CN104741446A - Thick material stretching and side wall microhole machining method - Google Patents
Thick material stretching and side wall microhole machining method Download PDFInfo
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- CN104741446A CN104741446A CN201310730924.2A CN201310730924A CN104741446A CN 104741446 A CN104741446 A CN 104741446A CN 201310730924 A CN201310730924 A CN 201310730924A CN 104741446 A CN104741446 A CN 104741446A
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- thick
- thick material
- microhole
- side wall
- thinning
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Abstract
The invention provides a thick material stretching and side wall microhole machining method. The method comprises the following steps: when a thick material is stretched, the pre-thinning is performed for a perforating area of a side wall, and the diameter of the thinning area is greater than the thickness of the material, so that the thickness of the material in the perforating area is locally thinned under the effect of a punch; and the thinning area of the side wall is punched by the punch to form a microhole. The ratio of the smallest diameter of the microhole to the thickness of a prefabricated part is 0.3-0.5: 1. The thick material stretching and side wall microhole machining method, provided by the invention, solves the ratio of the thickness to the diameter incapable of being reached in the prior art; the machined microhole can enable the thick material to keep the completeness of the hole in the subsequent machining; and the surface of the thick material is tidy, so that the stretching patterns can be reduced in machining.
Description
Technical field
The present invention relates to Machining Technology field, more particularly, relates to a kind of thick material stretching sidewall capillary processing method.
Background technology
As shown in Figure 1, existing Metal-Piercing technology is many limited to by material material is thick, and blocked up material is thick not only easily in the process of rushing micropore to be broken through material, and too little for the punch diameter of rushing micropore, intensity can not meet the punching of thick material, very easily ruptures in punch process.Domestic existing Metal-Piercing technology can only be processed according to the ratio of material thick D and aperture R1:3, i.e. the thick 1mm of metal charge, and punching hole diameter need be greater than 3mm; Advanced foreign technology can accomplish to expect the ratio of thick D and aperture R` close to 1:1, i.e. the thick 1mm of metal charge, punching hole diameter need be greater than 1mm.For the product that some material is thick, capillary processing be realized very difficult.
Summary of the invention
In view of this, the invention provides a kind of thick material stretching sidewall capillary processing method.
In order to solve the problems of the technologies described above, the invention provides a kind of thick material stretching sidewall capillary processing method, comprising the steps,
While S1, thick material stretch, oppose side wall needs perforated area to thin in advance, and it is thick that the diameter thinning region is greater than material, makes that the material of punching areas is thick occurs that under drift effect local is thinning;
S2, utilize punching pin to carry out punch press process in the region that thins of sidewall, form micropore.
Preferably, the minimum diameter of described micropore is 0.3 ~ 0.5:1 with the ratio of the thickness of described prefabricated component.
Thick material stretching sidewall capillary processing method provided by the invention, solve the ratio of inaccessiable thickness and diameter in prior art, and the micropore processed can make the integrality of described thick material retaining hole in following process, and thick material surface is clean and tidy, can reduce drag line during reprocessing.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1: punching schematic diagram of the prior art;
Fig. 2: the schematic diagram of the sheet material after the processing of patent of the present invention;
Fig. 3: the punching schematic diagram of patent of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, carry out clear, complete description to the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on embodiments of the invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
The invention provides a kind of thick material stretching sidewall capillary processing method, comprise the steps,
While S1, thick material stretch, oppose side wall needs perforated area to thin in advance, and it is thick that the diameter thinning region is greater than material, makes that the material of punching areas is thick occurs that under drift effect local is thinning;
S2, utilize punching pin to carry out punch press process in the region that thins of sidewall, form micropore.
Preferably, the minimum diameter of described micropore is 0.3 ~ 0.5:1 with the ratio of the thickness of described prefabricated component.
Composition graphs 2, material extending that Fig. 3 is shown in obtain tensioning member a after completing, and before punching, carry out material thin in advance in punching areas.Obtaining for thinning part b when being thinned down to predetermined thickness Deng material, describedly thinning region A for thinning part b comprises, carry out capillary processing thinning region A, obtain the thick material stretching prefabricated component c containing micropore.Use the method, the capillary processing of 0.5mm diameter can be carried out on the thick material of 1mm.Material material is thick reaches 1:0.5 with bore dia ratio, is obviously better than domestic 1:3 and external 1:1 and processes ratio.
The capillary processing adopting this technology described by invention not only can realize on thicker material, can also reduce wearing and tearing during drift punching, the risk ruptured when reducing drift punching greatly.To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (2)
1. a thick material stretching sidewall capillary processing method, is characterized in that, comprise the steps,
While S1, thick material stretch, oppose side wall needs perforated area to thin in advance, and it is thick that the diameter thinning region is greater than material, makes that the material of punching areas is thick occurs that under drift effect local is thinning;
S2, utilize punching pin to carry out punch press process in the region that thins of sidewall, form micropore.
2. thick material stretching sidewall capillary processing method according to claim 1, it is characterized in that, the minimum diameter of described micropore is 0.3 ~ 0.5:1 with the ratio of the thickness of described prefabricated component.
Priority Applications (1)
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CN201310730924.2A CN104741446A (en) | 2013-12-27 | 2013-12-27 | Thick material stretching and side wall microhole machining method |
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CN201310730924.2A CN104741446A (en) | 2013-12-27 | 2013-12-27 | Thick material stretching and side wall microhole machining method |
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CN104741446A true CN104741446A (en) | 2015-07-01 |
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CN201310730924.2A Pending CN104741446A (en) | 2013-12-27 | 2013-12-27 | Thick material stretching and side wall microhole machining method |
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Citations (6)
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---|---|---|---|---|
JP2001170721A (en) * | 1999-10-08 | 2001-06-26 | Shinko Electric Ind Co Ltd | Platelike body having recessed part, its manufacturing method and press die for forming recessed part |
US6748787B1 (en) * | 2000-10-02 | 2004-06-15 | Rulong Precision Industry Co., Ltd. | Method of producing workpiece having irregular cross section by stamping thin plate into thick plate |
JP2008137073A (en) * | 2006-02-16 | 2008-06-19 | Nippon Steel Corp | Method of punching metallic material |
CN102248066A (en) * | 2011-06-09 | 2011-11-23 | 北京航空航天大学 | Drawing and hydraulic integrated forming method |
CN102847785A (en) * | 2011-06-29 | 2013-01-02 | 英业达股份有限公司 | One-step press forming process and manufacturing method of CPU (Central Processing Unit) back board |
CN103100593A (en) * | 2013-01-22 | 2013-05-15 | 东莞市祥鑫汽车模具制品有限公司 | Method of machining cylinder-shaped sink hole in thick steel plate in cold-stamping mode |
-
2013
- 2013-12-27 CN CN201310730924.2A patent/CN104741446A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001170721A (en) * | 1999-10-08 | 2001-06-26 | Shinko Electric Ind Co Ltd | Platelike body having recessed part, its manufacturing method and press die for forming recessed part |
US6748787B1 (en) * | 2000-10-02 | 2004-06-15 | Rulong Precision Industry Co., Ltd. | Method of producing workpiece having irregular cross section by stamping thin plate into thick plate |
JP2008137073A (en) * | 2006-02-16 | 2008-06-19 | Nippon Steel Corp | Method of punching metallic material |
CN102248066A (en) * | 2011-06-09 | 2011-11-23 | 北京航空航天大学 | Drawing and hydraulic integrated forming method |
CN102847785A (en) * | 2011-06-29 | 2013-01-02 | 英业达股份有限公司 | One-step press forming process and manufacturing method of CPU (Central Processing Unit) back board |
CN103100593A (en) * | 2013-01-22 | 2013-05-15 | 东莞市祥鑫汽车模具制品有限公司 | Method of machining cylinder-shaped sink hole in thick steel plate in cold-stamping mode |
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