CN104746044B - reaction chamber and plasma processing device - Google Patents

reaction chamber and plasma processing device Download PDF

Info

Publication number
CN104746044B
CN104746044B CN201310738635.7A CN201310738635A CN104746044B CN 104746044 B CN104746044 B CN 104746044B CN 201310738635 A CN201310738635 A CN 201310738635A CN 104746044 B CN104746044 B CN 104746044B
Authority
CN
China
Prior art keywords
reaction chamber
recess
transparent window
cooling water
ring baffle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310738635.7A
Other languages
Chinese (zh)
Other versions
CN104746044A (en
Inventor
袁福顺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing North Microelectronics Co Ltd
Original Assignee
Beijing North Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing North Microelectronics Co Ltd filed Critical Beijing North Microelectronics Co Ltd
Priority to CN201310738635.7A priority Critical patent/CN104746044B/en
Publication of CN104746044A publication Critical patent/CN104746044A/en
Application granted granted Critical
Publication of CN104746044B publication Critical patent/CN104746044B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

The present invention relates to reaction chamber and plasma processing device, including chamber roof, cooling unit and temperature measuring unit;Cooling unit is used for chamber roof spraying cooling water;Temperature measuring unit includes temperature sensor and ring baffle, and chamber roof is provided with transparent window, at temperature sensor position above chamber roof and corresponding with transparent window, is used to be detected through transparent window the internal temperature of reaction chamber;Ring baffle is used to, by transparent window and cooling water segregation, to prevent cooling water from flowing on transparent window, the internal perisporium recess of a week is provided around on ring baffle internal perisporium, and recess opening upwards are inclined;Osculum is provided with recess, is used to flow into the cooling water discharge of recess.Above-mentioned reaction chamber can be such that the cooling water being splashed on ring baffle internal perisporium is flowed into recess along ring baffle internal perisporium, and be discharged through discharge outlet, be flowed on transparent window so as to avoid cooling water, and the detection accuracy to temperature sensor has undesirable effect.

Description

Reaction chamber and plasma processing device
Technical field
The present invention relates to microelectronic processing technique field, in particular it relates to reaction chamber and plasma processing device.
Background technology
Aumospheric pressure cvd(Atmospheric Pressure Chemical Vapor Deposition, APCVD)Refer to a kind of method of the chemical vapor deposition for carrying out under atmospheric pressure, due to its simple system, reaction speed is fast, APCVD technologies are used to prepare film in chip manufacturing proces.During APCVD techniques are carried out, it usually needs to being added Work workpiece is heated, so that it can react under technological temperature higher with process gas, and forms film.In order to Process uniformity is improved, quality of forming film is improved, it is necessary to ensures the uniformity of heating workpiece to be machined, therefore, generally by temperature The temperature of detection means monitor in real time workpiece to be machined is spent, in the non-uniform temperature of its regional, can carry out in time Adjustment.Additionally, in order to prevent reaction chamber from being damaged in hot environment, generally being carried out to reaction chamber using cooling system cold But.
Fig. 1 is the structural representation of existing reaction chamber.As shown in figure 1, being provided with cooling above reaction chamber roof System and temperature-detecting device.Wherein, cooling system includes spray equipment 11 and water fender 12, and spray equipment 11 is located at reaction chamber Room top, it includes multiple water jets 111, to the top spray cooling water of orientating reaction chamber;Water fender 12 is located at reaction On the roof of chamber, and be looped around the periphery of multiple water jets 111, it forms tank with the roof of reaction chamber, with accommodate from The cooling water that water jet 111 sprays.Temperature-detecting device includes infrared measurement of temperature unit 21 and measurement window 22, wherein, measurement window Mouth 22 includes the transparent window 221 being arranged on reaction chamber roof and the ring baffle for being looped around the periphery of transparent window 221 222;Infrared measurement of temperature unit 21 is arranged on reaction chamber top, and at the position corresponding with transparent window 221, is used to be received from The infrared ray that reaction chamber inside radiates through transparent window 221, to monitor the internal temperature of reaction chamber;Ring baffle 222 be used for transparent window 221 and cooling water in tank is mutually isolated.
Above-mentioned reaction chamber is inevitably present following problems in actual applications, i.e.,:
During technique is carried out, due to cooling system to the cooling of reaction chamber and temperature-detecting device to reaction chamber The monitoring of the internal temperature of room is carried out simultaneously, and the cooling water sprayed on the roof of reaction chamber can be splashed into ring baffle unavoidably In 222, and flow on transparent window 221, cause the infrared ray that autoreaction chamber interior is radiated because on transparent window 221 Cooling water and produce energy loss, so as to infrared measurement of temperature unit 21 measurement accuracy bring harmful effect.And, flow to Cooling water on bright window 221 can leave watermark on transparent window 221 after the drying, and the watermark equally can be to through transparency window The infrared ray of mouth 221 produces influence, and then influences the accuracy of the measurement of infrared measurement of temperature unit 21;And, the watermark is difficult to remove, So as to the maintenance to equipment brings difficulty.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art, it is proposed that a kind of reaction chamber and wait Plasma processing apparatus, it can make to be splashed into the inner circumferential of ring baffle in cooling procedure of the cooling unit to reaction chamber Cooling water on wall, is flowed into the recess on ring baffle internal perisporium, and is discharged from the osculum in the recess; So as to avoid cooling water from being flowed into from the internal perisporium of ring baffle on chamber roof transparent window on, to the survey of temperature measuring unit Amount accuracy brings harmful effect.
A kind of reaction chamber is provided to realize the purpose of the present invention, including chamber roof, cooling unit and temperature measuring unit, Wherein, the cooling unit is used to cool down reaction chamber by towards the chamber roof spraying cooling water;The survey Warm unit includes temperature sensor and ring baffle, and transparent window, the temperature sensor are provided with the chamber roof It is arranged on chamber roof top, and at the position corresponding with the transparent window, is used to anti-through transparent window detection Answer the internal temperature of chamber;The ring baffle is used to be isolated the transparent window and cooling water, to prevent cooling water stream Enter on the transparent window;The internal perisporium recess of a week is provided around on the internal perisporium of the ring baffle, and it is described The opening upwards of recess are inclined;Also, osculum is provided with the recess, is used to the cooling water drainage by the recess is flowed into Go out.
Wherein, there is chamfering or fillet between the roof and periphery wall of the ring baffle.
Wherein, there is fillet between the internal perisporium of the ring baffle and the upper wall of the recess.
Wherein, the part above the recess of the internal perisporium of the ring baffle with diameter greater than positioned at described recessed The diameter of the part below portion.
Wherein, pallet is provided with the reaction chamber, is used to carry workpiece to be machined;Also, the transparent window At the position corresponding with the tray upper surface;The temperature sensor is used to be detected by through the transparent window The temperature of the pallet obtains the internal temperature of the reaction chamber.
Wherein, the transparent window the pallet projection in the plane extended to from the center of the pallet it is described The edge of pallet;The temperature measuring unit also includes straight line driving mechanism, and the straight line driving mechanism is used to drive the temperature to pass Sensor makees straight reciprocating motion between the two ends of the transparent window.
Wherein, the temperature measuring unit also includes control device, and the control device is used to control the straight line driving mechanism The temperature sensor is driven to make the speed and distance of straight reciprocating motion.
Wherein, the straight line driving mechanism includes cylinder or linear electric motors.
Wherein, the control device includes PLC.
Wherein, the cooling unit includes spray equipment and water fender;Wherein described spray equipment is located at the chamber top Wall top, it has multiple water jets, to towards the chamber roof spraying cooling water;The water fender is located at the chamber On roof, and the periphery of the multiple water jet is looped around, the water fender and the chamber roof form tank, are used to accommodate From the cooling water that the water jet sprays.
Wherein, the scope of the vertical spacing between the water jet and the chamber roof is 10~25mm.
Wherein, the cooling unit also includes lift drive mechanism, and the lift drive mechanism is used to drive the spray Device rises or falls, to adjust the vertical spacing between the water jet and the chamber roof.
Used as another technical scheme, the present invention also provides a kind of plasma processing device, including reaction chamber, described Reaction chamber employs the above-mentioned reaction chamber of present invention offer.
The invention has the advantages that:
The reaction chamber that the present invention is provided, is provided around the internal perisporium one of the ring baffle on the internal perisporium of its ring baffle The recess in week, in cooling unit towards chamber roof spraying cooling water, during cooling down reaction chamber, to make to be splashed into Cooling water on the internal perisporium of the ring baffle above the recess is under gravity along the internal perisporium of ring baffle It is flowed into the recess, and is discharged via the discharge outlet in the recess, so as to avoids above-mentioned cooling water from ring baffle Internal perisporium be flowed on the transparent window on chamber roof, to temperature sensor detection reaction chamber inside temperature standard True property has undesirable effect.
The plasma processing device that the present invention is provided, it uses the reaction chamber of present invention offer, can be single in cooling Unit during cooling down reaction chamber, makes to be splashed into the ring above the recess towards chamber roof spraying cooling water Cooling water on the internal perisporium of shape baffle plate is flowed into the recess along the internal perisporium of ring baffle under gravity, and is passed through Discharged by the discharge outlet in the recess, chamber roof is flowed into from the internal perisporium of ring baffle so as to avoid above-mentioned cooling water On transparent window on, the accuracy of temperature to the inside of temperature sensor detection reaction chamber has undesirable effect.
Brief description of the drawings
Fig. 1 is the structural representation of existing reaction chamber;
The schematic top plan view of the reaction chamber that Fig. 2 is provided for first embodiment of the invention;
Fig. 3 is the sectional view along A-A directions of reaction chamber shown in Fig. 2;
Fig. 4 is the schematic top plan view of the ring baffle in reaction chamber shown in Fig. 2;
Fig. 5 is the sectional view along B-B directions of ring baffle shown in Fig. 4;And
The schematic diagram of ring baffle in the reaction chamber that Fig. 6 is provided for second embodiment of the invention.
Specific embodiment
To make those skilled in the art more fully understand technical scheme, come below in conjunction with the accompanying drawings to the present invention The reaction chamber and plasma processing device of offer are described in detail.
The schematic top plan view of the reaction chamber that Fig. 2 is provided for first embodiment of the invention.Fig. 3 is reaction chamber shown in Fig. 2 The sectional view along A-A directions.Please in the lump referring to Fig. 2 and Fig. 3, reaction chamber includes chamber roof 3, cooling unit 4 and thermometric Unit 5.Wherein, transparent window is provided with chamber roof 3, to detect reaction chamber through the transparent window by temperature measuring unit 5 The internal temperature of room.
Cooling unit 4 is used to cool down reaction chamber by towards the spraying cooling water of chamber roof 3;Specifically, it is cold But unit 4 includes spray equipment 41 and water fender 42;Wherein, located at the top of chamber roof 3, it has multiple sprays to spray equipment 41 The mouth of a river 410, to towards the spraying cooling water of chamber roof 3;Water fender 42 is looped around above-mentioned multiple on chamber roof 3 The periphery of water jet 410, the water fender 42 and chamber roof 3 form tank, are used to accommodate and are sprayed from above-mentioned multiple water jets 410 Cooling water.
Temperature measuring unit 5 includes temperature sensor 51 and ring baffle 52;Wherein, temperature sensor 51 is arranged on chamber roof At positions above in the of 3 and corresponding with transparent window, it is used to be detected through transparent window the internal temperature of reaction chamber;Annular Baffle plate 52 is used to be isolated the cooling water that transparent window and cooling unit 4 are sprayed towards chamber roof 3, to prevent cooling water stream Enter onto transparent window.
Please in the lump referring to the schematic top plan view that Fig. 4 and Fig. 5, Fig. 4 are the ring baffle in reaction chamber shown in Fig. 2.Fig. 5 is The sectional view along B-B directions of ring baffle shown in Fig. 4.Ring baffle 52 is provided around on the internal perisporium of ring baffle 52 The internal perisporium recess of a week 520, and the recess 520 opening upwards incline;Also, it is provided with osculum in the recess 520 521.During cooling unit 4 is cooled down to reaction chamber, the ring baffle 52 being splashed into above recess 520 Cooling water on internal perisporium is flowed into recess 520 along the internal perisporium of ring baffle 52, and from the osculum in the recess 520 521 discharges.
It is readily appreciated that, in actual use, the height for setting osculum 521 is formed higher than water fender 42 with chamber roof 3 Tank in cooling water height of water level, water can be drained into from osculum 521 with the cooling water flowed into recess 520 In groove, and the cooling water in tank cannot pour in down a chimney in recess 520 through osculum 521.
The reaction chamber that first embodiment of the invention is provided, is provided around annular gear on the internal perisporium of its ring baffle 52 The internal perisporium recess of a week 520 of plate 52, in cooling unit 4 towards the spraying cooling water of chamber roof 3, with to reaction chamber When being cooled down, make to be splashed into effect of the cooling water on the internal perisporium of the ring baffle 52 of the top of recess 520 in gravity The lower internal perisporium along ring baffle 52 is flowed into recess 520, and is discharged via the discharge outlet 521 in recess 520, so as to avoid Above-mentioned cooling water is flowed on the transparent window on chamber roof 3 from the internal perisporium of ring baffle 52, to temperature sensor 51 Detect that the accuracy of the temperature of the inside of reaction chamber has undesirable effect.
Specifically, as shown in figure 5, having chamfering between the roof and periphery wall of ring baffle 52, it is used to make ring baffle Between 52 roof and periphery wall have a downward-sloping plane, so as to cooling unit 4 water jet 410 to chamber top On wall 3 during spraying cooling water, allow the cooling water edge being splashed into the roof of ring baffle 52 and the downward-sloping plane The plane is flowed into the tank outside ring baffle 52;Less cooling water can so be flowed into ring baffle 52 Portion.In actual use, the chamfering between above-mentioned roof and periphery wall located at ring baffle 52 can also be replaced with fillet.
With continued reference to Fig. 5, in the present embodiment, there is circle between the internal perisporium of ring baffle 52 and the upper wall of recess 520 Angle, is used to make to be located between the internal perisporium of the ring baffle 52 of the top of recess 520 and recess 520 have the arc for connecting the two Face, so as to when the water jet 410 of cooling unit 4 is to spraying cooling water on chamber roof 3, it is possible to reduce be splashed into positioned at recess Cooling water on the internal perisporium of the ring baffle 52 of 520 tops not along ring baffle 52 internal perisporium and recess 520 junction Recess 520 is flowed into, and falls directly into the probability on the transparent window on chamber roof 3 or chamber roof 3 under gravity, Make the cooling water being splashed on the internal perisporium of the ring baffle 52 of the top of recess 520 more along connection ring baffle 52 Cambered surface between internal perisporium and recess 520 is flowed into recess 520, and is discharged via discharge outlet 521.
Additionally, to make the water jet 410 of cooling unit 4 during to the spraying cooling water of chamber roof 3, being splashed into ring Cooling water inside shape baffle plate 52 is few as much as possible, in the present embodiment, sets perpendicular between water jet 410 and chamber roof 3 Straight spacing is 10-25mm, is proven, and the vertical spacing between above-mentioned water jet 410 and chamber roof 3 makes water jet There is necessary spacing, in case on the premise of colliding between the two, water jet 410 can be made between 410 and chamber roof 3 During the spraying cooling water of chamber roof 3, the water droplet for splashing it is highly sufficiently small so that being splashed into ring baffle 52 The cooling water in portion is few as much as possible.
Further, cooling unit 4 also includes lift drive mechanism, and the lift drive mechanism is used to drive spray equipment 41 Rise or fall, to adjust the vertical spacing between water jet 410 and chamber roof 3;Such that it is able to by by water jet 410 with Vertical spacing between chamber roof 3 is adjusted to more suitably height, makes water jet 410 to the spraying cooling water of chamber roof 3 During, the height of the water droplet for splashing is smaller, and then makes the cooling water being splashed into inside ring baffle 52 less.
In the present embodiment, pallet 6 is provided with reaction chamber, is used to carry workpiece to be machined;Temperature sensor 51 leads to The internal temperature crossed the temperature for detecting reaction chamber inner pallet 6 and obtain reaction chamber;Specifically, it is transparent on chamber roof 3 Window is located at the position corresponding with the upper surface of pallet 6, and temperature sensor is through transparent window detection reaction chamber inner pallet 6 Temperature, and the internal temperature of reaction chamber is obtained with this.
Specifically, transparent window pallet 6 projection in the plane the edge of pallet 6 is extended to from the center of pallet 6; That is, the two ends of transparent window correspond respectively to the center and peripheral of pallet 6.In the case, temperature measuring unit 5 can be with Including straight line driving mechanism 53 and control device, wherein, straight line driving mechanism 53 is used for actuation temperature sensor 51 in transparency window Make straight reciprocating motion between the two ends of mouth, control device is used to control the actuation temperature sensor 51 of straight line driving mechanism 53 to make directly The reciprocating speed of line and distance;So as to, under the control of control device and the driving of straight line driving mechanism 53, TEMP Device 51 can measure the temperature from the center of pallet 6 to the edge of pallet 6;Also, work in actual applications, is carried out to workpiece to be machined During skill, pallet 6 is typically ceaselessly rotated, so further such that temperature sensor 51 can be to any region on pallet 6 Temperature detected.In actual use, above-mentioned straight line driving mechanism can be cylinder or linear electric motors;Control device can be with It is PLC.
Refer to Fig. 6, the schematic diagram of the ring baffle in the reaction chamber that Fig. 6 is provided for second embodiment of the invention.This The reaction chamber that embodiment is provided equally includes chamber roof 3, cooling unit 4 and temperature measuring unit 5 compared with first embodiment, Because the 26S Proteasome Structure and Function of above-mentioned chamber roof 3, cooling unit 4 and temperature measuring unit 5 is existing detailed in the above-described first embodiment Description, will not be repeated here.
Only the present embodiment is described in detail with the difference of above-mentioned first embodiment below.Specifically, in this reality In applying example, the internal perisporium of ring baffle 52 be located at the part of the top of recess 520 with diameter greater than the part positioned at the lower section of recess 520 Diameter.In the case, the water jet 410 of cooling unit 4 on chamber roof 3 to during spraying cooling water, being splashed into positioned at recessed Cooling water on the internal perisporium of the ring baffle 52 of the top of portion 520 can flow downward under gravity, and along recess 520 Upper wall and the internal perisporium of ring baffle 52 between connecting portion enter into recess 520, or from the internal perisporium of ring baffle 52 Lower wall with the connecting portion of the upper wall of recess 520 drops onto recess 520, is then flowed into recess 520, such that it is able to preferably The cooling water being splashed on the internal perisporium of the ring baffle 52 of the top of recess 520 is avoided to be flowed into chamber roof 3 or transparent On window.
Can have additionally, in the present embodiment, between the internal perisporium of ring baffle 52 and the upper wall of recess 520 fillet or Without fillet.Preferably, there is fillet between the internal perisporium of ring baffle 52 and the upper arm of recess 520, can so makes There is the cambered surface for connecting the two between the internal perisporium and recess 520 of the ring baffle 52 of the top of recess 520, in this situation Under, the cooling water being splashed on the internal perisporium of the ring baffle 52 of the top of recess 520 can more along connection ring baffle Cambered surface between 52 internal perisporium and recess 520 is flowed into recess 520, and less from the internal perisporium of ring baffle 52 with it is recessed The connecting portion of the upper wall in portion 520 drops onto the lower wall of recess 520, so as to drop onto the cooling water of the lower wall of recess 520 with it is recessed It is less that the water droplet on transparent window is splash and dropped into the collision process of the lower wall in portion 520, and then less to TEMP The measurement accuracy of device 51 produces harmful effect.
Used as another technical scheme, embodiments of the invention also provide a kind of plasma processing device, and it includes instead Chamber is answered, and the reaction chamber employs the reaction chamber of the above embodiment of the present invention offer.
The plasma processing device that embodiments of the invention are provided, it uses the reaction that the above embodiment of the present invention is provided Chamber, during cooling down reaction chamber, can make to be splashed into ring in cooling unit 4 towards the spraying cooling water of chamber roof 3 Cooling water on the internal perisporium of shape baffle plate 52 is flowed into recess 520 along the internal perisporium of ring baffle 52 under gravity, And discharged via the discharge outlet 521 in recess 520, it is flowed into from the internal perisporium of ring baffle 52 so as to avoid above-mentioned cooling water On transparent window on chamber roof 3, the accuracy to the temperature of the inside of the detection reaction chamber of temperature sensor 51 is caused not Good influence.
It is understood that the embodiment of above principle being intended to be merely illustrative of the present and the exemplary implementation for using Mode, but the invention is not limited in this.For those skilled in the art, essence of the invention is not being departed from In the case of god and essence, various changes and modifications can be made therein, and these variations and modifications are also considered as protection scope of the present invention.

Claims (13)

1. a kind of reaction chamber, including chamber roof, cooling unit and temperature measuring unit, wherein, the cooling unit is used to pass through Reaction chamber is cooled down towards the chamber roof spraying cooling water;The temperature measuring unit includes temperature sensor and annular Baffle plate, is provided with transparent window on the chamber roof, and the temperature sensor is arranged on above the chamber roof, and with At the corresponding position of the transparent window, it is used to be detected through transparent window the internal temperature of reaction chamber;The annular gear Plate is used to be isolated the transparent window and cooling water, to prevent cooling water from flowing on the transparent window, it is characterised in that The internal perisporium recess of a week is provided around on the internal perisporium of the ring baffle, and the opening upwards of the recess incline Tiltedly;Also,
Osculum is provided with the recess, is used to flow into the cooling water discharge of the recess.
2. reaction chamber according to claim 1, it is characterised in that between the roof and periphery wall of the ring baffle With chamfering or fillet.
3. reaction chamber according to claim 1, it is characterised in that in internal perisporium and the recess of the ring baffle Upper wall between have fillet.
4. the reaction chamber according to claim 1 or 3, it is characterised in that the internal perisporium of the ring baffle positioned at institute State the diameter with diameter greater than the part below the recess of the part above recess.
5. reaction chamber according to claim 1, it is characterised in that be provided with pallet in the reaction chamber, be used to Carry workpiece to be machined;Also, the transparent window is located at the position corresponding with the tray upper surface;
The temperature sensor is used to obtain the reaction chamber by detecting the temperature of the pallet through the transparent window The internal temperature of room.
6. reaction chamber according to claim 5, it is characterised in that the transparent window in pallet institute in the plane Projection the edge of the pallet is extended to from the center of the pallet;
The temperature measuring unit also includes straight line driving mechanism, and the straight line driving mechanism is used to drive the temperature sensor in institute Make straight reciprocating motion between the two ends for stating transparent window.
7. reaction chamber according to claim 6, it is characterised in that the temperature measuring unit also includes control device, described Control device is used to control the straight line driving mechanism to drive the temperature sensor to make the speed and distance of straight reciprocating motion.
8. reaction chamber according to claim 6, it is characterised in that the straight line driving mechanism includes cylinder or straight-line electric Machine.
9. reaction chamber according to claim 7, it is characterised in that the control device includes PLC.
10. reaction chamber according to claim 1, it is characterised in that the cooling unit includes spray equipment and dash Plate;Wherein
The spray equipment is located at the chamber roof top, and it has multiple water jets, to be sprayed towards the chamber roof Drench cooling water;
The water fender is located on the chamber roof, and is looped around the periphery of the multiple water jet, the water fender and institute State chamber roof and form tank, be used to accommodate the cooling water sprayed from the water jet.
11. reaction chambers according to claim 10, it is characterised in that between the water jet and the chamber roof The scope of vertical spacing is 10~25mm.
12. reaction chamber according to claim 10 or 11, it is characterised in that the cooling unit also includes that lifting drives Mechanism, the lift drive mechanism is used to drive the spray equipment to rise or fall, to adjust the water jet with the chamber Vertical spacing between ceiling wall.
A kind of 13. plasma processing devices, including reaction chamber, it is characterised in that the reaction chamber employs right will Seek the reaction chamber described in 1-12 any one.
CN201310738635.7A 2013-12-27 2013-12-27 reaction chamber and plasma processing device Active CN104746044B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310738635.7A CN104746044B (en) 2013-12-27 2013-12-27 reaction chamber and plasma processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310738635.7A CN104746044B (en) 2013-12-27 2013-12-27 reaction chamber and plasma processing device

Publications (2)

Publication Number Publication Date
CN104746044A CN104746044A (en) 2015-07-01
CN104746044B true CN104746044B (en) 2017-07-04

Family

ID=53586279

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310738635.7A Active CN104746044B (en) 2013-12-27 2013-12-27 reaction chamber and plasma processing device

Country Status (1)

Country Link
CN (1) CN104746044B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1906469A (en) * 2004-07-01 2007-01-31 株式会社爱发科 Substrate temperature measuring apparatus and processor
CN101656194A (en) * 2008-08-21 2010-02-24 北京北方微电子基地设备工艺研究中心有限责任公司 Plasma cavity and temperature control method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6811662B1 (en) * 2003-08-22 2004-11-02 Powership Semiconductor Corp. Sputtering apparatus and manufacturing method of metal layer/metal compound layer by using thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1906469A (en) * 2004-07-01 2007-01-31 株式会社爱发科 Substrate temperature measuring apparatus and processor
CN101656194A (en) * 2008-08-21 2010-02-24 北京北方微电子基地设备工艺研究中心有限责任公司 Plasma cavity and temperature control method thereof

Also Published As

Publication number Publication date
CN104746044A (en) 2015-07-01

Similar Documents

Publication Publication Date Title
KR102120498B1 (en) Substrate processing apparatus and substrate processing method
JP2016515300A5 (en)
US9793142B2 (en) Substrate processing apparatus and substrate processing method
US9818626B2 (en) Substrate processing apparatus and substrate processing method
TWI476859B (en) Substrate position detection apparatus, film deposition apparatus equipped with the same, and substrate position detection method
KR102346803B1 (en) Substrate processing apparatus and substrate processing method
JP2019153803A (en) System and method for performing wet etching process
TW201445628A (en) Substrate processing apparatus and substrate processing method
CN107378570A (en) A kind of cylindrical workpiece Double-layer clamping device for Digit Control Machine Tool
CN104617016A (en) Wafer processing unit
JP2018517293A (en) Device for protecting the bevel and back of the substrate
US10157754B2 (en) Liquid knife cleaning device
US10402997B2 (en) Displacement detecting apparatus, displacement detecting method and substrate processing apparatus
TWI511798B (en) Processing cup and substrate processing apparatus
CN104746044B (en) reaction chamber and plasma processing device
TWI618140B (en) Inductively coupled plasma processor
KR20190015667A (en) Substrate processing apparatus and in line type substrate processing system using the same
CN204407300U (en) Wafer processing device
CN105321837B (en) Semiconductor processing equipment and its online fault detection method
CN209615154U (en) Grinding wafer equipment
TWI595584B (en) A device to prevent contamination of the wafer by the back-splashing liquid
CN107305854A (en) A kind of ic substrate cleaning equipment
CN103406664B (en) Laser machining device
US11667007B2 (en) Polishing apparatus and polishing method
CN114420538A (en) Method capable of effectively cleaning surface of wafer

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address

Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone

Patentee after: Beijing North China microelectronics equipment Co Ltd

Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No.

Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing

CP03 Change of name, title or address