when device be configured to equilateral triangle.
It will be appreciated that, light emitting device according to the present invention is not limited to described exemplary embodiment, and of the invention
Variation can be made in range.Although the present invention is also suitable for example, the present invention is described about LED based light emitting device
For the device based on other solid-state light emitters (including solid-state laser and laser diode).
Claims (17)
1. a kind of light emitting device comprising:
Light-transmissive substrate；
First unencapsulated LED chip array, is directly installed on the first face of the Light-transmissive substrate, wherein described first not
Packaging LED chips array can be operated to generate the blue excitation with the peak wavelength in the wave-length coverage of 440nm to 480nm
Light；And
Photoluminescence wavelength transition components comprising directly apply at least one of the described first unencapsulated LED chip array
The mixture of the particle of the particle and light reflecting material of embedded photoluminescent material, wherein the photoluminescence wavelength transition components are through matching
It sets and a part of the exciting light in operation, generated by the described first unencapsulated LED chip array is emitted through
The photoluminescence wavelength transition components are to facilitate final visible emission product.
It further comprise the second unencapsulated LED chip array 2. light emitting device according to claim 1, described second
Unencapsulated LED chip array is directly installed on the second face of the Light-transmissive substrate, and the wherein photic hair of at least one
The mixture of the particle of luminescent material and the light reflecting material directly applies to the described second unencapsulated LED chip array.
3. light emitting device according to claim 1, wherein the Light-transmissive substrate is for visible light at least 50%
Transmission coefficient.
4. light emitting device according to claim 1, wherein the Light-transmissive substrate is thermal conductivity.
5. light emitting device according to claim 4, wherein at least part of the Light-transmissive substrate is selected from by following material
Expect the group of composition: magnesia, sapphire, aluminium oxide, quartz glass, aluminium nitride and diamond.
6. light emitting device according to claim 1, wherein the light reflecting material has selected from being made of following size
Group in the range of granularity: 0.01 μm to 10 μm, 0.01 μm to 1 μm and 0.1 μm to 1 μm.
7. light emitting device according to claim 1, wherein light reflecting material is at least one embedded photoluminescent material
0.01% to 10%, 0.01% to 1% weight percent is loaded in the range of the group being made of following percentage:,
0.1% to 1% and 0.5% to 1%.
8. light emitting device according to claim 1, wherein the light reflecting material is selected from the group being made of following material:
Magnesia, titanium dioxide, barium sulfate, and combinations thereof.
9. light emitting device according to claim 1, wherein granularity corresponding to the particle of the light reflecting material makes
It obtains and scatters the light generated by least one phosphor material compared with the particle, scattering phase is to more by described unencapsulated
The blue excitation light that LED chip generates.
10. light emitting device according to claim 1 further comprises adjacent to the photoluminescence wavelength transition components
Optical diffusion layer.
11. light emitting device according to claim 10, wherein the optical diffusion layer includes the particle of light reflecting material, it is described
Granularity corresponding to particle to scatter the light generated by least one embedded photoluminescent material, scattering compared with the particle
The blue excitation light more generated relatively by the unencapsulated LED chip.
12. light emitting device according to claim 11, wherein the light reflective material has in 100nm to 150nm model
Granularity in enclosing.
13. luminescent device according to claim 1, wherein the first unencapsulated LED chip array be electrically connected to it is described
First face of Light-transmissive substrate.
14. luminescent device according to claim 2, wherein the second unencapsulated LED chip array be electrically connected to it is described
Second face of Light-transmissive substrate.
15. luminescent device according to claim 1, wherein the Light-transmissive substrate includes light transmission circuit board.
16. luminescent device according to claim 1, wherein the Light-transmissive substrate is plane and has elongated shape.
17. luminescent device according to claim 16, wherein the first unencapsulated LED chip array and/or second is not
Packaging LED chips array is configured as linear array.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/141,275 US8957585B2 (en) | 2010-10-05 | 2013-12-26 | Solid-state light emitting devices with photoluminescence wavelength conversion |
| US14/141,275 | 2013-12-26 |
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| Publication Number | Publication Date |
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| CN104752590A CN104752590A (en) | 2015-07-01 |
| CN104752590B true CN104752590B (en) | 2019-06-11 |
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| CN (1) | CN104752590B (en) |
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| US10066160B2 (en) | 2015-05-01 | 2018-09-04 | Intematix Corporation | Solid-state white light generating lighting arrangements including photoluminescence wavelength conversion components |
| JP6536325B2 (en) * | 2015-09-30 | 2019-07-03 | 日亜化学工業株式会社 | Light emitting device |
| CN107305921A (en) * | 2016-04-20 | 2017-10-31 | 松下知识产权经营株式会社 | Wavelength convert part, light source and headlight for automobile |
| JP6982965B2 (en) * | 2016-05-10 | 2021-12-17 | 三菱電機株式会社 | Lighting equipment |
| CN111183315B (en) | 2017-04-03 | 2022-11-01 | 英特曼帝克司公司 | Color liquid crystal display and display backlight |
| KR102389815B1 (en) * | 2017-06-05 | 2022-04-22 | 삼성전자주식회사 | Quantum dot glass cell and light emitting device package comprising the same |
| TWI759464B (en) * | 2018-04-18 | 2022-04-01 | 美商英特曼帝克司公司 | Color liquid crystal displays and display backlights |
| TWI823266B (en) * | 2018-04-18 | 2023-11-21 | 美商英特曼帝克司公司 | Color liquid crystal displays and display backlights |
| CN113330245B (en) * | 2019-01-24 | 2024-06-21 | 昕诺飞控股有限公司 | LED Filament Device |
| CN109933302B (en) * | 2019-01-29 | 2021-04-20 | 华中科技大学 | Method and device for generating random number based on diamond |
| CN113574311B (en) | 2019-03-14 | 2024-10-15 | 昕诺飞控股有限公司 | LED filament device |
| JP7335448B2 (en) * | 2020-01-02 | 2023-08-29 | シグニファイ ホールディング ビー ヴィ | T-LED air-containing light tube |
| CN113257113A (en) * | 2020-02-13 | 2021-08-13 | 群创光电股份有限公司 | Optical device |
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| CN104752590A (en) | 2015-07-01 |
| JP2015144261A (en) | 2015-08-06 |
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