CN104730862B - Negative image photosensitive composition and heat-sensitive plate made of the same - Google Patents

Negative image photosensitive composition and heat-sensitive plate made of the same Download PDF

Info

Publication number
CN104730862B
CN104730862B CN201310706605.8A CN201310706605A CN104730862B CN 104730862 B CN104730862 B CN 104730862B CN 201310706605 A CN201310706605 A CN 201310706605A CN 104730862 B CN104730862 B CN 104730862B
Authority
CN
China
Prior art keywords
photosensitive composition
solid content
plate
composition
total solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310706605.8A
Other languages
Chinese (zh)
Other versions
CN104730862A (en
Inventor
宋小伟
张刚
杨青海
高峰
刘松玲
张攀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lucky Huaguang Graphics Co Ltd
Original Assignee
Lucky Huaguang Graphics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucky Huaguang Graphics Co Ltd filed Critical Lucky Huaguang Graphics Co Ltd
Priority to CN201310706605.8A priority Critical patent/CN104730862B/en
Publication of CN104730862A publication Critical patent/CN104730862A/en
Application granted granted Critical
Publication of CN104730862B publication Critical patent/CN104730862B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The invention discloses a negative photosensitive composition which is characterized by comprising nano-micron particle diurea ketone prepolymer, polyfunctional group monomer, thermal polymerization initiator, infrared absorbent and accelerator, wherein the discrete nano-micron particles account for 30-70% of the total solid content of the composition, the diurea ketone prepolymer accounts for 10-50% of the total solid content of the composition, the polyfunctional group monomer accounts for 10-30% of the total solid content of the composition, the thermal polymerization initiator accounts for 1-20% of the total solid content of the composition, the infrared absorbent accounts for 1-20% of the total solid content of the composition, and the organic metal accelerator accounts for 0.5-5% of the total solid content of the composition. The invention solves the defect of poor solvent resistance and printing resistance of the plate in the prior treatment-free thermosensitive CTP plate technology, and obtains better wear resistance by adding the network-structure polymer resin which is difficult to dissolve into the thermosensitive composition so as to improve the printing resistance of the plate.

Description

Negative image photosensitive composition and heat-sensitive plate made of the same
Technical Field
The invention relates to a negative photosensitive composition and a washing-free direct printing thermosensitive CTP lithographic plate on a machine.
Background
The lithographic printing technology has been completely moved from the traditional PS plate copying technology of laser photo film to the computer-to-plate technology (CTP technology for short), and CTP plates are gradually popularized. The CTP plates are various in types and include silver salt diffusion CTP plates, UV-CTP plates, violet laser polymerization CTP plates, thermosensitive CTP plates and the like which are more popular. Among them, the most widely used is the thermosensitive CTP plate.
The CTP plate making technology needs a 'developing process', and has the environmental problem caused by waste liquid treatment. At present, the development of a new generation of green and environment-friendly CTP plate free of chemical treatment is a hotspot for the development of plate materials in the world.
The development of green and environment-friendly chemical treatment-free CTP plates has many technical routes, which can be divided into a thermal ablation technology, a polarity conversion technology and a hot melting technology. The thermal ablation technology plate adopts an aluminum plate base or a polyester base, and utilizes a plasma metal deposition technology to prepare the plate. But ablation plates present a residue problem. Presstek company has published ablative plates with a sandwich structure to solve the ablation residue problem. Eka corporation developed an ablative technique of untreated CTP plates with a silver deposit, consisting of a support with a hydrophilic surface (aluminum, PET), a metal deposit that can be ablated and a cross-linked hydrophobic layer. The metal deposition layer is a metal film formed by using a metal deposition technique, and the metal may be silver, titanium, or the like. The crosslinked hydrophobic layer is crosslinked by irradiation or heat curing to crosslink the unsaturated monomer, and may be crosslinked by a heat-sensitive resin to form a cured layer, or may be obtained by treatment with a lipid-sensitive liquid. The infrared laser energy causes the silver particles in the silver layer to change in surface tension to form fluffy silver particles which remain on the surface of the plate, so that the residues are easily removed by vacuum adsorption or liquid to expose the hydrophilic surface of the aluminum plate to form hydrophilic areas, while the unexposed crosslinked layer is insoluble in the liquid to form lipophilic areas.
Polarity conversion technology: the plate material consists of a supporting body and a thermosensitive imaging layer. The thermosensitive imaging layer contains photothermal transducer and thermosensitive switchable polymer (such as polytetrahydropyran methacrylate, ethylene copolymer with aryldiazosulfonic acid group). A heat sensitive switchable polymer is used to form the heat sensitive material. Before imaging, the thermosensitive layer is dissolved in an aqueous solution. During imaging, the infrared absorber absorbs laser energy, and the generated heat causes diazo decomposition, so that the exposed thermosensitive copolymer is changed from hydrophilic to hydrophobic, and a lipophilic area is formed. While the thermosensitive copolymer remains soluble in water in the unexposed areas, forming hydrophilic areas. The factors that restrict this technology development are still printability. The ink and wash part is coated with a medicine film, so that the printing control and the printing resistance are greatly restricted, and the large-scale commercial application is realized.
Hot melting technology: is a technology really applied to commercialization in the third generation treatment-free plate at present. In thermal imaging, the infrared absorber converts laser energy into heat energy, the generated heat makes the temperature of thermoplastic polymer particles dispersed in the crosslinking hydrophilic layer higher than the gel humidity thereof, the thermoplastic polymer particles are subjected to agglutination reaction, and the exposed area is changed from hydrophilicity to hydrophobicity and lipophilicity. And the unexposed area is still dissolved in the aqueous solution with the PH being more than or equal to 4 to form a hydrophilic area. The blank part of the printing plate is an aluminum base after frosting and oxidation treatment, but not a medicine film coating, and the printability of the printing plate is not different from that of a common plate.
One of the key technologies for developing a chemical treatment-free CTP plate is the development of a plate precursor, namely a functional organic substance. EP0980754 describes a technique for realizing hydrophilic-hydrophobic transformation by carboxyl decarboxylation, but the molecular weight of a phase-transition compound is too large, the energy threshold value is large, and the decarboxylation is difficult, so that the printing plate material has poor printing resistance. WO94/23954 describes a microcapsule hot melting technique, wherein laser hot melting destroys microcapsules, hydrophilic substances are destroyed and turned into hydrophobic substances, but the damaged substances easily cause pollution to printing blanks; US4004924 describes a mixture of thermoplastic hydrophobic particles and a hydrophilic binder, but is not print-resistant; aikfa EP2006-5-2406114475.4 introduces a semi-continuous emulsion method for preparing styrene and acrylonitrile emulsion thermoplastic particles, which can realize hot melting, but does not contain self-emulsifying hydrophilic groups, has high technical requirements on particle control, has poor stability of emulsified emulsion, and needs to be added with an anti-microbial agent; kodak US2005-8-311/196, 124 describes an adhesive comprising a polyalkylene oxide segment and a hydrophobic cyano pendant group polymeric, the molecules being one-dimensional linear in structure and not highly resistant to indentation; kodak US2006-7-2711/494, 235 describes a solvent-resistant polymer containing hydrophilic and cyano side groups, containing allyl ester branches, which are formed by condensation of carboxyl side groups and allyl halides under the action of a base, but with a large number of side reaction by-products, troublesome work-up and also the ester groups are not print-resistant.
At present, further improving the performance of the treatment-free thermosensitive CTP plate, particularly improving the printing resistance of the plate material is a hot spot for developing the thermosensitive CTP plate material.
To improve the printing resistance of the plate material of the treatment-free thermosensitive CTP plate, the solvent resistance of the plate material needs to be improved. By plate resistant to solvents is meant that the printing plate is resistant to attack by organic solvents in various printing chemicals, such as washing oils, fountain solutions, gum solutions, plate preservers, plate cleaners, printing inks, especially UV ink washing oils, used in printing.
The CTP plate printing plate has a certain correlation between the printing resistance and the solvent resistance, and generally, a plate with better solvent resistance has higher wear resistance and can obtain higher printing resistance.
Many methods are used for improving the solvent resistance and printing resistance of the thermosensitive CTP plate, and one of the most important methods is the development of organic matters of the printing plate, particularly functional film-forming resins. According to the disclosure of Shimazu patent US 6294311: carboxyl acrylic resin, vinyl acetate/crotonate (trans-butenoate)/vinyl neodecanoate copolymer, styrene maleic anhydride copolymer, phenolic resin, maleated wood rosin and a composition thereof have a solvent resistance effect, and particularly, N-substituted maleimide, methacrylamide and polyvinyl acetal polymers can improve the printing process of a printing plate; kodak patent CN101321632A discloses that a phosphoric acid or adamantane side group is introduced into a polymer to improve the chemical resistance and the pressrun of a printing plate; WO2004/033206 by Kodak company proposes that barbituric acid groups are introduced into the side chains of high polymer resin, so that the solvent resistance and the wear resistance of a plate coating can be obviously improved, and the printing resistance of the plate is improved; kodak in WO2004/033206 discloses a QHB modified phenolic resin, which is modified with isocytosine (2-amino-4-hydroxypyrimidine) and isocyanate to form a strong polar tetrahydrobonded structure, and is used as an upper layer of a multi-layer thermosensitive plate, i.e., a second polymerization layer, to improve the wear resistance of the plate; in kodak patent US2006, 045648 a solvent resistant plate is disclosed containing an anhydride based polymer, the most useful anhydride groups disclosed being maleic anhydride and its derivatives; ack company EP 31 02102446.8 discloses a modification method for diazo salt grafting of phenolic resin by phenolic hydroxyl telechelic group to form azo-aryl group (-N = N-Q group, Q is aromatic group), which improves chemical resistance of coating and printing resistance of plate; fuji film [32]2004.3.11[33] JP [31]2004-069478 proposes that thermosensitive plate resin with a main chain having a phenol skeleton and a urea bond (-NHCONH-) has solvent resistance, so that the printing resistance of the printing plate material is improved; in EP- cA-1101607, cA heat-sensitive plate technique is disclosed, in which cA solvent-resistant technique is described, in which cA coating of the plate, to which an acidic cellulose polymer is added, improves the solvent resistance of the coating of the plate, and which is resistant to attack by ink and fountain solution on the film of the plate and has excellent resistance to printing.
The method for improving the printing capability of the thermosensitive CTP plate is realized by developing organic matters of the printing plate, particularly functional film-forming resin.
It is known that polymer resins are classified into linear structures and network structures, and generally, linear structure resins can be dissolved in a solvent, while network structure polymer resins are generally swollen only by a solvent and cannot be dissolved by a solvent. Therefore, the reticular polymer resin has better wear resistance.
The process for producing the treatment-free thermosensitive CTP plate generally comprises the step of coating a thermosensitive composition on a support such as an aluminum plate base in a form of solution by means of dip coating, spray coating or extrusion coating, so that the situation that a reticular structure polymer resin which is difficult to dissolve is added into the thermosensitive composition to obtain better wear resistance so as to improve the printing resistance of the plate material is difficult to realize.
Disclosure of Invention
Aiming at the problems, the invention designs a treatment-free thermosensitive CTP plate negative photosensitive composition and a thermosensitive plate manufactured by using the same. The negative photosensitive composition comprises discrete nano-micron particles, a diurea ketone prepolymer, a multifunctional monomer, a thermal polymerization initiator, an infrared absorbent and an organic metal promoter. The plate material has a brand new multiple thermal-sensitive imaging mechanism, can realize the hot melting thermoplasticity of nano-micron particles, the free baseline thermal polymerization and the reticulated thermal crosslinking of polyurethane, and has the advantages of high light sensitivity, good mesh reducibility and high pressrun due to the multiple thermal-sensitive imaging mechanism. After infrared laser scanning imaging is carried out, the oil-in-water structure is changed into oleophylic by the hot melting and thermoplastic destruction of nano-micro particles, and meanwhile, the molecular weight of a coating is rapidly increased by free-base linear thermal polymerization and the reticular thermal crosslinking of polyurethane, so that the coating is firmer, and the coating after laser thermal exposure is difficult to remove by fountain water and printing ink; and removing the redundant coating of the unexposed blank part on a printing machine under the action of dampening water and printing ink, and carrying away the redundant coating by the printing paper after removing the redundant coating, wherein the blank part is a hydrophilic aluminum plate base. The strong polar urethane bond net-shaped cross-linked structure enables the plate material to obtain ultrahigh printing resistance. The method can be used for direct machine printing without any washing processing step, can obtain high printing resistance, and realizes the environmental protection purpose of no pollutant discharge in the plate making process.
The invention can solve the defects of poor solvent resistance and poor printing resistance of the plate in the prior treatment-free thermosensitive CTP plate technology, and particularly solves the problem that the printing resistance of the plate is improved by adding network-structure polymer resin which is difficult to dissolve into a thermosensitive composition to obtain better wear resistance.
The negative photosensitive composition comprises discrete nano-micron particles, a diurea ketone prepolymer, a multifunctional monomer, a thermal polymerization initiator, an infrared absorbent and an organic metal promoter. The plate material has a brand new multiple thermal-sensitive imaging mechanism, can realize the hot melting thermoplasticity of nano-micron particles, the free baseline thermal polymerization and the reticulated thermal crosslinking of polyurethane, and has the advantages of high light sensitivity, good mesh reducibility and high pressrun due to the multiple thermal-sensitive imaging mechanism. In order to achieve the purpose, the invention adopts the following technical scheme: the negative photosensitive composition comprises discrete nano-micron particles, a diurea ketone prepolymer, a multifunctional monomer, a thermal polymerization initiator, an infrared absorbent and an organic metal promoter. The plate has a brand new multiple thermal sensitive imaging mechanism:
a. the plate has hot-melt thermoplastic imaging capacity: the discrete nano-micron particles are in a hydrophilic thermoplastic hot-melting nano-micron particle structure, and have the same unique characteristics of the ultramicro nano-micron particles, namely, the optical, thermal, electrical, magnetic, mechanical and chemical properties of the ultramicro nano-micron particles are obviously different from those of the ultramicro nano-micron particles in comparison with those of bulk solids. In terms of melting point, each particle of the ultrafine nano-micron particles has few constituent atoms, and surface atoms are in an unstable state, so that the amplitude of vibration of surface lattices is large, and therefore, the ultrafine nano-micron particles have high surface energy, and the specific thermal properties of the ultrafine particles are caused: the melting point decreases. The nano-micron particles designed by the invention can realize hot-melt thermoplastic imaging under the action of infrared laser heat.
b. The plates have the ability to be free-radically thermally polymerized: the heat of infrared laser transfers laser energy to the thermal polymerization initiator through the infrared absorbent, the thermal polymerization initiator releases active primary free radicals, and the primary free radicals initiate unsaturated double bonds in the polyfunctional monomer and the diurea ketone prepolymer to realize free-radical linear polymerization.
c. The plate has the capability of reticular thermal crosslinking: the heat of infrared laser is transmitted through the laser energy of an infrared absorbent to enable the diurea ketone in the diurea ketone prepolymer to generate thermal splitting to generate active isocyanate groups (-NCO), the active isocyanate groups (-NCO) and branched chain hydroxyl groups (-OH) in the nano-micron particles generate polyurethane reaction under the catalysis of an organic metal accelerator to form strong polar urethane bonds (-NHCOO), free base linear polymerization is realized, meanwhile, the polyurethane reticular thermal crosslinking is realized, the strong polar urethane bonds have high wear resistance, and the urethane bond reticular crosslinking structure enables the plate material to obtain ultrahigh printing resistance.
After infrared laser scanning imaging, nano-micron particle hot melting thermoplastic damages an oil-in-water structure to be converted into oleophylic, and meanwhile, free base line thermal polymerization and polyurethane reticular thermal crosslinking enable the molecular weight of a coating to be rapidly increased, so that the coating is firmer, and the coating after laser thermal exposure is difficult to remove by fountain water and printing ink; and removing the redundant coating of the unexposed blank part on a printing machine under the action of dampening water and printing ink, and carrying away the redundant coating by the printing paper after removing the redundant coating, wherein the blank part is a hydrophilic aluminum plate base. The strong polar urethane bond net-shaped cross-linked structure enables the plate material to obtain ultrahigh printing resistance. The method can be used for direct machine printing without any washing processing step, can obtain high printing resistance, and realizes the environmental protection purpose of no pollutant discharge in the plate making process.
The present invention is described in detail below:
the invention designs a negative photosensitive composition and a thermosensitive plate made of the composition. The negative photosensitive composition comprises discrete nano-micron particles, a diurea ketone prepolymer, a multifunctional monomer, a thermal polymerization initiator, an infrared absorbent and an organic metal promoter. The plate material has a brand new multiple thermal-sensitive imaging mechanism, can realize nano-micron particle hot melting thermoplasticity, free baseline thermal polymerization and polyurethane reticular thermal crosslinking, strong polar urethane bonds have high wear resistance, and the urethane bond reticular crosslinking structure enables the plate material to obtain ultrahigh printing resistance, so that the plate can be directly printed on a machine, and green and environment-friendly effects are realized.
The discrete nano-micro particles in the negative-working photosensitive composition are first described.
The heat-sensitive plate is designed by considering the heat-sensitive coating of the plate, wherein the heat-sensitive coating needs an important binder, namely functional film-forming resin, and the resin can form a film after ensuring that the coating liquid is dried so as to ensure that the heat-sensitive coating is attached to a support. The binder may be in the form of a solution or an emulsion. The discrete nano-micro particles in the negative-working photosensitive composition of the present invention are such binders.
The diameter of the discrete nano-micron particles in the negative photosensitive composition is 50-300nm, and the negative photosensitive composition has the following structure:
Figure BDA0000441699600000061
r1, R2 and R4 are H atoms or methyl, R3 is CH2CH2OH or CH2CH2CH2OH, R5 is COO (CH2CH2) nH or COOCH2CH2NHCOO (CH2CH2) nH, and n is an integer of 20-60;
a. b, c and d are the weight percentage of the corresponding copolymerization units, the proportion of a is 40-70%, the proportion of b is 10-30%, the proportion of c is 10-30%, and the proportion of d is 10-30%.
Most of the chemical treatment-free thermosensitive CTP plate discrete nano-micron particle adhesives are designed with thermoplastic styrene structural units. The discrete nano-micro particles of the present invention also contain thermoplastic styrene building blocks. As is well known, the styrene structural unit has good thermoplasticity and higher glass transition temperature, and the styrene copolymer used as the adhesive of the chemical treatment-free thermosensitive CTP plate has the advantages that the heated part is easier to melt, the arrangement among molecules is tighter, the thermal image part is firmer, and the printing resistance of the plate can be increased. The content of styrene in the copolymer directly affects the glass transition temperature and the thermoplasticity of the polymer. The multipolymer of the invention is synthesized, and the content of the styrene copolymerization unit in the multipolymer is 40 to 70 percent by weight.
It is necessary to design a CTP plate binder and select an excellent hydrophobic segment. Cyano groups are relatively excellent hydrophobic groups. The discrete nano-micron particle of the invention introduces hydrophobic side chain cyano, and the copolymer is used as an adhesive thermoplastic fusion imaging part after introducing the hydrophobic side chain cyano, and has good flexibility, drug resistance and hydrophobicity. The method for introducing hydrophobic side chain group nitrile into the multipolymer is to design a vinyl component structural unit of side chain group-containing nitrile in a copolymerization component, preferably acrylonitrile or methacrylonitrile or a mixture of the acrylonitrile or the methacrylonitrile. The multipolymer of the invention is synthesized, and the content of the (methyl) acrylonitrile copolymerization unit in the multipolymer is 10 to 30 percent by weight.
The plate material designed by the invention has the capability of net-shaped thermal crosslinking, the heat of infrared laser leads the diurea ketone in the diurea ketone prepolymer to generate thermal splitting through the laser energy transferred by an infrared absorbent, active isocyanate (-NCO) is generated, the active isocyanate (-NCO) and branched chain hydroxyl (-OH) in nano-micron particles generate polyurethane reaction under the catalysis of an organic metal accelerator, strong polar urethane bond (-NHCOO) is formed, and the net-shaped thermal crosslinking of polyurethane is realized while the free base linear polymerization is realized. The invention introduces branched hydroxyl into a discrete nano-micron particle polymer resin structure chain, selects hydroxyl-containing acrylic monomers as copolymerization units, the hydroxyl-containing acrylic monomers comprise 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate (HPA), 2-hydroxyethyl methacrylate (HEMA), 2-hydroxypropyl methacrylate (HPMA) and the like, and the weight percentage content of the hydroxyl-containing acrylic monomer copolymerization units in the multipolymer is 10-30%.
As a chemical treatment-free CTP emulsion adhesive, the discrete nano-micron particles contain self-emulsifying structural units better, the polymer can realize emulsification by polyether emulsifying groups under the condition of no external emulsifier, and the synthesized emulsion particles are more uniform and smooth than external emulsion particles and have better stability. The discrete nano-micron particles of the invention are provided with polyether self-emulsifying structural units in the copolymerization component, including esterified branched polyether and urethanized branched polyether, and the specific examples are as follows (without being limited thereto):
A1:
Figure BDA0000441699600000071
A2:
Figure BDA0000441699600000072
the weight percentage content of the polyether self-emulsifying structure copolymerization unit in the multipolymer is 10-30%.
The discrete nano-micron particles are synthesized by adopting an emulsion copolymerization method, and the copolymerization reaction can be random copolymerization or block copolymerization, preferably random copolymerization. Initiators for polymerization include peroxides such as di-t-butyl peroxide, benzoyl peroxide, persulfates such as potassium persulfate, amine persulfate, azo compounds such as azobisisobutyronitrile, and the like. The copolymerization mode adopts emulsion polymerization.
As the reaction solvent, there can be mentioned water, methanol, ethanol, N-propanol, isopropanol, butanol, acetone, methyl ethyl ketone, cyclohexanone, ethyl acetate, butyl acetate, tetrahydrofuran, 1, 4-dioxane, N-dimethylformamide, dimethylacetamide acetone, methyl ethyl ketone, cyclohexane, ethylene dichloride, toluene, ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol dimethyl ether, propylene glycol methyl ether, propylene glycol ethyl ether, acetylacetone, diacetone alcohol, ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate, ethylene glycol isopropyl ether, ethylene glycol butyl ether acetate, 3-methoxypropanol, methoxymethoxyethanol, diethylene glycol methyl ether, diethylene glycol ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, dimethyl sulfoxide, methyl lactate, ethyl lactate and the like, or a mixture thereof. It is advantageous to use mixtures of alcohols and water, preferably n-propanol-water or isopropanol-water mixtures. The emulsion copolymerization reaction temperature is preferably 40 to 100 ℃, and most preferably 60 to 90 ℃.
The discrete nano-micron particles are synthesized, the feeding mode adopts a partial raw material dripping mode, the particle size of the discrete nano-micron particles can be controlled by changing the concentration of a reaction system and the dripping time, the diameter of the discrete nano-micron particles is reduced along with the reduction of the concentration of the reaction system and the increase of the dripping time, and the particle size of the discrete nano-micron particles can be controlled in a nano-scale mode by adjusting the concentration of the reaction system and the dripping time. The diameter of the discrete nano-micron particles in the negative photosensitive composition is 50-300 nm.
The weight average molecular weight of the discrete nano-micron particles is 40000-10000. The glass transition temperature is 110-130 ℃.
The discrete nano-micron particles designed by the invention account for 30-70%, preferably 40-60% of the total solid content of the composition.
Next, the diurea ketone prepolymer in the negative photosensitive composition will be described.
The plate material designed by the invention has the capability of net-shaped thermal crosslinking, the heat of infrared laser leads the diurea ketone in the diurea ketone prepolymer to generate thermal splitting through the laser energy transferred by an infrared absorbent (dye) to generate active isocyanate (-NCO), the active isocyanate (-NCO) and branched chain hydroxyl (-OH) in nano-micron particles generate polyurethane reaction under the catalysis of an organic metal promoter to form strong polar urethane bond (-NHCOO), and the net-shaped thermal crosslinking of polyurethane is realized while the free-radical linear polymerization is realized.
The diurea ketone prepolymer in the negative photosensitive composition has the following structural general formula:
Figure BDA0000441699600000081
wherein R is:
Figure BDA0000441699600000082
the laser pyrolysis mechanism is schematically represented by the following formula:
Figure BDA0000441699600000091
diuranones are dimers of two isocyanate groups provided by two different structures of isocyanate (-R1-NCO, -R2-NCO) or by one of the same structures of isocyanate (-RNCO). The two isocyanate groups for synthesizing the diurea ketone are provided by isocyanate- (RNCO) with the same structure. The diuranone synthesized by isocyanate groups provided by isocyanate with the same structure has symmetrical structure and good stability at normal temperature, and active isocyanate (-NCO) groups are quickly decomposed at high temperature under the action of laser.
The b-diurea ketone prepolymer designed by the invention contains unsaturated double bonds, and the unsaturated double bonds are connected with isocyanate groups through hydroxyl groups, so the selected isocyanate is diisocyanate. Diisocyanates include aromatic diisocyanate Toluene Diisocyanate (TDI) and diphenylmethane diisocyanate (MDI), p-phenylene diisocyanate (PPDI), Naphthalene Diisocyanate (NDI), dimethylbiphenyl diisocyanate (TODI); aliphatic and cycloaliphatic isomers are 1, 6-Hexamethylene Diisocyanate (HDI), 1-isocyanate-3-isocyanatomethylene-3, 5, 5-trimethyl-cyclohexyl (isophorone diisocyanate, IPDI), 4' -diisocyanate dicyclohexylmethane (H12MDI), Xylylene Diisocyanate (XDI), cyclohexane diisocyanate (CHDI), tetramethylxylylene diisocyanate (TMXDI), 1, 3-bis (isocyanatomethyl) cyclohexane (H6XDI), and the like. The diisocyanate selected for synthesizing the biurea ketone prepolymer in the invention is aromatic diisocyanate or diisocyanate containing cyclohexyl. Considering the good stability at normal temperature and the laser pyrolysis property of the diuridone prepolymer, the diisocyanate selected by the invention is diphenylmethane diisocyanate (MDI), 4' -diisocyanate dicyclohexylmethane (H12MDI), Xylylene Diisocyanate (XDI), Toluene Diisocyanate (TDI) and Naphthalene Diisocyanate (NDI).
The unsaturated double bond contained in the b-diurea ketone prepolymer designed by the invention is connected with isocyanate group through hydroxyl, and the unsaturated double bond monomer containing hydroxyl comprises 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate (HPA), 2-hydroxyethyl methacrylate (HEMA), 2-hydroxypropyl methacrylate (HPMA), pentaerythritol triacrylate (PETA) and the like. Considering the activity of unsaturated double bond and the good stability of diurea ketone prepolymer at normal temperature and laser pyrolysis, the unsaturated double bond monomer containing hydroxyl is methacrylic acid-2-hydroxyethyl methacrylate (HEMA) and pentaerythritol triacrylate (PETA).
The content of the b-diurea ketone prepolymer in the total solid content of the composition is 10-50%, preferably 20-40%.
The photopolymerizable polyfunctional monomer comprises diacrylate, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate and tetraacrylate, 1,3, 5-tris (2-acryloyloxyethyl) isocyanurate, hydroxypropyl glyceryl triacrylate, hydroxyethyl trimethylolpropane triacrylate, polyethylene glycol dimethacrylate and the like. The polyfunctional monomer accounts for 10-30% of the dry weight of the coating film in the photosensitive coating, preferably 10-20%.
The components of the heat-sensitive negative-working composition of the invention are described in detail below: a thermal polymerization initiator.
The thermosensitive plate is a polymerizable plate, the plate has the capability of free radical thermal polymerization, the heat of infrared laser transmits laser energy to a thermal polymerization initiator through an infrared absorbent, the thermal polymerization initiator releases active primary free radicals, and the primary free radicals initiate unsaturated double bonds in a polyfunctional group monomer and a diurea ketone prepolymer to realize free radical linear polymerization.
The thermal polymerization initiator in the invention is heated and decomposed to generate primary free radicals, and the unsaturated double bonds are initiated to generate free radical polymerization. There are many kinds of thermal polymerization initiators capable of initiating radical polymerization, including peroxides such as hydrogen peroxide, ammonium persulfate, potassium persulfate, benzoyl peroxide t-butyl peroxide, methyl ethyl ketone peroxide, etc.; azo compounds such as azobisisobutyronitrile, azobisisoheptonitrile, dimethyl azobisisobutyrate, azo compounds having a carboxyl group or a sulfonic group, and azobisisobutylamidine hydrochloride; onium salts such as iodonium salt, sulfonium salt and the like; and triazine compounds containing halogen substitution, and the like. Considering their stability at room temperature and sensitivity to laser thermal decomposition, halogen-substituted triazine compounds are preferable. The thermal polymerization initiator is 1 to 20%, preferably 5 to 15% of the total composition solids.
The components of the heat-sensitive negative-working composition of the invention are described in detail below: an infrared absorber.
The components of the thermosensitive plate composition of the invention are as follows: the infrared absorbent mainly plays a role in energy transfer, the heat of infrared laser transfers laser energy to the thermal polymerization initiator through the infrared absorbent, the thermal polymerization initiator releases active primary free radicals, and the primary free radicals initiate unsaturated double bonds in the polyfunctional monomer and the diurea ketone prepolymer to realize free-radical linear polymerization; meanwhile, the heat of infrared laser is utilized to carry out thermal splitting on the diurea ketone in the diurea ketone prepolymer through the laser energy transferred by the infrared absorbent, so as to generate active isocyanate group (-NCO), and the active isocyanate group (-NCO) and branched chain hydroxyl group (-OH) of the discrete nano-micron particles are subjected to polyurethane reaction under the catalytic action of the e organic metal accelerator, so as to form urethane bond (-NHCOO), realize free radical linear polymerization and realize polyurethane reticular thermal crosslinking at the same time.
The photosensitive composition for negative images contains an infrared absorbing compound having a maximum absorption wavelength of 750-1100nm and selected from carbon black, azo dyes, triarylamine dyes, indolium dyes, oxonol dyes, cyanine dyes, merocyanine dyes, indocyanine dyes, phthalocyanine dyes, polythiophene dyes, pyrazoline azo dyes, oxazine dyes, naphthoquinone dyes, anthraquinone dyes, quinoneimine dyes, methine dyes, porphyrin dyes, and the like. The negative photosensitive composition comprises the following components: the infrared absorbent is cyanine dye with the maximum absorption range of preferably 750-850nm, and the infrared absorbent accounts for 1-20% of the dry weight of the coating in the photosensitive coating, preferably 5-15%.
The components contained in the negative photosensitive composition of the present invention are described in detail below: an organometallic promoter.
The thermal sensitive plate has the characteristic of polyurethane thermal crosslinking, the heat of infrared laser leads diurea ketone in diurea ketone prepolymer to generate thermal splitting through the laser energy transferred by an infrared absorbent, active isocyanate (-NCO) is generated, the active isocyanate (-NCO) and branched chain hydroxyl (-OH) of discrete nano-micron particles generate polyurethane reaction under the catalysis of e organic metal accelerant, and urethane bond (-NHCOO) is formed, thus realizing free radical linear polymerization and simultaneously realizing polyurethane reticular thermal crosslinking.
Polyurethane reactions generally require catalysts, and there are many catalysts that promote polyurethane reactions, and polyurethane catalysts can be divided into two broad classes, amine compounds and organometallic compounds. Amine compounds such as Triethylenediamine (TEDA), Dimethylcyclohexylamine (DMCHA), Dimethylethanolamine (DMEA), Tetramethylbutanediamine (TMBDA), dimethylaminebisethylether (a-99) Benzyldimethylamine (BDMA), and the like; organometallic compounds such as mercury, lead, tin, bismuth, zinc, iron, and the like. The components of the thermosensitive plate composition of the invention are as follows: the organic metal promoter is stable and efficient organic metal tin compound, such as diisobutyl tin laurate, stannous octoate, etc. The organometallic tin compound is preferably present in the photosensitive coating in an amount of 0.5 to 5%, preferably 1 to 3%, based on the dry weight of the coating film.
Finally, the support of the thermal plate of the present invention is described in detail.
The thermosensitive plate composition is required to be coated on a thermosensitive plate support, and the thermosensitive plate support comprises a paper plate base, a polyester base, a rubber plate base, a composite material plate base and a metal plate base such as a copper plate base, an aluminum plate base and the like. The heat-sensitive plate support body selected by the invention is an aluminum plate base which is treated by a special process.
The aluminum plate base treatment process comprises the following steps: the plate base used in the invention is an aluminum plate base subjected to electrolytic coarsening, anodic oxidation and hole sealing treatment, and the average thickness of the central line is 0.3-0.6 um. Such a substrate can be produced by various electrolytic roughening methods. The aluminum plate base of the invention is a high-purity aluminum plate, and the aluminum content is preferably more than 99%. Suitable aluminum substrates include, but are not limited to, 0.1% to 0.5% iron, 0.03% to 0.3% silicon, 0.003% to 0.03% copper, and 0.01% to 0.l titanium. The electrolyte used for electrolytic roughening may be an aqueous solution of an acid, base or salt or an aqueous solution containing an organic solvent. Among them, hydrochloric acid, nitric acid or an aqueous solution of a salt thereof is preferably used as the electrolyte. Firstly, the aluminium plate is put into 1% -30% aqueous solution of sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate and the like, and the temperature is 20-80 DEG CChemical etching for 5-250 seconds. Then neutralizing in 10% -30% nitric acid or sulfuric acid at 20-70 deg.C to remove gray matter. The cleaned aluminum plate is subjected to positive and negative alternation at 10-6O deg.C with rectangular wave, table wave or sine wave at a ratio of 5-100A/dm2The current density of (2) is electrolytic treatment in an electrolyte of nitric acid or hydrochloric acid for 10 to 300 seconds. Subsequently, the electrolytic aluminum plate is subjected to anodic oxidation treatment. Anodic oxidation is typically carried out by the sulfuric acid process. The concentration of the used sulfuric acid is 5-30%, and the current density is 1-15A/dm2The oxidation temperature is 20-60 deg.C, and the oxidation time is 5-250 s, so as to form 1-10g/m2The oxide film of (3). The oxide film formed in this way usually has high oxide film micropores, has strong adsorption capacity, and is easy to adhere dirt. Therefore, a sealing treatment is usually required. The sealing treatment may be carried out by various methods, preferably by sealing 50 to 80% by volume of the micropores of the oxide film. Finally, the aluminum plate thus treated was coated with polyvinylphosphonic acid to a thickness of 3 mg/m 2.
The photosensitive composition of the present invention may further comprise other necessary auxiliaries such as solvents, room temperature thermal polymerization inhibitors, coating colorants, surfactants, and the like.
The solvent is mainly used for preparing the thermosensitive coating photosensitive solution, and the preparation of the thermosensitive coating photosensitive solution solvent comprises the following steps: acetone, methyl ethyl ketone, cyclohexane, ethyl acetate, ethylene dichloride, tetrahydrofuran, toluene, ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol dimethyl ether, propylene glycol methyl ether, propylene glycol ethyl ether, acetylacetone, cyclohexanone, diacetone alcohol, ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate, ethylene glycol isopropyl ether, ethylene glycol butyl ether acetate, 3-methoxypropanol, methoxymethoxyethanol, diethylene glycol methyl ether, diethylene glycol ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, n.n-dimethylformamide, dimethyl sulfoxide, methyl lactate, and ethyl lactate, and the like. The solvents can be used in pure form or as mixtures.
The normal temperature thermal polymerization inhibitor is used for preventing the sheet material from polymerizing at normal temperature and improving the normal temperature stability of the plate material. The thermal polymerization inhibitor includes: hydroquinone, nitroxide radical piperidinol, p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol, t-butylcatechol, benzoquinone, 4 '-thiobis- (3-methyl-6-t-butylphenol), 2' -methylenebis (4-methyl-16-t-butylphenol), and the primary cerium salt of N-nitrosophenylhydroxylamine, and the like.
The heat sensitive coating contains a coating colorant. In order to increase the image density of the heat-sensitive plate after the plate is made and facilitate the visual inspection of the heat-sensitive plate after the plate is made or the plate performance measurement of image analysis and measurement equipment, the heat-sensitive layer of the heat-sensitive plate is added with a layer coloring agent. It includes: methyl violet, ethyl violet, crystal violet, victoria blue, oil green, oil blue, oil yellow, rhodamine B, methyl violet, malachite green, methylene blue, triazines, and the like.
The heat sensitive coating contains a surfactant, and can be selected from nonionic surfactants, amphoteric surfactants, silicon-containing surfactants, fluorine-containing surfactants and the like. Such as betaines, glyceryl stearates, sorbitan esters, silicones, polyfluoroalkyl ethers.
As the thermosensitive plate, a protective layer is coated on the thermosensitive coating to prevent oxygen in the air or other pollutants in the environment from influencing the performance of the thermosensitive coating. As the material for the protective layer, polymers having water solubility such as poly (vinyl alcohol), polyvinylpyrrolidone, acidic cellulose derivatives, gelatin, gum arabic, and poly (propenol, etc. are preferable, and these materials can obtain good oxygen repellency and development removability as the main component of the protective layer, for specific examples of polyvinyl alcohol, compounds which are 71-100% hydrolysed and have a molecular weight of 300-2400 may be mentioned, specific examples being: PVA-105, PVA-110, PVA-117 H.PVA-120, PVA-124 H.PVA-CS.PVA-CST, PVA-HC.PVA-203, PVA-204, PVA-205, PVA-210, PVA-217, PVA-220, PVA-224, PVA-217 EE, PVA-217E, PVA-220 E.PVA-224E, PVA-405, PVA-420, PVA-613, etc. the coating weight of the protective layer is usually 5-20mg/dm in terms of dry mass.2Preferably 10-15mg/dm2
The heat-sensitive compositions of the present invention are typically coated (e.g., knife coated, bar coated, roll coated, press coated, etc.) onto an aluminum substrate using techniques known in the art.
Detailed Description
The following are examples of the synthesis of the present invention, but the present invention is not limited to the following examples.
Raw materials are available from the following companies: styrene St: shandong Han Zun energy science and technology, Inc.; methacrylonitrile MAN, acrylonitrile AN: tianjin chemical reagent II; hydroxyethyl methacrylate HEMA, hydroxyethyl acrylate HEA, hydroxypropyl methacrylate HPMA, hydroxypropyl acrylate HPA: mitsubishi corporation of japan; exemplary compounds a1, a 2: SIGMA corporation, UK; isopropyl alcohol: yangzhou Chengyu chemical industry; azobisisobutyronitrile: fosen chemical, benzoyl peroxide BPO Laiwukang new reagent.
A first part: synthesis examples of discrete Nano-micro emulsion particles (code P) P1-P10
Example 1 (emulsion particle P01)
300g of isopropanol, 100g of deionized water, 10g (10 wt%) of the exemplified compound A1(n is about 60) were placed in a 1000ml four-neck flask with a temperature-controlled heating device, mechanical stirring, reflux condensation and nitrogen protection, and the mixture was stirred while heating, 70g (70 wt%) of St (styrene), 10g (10 wt%) of AN (acrylonitrile), 10g (10 wt%) of HEMA hydroxyethyl methacrylate and 0.7g of AIBN (azobisisobutyronitrile) were added dropwise at 80 ℃ for 1 hour, and after 7.5 hours of further reaction, 0.3g of AIBN (azobisisobutyronitrile) was added, and the reaction was completed after 12 hours of further reaction.
The solids content was 25%, the GPC molecular weight was 93600, and the particle diameter was 200 nm.
Example 2 (emulsion particle P02)
357g of isopropanol, 119g of deionized water, 10g (10 wt%) of the exemplified compound A2(n is about 50) were added to a 1000ml four-neck flask with a temperature-controlled heating device, mechanical stirring, reflux condensation and nitrogen protection, and the mixture was stirred while heating, 60g (60 wt%) of St (styrene), 20g (20 wt%) of AN (acrylonitrile), 10g (10 wt%) of HEMA hydroxyethyl methacrylate and 0.7g of AIBN (azobisisobutyronitrile) were added dropwise at 60 ℃ for 1.5 hours, and after 7.5 hours of further reaction, 0.3g of AIBN (azobisisobutyronitrile) was added and the reaction was completed after 12 hours of further reaction.
The solids content (solute/solvent) was 21%, the GPC molecular weight was 76800, and the particle diameter was 150 nm.
Example 03 (emulsion particle P03)
417g of isopropanol, 139g of deionized water, 10g (10 wt%) of the exemplified compound A1(n is about 40) were placed in a 1000ml four-neck flask with temperature-controlled heating, mechanical stirring, reflux condensation and nitrogen protection, and the mixture was stirred while heating, 50g (50 wt%) of St (styrene), 30g (30 wt%) of AN (acrylonitrile), 10g (10 wt%) of hydroxyethyl HEA acrylate and 0.7g of AIBN (azobisisobutyronitrile) were added dropwise at 60 ℃ for 2.0 hours, and after 7.5 hours of further reaction, 0.3g of AIBN (azobisisobutyronitrile) was added, and the reaction was completed after 12 hours of further reaction.
The solid content was 18%, the GPC molecular weight was 63700, and the particle diameter was 100 nm.
Example 04 (emulsion particle P04)
500g of isopropanol, 167g of deionized water, 10g (10 wt%) of the exemplified compound A2(n is about 20) were placed in a 1000ml four-neck flask with a temperature-controlled heating device, mechanical stirring, condensation reflux and nitrogen protection, and the mixture was stirred while heating, 40g (40 wt%) of St (styrene), 10g (10 wt%) of AN (acrylonitrile), 20g (20 wt%) of hydroxyethyl HEA acrylate and 0.7g of AIBN (azobisisobutyronitrile) were added dropwise at 60 ℃ for 2.5 hours, and after 7.5 hours of further reaction, 0.3g of AIBN (azobisisobutyronitrile) was added, and the reaction was completed after 12 hours of further reaction.
The solids content was 15%, the GPC molecular weight was 40500, and the particle diameter was 50 nm.
Example 05 (emulsion particle P05)
250g of isopropanol, 83.3g of deionized water, 10g (10 wt%) of the exemplified compound A1(n is about 50) were placed in a 1000ml four-necked flask with temperature-controlled heating, mechanical stirring, condensation reflux and nitrogen protection, and the mixture was stirred while heating, 60g (60 wt%) of St (styrene), 10g (10 wt%) of MAN (methacrylonitrile), 20g (20 wt%) of HEPA hydroxypropyl methacrylate and 0.7g of benzoyl peroxide BPO were added dropwise at 90 ℃ for 0.5 hour, and after 7.5 hours of further reaction, 0.3g of benzoyl peroxide BPO was added, and the reaction was terminated after 12 hours of further reaction.
The solids content was 30%, the GPC molecular weight was 102400, and the particle diameter was 300 nm.
Example 06 (emulsion particle P06)
268g of isopropanol, 89.3g of deionized water, 10g (10 wt%) of the exemplified compound A2(n is about 40) were added to a 1000ml four-neck flask with temperature-controlled heating, mechanical stirring, condensation reflux and nitrogen protection, the mixture was heated and stirred uniformly, 50g (50 wt%) of St (styrene), 10g (10 wt%) of MAN (methacrylonitrile), 30g (30 wt%) of HPMA hydroxypropyl ethyl methacrylate and 0.7g of benzoyl peroxide BPO were added dropwise at 85 ℃ for 45 minutes, the mixture was reacted for 7.5 hours, then 0.3g of benzoyl peroxide BPO was added, and the reaction was continued for 12 hours and then ended.
The solids content was 28%, the GPC molecular weight was 97500, and the particle diameter was 250 nm.
Example 07 (emulsion particle P07)
A1000 ml four-necked flask with temperature-controlled heating, mechanical stirring, reflux condensation and nitrogen protection was charged with 312.5g of isopropanol, 104.1g of deionized water, 30g (30 wt%) of the exemplified compound A1(n about 20), heated and stirred uniformly, 40g (40 wt%) of St (styrene), 20g (20 wt%) of MAN (methacrylonitrile), 10g (10 wt%) of hydroxypropyl HPA acrylate, and 0.7g of AIBN (azobisisobutyronitrile) were added dropwise at 80 ℃ for 1 hour and 20 minutes, reacted for 7.5 hours, and then 0.3g of AIBN (azobisisobutyronitrile) was added, and the reaction was continued for 12 hours and then ended.
The solid content was 24%, the GPC molecular weight was 91300, and the particle diameter was 180 nm.
Example 08 (emulsion particle P08)
441g of isopropanol, 147g of deionized water, 20g (20 wt%) of the exemplified compound A2(n about 60) were added to a 1000ml four-necked flask equipped with a temperature-controlled heating device, a mechanical stirrer, a condensing reflux device and a nitrogen blanket, and the mixture was stirred while heating, 60g (60 wt%) of St (styrene), 10g (10 wt%) of AN (acrylonitrile), 10g (10 wt%) of hydroxypropyl acrylate HPA, and 0.7g of AIBN (azobisisobutyronitrile) were added dropwise at 65 ℃ for 2.5 hours, and after 7.5 hours of the reaction, 0.3g of AIBN (azobisisobutyronitrile) was added, and the reaction was completed after 12 hours of the reaction.
The solids content was 17%, the GPC molecular weight was 56400, and the particle diameter was 70 nm.
Example 09 (emulsion particle P09)
375g of isopropanol, 125g of deionized water, 30g (30 wt%) of the exemplified compound A1(n is about 30) were added to a 1000ml four-neck flask with temperature-controlled heating, mechanical stirring, condensation reflux and nitrogen protection, and the mixture was heated and stirred uniformly, 50g (50 wt%) of St (styrene), 10g (10 wt%) of AN (acrylonitrile), 10g (10 wt%) of HEMA hydroxyethyl methacrylate and 0.7g of AIBN (azobisisobutyronitrile) were added dropwise at 70 ℃ for 2 hours and 15 minutes, reacted for 7.5 hours, then 0.3g of AIBN (azobisisobutyronitrile) was added, and the reaction was continued for 12 hours and ended.
The solids content was 20%, the GPC molecular weight was 68700, and the particle diameter was 90 nm.
Example 10 (emulsion particle P10)
In a 1000ml four-necked flask with temperature-controlled heating, mechanical stirring, reflux condensation and nitrogen protection, 326g of isopropanol, 108.7g of deionized water, 10g (10 wt%) of the exemplified compound A2(n is about 60) were added, the mixture was heated and stirred uniformly, 40g (40 wt%) of St (styrene), 30g (30 wt%) of AN (acrylonitrile), 10g (10 wt%) of hydroxyethyl HEA acrylate and 0.7g of AIBN (azobisisobutyronitrile) were added dropwise at 80 ℃ for 1 hour, and after 7.5 hours of the reaction, 0.3g of AIBN (azobisisobutyronitrile) was added, and the reaction was continued for 12 hours and then ended.
The solids content was 23%, the GPC molecular weight was 85400, and the particle diameter was 130 nm.
Comparative examples 1-5 (Synthesis of similar Acer hair emulsion particles A1-A5):
according to the Airkish patent EP2006-5-2406114475.4, a semi-continuous emulsion method is introduced to prepare styrene and acrylonitrile emulsion thermoplastic particles, which can realize hot melting, but does not contain self-emulsifying hydrophilic groups, and the main structure of plastic particles is as follows:
Figure BDA0000441699600000161
similar emulsion particles A1-A5 were synthesized.
Basic operation: 250g of n-propanol, 75g of deionized water and 5g of sodium dodecyl sulfate are added into a 1000ml four-neck flask with a temperature-controlled heating device, a mechanical stirring device, a condensation reflux device and a nitrogen protection device, 60g (60 wt%) of ST (styrene), 40g (40 wt%) of AN (acrylonitrile) and 0.7g of AIBN (azobisisobutyronitrile) are dropwise added at 80 ℃, the dropwise adding time is 2.5 hours, 0.3g of AIBN (azobisisobutyronitrile) is added after the reaction is carried out for 7.5 hours, and the reaction is finished after the reaction is continued for 12 hours.
The solids content was 23.5%, the GPC molecular weight was 80000, and the particle diameter was 55 nm.
The reaction concentration and the dropping time are changed to change the particle diameter and the molecular weight, so that similar Acer emulsion particles A1-A5 are synthesized, and the properties are shown in the attached table 1.
Comparative examples 6-10 (Synthesis of similar coanda emulsion particles K1-K5):
according to Kodak patent US2005-8-311/196, a self-emulsifying adhesive is described comprising a polymeric polyalkylene oxide segment and hydrophobic cyano side groups, the plastic particle host structure:
Figure BDA0000441699600000171
similar emulsion particles K1-K5 were synthesized.
Basic operation: 250g of n-propanol and 75g of deionized water were added dropwise to a 1000ml four-neck flask equipped with a temperature-controlled heating device, a mechanical stirrer, a condensing reflux device and a nitrogen protection device at 80 ℃ to 20g (0 wt%) of ST (styrene), 70g (70 wt%) of AN (acrylonitrile), 20g (20 wt%) of PEGMA (polyethoxymethylacrylate) and AIBN (azobisisobutyronitrile), the dropwise addition was carried out for 2.5 hours, and after 7.5 hours of reaction, 0.3g of AIBN (azobisisobutyronitrile) was added, and the reaction was continued for 12 hours and then ended.
The solids content was 23.5%, the GPC molecular weight was 80000, and the particle diameter was 75 nm.
The reaction concentration and the dropping time are changed to change the particle diameter and the molecular weight, so that similar kodak emulsion particles K1-K5 are synthesized, and the properties are shown in the attached table 1.
b: diurea ketone prepolymer: synthesis examples b1-b5
Raw materials are available from the following companies: pentaerythritol triacrylate PETA: sartomer, SR444, sartomer, usa; 2-hydroxyethyl methacrylate: mitsubishi corporation of japan; xylene methane diisocyanate MDI, Japan Tri-well chemistry; toluene diisocyanate TDI: japan polyurethane industries Ltd; xylylene diisocyanate XDI manufactured by Takenato, Wuta chemical industries, Japan; naphthalene-1, 5-diisocyanate NDI, Sandhoo pressure chemical Co., Ltd, Japan; dicyclohexylmethane diisocyanate HMDI Bayer, Desodurw; methyl ethyl ketone MEK: japan is perfecting petrochemicals.
Synthesis of compounds example b 1:
298.0g of pentaerythritol triacrylate PETA, g of methyl ethyl ketone MEK and 1.0g of dibutyltin dilaurate are added into a 2000ml four-neck flask with a temperature-controlled heating device, a mechanical stirring device, a condensation reflux device and a nitrogen protection device, nitrogen protection is carried out, molten 500.5g of xylene methane diisocyanate MDI is dropwise added when the temperature is 60 ℃, the dropwise adding time is 30 minutes, 130.1g of 2-hydroxyethyl methacrylate is dropwise added after 2-hour reaction, the dropwise adding time is 30 minutes, the reaction is carried out for 2 hours again, 232.1g of methyl ethyl ketone is added, the reaction is carried out in an ice water bath for 48 hours until the peak of active isocyanate 2275 disappears through infrared spectrum detection, and the MEK solution of the compound b1 with the solid content of 80% is obtained.
Synthesis of compounds example b 2:
298.0g of pentaerythritol triacrylate PETA, g of methyl ethyl ketone MEK and 1.0g of dibutyltin dilaurate are added into a 1000ml four-neck flask with a temperature-controlled heating device, mechanical stirring device, condensation reflux device and a nitrogen protection device, nitrogen protection is carried out, 348.3g of toluene diisocyanate TDI is added dropwise when the flask is heated to 60 ℃, the dropping time is 30 minutes, 130.1g of 2-hydroxyethyl methacrylate is added dropwise after 2 hours of reaction, the dropping time is 30 minutes, the reaction is carried out for 2 hours again, 194.1g of methyl ethyl ketone is added, the reaction is carried out in an ice-water bath for 48 hours until the peak of active isocyanate 2275 disappears through infrared spectrum detection, and the MEK solution of the compound 2 with the solid content of 80% is obtained.
Synthesis of compounds example b 3:
298.0g of pentaerythritol triacrylate PETA, g of methyl ethyl ketone MEK and 1.0g of dibutyltin dilaurate are added into a 1000ml four-neck flask with a temperature-controlled heating device, mechanical stirring device, condensation reflux device and nitrogen protection device, nitrogen protection is carried out, 376.4g of xylylene diisocyanate XDI is added dropwise when the temperature is increased to 60 ℃, the dropping time is 30 minutes, 130.1g of 2-hydroxyethyl methacrylate is added dropwise after 2-hour reaction, the dropping time is 30 minutes, the reaction is carried out for 2 hours again, 201.1g of methyl ethyl ketone is added, and the reaction is carried out in an ice-water bath for 48 hours until the peak of active isocyanate 2275 disappears through infrared spectrum detection, so that the MEK solution of the compound b3 with the solid content of 80% is obtained.
Synthesis of compounds example b 4:
298.0g of pentaerythritol triacrylate PETA, g of methyl ethyl ketone MEK and 1.0g of dibutyltin dilaurate were added into a 2000ml four-neck flask with a temperature-controlled heating, mechanical stirring, condensation reflux and nitrogen protection device, nitrogen protection was carried out, molten 420.0g of naphthalene-1, 5-diisocyanate NDI was added dropwise when the flask was heated to 60 ℃ for 30 minutes, 130.1g of 2-hydroxyethyl methacrylate was added dropwise after 2 hours of reaction, the dropwise addition was carried out for 30 minutes, the reaction was carried out for 2 hours again, 212.0g of methyl ethyl ketone was added, and the reaction was carried out in an ice-water bath for 48 hours until the peak of active isocyanate 2275 disappeared by infrared spectroscopy, whereby an MEK solution of compound b4 with a solid content of 80% was obtained.
Synthesis of compounds example b 5:
298.0g of pentaerythritol triacrylate PETA, g of methyl ethyl ketone MEK and 1.0g of dibutyltin dilaurate are added into a 2000ml four-neck flask with a temperature-controlled heating device, mechanical stirring device, condensation reflux device and a nitrogen protection device, nitrogen protection is carried out, 524.0g of dicyclohexylmethane diisocyanate HMDI is added dropwise when the flask is heated to 60 ℃, the dropping time is 30 minutes, 130.1g of 2-hydroxyethyl methacrylate is added dropwise after 2 hours of reaction, the dropping time is 30 minutes, the reaction is carried out for 2 hours again, 238.0g of methyl ethyl ketone is added, and the reaction is carried out in an ice-water bath for 48 hours until the peak of active isocyanate 2275 disappears through infrared spectrum detection, so that the MEK solution of the compound b5 with the solid content of 80% is obtained.
The photosensitive composition of the present invention is dissolved in an appropriate solvent to prepare a coating solution. The following photosensitive solution was extrusion-coated on the above aluminum plate base, followed by drying at 110 ℃ for 60 seconds to obtain 1.8g/m2Dry weight of coating (2).
The thermoplastic nano-micro emulsion particles P01-P10 are used; b: synthesis of Diuretone prepolymer example Compounds b1-b5, polyfunctional monomer, thermal polymerization initiator, infrared absorber and accelerator the example non-chemically treated thermal lithographic plates 1-10 were prepared, and the comparative example non-chemically treated thermal lithographic plates 1-10 were prepared using the above comparative examples A1-A5, K1-K5 nano-micron emulsion particles.
The following are examples of the practice of the invention, but are not limited to the following examples:
example 1
The heat-sensitive plate made of the negative photosensitive composition comprises a base plate 1, a negative photosensitive composition coating layer 2 arranged on the base plate, and a protective layer 3 arranged on the negative photosensitive composition coating layer.
Preparing a substrate: a1050-rolled aluminum plate having a purity of 99.5% and a thickness of 0.3 mm was immersed in a 5% aqueous solution of sodium hydroxide at 70 ℃ for 20 seconds, washed with running water, and immediately neutralized with A1% aqueous solution of nitric acid. Then, the mixture was subjected to a sine wave alternating current at 40 ℃ in a 1% hydrochloric acid aqueous solution at a frequency of 50A/dm2Current density electrolytic roughening for 16 seconds. Then, the mixture was neutralized with a 5% aqueous solution of sodium hydroxide at 40 ℃ for 10 seconds. And (5) washing with water. Finally, at 30 ℃, using 20% sulfuric acid water solution at 15A/dm2Anodic oxidation for 20 seconds. And (5) washing with water. The pore sealing treatment was carried out with a 5% aqueous solution of sodium silicate at 80 ℃ for 18 seconds. And (5) washing with water. And (5) drying. The thus obtained aluminum plate base support had an average thickness of 0.5 um at the center line and a weight of the oxide film of 3.0g/dm2
Coating a photosensitive layer: the following photosensitive liquid was extrusion-coated on the above hydrophilized substrate, and then dried at 100 ℃ for 60 seconds. 10mg/dm was obtained2Dry weight of coating (2). The photosensitive solution used was the following composition (each component in parts by weight):
Figure BDA0000441699600000201
coating a protective layer: the protective layer solution was extrusion-coated on the photosensitive layer obtained above, and then dried at 110 ℃ for 60 seconds. 10mg/dm was obtained2Dry weight of coating (each component is as follows)Parts by weight).
Protective layer formula (each component is according to weight portion)
Polyvinyl alcohol PVA-205 (Colorado, Japan) 17
Polyvinylpyrrolidone PVPK30 (BASF, Germany) 3
Emulsifier OP-10 (Hamm Germany) 0.45
Deionized water 480
The infrared absorbing dye ADS830 has the following structure:
Figure BDA0000441699600000202
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 2
The substrate, photosensitive layer and protective layer were prepared in the same manner as above. The photosensitive solution comprises the following components:
Figure BDA0000441699600000211
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 3
The substrate, photosensitive layer and protective layer were prepared in the same manner as above. The photosensitive solution comprises the following components:
Figure BDA0000441699600000212
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 4
The substrate, photosensitive layer and protective layer were prepared in the same manner as above. The photosensitive solution comprises the following components:
Figure BDA0000441699600000221
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 5
The substrate, photosensitive layer and protective layer were prepared in the same manner as above. The photosensitive solution comprises the following components:
Figure BDA0000441699600000222
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2The exposure is performed. The properties are shown in Table 2 below.
Example 6
The substrate, photosensitive layer and protective layer were prepared in the same manner as above. The photosensitive solution comprises the following components:
Figure BDA0000441699600000231
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 7
The substrate, photosensitive layer and protective layer were prepared in the same manner as above. The photosensitive solution comprises the following components:
Figure BDA0000441699600000232
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 8
The substrate, photosensitive layer and protective layer were prepared in the same manner as above. The photosensitive solution comprises the following components:
Figure BDA0000441699600000241
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 9
The substrate, photosensitive layer and protective layer were prepared in the same manner as above. The photosensitive solution comprises the following components:
Figure BDA0000441699600000242
Figure BDA0000441699600000251
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 10
The substrate, photosensitive layer and protective layer were prepared in the same manner as above. The photosensitive solution comprises the following components:
Figure BDA0000441699600000252
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 11
A substrate, a photosensitive layer and a protective layer were prepared in the same manner as in example 1. Except that the average thickness of the center line of the substrate is 0.4 um
The plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 12
A substrate, a photosensitive layer and a protective layer were prepared in the same manner as in example 1. Except that the average thickness of the center line of the substrate is 0.6um
The plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 13
A substrate, a photosensitive layer and a protective layer were prepared in the same manner as in example 1. Except that the dry coating weight of the photosensitive layer was 8mg/dm2
The plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 14
A substrate, a photosensitive layer and a protective layer were prepared in the same manner as in example 1. Except that the weight of the dried coating layer of the photosensitive layer was set to 15mg/dm2
The plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are listed in table 2 below.
Example 15
A substrate, a photosensitive layer and a protective layer were prepared in the same manner as in example 1. Except that the dry coating weight of the protective layer was set to 5mg/dm2
The plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Example 16
A substrate, a photosensitive layer and a protective layer were prepared in the same manner as in example 1. Except that the dry coating weight of the protective layer was 20mg/dm2
The plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Comparative examples 1 to 5
A substrate, a photosensitive layer and a protective layer were prepared in the same manner as in example 1. The photosensitive coating liquid used the following components:
Figure BDA0000441699600000261
Figure BDA0000441699600000271
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Is exposed to light. The properties are shown in Table 2 below.
Comparative examples 6 to 10
A substrate, a photosensitive layer and a protective layer were prepared in the same manner as in example 1. The photosensitive coating liquid used the following components:
Figure BDA0000441699600000272
the plate thus obtained was subjected to Kodak-win thermosensitive CTP plate-making machine at 120mJ/cm2Exposing with energy, measuring the density of the layout with Eimeria 528, and measuring the dot performance with a dot machine; the plate sample is normally printed on a machine (Heidelberg four-color quarto high-speed rotary printing machine), and the number of passing papers and the printing resistance are inspected. The plate properties are shown in the attached Table 2.
The detection application result of the attached table shows that compared with the plate material with a single hot-melting and free radical polymerization mechanism, the heat-sensitive plate material disclosed by the invention has a multiple heat-sensitive imaging mechanism, can realize nano-micron particle hot-melting thermoplasticity, free-base line hot-polymerization and polyurethane reticular heat crosslinking, has the advantages of high light sensitivity, good dot reducibility and high pressrun due to the multiple heat-sensitive imaging mechanism, can be directly printed on a machine without any washing processing step after being scanned and imaged by infrared laser, can obtain very high pressrun, and realizes green and environment-friendly printing.
Attached table 1: emulsion particle performance table
Figure BDA0000441699600000273
Figure BDA0000441699600000281
Attached table 2: plate material application performance table
Figure BDA0000441699600000282
Figure BDA0000441699600000291

Claims (16)

1. A negative-working photosensitive composition characterized by: the composition comprises nano-micron particles, diurea ketone prepolymer, multifunctional group monomer, thermal polymerization initiator, infrared absorbent and accelerator, wherein the nano-micron particles account for 30-70% of the total solid content of the composition, the diurea ketone prepolymer accounts for 10-50% of the total solid content of the composition, the multifunctional group monomer accounts for 10-30% of the total solid content of the composition, the thermal polymerization initiator accounts for 1-20% of the total solid content of the composition, the infrared absorbent accounts for 1-20% of the total solid content of the composition, and the accelerator accounts for 0.5-5% of the total solid content of the composition;
the diurea ketone prepolymer has the following structure:
Figure FDA0002363969330000011
wherein R is:
Figure FDA0002363969330000012
2. the negative photosensitive composition of claim 1, wherein: the composite material comprises nano-micron particles, diurea ketone prepolymer, multifunctional group monomer, thermal polymerization initiator, infrared absorbent and accelerator, wherein the nano-micron particles account for 40-60% of the total solid content of the composite, the diurea ketone prepolymer accounts for 20-40% of the total solid content of the composite, the multifunctional group monomer accounts for 10-20% of the total solid content of the composite, the thermal polymerization initiator accounts for 5-15% of the total solid content of the composite, the infrared absorbent accounts for 5-15% of the total solid content of the composite, and the accelerator accounts for 1-3% of the total solid content of the composite.
3. The negative photosensitive composition of claim 1 or 2, wherein: the nano-micron particle has the particle size of 50-300nm and the weight-average molecular weight of 10000-40000, and has the following structure:
Figure FDA0002363969330000013
r1, R2 and R4 are H atoms or methyl, R3 is CH2CH2OH or CH2CH2CH2OH, R5 is COO (CH2CH2O) nH or COOCH2CH2NHCOO (CH2CH2O) nH, and n is an integer of 20-60;
a. b, c and d are the weight percentage of the corresponding copolymerization units, the proportion of a is 40-70%, the proportion of b is 10-30%, the proportion of c is 10-30%, and the proportion of d is 10-30%.
4. The negative photosensitive composition of claim 1 or 2, wherein: the multifunctional monomer is selected from multifunctional acrylic monomers, and the multifunctional acrylic monomers are any one of diacrylate, 1, 6-hexanediol diacrylate, pentaerythritol triacrylate, tetraacrylate, 1,3, 5-tris-mono (2-acryloyloxyethyl) isocyanurate, hydroxypropyl glyceryl triacrylate, hydroxyethyl trimethylolpropane triacrylate, and polyethylene glycol dimethacrylate.
5. The negative photosensitive composition of claim 1 or 2, wherein: the thermal polymerization initiator is any one of a peroxide, an azo compound, a halogen-substituted triazine compound, or an onium salt.
6. The photosensitive composition of claim 5, wherein: the peroxide is any one of hydrogen peroxide, ammonium persulfate, potassium persulfate, benzoyl peroxide tert-butyl ester and methyl ethyl ketone peroxide; the azo compound is any one of azodiisobutyronitrile, azodiisoheptonitrile, azodiisobutyronitrile dimethyl ester, azo compound with carboxyl, azo compound with sulfonic acid group and azodiisobutyl amidine hydrochloride, the onium salt is iodonium salt or sulfonium salt, and the halogen substituted triazine compound is chlorine substituted triazine compound or bromine substituted triazine compound.
7. The negative photosensitive composition of claim 1 or 2, wherein: the thermal decomposition temperature of the thermal polymerization initiator is 150-200 ℃.
8. The negative photosensitive composition of claim 1 or 2, wherein: the infrared absorbent is any one of carbon black, azo dye, triarylamine dye, indolium dye, oxonol dye, cyanine dye, merocyanine dye, indocyanine dye, phthalocyanine dye, polythiophene dye, pyrazoline azo dye, oxazine dye, naphthoquinone dye, anthraquinone dye, quinoneimine dye, methine dye and porphyrin dye, and the maximum absorption wavelength range of the infrared absorbent is 750-1100 nm.
9. The negative photosensitive composition of claim 1 or 2, wherein: the infrared absorber is a cyanine dye, and the maximum absorption wavelength range of the infrared absorber is 750-850 nm.
10. The negative photosensitive composition of claim 1 or 2, wherein: the accelerator is an amine compound and an organic metal compound, wherein the amine compound is any one of triethylene diamine (TEDA), Dimethylcyclohexylamine (DMCHA), Dimethylethanolamine (DMEA), Tetramethylbutanediamine (TMBDA), dimethylamino bisethyl ether (A-99) and benzyldimethylamine; the organometallic compound is any of organometallic compounds of mercury, lead, tin, bismuth, zinc, and iron.
11. The negative photosensitive composition of claim 10, wherein: the tin organometallic compound is diisobutyltin laurate or stannous octoate.
12. A heat-sensitive plate made of the negative photosensitive composition of claim 1 or 2, characterized in that: it comprises a substrate (1), a negative photosensitive composition coating layer (2) disposed on the substrate, and a protective layer (3) disposed on the negative photosensitive composition coating layer.
13. A heat-sensitive plate made of the negative photosensitive composition according to claim 12, wherein: the substrate is an aluminum plate base which is subjected to electrolytic coarsening and anodic oxidation and subjected to hole sealing treatment, and the average thickness of the central line of the aluminum plate base is 0.4-0.6 mu m.
14. A heat-sensitive plate made of the negative photosensitive composition according to claim 13, wherein: the dry weight of the coating layer of the negative photosensitive composition is 8-15mg/dm2
15. A heat-sensitive plate made of the negative photosensitive composition according to claim 12, wherein: the dry weight of the protective layer is 5-20mg/dm2
16. A heat-sensitive plate made of the negative photosensitive composition according to claim 12, wherein: the material of the protective layer is a water-soluble polymer, and the water-soluble polymer is any one of polyvinyl alcohol, polyvinylpyrrolidone, acid cellulose derivative, gelatin, gum arabic or polypropylene phenol.
CN201310706605.8A 2013-12-19 2013-12-19 Negative image photosensitive composition and heat-sensitive plate made of the same Active CN104730862B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310706605.8A CN104730862B (en) 2013-12-19 2013-12-19 Negative image photosensitive composition and heat-sensitive plate made of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310706605.8A CN104730862B (en) 2013-12-19 2013-12-19 Negative image photosensitive composition and heat-sensitive plate made of the same

Publications (2)

Publication Number Publication Date
CN104730862A CN104730862A (en) 2015-06-24
CN104730862B true CN104730862B (en) 2020-06-19

Family

ID=53454895

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310706605.8A Active CN104730862B (en) 2013-12-19 2013-12-19 Negative image photosensitive composition and heat-sensitive plate made of the same

Country Status (1)

Country Link
CN (1) CN104730862B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108297565B (en) * 2016-08-27 2020-10-27 乐凯华光印刷科技有限公司 On-machine development treatment-free thermosensitive plate with nano-micron structure protective layer
CN106362180B (en) * 2016-08-29 2019-08-06 南京巨鲨显示科技有限公司 A kind of hot air sterilization indicant and preparation method thereof
CN108227384A (en) * 2016-12-14 2018-06-29 乐凯华光印刷科技有限公司 Negative type heat-sensitive CTP plate precursor with double-layer structure
EP3640039B1 (en) 2017-06-12 2024-04-24 FUJIFILM Corporation Lithography original plate, platemaking method for lithography plate, and photosensitive resin composition
CN109263338B (en) * 2017-07-17 2021-09-14 乐凯华光印刷科技有限公司 On-press development treatment-free thermosensitive plate and preparation method thereof
CN109725067A (en) * 2017-10-27 2019-05-07 乐凯华光印刷科技有限公司 The detection method of free isocyanate group content in a kind of offset plate material emulsion
CN108107678A (en) * 2018-01-18 2018-06-01 陈超 It is a kind of for negative graph photosensitive composition of CTP systems and preparation method thereof
CN109814337A (en) * 2019-01-25 2019-05-28 安徽强邦印刷材料有限公司 A kind of directly upper machine of double coatings exempts from processing CTP editions
CN109835080B (en) * 2019-01-25 2021-10-08 安徽强邦新材料股份有限公司 Single-coating direct-machining treatment-free CTP (computer to plate)
CN110172773A (en) * 2019-06-12 2019-08-27 苏州福洹纺织科技有限公司 A kind of preparation method of high-tensile high-model heterocycle aramid fiber woven fabric
CN112976859B (en) * 2019-12-16 2023-03-10 乐凯华光印刷科技有限公司 Negative lithographic printing plate precursor and negative lithographic printing plate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1297168A (en) * 1999-10-20 2001-05-30 罗姆和哈斯公司 Light image-forming composition contg. light polymerizable adhesive oligomer
JP2008238505A (en) * 2007-03-27 2008-10-09 Mitsubishi Paper Mills Ltd Process-less photosensitive lithographic printing plate
CN101291969A (en) * 2005-10-25 2008-10-22 氰特表面技术有限公司 Polymer and compositions
CN102540709A (en) * 2010-12-30 2012-07-04 乐凯华光印刷科技有限公司 Infrared sensitive chemistry-free light-sensing composition and lithographic printing plate made from same
CN103019032A (en) * 2011-09-26 2013-04-03 富士胶片株式会社 Photosensitive resin composition, method of producing cured film, cured film, organic el display device, and liquid crystal display device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1297168A (en) * 1999-10-20 2001-05-30 罗姆和哈斯公司 Light image-forming composition contg. light polymerizable adhesive oligomer
CN101291969A (en) * 2005-10-25 2008-10-22 氰特表面技术有限公司 Polymer and compositions
JP2008238505A (en) * 2007-03-27 2008-10-09 Mitsubishi Paper Mills Ltd Process-less photosensitive lithographic printing plate
CN102540709A (en) * 2010-12-30 2012-07-04 乐凯华光印刷科技有限公司 Infrared sensitive chemistry-free light-sensing composition and lithographic printing plate made from same
CN103019032A (en) * 2011-09-26 2013-04-03 富士胶片株式会社 Photosensitive resin composition, method of producing cured film, cured film, organic el display device, and liquid crystal display device

Also Published As

Publication number Publication date
CN104730862A (en) 2015-06-24

Similar Documents

Publication Publication Date Title
CN104730862B (en) Negative image photosensitive composition and heat-sensitive plate made of the same
CN105372935B (en) can directly be put in printing and exempt from to handle thermosensitive version
CN108297565B (en) On-machine development treatment-free thermosensitive plate with nano-micron structure protective layer
EP3182204B1 (en) Planographic printing plate precursor using a polymerizable composition
CN100504600C (en) Lithographic printing plate precursor and lithographic printing method using the same
JP5645743B2 (en) Planographic printing plate precursor, plate making method thereof, and polyvalent isocyanate compound
JPH10333321A (en) Photosensitive planographic printing plate developed by printing and photomechanical process for the same
JP6518767B2 (en) Lithographic printing plate precursor and plate making method
WO2008022431A1 (en) Reactive near infrared absorbing polymeric particles, methods of preparation and uses thereof
WO2021172453A1 (en) Lithographic printing plate original plate, lithographic printing plate manufacturing method, and lithographic printing method
EP2090430B1 (en) Photosensitive composition and lithographic printing original plate using the composition
WO2004043935A1 (en) Polymerizable compounds with quadruple hydrogen bond forming groups
EP1391784A2 (en) Polymerizable composition and negative-working planographic printing plate precursor using the same
JP5757732B2 (en) Planographic printing plate precursor and plate making method using microcapsules
CN103879168B (en) A kind of long print journey temperature-sensitive version
CN112976859B (en) Negative lithographic printing plate precursor and negative lithographic printing plate
CN109263338B (en) On-press development treatment-free thermosensitive plate and preparation method thereof
JPH106468A (en) Improved original plate for thermosensitive direct lithography
CN111103759A (en) Low-chemical-treatment thermosensitive plate and preparation method thereof
JP2011213113A (en) Original plate for lithographic printing plate and method for plate making
JPH1165098A (en) Manufacture of photosensitive planographic plate
CN116554392A (en) Water-soluble heat-crosslinking multipolymer, negative-working lithographic plate precursor and preparation method
JP5627517B2 (en) Photosensitive planographic printing plate
CN114685698A (en) Iodonium borate initiator, negative planographic printing plate precursor and preparation method of negative planographic printing plate
WO2018230413A1 (en) Lithography original plate, platemaking method for lithography plate, organic polymer particles, and photosensitive resin composition

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant