CN104750962B - The Productivity and system of Pvd equipment - Google Patents
The Productivity and system of Pvd equipment Download PDFInfo
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- CN104750962B CN104750962B CN201310750694.6A CN201310750694A CN104750962B CN 104750962 B CN104750962 B CN 104750962B CN 201310750694 A CN201310750694 A CN 201310750694A CN 104750962 B CN104750962 B CN 104750962B
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Abstract
The invention discloses the Productivity and system of a kind of Pvd equipment, wherein, method includes：When technological process starts, T at the beginning of technological process is recordeds；After technological process starts, the change in location of real-time monitoring wafer, after monitoring that N wafers are transmitted back to material box, time T when record N wafers are transmitted back toN, wherein, N is integer and N >=1；According to averaging method, the average time per wafer needed for completion technique in N wafers is calculated in real timeAccording to the definition of the production capacity of equipment, the production capacity P of real-time computing device is simultaneously shown,Wherein, t is the unit time.The Productivity and system of Pvd equipment provided by the invention the production capacity of computing device and can be shown, effectively reduce the generation of redundant data, reduce error in real time, be capable of the actual production capacity of effective consersion unit in real time.
Description
Technical field
The present invention relates to semiconductor applications, a kind of Productivity more particularly to Pvd equipment and it is
System.
Background technology
In manufacturing industry production management, the production capacity of equipment is all that a needs are paid close attention to for all enterprises
Parameter.Enterprise needs the yield of real-time statistics production scene, to understand the production efficiency in entire manufacturing process, is realized for optimization
The every system and adjusting process structure of production provide data and support.For PVD (Physical Vapor Deposition,
Physical vapour deposition (PVD)) for field, the production capacity of equipment（Wafer per Hour, abbreviation WPH）Refer to that every equipment is performing
Automatic Job（Process task）When can produce how many wafer per hour（Chip）Ability, it is single device production capacity
One important indicator of one technical parameter and reflection enterprise production possibility.
At present, generally use manually calculates the production capacity of PVD equipment, and specific method is as follows：When performing a certain batch Job,
Assuming that N（N>=1）Piece wafer transfers back to material box after completing all techniques（LoadPort, abbreviation LP）When time be t1,
Time when transferring back to material box after N+1 pieces wafer completion techniques is t2, time interval Δ t=t2-t1, represent current a piece of
Wafer has performed the time of Job flows, at this time production capacity WPH=unit interval of equipment（1 hour）/Δt（Unit：Hour）, i.e.,
Complete the number of wafer per hour for equipment during the batch automatic process.
In practical automatic process flow implementation procedure, often calculate the relevant wafer's of Job using subsection scheduling algorithm
Sequence is transmitted, is caused in the Job implementation procedures of a batch, what may continuously be passed back from LL there are two panels wafer shows
As time interval of delta t is a fixed value.It is passed so the prior art is used after manually completing technique according to adjacent two panels wafer
The production capacity of time difference computing device when returning to material box, data redundancy is serious, and error is larger, it is impossible to effective consersion unit
Actual production capacity.
Invention content
Based on this, it is necessary to it is in view of the drawbacks of the prior art and insufficient, a kind of production capacity of Pvd equipment is provided
Computational methods and system can in real time, effectively calculate the production capacity of Pvd equipment, with the actual production of consersion unit
Ability.
The Productivity of Pvd equipment provided for achieving the object of the present invention, includes the following steps：
S100 when technological process starts, records T at the beginning of the technological processs；
S200, after the technological process starts, the change in location of real-time monitoring wafer, when monitoring N wafer quilts
After passing material box back, the time T when N wafers are transmitted back to is recordedN, wherein, N is integer and N >=1；
S300 according to averaging method, calculates the average time per wafer needed for completion technique in N wafers in real time
S400 according to the definition of the production capacity of equipment, calculates the production capacity P of the equipment and is shown in real time,
Wherein, t is the unit time.
Wherein, the Productivity of Pvd equipment of the invention is further comprising the steps of：
S300 ' according to averaging method, is calculated in addition to the first wafer in real time, complete per wafer in other N-1 wafers
Into the average time needed for techniqueWherein, T1The first wafer quilt for record
Pass time during material box back；
S400 ' according to the definition of the production capacity of the equipment, calculates production of the equipment when ignoring the first wafer in real time
It can P1And shown,Wherein, t is the unit time.
Wherein, the Productivity of Pvd equipment of the invention is further comprising the steps of：
S200 ' according to the request of user, judges whether the validity for ignoring the first wafer, if being judged as YES, enters
Step S300 '；If being judged as NO, S300 is entered step.
Wherein, the step S200 includes the following steps：
S210 after the technological process starts, subscribes to AddMatStateListener events, to the N wafers
Position monitored；
S220, when the upper position for listening to the N wafers is manipulator, and current position is the material
During box, judge that the N wafers have completed technique, record the time T when N wafers are transmitted back toN。
Wherein, the Productivity of Pvd equipment of the invention is further comprising the steps of：
S500, judges whether the technological process terminates, if being judged as YES, the position of chip is monitored in cancellation.
Correspondingly, the AOF calculation system of Pvd equipment provided for achieving the object of the present invention, including
One logging modle, the second logging modle, the first computing module and the second computing module；
First logging modle, for when technological process starts, recording Ts at the beginning of the technological process；
Second logging modle, for after the technological process starts, the change in location of real-time monitoring wafer, and
After monitoring that N wafers are transmitted back to material box, the time TN when N wafers are transmitted back to is recorded, wherein, N is whole
Number and N >=1；
First computing module, for according to averaging method, calculating complete technique in N wafers per wafer in real time
Required average time
Second computing module, for the definition of the production capacity according to equipment, the production capacity P for calculating the equipment in real time goes forward side by side
Row display,Wherein, t is the unit time.
Wherein, the AOF calculation system of Pvd equipment of the invention, further includes third computing module and the 4th
Computing module；
The third computing module, for according to averaging method, calculating in addition to the first wafer in real time, other N-1 pieces
Average time in chip per wafer needed for completion techniqueWherein, T1For record
First wafer is transmitted back to time during material box；
4th computing module for the definition of the production capacity according to the equipment, calculates the equipment and is ignoring in real time
Production capacity P during the first wafer1And shown,Wherein, when t is unit
Between.
Wherein, the AOF calculation system of Pvd equipment of the invention, further includes judgment module；
The judgment module for receiving the request of user, and judges whether to ignore first according to the request of the user
The validity of wafer, if being judged as YES, into the third computing module；If being judged as NO, enter the described first meter
Calculate module.
Wherein, second logging modle includes monitoring unit and recording unit；
The monitoring unit, it is right for after the technological process starts, subscribing to AddMatStateListener events
It is monitored the position of the N wafers；
The recording unit, for being manipulator, and current position when the upper position for listening to the N wafers
When being set to the material box, judge that the N wafers have completed technique, record when the N wafers are transmitted back to when
Between TN。
Wherein, the AOF calculation system of Pvd equipment of the invention further includes cancellation and monitors module：
Described cancel monitors module, for judging whether the technological process terminates, if being judged as YES, cancels to chip
Position monitored.
Beneficial effects of the present invention：The Productivity and system of Pvd equipment provided by the invention, profit
Production capacity is further calculated with the average time for completing technique is solved, whenever thering is a wafer to transfer back in material box,
To calculate the average time completed at that time needed for a wafer, and then production capacity at this time can be calculated and shown, effectively
Reduce the generation of redundant data, so as to reduce error, be capable of the actual production capacity of effective consersion unit in real time.
Description of the drawings
In order to make the Productivity of the Pvd equipment of the present invention and the purpose of system, technical solution and excellent
Point is more clearly understood, below in conjunction with specific drawings and the specific embodiments, to the production capacity meter of Pvd equipment of the present invention
Method and system are calculated to be further elaborated.
Fig. 1 is that the automatic process of Pvd equipment passes piece flow diagram；
Fig. 2 is that the automatic idiographic flow being transmitted back to after chip completion technique in piece flow that passes of Pvd equipment shows
It is intended to；
Fig. 3 is the flow chart of one embodiment of the Productivity of the Pvd equipment of the present invention；
Fig. 4 is another embodiment of the Productivity of the Pvd equipment of the present invention shown in Fig. 3
Flow chart；
Fig. 5 is the structure chart of one embodiment of the AOF calculation system of the Pvd equipment of the present invention.
Specific embodiment
The automatic of PVD equipment shown in Figure 1 passes piece flow（That is the implementation procedure of automatic process flow）, work as wafer
Complete processing chamber（PM）Technique after, atmospheric mechanical hand will be from inverting chamber（LoadLock, abbreviation LL）It is middle to fetch wafer
And be put back into material box, before the wafer fetched from inverting chamber is put back into material box by manipulator, system needs pair
Inverting chamber carries out filling air operation, when the chamber pressure in inverting chamber is consistent with ambient atmosphere environmental pressure, inverting chamber and machine
The gate valve of tool hand end junction could be opened safely, and wafer from inverting chamber is fetched be put into material box again by manipulator later.
In the process, system can be calculated according to the state of current board and wafer positions using subsection scheduling algorithm
The transmission sequence of the relevant wafer of Job.Due to there is rushing when smoking number and biography piece to chamber in PVD equipment dispatching algorithm
The considerations of factors such as stand-by period, therefore according to the optimal motion sequence calculated, system may wait two in inverting chambers
Slot position, which has, completes after technique when waiting for the wafer being transmitted back to, just it to be carried out to fill air operation.As shown in Fig. 2, it deposits at this time
Adjacent two panels wafer is continuously passed back from inverting chamber the phenomenon that, the time interval that adjacent two panels wafer is transmitted back to is fixed for one
Value, it is approximately equivalent that value and atmospheric mechanical hand pick and place the piece time, therefore, if at this time according to adjacent two panels wafer completion techniques after
The production capacity of time difference computing device when transferring back to material box, is also a fixed value.According to dispatching algorithm, in batch
In Job implementation procedures, the phenomenon that may continuously being passed back from inverting chamber there are a large amount of two panels wafer, therefore the calculation is utilized
The equipment capacity that method calculates has no practical significance, and data redundancy is serious.
In view of the above-mentioned problems, the present invention proposes a kind of Productivity of Pvd equipment, this method can
The production capacity of computing device effectively in real time during to be performed in Job, reduces the generation of redundant data in calculating process.
One embodiment of the Productivity of Pvd equipment provided by the invention, as shown in figure 3, including
Following steps：
S100 when technological process starts, records T at the beginning of technological processs；
S200 after technological process starts, monitors the change in location of wafer, when monitoring that N pieces wafer is passed in real time
After returning material box, time T when record N pieces wafer is transmitted back toN, wherein, N is integer and N >=1；
S300 according to averaging method, calculates the average time needed for every wafer completion techniques in N pieces wafer in real time
S400, according to the definition of the production capacity of equipment, the production capacity P of real-time computing device is simultaneously shown,
Wherein, t is the unit time.
Involved variate-value N is referred to currently completing technique and has been returned in LP in above-described embodiment
The number of wafer.Using the Productivity of the Pvd equipment of the present invention, transferred back to whenever there is a piece of wafer
When in LP, the average time completed at that time needed for a piece of wafer can be calculated, and then the production capacity that can be calculated at this time is gone forward side by side
Row display.Due to the average time calculatedIt is a statistic, so, it can effectively represent whole general water
It is flat, further utilize average timeProduction capacity P is calculated, the generation of redundant data can be effectively reduced, it is real so as to reducing error
When effective consersion unit actual production capacity.
Preferably, as a kind of embodiment, the Productivity of Pvd equipment provided by the invention
It is further comprising the steps of：
S300 ' according to averaging method, is calculated in addition to first wafer, every in other N-1 pieces wafer in real time
Wafer completes the average time needed for techniqueWherein, T1First wafer for record
It is transmitted back to time during material box；
S400 ', according to the definition of the production capacity of equipment, production capacity P of the real-time computing device when ignoring first wafer1And
It is shown,Wherein, t is the unit time.
In the automatic biography piece flow of PVD equipment, when Job just starts to perform, need that processing chamber is carried out to heat etc. one
The operation of series, therefore first wafer has performed the Job flows required time and has often been performed much larger than other wafer
The Job flows required time.So during the production capacity of computing device, it should be considered according to specific process condition
The process time by first wafer whether is needed to count, that is, considers the validity of first wafer.And existing
The method of the production capacity of time difference computing device when completing to transfer back to material box after technique according to adjacent two panels wafer lacks to the
The Effective judgement of a piece of wafer.
In the user interface, the validity of first wafer can be configured by user according to process condition, and selection is
The no validity for ignoring first wafer.
The detailed process of the realization process of the Productivity of Pvd equipment provided by the invention, such as Fig. 4
It is shown.
As a kind of embodiment, the Productivity of Pvd equipment provided by the invention further include with
Lower step：
S200 ' according to the request of user, judges whether to ignore the validity of first, if being judged as YES, enter step
S300’；If being judged as NO, S300 is entered step.
Specifically, as a kind of embodiment, step S200 includes the following steps：
S210 after technological process starts, subscribes to AddMatStateListener events, to the position of N pieces wafer
It is monitored.AddMatStateListener events are wafer change in location events, i.e., are opened in the automatic flow of process task
After beginning, wafer change in location events are monitored.
S220 when the upper position for listening to N pieces wafer is manipulator, and current position is material box, sentences
Disconnected N pieces wafer has completed technique, time TN when record N pieces wafer is transmitted back to.
As a kind of embodiment, the Productivity of Pvd equipment provided by the invention further include with
Lower step：
S500, judges whether technological process terminates, if being judged as YES, the position of wafer is monitored in cancellation, if sentencing
It is no to break, then continues to monitor the position of wafer.I.e. after technological process is judged, cancel to wafer change in location
Event（AddMatStateListener events）Monitoring.
Using the Productivity of the Pvd equipment of the present invention, transferred back in LP whenever there is a piece of wafer
When, the average time completed at that time needed for a piece of wafer can be calculated, and then production capacity at this time can be calculated and shown
Show, realize the function of calculating Pvd equipment production capacity in real time.Whether user can be set according to process condition by the
The process time of a piece of wafer counts, and improves the validity of AOF calculation.The Pvd equipment of the present invention
Productivity further calculates production capacity using the average time for solving completion technique, effectively reduces redundant data
It generates, reduces calculating error；Simultaneously, it is contemplated that the validity of first wafer has effectively reacted the reality of equipment in real time
Border production capacity provides accurate reference for machine operations personnel.
Based on same inventive concept, correspondingly the present invention also provides a kind of AOF calculation systems of Pvd equipment
System, due to the principle that this system solves the problems, such as and the realization principle phase of the Productivity of said physical vapor deposition apparatus
Seemingly, the implementation of this system can be realized, therefore overlaps will not be repeated by the detailed process of preceding method.
One embodiment of the AOF calculation system of Pvd equipment provided by the invention, as shown in figure 5, including
First logging modle 100, the second logging modle 200, the first computing module 300 and the second computing module 400；
First logging modle 100, for when technological process starts, recording Ts at the beginning of technological process；
Second logging modle 200 for after technological process starts, monitoring the change in location of wafer in real time, and is being supervised
It measures after N pieces wafer is transmitted back to material box, time T when record N pieces wafer is transmitted back toN, wherein, N for integer and N >=
1；
Second computing module 400, for the definition of the production capacity according to equipment, the production capacity P of real-time computing device is simultaneously shown
Show,Wherein, t is the unit time.
Preferably, as a kind of embodiment, the AOF calculation system of Pvd equipment of the invention is also wrapped
Include 300 ' and the 4th computing module 400 ' of third computing module；
Third computing module 300 ', for according to averaging method, calculating in addition to first wafer in real time, other N-1 pieces
Every wafer completes the average time needed for technique in waferWherein, T1For record
Times of first wafer when being transmitted back to material box；
4th computing module 400 ', for the definition of the production capacity according to equipment, real-time computing device is ignoring first
Production capacity P during wafer1And shown,Wherein, t is the unit time.
As a kind of embodiment, the AOF calculation system of Pvd equipment of the invention further includes judgement mould
Block 200 '；
Judgment module 200 ' for receiving the request of user, and judges whether to ignore first according to the request of user
Validity, if being judged as YES, into third computing module 300 '；If being judged as NO, into the first computing module 300.
As a kind of embodiment, the second logging modle 200 includes monitoring unit 210 and recording unit 220；
Monitoring unit 210, for after technological process starts, AddMatStateListener events being subscribed to, to N pieces
It is monitored the position of wafer；
Recording unit 220, for being manipulator, and current position is when the upper position for listening to N pieces wafer
During material box, judge that N pieces wafer has completed technique, time T when record N pieces wafer is transmitted back toN。
As a kind of embodiment, the AOF calculation system of Pvd equipment of the invention further includes cancellation prison
Listen module 500：
Cancel and monitor module 500, for judging whether technological process terminates, if being judged as YES, cancel the position to wafer
It puts and is monitored.
The present invention Pvd equipment Productivity and system, using the average time for completing technique come
Production capacity is calculated, the generation of redundant data is effectively reduced, reduces calculating error；Simultaneously, it is contemplated that first wafer's has
Effect property, has effectively reacted the actual production capacity of equipment, accurate reference is provided for machine operations personnel in real time.
Above example only expresses the several embodiments of the present invention, and description is more specific and detailed, but can not
Therefore it is interpreted as the limitation to the scope of the claims of the present invention.It should be pointed out that for those of ordinary skill in the art,
Without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection model of the present invention
It encloses.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (8)
1. a kind of Productivity of Pvd equipment, which is characterized in that include the following steps：
S100 when technological process starts, records T at the beginning of the technological processs；
S200, after the technological process starts, the change in location of real-time monitoring wafer, when monitoring that N wafers are transmitted back to
After material box, the time T when N wafers are transmitted back to is recordedN, wherein, N is integer and N >=1；
S300 according to averaging method, calculates the average time per wafer needed for completion technique in N wafers in real time
S400 according to the definition of the production capacity of equipment, calculates the production capacity P of the equipment and is shown in real time,
Wherein, t is the unit time.
2. the Productivity of Pvd equipment according to claim 1, which is characterized in that further include following
Step：
S200 ' according to the request of user, judges whether the validity for ignoring the first wafer, if being judged as YES, enters step
S300’；If being judged as NO, S300 is entered step；
S300 ' according to averaging method, calculates in addition to the first wafer, completes work in other N-1 wafers per wafer in real time
Average time needed for skillWherein, T1First wafer for record is transmitted back to
Time during material box；
S400 ' according to the definition of the production capacity of the equipment, calculates production capacity P of the equipment when ignoring the first wafer in real time1
And shown,Wherein, t is the unit time.
3. the Productivity of the Pvd equipment according to claim 1 to 2 any one, feature exist
In the step S200 includes the following steps：
S210 after the technological process starts, subscribes to AddMatStateListener events, to the position of the N wafers
It puts and is monitored；
S220, when the upper position for listening to the N wafers is manipulator, and current position is the material box
When, judge that the N wafers have completed technique, record the time T when N wafers are transmitted back toN。
4. the Productivity of Pvd equipment according to claim 3, which is characterized in that further include following
Step：
S500, judges whether the technological process terminates, if being judged as YES, the position of chip is monitored in cancellation.
5. the AOF calculation system of a kind of Pvd equipment, which is characterized in that including the first logging modle, the second record
Module, the first computing module and the second computing module；
First logging modle, for when technological process starts, recording T at the beginning of the technological processs；
Second logging modle, for after the technological process starts, the change in location of real-time monitoring wafer, and supervising
It measures after N wafers are transmitted back to material box, records the time T when N wafers are transmitted back toN, wherein, N is integer and N
≥1；
First computing module, for according to averaging method, calculating in N wafers completed needed for technique per wafer in real time
Average time
Second computing module for the definition of the production capacity according to equipment, calculates the production capacity P of the equipment and is shown in real time
Show,Wherein, t is the unit time.
6. the AOF calculation system of Pvd equipment according to claim 5, which is characterized in that further include judgement
Module, third computing module and the 4th computing module；
The judgment module for receiving the request of user, and judges whether according to the request of the user to ignore the first platelet
The validity of piece, if being judged as YES, into the third computing module；If being judged as NO, enter described first and calculate mould
Block；
The third computing module, for according to averaging method, calculating in addition to the first wafer in real time, other N-1 wafers
In per wafer complete technique needed for average timeWherein, T1Described for record
One wafer is transmitted back to time during material box；
4th computing module for the definition of the production capacity according to the equipment, calculates the equipment and is ignoring first in real time
Production capacity P during wafer1And shown,Wherein, t is the unit time.
7. according to the AOF calculation system of claim 5 to 6 any one of them Pvd equipment, which is characterized in that
Second logging modle includes monitoring unit and recording unit；
The monitoring unit, for after the technological process starts, AddMatStateListener events being subscribed to, to described
It is monitored the position of N wafers；
The recording unit, for being manipulator, and current position is when the upper position for listening to the N wafers
During the material box, judge that the N wafers have completed technique, record the time T when N wafers are transmitted back toN。
8. the AOF calculation system of Pvd equipment according to claim 7, which is characterized in that further include cancellation
Monitor module：
Described cancel monitors module, for judging whether the technological process terminates, if being judged as YES, cancels the position to chip
It puts and is monitored.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560406A (en) * | 2010-12-24 | 2012-07-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Physical vapor deposition (PVD) device and method for processing wafers by adopting same |
| CN103163874A (en) * | 2011-12-09 | 2013-06-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Semiconductor device safety detection system and semiconductor device safety measuring method |
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2013
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| CN102560406A (en) * | 2010-12-24 | 2012-07-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Physical vapor deposition (PVD) device and method for processing wafers by adopting same |
| CN103163874A (en) * | 2011-12-09 | 2013-06-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Semiconductor device safety detection system and semiconductor device safety measuring method |
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