CN104749664A - Lens module and lens thereof, and wafer-level lens array and preparation method thereof - Google Patents
Lens module and lens thereof, and wafer-level lens array and preparation method thereof Download PDFInfo
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- CN104749664A CN104749664A CN201310737710.8A CN201310737710A CN104749664A CN 104749664 A CN104749664 A CN 104749664A CN 201310737710 A CN201310737710 A CN 201310737710A CN 104749664 A CN104749664 A CN 104749664A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
Abstract
Provided is a preparation method of a wafer-level lens array. The method comprises the steps that a transparent substrate which comprises a first surface and a second surface opposite to the first surface is provided; and multiple boss-shaped optical portions are formed at the first surface and multiple groove-shaped optical portions are formed at the second surface by multiple times of exposure, development, etching and cleaning. Each boss-shaped optical portion comprises a plurality of laminated cylinders, the symmetric axes of the plurality of cylinders are in the same line, and diameters of the plurality of cylinders are gradually reduced away from the first surface. The optical axes of the groove-shaped optical portion and the corresponding boss-shaped optical portion are on the same line. A plurality of step portions are configured to surround the inner sidewall of the groove-shaped optical portion, each step portion surrounds to form a circular groove, symmetric axes of the plurality of circular grooves are on the same line, and diameters of the plurality of circular grooves are gradually reduced from the second surface to the first surface. The invention also provides the wafer-level lens array prepared by the method, a lens prepared from the wafer-level lens array, and a lens module with the lens.
Description
Technical field
The present invention relates to a kind of eyeglass, particularly relate to a kind of camera lens module and eyeglass, wafer scale lens array and preparation method thereof.
Background technology
At present, the method processed of wafer scale lens array normally, provides a transparency carrier, one on substrate surperficial coated and molded glue, utilizes impressing mould to carry out mold pressing to shaping glue and forms sphere or aspheric lens array.Use impressing mould impresses, can only the lens array of a shaping corresponding type after making.Further, substrate is after a surperficial coated and molded glue shape glue carries out mold pressing formation sphere or aspheric lens array, and another surface of substrate can not impress again.Therefore, satisfied more optical design demand is difficult to.
Summary of the invention
Based on this, be necessary to provide one can avoid using impressing mould impression, camera lens module and the eyeglass thereof of multiple optical design needs can be met.
A kind of eyeglass of camera lens module, comprise transparency carrier, described transparency carrier comprises relative first surface and second surface, described first surface is provided with a boss-shaped optics portion, described boss-shaped optics portion comprises and multiplely stackedly arranges cylinder, and the axis of symmetry of multiple described cylinder is located along the same line, the diameter of multiple described cylinder reduces gradually along away from described first surface direction, described second surface is provided with a groove-like optics portion, the optical axis in described groove-like optics portion and described boss-shaped optics portion is located along the same line, the madial wall in described groove-like optics portion is around the stage portion being provided with multiple annular, each described stage portion surrounds a circular groove, the axis of symmetry of multiple described circular groove is located along the same line, the diameter of multiple described circular groove reduces towards described first surface gradually from described second surface.
Wherein in an embodiment, described transparency carrier is glass or silicon dioxide, and the diameter of multiple cylinders in described boss-shaped optics portion becomes arithmetic progression to change, and the diameter of multiple circular grooves in described groove-like optics portion becomes arithmetic progression to change.
Wherein in an embodiment, the neighboring of the circle of multiple described cylinder is all positioned on same sphere, and the neighboring of the circle of multiple described circular groove is all positioned in same aspheric surface.
Wherein in an embodiment, the described cylinder quantity in described boss-shaped optics portion equals the quantity of the described circular groove in described groove-like optics portion.
A kind of camera lens module, comprises above-mentioned eyeglass.
A kind of wafer scale lens array and preparation method thereof is also provided.
A kind of wafer scale lens array, comprise multiple above-mentioned eyeglass, described boss-shaped optics portion and the described groove-like optics portion of multiple described eyeglass are all arranged in array, and the transparency carrier of described multiple eyeglass is a monoblock plate body.
A method for making for wafer scale lens array, comprising:
Steps A, provides a transparency carrier, and described transparency carrier has relative first surface and second surface;
Step B, through multiexposure, multiple exposure, development, etching, cleaning, multiple boss-shaped optics portion is formed at described first surface, multiple groove-like optics portion is formed at described second surface, described boss-shaped optics portion comprises and multiplely stackedly arranges cylinder, and the axis of symmetry of multiple described cylinder is located along the same line, the diameter of multiple described cylinder reduces gradually along away from described first surface direction, described second surface is provided with a groove-like optics portion, the optical axis in described groove-like optics portion and described boss-shaped optics portion is located along the same line, the madial wall in described groove-like optics portion is around the stage portion being provided with multiple annular, each described stage portion surrounds a circular groove, the axis of symmetry of multiple described circular groove is located along the same line, the diameter of multiple described circular groove reduces towards described first surface gradually from described second surface.
Wherein in an embodiment, described step B comprises further:
Step B1, photoresist layer is coated with respectively on first surface and second surface, photoresist layer is exposed, develops, remove presumptive area photoresist layer, make the first occlusion part this first surface being formed multiple circle, second surface is formed the first exposed portion of multiple circle, the first occlusion part and the first exposed portion are oppositely arranged;
Step B2, etches first surface and second surface, and first surface forms the cylinder of the first order in the first occlusion part, and second surface forms the circular groove of the first order in the first place of exposed portion, and the sidewall of the circular groove of the described first order is the stage portion of the first order;
Step B3, photoresist layer is coated with respectively at the diapire of the periphery of the cylinder of the first order and the circular groove of the first order, carry out exposing, develop, formed in the periphery of the cylinder of the first order the second occlusion part of annular, the conglobate second exposed portion of diapire shape of the circular groove of the first order;
Step B4, first surface and second surface are etched, the cylinder of the formation second level, below of the cylinder of the first order, the diameter of the cylinder of the second level is less than the diameter of the cylinder of the first order, the axis of symmetry of the cylinder of the second level and the cylinder of the first order is located along the same line, the circular groove of the formation second level, bottom of the circular groove of the first order, the diameter of the circular groove of the second level is less than the diameter of the circular groove of the first order, the axis of symmetry of the circular groove of the second level and the circular groove of the first order is located along the same line, and the sidewall of the circular groove of the described second level is the stage portion of the second level;
Step B5, removes photoresist layer, forms boss-shaped optics portion and groove-like optics portion.
Wherein in an embodiment, also comprise: between step B4 and step B5, repeating said steps B3 and step B4, with the described circular groove of the described cylinder and N level that form N level, N is more than or equal to 3, and the cylinder of rear stage is formed on the bottom of the cylinder of previous stage, the diameter of multiple cylinder increases successively gradually, the circular groove of rear stage is formed on the bottom of the circular groove of previous stage, and to form multiple described stage portion, the diameter of multiple circular groove reduces successively gradually.
Wherein in an embodiment, described step B comprises further:
Step B1: be coated with photoresist layer on the first surface, exposes photoresist layer, develops, and removes presumptive area photoresist layer, makes the first occlusion part this first surface being formed multiple circle;
Step B2: first surface is etched, first surface forms the cylinder of the first order at the first occlusion part;
Step B3: in the periphery of the cylinder of first order coating photoresist layer, carry out exposing, develop, at the second occlusion part of the periphery of the cylinder of first order formation annular;
Step B4: first surface is etched, the cylinder of the formation second level, below of the cylinder of the first order, the diameter of the cylinder of the second level is less than the diameter of the cylinder of the first order, and the axis of symmetry of the cylinder of the second level and the cylinder of the first order is located along the same line;
Step B5: be coated with photoresist layer on a second surface, exposes photoresist layer, develops, and remove presumptive area photoresist layer, make the first exposed portion second surface being formed multiple circle, the first occlusion part and the first exposed portion are oppositely arranged;
Step B6: second surface is etched, second surface forms the circular groove of the first order at the first place of exposed portion, and the sidewall of the circular groove of the described first order is the stage portion of the first order;
Step B7: in the diapire coating photoresist layer of the circular groove of the first order, carry out exposing, developing, in the conglobate second exposed portion of the diapire shape of the circular groove of the first order;
Step B8: second surface is etched, the circular groove of the formation second level, bottom of the circular groove of the first order, the diameter of the circular groove of the second level is less than the diameter of the circular groove of the first order, the axis of symmetry of the circular groove of the second level and the circular groove of the first order is located along the same line, and the sidewall of the circular groove of the second level is the stage portion of the second level;
Step B9, removes photoresist layer, forms boss-shaped optics portion and groove-like optics portion.
Wherein in an embodiment, also comprise: between step B4 and step B5, repeating said steps B3 and step B4, to form the described cylinder of N level, N is more than or equal to 3, and the diameter of multiple cylinder increases successively gradually; Between step B8 and step B9, repeating said steps B7 and step B8, to form the described circular groove of N level, N is more than or equal to 3, the circular groove of rear stage is formed on the bottom of the circular groove of previous stage, and to form multiple described stage portion, the diameter of multiple circular groove reduces successively gradually.
Wherein in an embodiment, described step B comprises:
Step B1: be coated with photoresist layer on a second surface, exposes photoresist layer, develops, and remove presumptive area photoresist layer, make the first exposed portion second surface being formed multiple circle, the first occlusion part and the first exposed portion are oppositely arranged;
Step B2: second surface is etched, second surface forms the circular groove of the first order at the first place of exposed portion, and the sidewall of the circular groove of the first order is the stage portion of the first order;
Step B3: in the diapire coating photoresist layer of the circular groove of the first order, carry out exposing, developing, in the conglobate second exposed portion of the diapire shape of the circular groove of the first order;
Step B4: second surface is etched, the circular groove of the formation second level, bottom of the circular groove of the first order, the diameter of the circular groove of the second level is less than the diameter of the circular groove of the first order, the axis of symmetry of the circular groove of the second level and the circular groove of the first order is located along the same line, and the sidewall of the circular groove of the second level is the stage portion of the second level;
Step B5: be coated with photoresist layer on the first surface, exposes photoresist layer, develops, and removes presumptive area photoresist layer, makes the first occlusion part this first surface being formed multiple circle;
Step B6: first surface is etched, first surface forms the cylinder of the first order at the first occlusion part;
Step B7: in the periphery of the cylinder of first order coating photoresist layer, carry out exposing, develop, at the second occlusion part of the periphery of the cylinder of first order formation annular;
Step B8: first surface is etched, the cylinder of the formation second level, below of the cylinder of the first order, the diameter of the cylinder of the second level is less than the diameter of the cylinder of the first order, and the axis of symmetry of the cylinder of the second level and the cylinder of the first order is located along the same line;
Step B9, removes photoresist layer, forms boss-shaped optics portion and groove-like optics portion.
Wherein in an embodiment, also comprise: between step B4 and step B5, repeating said steps B3 and step B4, to form the described circular groove of N level, N is more than or equal to 3, the circular groove of rear stage is formed on the bottom of the circular groove of previous stage, and to form multiple described stage portion, the diameter of multiple circular groove reduces successively gradually; Between step B8 and step B9, repeating said steps B7 and step B8, to form the described cylinder of N level, N is more than or equal to 3, and the diameter of multiple cylinder increases successively gradually.
In above-mentioned wafer scale lens array, transparency carrier is glass or silicon dioxide.The transparency carrier that glass or silicon dioxide are made repeatedly etches at first surface and second surface and forms optics portion.The optics portion of above-mentioned eyeglass is compared to the optics portion by moulding material imprinting moulding, and refractive index not there are differences problem, ensures that image quality is better.
The method for making of above-mentioned wafer scale lens array, can make different eyeglass according to the demand of lens dimension, and without the need to making the impression block of different model, therefore manufacture craft is simple, reduces production cost, improves production efficiency.
The first surface of above-mentioned wafer scale lens array and second surface all can be provided with optics portion, more optical design demand can be met.
Accompanying drawing explanation
Fig. 1 is the stereographic map of the wafer scale lens array of an embodiment;
Fig. 2 is the stereographic map of another angle of wafer scale lens array shown in Fig. 1;
Fig. 3 is the particular flow sheet of the wafer scale lens array method for making of an embodiment;
Fig. 4 is the particular flow sheet of the step S20 of the wafer scale lens array method for making shown in Fig. 3;
Fig. 5 is the particular flow sheet of the step S250 of the wafer scale lens array method for making of an embodiment;
Fig. 6 is the schematic diagram of step S10 in method for making shown in Fig. 3;
Fig. 7 is the schematic diagram of step S220 in method for making shown in Fig. 4;
Fig. 8 is the schematic diagram of step S230 in method for making shown in Fig. 4;
Fig. 9 is the schematic diagram of step S240 in method for making shown in Fig. 4;
Figure 10 is the schematic diagram of step S251 in method for making shown in Fig. 5;
Figure 11 is the schematic diagram of step S252 in method for making shown in Fig. 5;
Figure 12 is the schematic diagram of step S253 in method for making shown in Fig. 5;
Figure 13 is the schematic diagram of step S254 in method for making shown in Fig. 5;
Figure 14 is the schematic diagram of step S255 in method for making shown in Fig. 5;
Figure 15 is the schematic diagram of step S256 in method for making shown in Fig. 5;
Figure 16 is the schematic diagram of step S260 in method for making shown in Fig. 4;
Figure 17 is the particular flow sheet of the wafer scale lens array method for making of another embodiment;
Figure 18 is the particular flow sheet of the wafer scale lens array method for making of another embodiment.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Better embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make to disclosure of the present invention understand more thorough comprehensively.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique embodiment.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe concrete embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Refer to Fig. 1 and Fig. 2, the wafer scale lens array 10 of present embodiment comprises transparency carrier 100.
Transparency carrier 100 comprises relative first surface 110 and second surface 120.First surface 110 is provided with multiple boss-shaped optics portion 111.Boss-shaped optics portion 111 comprises and multiplely stackedly arranges cylinder, and the axis of symmetry of multiple cylinder is located along the same line.The diameter of cylinder reduces gradually along away from described first surface 110 direction.
According to the designing requirement of different eyeglass, the diameter of cylinder and height can be set, to regulate the shape in boss-shaped optics portion 111.Be appreciated that the Changing Pattern of the diameter of cylinder can according to sinusoidal variation, the surface in boss-shaped optics portion 111 can for being approximately sphere, and namely the neighboring of each cylinder in boss-shaped optics portion 111 is positioned on same sphere.
Second surface 120 is provided with multiple groove-like optics portion 121.Groove-like optics portion 121 is located along the same line with the optical axis in boss-shaped optics portion 111.The madial wall in groove-like optics portion 121 is around the stage portion 122 being provided with multiple annular.Each stage portion 122 surrounds a circular groove.The axis of symmetry of multiple circular groove is located along the same line.The diameter of multiple circular groove reduces towards first surface 110 gradually from second surface 120.
Specifically in the present embodiment, the transparency carrier 100 of multiple eyeglass is a monoblock plate body.Multiple boss-shaped optics portion 111 and groove-like optics portion 121 are all arranged in array on transparency carrier 100.The cylinder quantity in boss-shaped optics portion 111 equals the quantity of the circular groove in groove-like optics portion 121.The diameter of multiple cylinders in boss-shaped optics portion 111 becomes arithmetic progression to change, and the diameter of multiple circular grooves in groove-like optics portion 121 becomes arithmetic progression to change.Boss-shaped optics portion 111 is near the diameter of the cylinder of first surface and groove-like optics portion 121 equal diameters near the circular groove of second surface.The height of multiple round platform and the deep equality of multiple circular groove.The neighboring of the circle of multiple cylinder is all positioned on same sphere, and the neighboring of the circle of multiple circular groove is all positioned in aspheric surface.
Be appreciated that the designing requirement according to different eyeglass, the diameter of circular groove and height can be set, with the shape in adjusting grooves shape optics portion 121.The surface in groove-like optics portion 121 can for being approximately aspheric surface.
The cylinder quantity in boss-shaped optics portion 111 is less than the quantity of the circular groove in groove-like optics portion 121, the equal diameters of the diameter of cylinder of the every one-level in boss-shaped optics portion 111 and the circular groove of the same one-level of groove-like optics 121.
Or in other embodiments, the cylinder quantity in boss-shaped optics portion 111 is greater than the quantity of the circular groove in groove-like optics portion 121.The diameter of the cylinder of the every one-level in groove-like optics portion and boss-shaped optics are with the equal diameters of the circular groove of one-level.
Transparency carrier is glass or silicon dioxide.The transparency carrier that glass or silicon dioxide are made forms optics portion at first surface 110 and second surface more than 120 etching.The optics portion of above-mentioned eyeglass is compared to the optics portion utilizing moulding material imprinting moulding, and refractive index not there are differences problem, ensures that image quality is better, and does not need the impression module using given shape.
Surrounding in each boss-shaped optics portion 111 on the first surface 110 of transparency carrier forms Cutting Road (not shown).Along Cutting Road cutting, wafer scale lens array is divided into multiple eyeglass.Second surface 120 is placed on the table, and transparency carrier can be enable to place stably on the table.When cutting crystal wafer level lens array 10 time, can be stable evenly cut along Cutting Road, prevents wafer scale lens array 10 from shaking.
A kind of method for making of wafer scale lens array is also provided.
Refer to Fig. 3, the method for making of wafer scale lens array, comprising:
Refer to Fig. 6, step S10, provide transparency carrier 100, transparency carrier 100 has relative first surface 110 and second surface 120.
Step S20, through multiexposure, multiple exposure, development, etching, cleaning, multiple boss-shaped optics portion 111 is formed at first surface 110, multiple groove-like optics portion 121 is formed at second surface 120, boss-shaped optics portion 111 comprises and multiplely stackedly arranges cylinder, and the axis of symmetry of multiple cylinder is located along the same line, the diameter of multiple cylinder reduces gradually along away from first surface 110 direction, second surface 120 is provided with the groove-like optics portion 121 of a groove-like, groove-like optics portion 121 is located along the same line with the optical axis in boss-shaped optics portion 111, the madial wall in groove-like optics portion 121 is around the stage portion being provided with multiple annular, each stage portion surrounds a circular groove, the axis of symmetry of multiple circular groove is located along the same line, the diameter of multiple circular groove reduces towards first surface 110 gradually from second surface 120.
Refer to Fig. 4, specifically in the present embodiment, step S20 comprises:
Refer to Fig. 7, step S220, on first surface 110 and second surface 120, be coated with the first photoresist layer 130 respectively.
Photoresist is used in the photochromics in many industrial process.Picture photoetching technique, can engrave the coating of a pattern at material surface.Be appreciated that photoresist can be forward photoresistance or negative sense photoresistance.
Refer to Fig. 8, step S230, first photoresist layer 130 is exposed, developed, remove the first photoresist layer 130 of presumptive area, make the first occlusion part 131 this first surface 110 being formed multiple circle, second surface 120 is formed the first exposed portion 141 of multiple circle, and the first occlusion part 131 and the first exposed portion 141 are oppositely arranged.
Concrete, adopt a masterplate with predetermined pattern to expose the first photoresist layer 130, UV light is radiated in the first photoresist layer 130 on first surface 110 and second surface 120.Develop to the photoresist after exposure, then on first surface 110 and second surface 120, the first photoresist layer 130 of presumptive area can be dissolved in developer solution, obtains predetermined pattern.Therefore, first surface 110 is formed the first occlusion part 131 of multiple circle.Second surface 120 is formed the first exposed portion 141 of multiple circle.
Refer to Fig. 9, step S240, etch first surface 110 and second surface 120, first surface 110 forms the cylinder 112 of the first order in the first occlusion part 131 place, and second surface 120 forms the circular groove 123 of the first order in the first exposed portion 141.The sidewall of the circular groove 123 of the first order is the stage portion 122 of the first order.
Etching is provided with the exposed part covering photoresist.Then avoid the first occlusion part 131, etch away first surface 110 and form the first etch layer 133 except the remainder of the first occlusion part 131, on first surface 110, therefore form the cylinder 112 of the first order of multiple projection.The cylinder 112 of the first order is the remaining layer of first surface 110 after etching.On second surface 120, etching the first exposed portion 141, forms depression at the first place of exposed portion 141, therefore second surface 120 is formed the circular groove 123 of multiple first order.
Refer to Fig. 4, Figure 10 and Figure 11, step S250, the second photoresist layer is coated with respectively at the diapire of the periphery of the cylinder 112 of the first order and the circular groove 123 of the first order, expose, development, the second occlusion part of annular is formed in the periphery of the cylinder 112 of the first order, the conglobate second exposed portion 142 of diapire shape of the circular groove 123 of the first order, etching, the below of the cylinder 112 of the first order forms the cylinder 113 of the first order, the diameter of the cylinder 113 of the second level is less than the diameter of the cylinder 112 of the first order, the cylinder 113 of the second level is located along the same line with the axis of symmetry of the cylinder 112 of the first order, the circular groove 124 of the formation second level, bottom of the circular groove 123 of the first order.The diameter of the circular groove 124 of the second level is less than the diameter of the circular groove 123 of the first order, and the circular groove 124 of the second level is located along the same line with the axis of symmetry of the circular groove 123 of the first order.The sidewall of the circular groove 124 of the second level is the stage portion (figure does not mark) of the second level.
Specifically in the present embodiment, above-mentioned wafer scale lens array 100 comprises multistage cylinder and circular groove, therefore, in the method for making of above-mentioned wafer scale lens array, step S250 also comprises the step repeatedly forming the cylinder 113 of the second level and the circular groove 124 of the second level, with the circular groove of the cylinder and N level that form N level, N is more than or equal to 3, the diameter of multistage cylinder increases successively gradually, the axis of symmetry of multistage cylinder is located along the same line, the circular groove of rear stage is formed on the bottom of the circular groove of previous stage, the diameter of multistage circular groove reduces successively gradually, the axis of symmetry of multistage circular groove and circular groove is located along the same line.Therefore, step S250 specifically can be divided into:
Refer to Fig. 5 and Figure 10, step S251, be coated with the second photoresist layer 150 respectively at the diapire of the periphery of the cylinder 112 of the first order and the circular groove 123 of the first order, the periphery of the cylinder 112 of the first order is the first etch layer 133.Carry out exposing, developing, remove the second photoresist layer 150 of presumptive area, form the second occlusion part 151 of annular in the periphery of the cylinder 112 of the first order, the conglobate second exposed portion 142 of diapire shape of circular groove.
Adopt a masterplate with predetermined pattern to expose the second photoresist layer 150, UV light is radiated in the second photoresist layer 150.Develop to the second photoresist after exposure, the second photoresist layer 150 of presumptive area is dissolved in developer solution, obtains predetermined pattern.Therefore, the second occlusion part 151 of annular is formed in the periphery of the cylinder 112 of the first order.The conglobate second exposed portion 142 of shape on the diapire of the circular groove 123 of the first order.
Refer to Figure 11, step S252, etch first surface 110 and second surface 120, the cylinder 113 of the formation second level, below of the cylinder 112 of the first order, the remainder etching away removing second occlusion part 151 of the first etch layer 133 forms the second etch layer 134.The diameter of the cylinder 113 of the second level is greater than the diameter of the cylinder 112 of the first order, and the cylinder 113 of the second level is located along the same line with the axis of symmetry of the cylinder 112 of the first order.The circular groove 124 of the formation second level, bottom of the circular groove 123 of the first order, the diameter of the circular groove 124 of the second level is less than the diameter of the circular groove 123 of the first order, and the circular groove 124 of the second level is located along the same line with the axis of symmetry of the circular groove 123 of the first order.
Refer to 5 and Figure 12, step S253, diapire coating the 3rd photoresist layer 160 of the periphery of the cylinder 113 respectively in the second level and the circular groove 124 of the second level, the periphery of the cylinder 113 of the second level is the second etch layer 134.Carry out exposing, developing, remove the 3rd photoresist layer 160 of presumptive area, the periphery of the cylinder 113 in the second level forms the 3rd occlusion part 161 of annular, the conglobate 3rd exposed portion 143 of diapire shape of the circular groove 124 of the second level.
Refer to Figure 13, step S254, etch first surface 110 and second surface 120, the below of the cylinder 113 of the second level forms the cylinder 114 of the third level, and the remainder etching away removing the 3rd occlusion part 161 of the second etch layer 134 forms the 3rd etch layer 135.The diameter of the cylinder 114 of the third level is greater than the diameter of the cylinder 113 of the second level, and the cylinder 114 of the third level is located along the same line with the axis of symmetry of the cylinder 112 of the first order.The circular groove 125 of the third level is formed on the bottom of the circular groove 124 of the second level.The diameter of the circular groove 125 of the third level is less than the diameter of the circular groove 124 of the second level, and the circular groove 125 of the third level is located along the same line with the axis of symmetry of the circular groove 124 of the second level.
Refer to Fig. 5 and Figure 14, step S255, be coated with the 4th photoresist layer 170 at the diapire of the periphery of the cylinder 114 of the third level and the circular groove 125 of the third level respectively, the periphery of the cylinder 114 of the third level is the 3rd etch layer 135.Carry out exposing, developing, remove the 4th photoresist layer 170 of presumptive area, form the 4th occlusion part 171 of annular in the periphery of the cylinder 114 of the third level, the conglobate 4th exposed portion 144 of diapire shape of the circular groove 125 of the third level.
Refer to Fig. 5 and Figure 15, step S256, etch first surface 110 and second surface 120, the below of the cylinder 114 of the third level forms the cylinder 115 of the fourth stage, and the remainder etching away removing the 4th occlusion part of the 3rd etch layer 135 forms the 4th etch layer 136.The diameter of the cylinder 115 of the fourth stage is greater than the diameter of the cylinder 114 of the third level, and the cylinder 115 of the fourth stage is located along the same line with the axis of symmetry of the cylinder 112 of the first order.The circular groove 126 of the fourth stage is formed on the bottom of the circular groove 125 of the third level, and the diameter of the circular groove 126 of the fourth stage is less than the diameter of the circular groove 125 of the third level, and the circular groove 126 of the fourth stage is located along the same line with the axis of symmetry of the circular groove 125 of the third level.
Be appreciated that according to different lens design needs, between step S260 and step S250, the step of step S250 formation cylinder and circular groove can be repeatedly.The number of times repeated is determined according to the structure of eyeglass.
Further, according to the design needs of eyeglass, the exposure masterplate with different predetermined pattern can be set.Thus the diameter of cylinder and circular groove can be changed, the shape in setting boss-shaped optics portion 111 and groove-like optics portion 121.
Specifically in the present embodiment, the diameter of multiple cylinders in boss-shaped optics portion 111 becomes arithmetic progression to change, and the diameter of multiple circular grooves in groove-like optics portion 121 becomes arithmetic progression to change.Boss-shaped optics portion 111 is near the diameter of the cylinder of first surface 110 and groove-like optics portion 121 equal diameters near the circular groove of second surface 120.Further, the photoresist that photoresist first surface 110 is coated with and second surface 120 are coated with is respectively forward photoresistance or negative sense photoresistance.Therefore, make the first order cylinder 112 in and make the fourth stage circular groove 126 time, identical exposure template can be used.In like manner, make the second level cylinder 113 in and make the third level circular groove 125 time, identical exposure template can be used.Therefore, in the method for making of above-mentioned wafer scale lens array, a set of exposure template can be used, can avoid making multiple exposure template, therefore save the cost of manufacture of template.
Refer to Fig. 4 and Figure 16, step S260, remove photoresist layer, form boss-shaped optics portion 111 and groove-like optics portion 121, boss-shaped optics portion 111 is located along the same line with the optical axis in groove-like optics portion 121.
Specifically in the present embodiment, by organic solvent, cleaning removal first photoresist layer 130, second photoresist layer 150, the 3rd photoresist layer 160 and the 4th photoresist layer 170.
Be appreciated that photoresist layer can also be removed by the mode peeled off.
Concrete the method for making of wafer scale lens array can also comprise in the present embodiment, and the surrounding in each boss-shaped optics portion 111 on the first surface 110 of transparent substrates forms the step of Cutting Road.
Along Cutting Road cutting, wafer scale lens array 10 is divided into multiple above-mentioned eyeglass.
The method for making of above-mentioned wafer scale lens array, can make different eyeglass according to the demand of lens dimension, and without the need to making the impression block of different model, therefore manufacture craft is simple, reduces production cost, improves production efficiency.
The first surface 110 of the wafer scale lens array 10 obtained by the method for making of above-mentioned wafer scale lens array and second surface 120 all can be provided with optics portion, more optical design demand can be met.
Be appreciated that in the method for making of above-mentioned wafer scale lens array, boss-shaped optics portion 111 can separate with groove-like optics portion 121 and makes.Therefore, can first carry out making boss-shaped optics portion 111, after carry out making groove-like optics portion 121.Also can first carry out making groove-like optics portion 121, after carry out making boss-shaped optics portion 111.Also can the multistage circular groove in the multistage cylinder in boss-shaped optics portion 111 and groove-like optics portion 121 be interlaced makes.
Refer to Figure 17, therefore, in other embodiments, a kind of method for making of wafer scale lens array first carries out making boss-shaped optics portion 111, after carry out making groove-like optics portion 121.A kind of method for making of wafer scale lens array comprises:
Step S310, provides a transparency carrier, and described transparency carrier has relative first surface and second surface.
Step S320, is coated with photoresist layer on the first surface, exposes, develops to photoresist layer, removes presumptive area photoresist layer, makes the first occlusion part this first surface being formed multiple circle.
Step S330, etches first surface, and first surface forms the cylinder of the first order at the first occlusion part.
Step S340, in the periphery of the cylinder of first order coating photoresist layer, carries out exposing, develop, at the second occlusion part of the periphery of the cylinder of first order formation annular.
Step S350, etches first surface, the cylinder of the formation second level, below of the cylinder of the first order, and the diameter of the cylinder of the second level is less than the diameter of the cylinder of the first order, and the axis of symmetry of the cylinder of the second level and the cylinder of the first order is located along the same line.
Step S360, is coated with photoresist layer on a second surface, exposes, develops to photoresist layer, and remove presumptive area photoresist layer, make the first exposed portion second surface being formed multiple circle, the first occlusion part and the first exposed portion are oppositely arranged.
Step S370, etches second surface, and second surface forms the circular groove of the first order at the first place of exposed portion, and the sidewall of the circular groove of the described first order is the stage portion of the first order.
Step S380, in the diapire coating photoresist layer of the circular groove of the first order, carries out exposing, developing, in the conglobate second exposed portion of the diapire shape of the circular groove of the first order.
Step S390, second surface is etched, etching, the circular groove of the formation second level, bottom of the circular groove of the first order, the diameter of the circular groove of the second level is less than the diameter of the circular groove of the first order, the axis of symmetry of the circular groove of the second level and the circular groove of the first order is located along the same line, and the sidewall of the circular groove of the second level is the stage portion of the second level.
Step S399, removes photoresist layer, and form boss-shaped optics portion and groove-like optics portion, the optical axis in boss-shaped optics portion and groove-like optics portion is located along the same line.
In other embodiments, between step S350 and step S360, repeating said steps S340 and step S350, to form the described cylinder of N level, N is more than or equal to 3, and the diameter of multiple cylinder increases successively gradually.
Between step S390 and step S399, repeating said steps S380 and step S390, to form the described circular groove of N level, N is more than or equal to 3, the circular groove of rear stage is formed on the bottom of the circular groove of previous stage, and to form multiple described stage portion, the diameter of multiple circular groove reduces successively gradually.
Refer to Figure 18, in other embodiments, a kind of method for making of wafer scale lens array first carries out making groove-like optics portion, after carry out making boss-shaped optics portion.A kind of method for making of wafer scale lens array comprises:
Step S410, provides a transparency carrier, and described transparency carrier has relative first surface and second surface.
Step S420, is coated with photoresist layer on a second surface, exposes, develops to photoresist layer, and remove presumptive area photoresist layer, make the first exposed portion second surface being formed multiple circle, the first occlusion part and the first exposed portion are oppositely arranged.
Step S430, etches second surface, and second surface forms the circular groove of the first order at the first place of exposed portion, and the sidewall of the circular groove of the first order is the stage portion of the first order.
Step S440, in the diapire coating photoresist layer of the circular groove of the first order, carries out exposing, developing, in the conglobate second exposed portion of the diapire shape of the circular groove of the first order.
Step S450, second surface is etched, the circular groove of the formation second level, bottom of the circular groove of the first order, the diameter of the circular groove of the second level is less than the diameter of the circular groove of the first order, the axis of symmetry of the circular groove of the second level and the circular groove of the first order is located along the same line, and the sidewall of the circular groove of the second level is the stage portion of the second level.
Step S460, is coated with photoresist layer on the first surface, exposes, develops to photoresist layer, removes presumptive area photoresist layer, makes the first occlusion part this first surface being formed multiple circle.
Step S470, etches first surface, and first surface forms the cylinder of the first order at the first occlusion part.
Step S480, in the periphery of the cylinder of first order coating photoresist layer, carries out exposing, develop, at the second occlusion part of the periphery of the cylinder of first order formation annular.
Step S490, etches first surface, the cylinder of the formation second level, below of the cylinder of the first order, and the diameter of the cylinder of the second level is less than the diameter of the cylinder of the first order, and the axis of symmetry of the cylinder of the second level and the cylinder of the first order is located along the same line.
Step S499, removes photoresist layer, and form boss-shaped optics portion and groove-like optics portion, the optical axis in boss-shaped optics portion and groove-like optics portion is located along the same line.
Be appreciated that, in other embodiments, between step S450 and step S460, repeating said steps S440 and step S450, to form the described circular groove of N level, N is more than or equal to 3, and the circular groove of rear stage is formed on the bottom of the circular groove of previous stage, to form multiple described stage portion, the diameter of multiple circular groove reduces successively gradually.
Between step S490 and step S499, repeating said steps S480 and step S490, to form the described cylinder of N level, N is more than or equal to 3, and the diameter of multiple cylinder increases successively gradually.
A kind of eyeglass (not shown) is also provided.Wafer scale lens array is cut along Cutting Road, is divided into multiple independently eyeglass.Wafer scale lens array comprises multiple eyeglass.
A kind of camera lens module (not shown) is also provided.Camera lens module comprises above-mentioned eyeglass.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (13)
1. the eyeglass of a camera lens module, it is characterized in that, comprise transparency carrier, described transparency carrier comprises relative first surface and second surface, described first surface is provided with a boss-shaped optics portion, described boss-shaped optics portion comprises and multiplely stackedly arranges cylinder, and the axis of symmetry of multiple described cylinder is located along the same line, the diameter of multiple described cylinder reduces gradually along away from described first surface direction, described second surface is provided with a groove-like optics portion, the optical axis in described groove-like optics portion and described boss-shaped optics portion is located along the same line, the madial wall in described groove-like optics portion is around the stage portion being provided with multiple annular, each described stage portion surrounds a circular groove, the axis of symmetry of multiple described circular groove is located along the same line, the diameter of multiple described circular groove reduces towards described first surface gradually from described second surface.
2. the eyeglass of camera lens module according to claim 1, is characterized in that, described transparency carrier is glass or silicon dioxide; The diameter of multiple cylinders in described boss-shaped optics portion becomes arithmetic progression to change, and the diameter of multiple circular grooves in described groove-like optics portion becomes arithmetic progression to change.
3. the eyeglass of camera lens module according to claim 1, is characterized in that, the neighboring of the circle of multiple described cylinder is all positioned on same sphere, and the neighboring of the circle of multiple described circular groove is all positioned in same aspheric surface.
4. the eyeglass of camera lens module according to claim 1, is characterized in that, the described cylinder quantity in described boss-shaped optics portion equals the quantity of the described circular groove in described groove-like optics portion.
5. a camera lens module, is characterized in that, comprises the eyeglass as described in Claims 1 to 4 any one.
6. a wafer scale lens array, it is characterized in that, comprise multiple eyeglass as described in Claims 1 to 4 any one, described boss-shaped optics portion and the described groove-like optics portion of multiple described eyeglass are all arranged in array, and the transparency carrier of described multiple eyeglass is a monoblock plate body.
7. a method for making for wafer scale lens array, is characterized in that, comprising:
Steps A, provides a transparency carrier, and described transparency carrier has relative first surface and second surface;
Step B, through multiexposure, multiple exposure, development, etching, cleaning, multiple boss-shaped optics portion is formed at described first surface, multiple groove-like optics portion is formed at described second surface, described boss-shaped optics portion comprises and multiplely stackedly arranges cylinder, and the axis of symmetry of multiple described cylinder is located along the same line, the diameter of multiple described cylinder reduces gradually along away from described first surface direction, the optical axis in described groove-like optics portion and described boss-shaped optics portion is located along the same line, the madial wall in described groove-like optics portion is around the stage portion being provided with multiple annular, each described stage portion surrounds a circular groove, the axis of symmetry of multiple described circular groove is located along the same line, the diameter of multiple described circular groove reduces towards described first surface gradually from described second surface.
8. the method for making of wafer scale lens array according to claim 7, is characterized in that, described step B comprises further:
Step B1, photoresist layer is coated with respectively on first surface and second surface, photoresist layer is exposed, develops, remove presumptive area photoresist layer, make the first occlusion part this first surface being formed multiple circle, second surface is formed the first exposed portion of multiple circle, the first occlusion part and the first exposed portion are oppositely arranged;
Step B2, etches first surface and second surface, and first surface forms the cylinder of the first order in the first occlusion part, and second surface forms the circular groove of the first order in the first place of exposed portion, and the sidewall of the circular groove of the described first order is the stage portion of the first order;
Step B3, photoresist layer is coated with respectively at the diapire of the periphery of the cylinder of the first order and the circular groove of the first order, carry out exposing, develop, formed in the periphery of the cylinder of the first order the second occlusion part of annular, the conglobate second exposed portion of diapire shape of the circular groove of the first order;
Step B4, first surface and second surface are etched, the cylinder of the formation second level, below of the cylinder of the first order, the diameter of the cylinder of the second level is less than the diameter of the cylinder of the first order, the axis of symmetry of the cylinder of the second level and the cylinder of the first order is located along the same line, the circular groove of the formation second level, bottom of the circular groove of the first order, the diameter of the circular groove of the second level is less than the diameter of the circular groove of the first order, the axis of symmetry of the circular groove of the second level and the circular groove of the first order is located along the same line, and the sidewall of the circular groove of the described second level is the stage portion of the second level;
Step B5, removes photoresist layer, forms boss-shaped optics portion and groove-like optics portion.
9. the method for making of wafer scale lens array according to claim 8, it is characterized in that, also comprise: between step B4 and step B5, repeating said steps B3 and step B4, with the described circular groove of the described cylinder and N level that form N level, N is more than or equal to 3, the cylinder of rear stage is formed on the bottom of the cylinder of previous stage, the diameter of multiple cylinder increases successively gradually, the circular groove of rear stage is formed on the bottom of the circular groove of previous stage, to form multiple described stage portion, the diameter of multiple circular groove reduces successively gradually.
10. the method for making of wafer scale lens array according to claim 7, is characterized in that, described step B comprises further:
Step B1: be coated with photoresist layer on the first surface, exposes photoresist layer, develops, and removes presumptive area photoresist layer, makes the first occlusion part this first surface being formed multiple circle;
Step B2: first surface is etched, first surface forms the cylinder of the first order at the first occlusion part;
Step B3: in the periphery of the cylinder of first order coating photoresist layer, carry out exposing, develop, at the second occlusion part of the periphery of the cylinder of first order formation annular;
Step B4: first surface is etched, the cylinder of the formation second level, below of the cylinder of the first order, the diameter of the cylinder of the second level is less than the diameter of the cylinder of the first order, and the axis of symmetry of the cylinder of the second level and the cylinder of the first order is located along the same line;
Step B5: be coated with photoresist layer on a second surface, exposes photoresist layer, develops, and remove presumptive area photoresist layer, make the first exposed portion second surface being formed multiple circle, the first occlusion part and the first exposed portion are oppositely arranged;
Step B6: second surface is etched, second surface forms the circular groove of the first order at the first place of exposed portion, and the sidewall of the circular groove of the described first order is the stage portion of the first order;
Step B7: in the diapire coating photoresist layer of the circular groove of the first order, carry out exposing, developing, in the conglobate second exposed portion of the diapire shape of the circular groove of the first order;
Step B8: second surface is etched, the circular groove of the formation second level, bottom of the circular groove of the first order, the diameter of the circular groove of the second level is less than the diameter of the circular groove of the first order, the axis of symmetry of the circular groove of the second level and the circular groove of the first order is located along the same line, and the sidewall of the circular groove of the second level is the stage portion of the second level;
Step B9, removes photoresist layer, forms boss-shaped optics portion and groove-like optics portion.
The method for making of 11. wafer scale lens arrays according to claim 10, is characterized in that, also comprise: between step B4 and step B5, repeating said steps B3 and step B4, to form the described cylinder of N level, N is more than or equal to 3, and the diameter of multiple cylinder increases successively gradually; Between step B8 and step B9, repeating said steps B7 and step B8, to form the described circular groove of N level, N is more than or equal to 3, the circular groove of rear stage is formed on the bottom of the circular groove of previous stage, and to form multiple described stage portion, the diameter of multiple circular groove reduces successively gradually.
The method for making of 12. wafer scale lens arrays according to claim 7, it is characterized in that, described step B comprises:
Step B1: be coated with photoresist layer on a second surface, exposes photoresist layer, develops, and remove presumptive area photoresist layer, make the first exposed portion second surface being formed multiple circle, the first occlusion part and the first exposed portion are oppositely arranged;
Step B2: second surface is etched, second surface forms the circular groove of the first order at the first place of exposed portion, and the sidewall of the circular groove of the first order is the stage portion of the first order;
Step B3: in the diapire coating photoresist layer of the circular groove of the first order, carry out exposing, developing, in the conglobate second exposed portion of the diapire shape of the circular groove of the first order;
Step B4: second surface is etched, the circular groove of the formation second level, bottom of the circular groove of the first order, the diameter of the circular groove of the second level is less than the diameter of the circular groove of the first order, the axis of symmetry of the circular groove of the second level and the circular groove of the first order is located along the same line, and the sidewall of the circular groove of the second level is the stage portion of the second level;
Step B5: be coated with photoresist layer on the first surface, exposes photoresist layer, develops, and removes presumptive area photoresist layer, makes the first occlusion part this first surface being formed multiple circle;
Step B6: first surface is etched, first surface forms the cylinder of the first order at the first occlusion part;
Step B7: in the periphery of the cylinder of first order coating photoresist layer, carry out exposing, develop, at the second occlusion part of the periphery of the cylinder of first order formation annular;
Step B8: first surface is etched, the cylinder of the formation second level, below of the cylinder of the first order, the diameter of the cylinder of the second level is less than the diameter of the cylinder of the first order, and the axis of symmetry of the cylinder of the second level and the cylinder of the first order is located along the same line;
Step B9, removes photoresist layer, forms boss-shaped optics portion and groove-like optics portion.
The method for making of 13. wafer scale lens arrays according to claim 12, it is characterized in that, also comprise: between step B4 and step B5, repeating said steps B3 and step B4, to form the described circular groove of N level, N is more than or equal to 3, and the circular groove of rear stage is formed on the bottom of the circular groove of previous stage, to form multiple described stage portion, the diameter of multiple circular groove reduces successively gradually; Between step B8 and step B9, repeating said steps B7 and step B8, to form the described cylinder of N level, N is more than or equal to 3, and the diameter of multiple cylinder increases successively gradually.
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Address after: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20211025 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 330013 Nanchang economic and Technological Development Zone, Nanchang, Jiangxi, north of the lilac road and the north of the Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |