CN104743278A - Multi-cavity diode packaging box - Google Patents
Multi-cavity diode packaging box Download PDFInfo
- Publication number
- CN104743278A CN104743278A CN201410403466.6A CN201410403466A CN104743278A CN 104743278 A CN104743278 A CN 104743278A CN 201410403466 A CN201410403466 A CN 201410403466A CN 104743278 A CN104743278 A CN 104743278A
- Authority
- CN
- China
- Prior art keywords
- cavity diode
- box body
- packaging box
- box
- diode package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention relates to a multi-cavity diode packaging box which comprises a box body. Filler is arranged in the box body. At least one circular concave hole for diode inserting is formed in the inner surface of the box body. According to the multi-cavity diode packaging box, a plurality of concave holes are formed in the filler, accordingly a plurality of diodes can be placed in the packaging box, and meanwhile high safety is achieved.
Description
Technical field
The present invention relates to a kind of multi-cavity diode package box.
Background technology
Common diode package box does not have foam-filled layer and can only place a diode, if place multiple diode diode to be easy to breakage, very dangerous.
Summary of the invention
The technical problem to be solved in the present invention is: for solving above-mentioned Problems existing, provides a kind of multi-cavity diode package box, under solving normal packet mounted box capacity and unsafe problem.
The technical solution adopted for the present invention to solve the technical problems is: a kind of multi-cavity diode package box, comprises box body, be provided with weighting material in box body, and cartridge inner surface offers at least one for inserting the circular shrinkage hole of diode.
Shrinkage pool bottom surface offers the electrode hole for electrode insertion.
Packed layer is foam-filled layer.
The invention has the beneficial effects as follows, the box filled thing of multi-cavity diode package of the present invention offers multiple shrinkage pool, thus dead packing box is very safe while can placing multiple diode.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is structural representation of the present invention.
1. box bodys, 2. weighting material, 3. shrinkage pool, 4. electrode hole in figure.
Detailed description of the invention
In conjunction with the accompanying drawings, the present invention is further detailed explanation.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present invention are described in a schematic way, and therefore it only shows the formation relevant with the present invention.
A kind of multi-cavity diode package box as shown in Figure 1, comprises box body 1, is provided with weighting material 2 in box body 1, and box body 1 inside face offers 12 for inserting the circular shrinkage hole 3 of diode.
Shrinkage pool 3 bottom surface offers the electrode hole 4 for electrode insertion.
Packed layer 2 is foam-filled layer.
With above-mentioned according to desirable embodiment of the present invention for enlightenment, by above-mentioned description, relevant staff in the scope not departing from this invention technological thought, can carry out various change and amendment completely.The technical scope of this invention is not limited to the content on specification sheets, must determine its technical scope according to right.
Claims (3)
1. a multi-cavity diode package box, comprise box body (1), it is characterized in that: be provided with weighting material (2) in described box body (1), box body (1) inside face offers at least one for inserting the circular shrinkage hole (3) of diode.
2. multi-cavity diode package box according to claim 1, is characterized in that: described shrinkage pool (3) bottom surface offers the electrode hole (4) for electrode insertion.
3. multi-cavity diode package box according to claim 1, is characterized in that: described packed layer (2) is foam-filled layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410403466.6A CN104743278A (en) | 2014-08-15 | 2014-08-15 | Multi-cavity diode packaging box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410403466.6A CN104743278A (en) | 2014-08-15 | 2014-08-15 | Multi-cavity diode packaging box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104743278A true CN104743278A (en) | 2015-07-01 |
Family
ID=53583678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410403466.6A Pending CN104743278A (en) | 2014-08-15 | 2014-08-15 | Multi-cavity diode packaging box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104743278A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109941587A (en) * | 2019-03-19 | 2019-06-28 | 台州风达机器人科技有限公司 | A kind of diode storage device |
-
2014
- 2014-08-15 CN CN201410403466.6A patent/CN104743278A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109941587A (en) * | 2019-03-19 | 2019-06-28 | 台州风达机器人科技有限公司 | A kind of diode storage device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150701 |
|
| WD01 | Invention patent application deemed withdrawn after publication |