CN104710616B - It is a kind of to can be used for the polyimide compositions of laser direct forming - Google Patents
It is a kind of to can be used for the polyimide compositions of laser direct forming Download PDFInfo
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Abstract
The present invention relates to flexible PCB manufacture technology field, specifically, be related to it is a kind of can be used for the polyimide compositions of laser direct forming, it is generated by following methods：Materials include（Weight portion）：40 60 parts of dibasic acid anhydride, 30 50 parts of diamine, 1 20 parts of light activating agent, 10 50 parts of solvent, 0.1 0.5 parts of primary antioxidant, 0.1 0.5 parts of auxiliary antioxidant, 0.1 0.5 parts of lubricant, 15 parts of filler.First dibasic acid anhydride, diamine are poured into be stirred to diamine in solvent and be completely dissolved, light activating agent, primary antioxidant, auxiliary anti-oxidant, lubricant, filler are added in stirring in solvent, until obtaining the solution containing light activating agent polyamic acid, solution is poured over curtain coating on carrier and obtains casting films, heating imidizate is carried out to casting films, then natural cooling is obtained.
Description
Technical field
The present invention relates to flexible PCB manufacture technology field, specifically, it is related to one kind to can be used for laser direct forming
Polyimide compositions.
Background technology
Polyimide circuits plate is suitable for electronic information integrated circuit material, and it is sub- to manufacture flexible polyamides in traditional additive process
It is related to film forming in amine wiring board, etches.With the development of microelectronics industry, it is desired to there is new technology to occur meeting electronic circuit
Making develop to directions such as low stain, simplification, granulars laser technology be incorporated into chemical plating process, not only can be with
Reduce operation and can be carried out patterned metal deposition without mask technique, its figure can be with real time computer control simultaneously
It is capable of achieving granular, laser induction chemical plating technology (LASER DIRECT STRUCTRING）On Kapton surface
Then deposition light activating agent carries out chemical plating so as to the patterned copper plating in deposition on polyimide surface as activation kind
Layer.And in conventional machining process, Kapton composition is not suitable for laser induction chemical plating technology, it is therefore desirable to develop energy
It is suitable for the composition of most up-to-date techniques requirement polyimides flexible wiring board, without the etching work high of contaminative in traditional handicraft
Skill.
The content of the invention
Polyimides component it is an object of the invention to solve in conventional process cannot meet the requirement of new technology；There is provided
A kind of to can be used for the polyimide compositions of laser direct forming, the polyimide compositions can reduce operation in conventional process,
Reduce the contamination hazard to environment.
The technical scheme for using to achieve the above object for：
It is a kind of to can be used for the polyimide compositions of laser direct forming, generated by following methods：Materials include（Weight
Part）：
Dibasic acid anhydride 40-60 parts
Diamine 30-50 parts
Light activating agent 1-20 parts
Solvent 10-50 parts
Primary antioxidant 0.1-0.5 parts
Auxiliary antioxidant 0.1-0.5 parts
Lubricant 0.1-0.5 parts
Filler 1-5 parts.
Wherein, first dibasic acid anhydride, diamine are poured into be stirred to diamine in solvent and is completely dissolved, add photoactivation
Agent, primary antioxidant, auxiliary anti-oxidant, lubricant, filler are molten containing light activating agent polyamic acid until obtaining in being stirred in solvent
Liquid, is poured over solution curtain coating on carrier and obtains casting films, and carrying out heating to casting films makes its imidizate, then natural cooling
Obtain.
Wherein, dibasic acid anhydride is：Pyromellitic dianhydride (PMDA), 3,3 ', 4,4 '-BPDA (BPDA), 3,3 ',
4,4 '-benzophenone tetracarboxylic dianhydride (BTDA), 3,3 ', 4,4 '-oxydiphthalic (ODPA) and Bisphenol A Type Diether Dianhydride
One or more mixtures in BPADA.
Preferably, dibasic acid anhydride is 3,3 ', 4,4 '-BPDA (BPDA) or pyromellitic dianhydride (PMDA) and its
Mixture.
Preferably, the content of described dibasic acid anhydride（Weight portion）For：40-60 parts, preferably composition by weight is：42-55
Part, it is more preferably 42-50 parts.
Preferably, diamine is：4,4 '-diaminodiphenyl ether（ODA）, 4,4 ' one DADPSs（DDS）, to benzene two
Amine (PDA), m-phenylene diamine (MPD) (m PDA), 4,4 '-MDA DDM, hexamethylene diamine (HMD) and two amidos
Diphenyl ether（DDE）In one or more mixing.
Preferably, the weight of the content component of described diamine is 30-50 parts, preferably 32-48 parts, more preferably
Be 35-45 parts.
Light activating agent of the present invention is a kind of compound of the miscellaneous pink salts of Erbium-doped containing metal, and its chemical formula structure is as follows
XaOcYbOdSnO2, X in above formula, Y are respectively IB in the periodic table of elements, a certain element in IIIA, IVA, VA race, preferably
Metallic element in IB, IIA, IVA；Preferably nickel, copper, silicon, aluminium, antimony etc., preferred elements are nickel, aluminium, silicon.It is further preferably：X
It is nickel, Y is aluminium.
A in above formula, b, c, d are positive integer（Such as：1,2,3,4）；Wherein the ratio between a/c is equal to 1：2 or 1:1 or 2:
3；The ratio between b/d is equal to 3：2 or 1:1；Or 2:3.
Preferably, the consumption of light activating agent（Weight）It is 1-20 parts, preferably 3-15 parts, more preferably 5-10 parts.
Solvent of the present invention is 1-METHYLPYRROLIDONE（NMP）, N,N-dimethylformamide（DMF）, dimethyl it is sub-
Sulfone（DMSO）, DMAC N,N' dimethyl acetamide（DMAc）, chloroform, acetone, a kind of or several solvent mixture in toluene etc., it is excellent
The solvent of choosing is 1-METHYLPYRROLIDONE（NMP）；N,N-dimethylformamide（DMF）, DMAC N,N' dimethyl acetamide（DMAc）In
One or several mixtures.More preferably 1-METHYLPYRROLIDONE（NMP）；N,N-dimethylformamide（DMF）；Described
Weight of solvent is 10-50 parts, preferably 20-40 parts than part.
Primary antioxidant of the present invention is Hinered phenols antioxidant, is that some have the phenolic compound of steric restriction,
Their thermal oxidation resistance effect is significant.The various types of this kind antioxidant, main product has：2,6- di-t-butyls are to methylbenzene
Double [the β-(3- tertiary butyl-4-hydroxy -5- aminomethyl phenyls) propionic ester of phenol (BHT), triethylene-glycol（245）, four (β-(3,5- tri-
Level butyl -4- hydroxy phenyls) propionic acid) pentaerythritol ester（1010）, β-（3,5- di-tert-butyl-hydroxy phenyls）Propionic acid positive ten
Eight carbon alcohol esters（1076）Middle one of which or several mixtures；Preferably four (β-(3,5- three-level butyl -4- hydroxy benzenes
Base) propionic acid) pentaerythritol ester（1010）, the β-positive octadecanol ester of (3,5- di-tert-butyl-hydroxy phenyl) propionic acid（1076）；
More preferred but four (β-(3,5- three-level butyl -4- hydroxy phenyls) propionic acid) pentaerythritol esters（1010）；Primary antioxidant
Weight is 0.1-0.5 parts, preferably 0.2-0.3 parts.
Auxiliary anti-oxidant of the present invention is：Thio-2 acid dibasic acid esters, double Lauryl Alcohol esters, double ten four carbon alcohols esters or double ten
Eight carbon alcohol esters.Phosphite ester is also auxiliary antioxidant, and major product has：Three monooctyl esters, three last of the ten Heavenly stems esters, three（Lauryl Alcohol）Ester and three
(16 carbon alcohol) ester it is relatively common have three [2.4- di-tert-butyl-phenyls] phosphite esters（168）, double (2,4- di-tert-butyls
Base) propionic acid pentaerythritol diphosphites, four (2,4- di-tert-butylphenol) -4,4'- xenyl diphosphites（PEPQ）In
One or several mixtures.The weight of auxiliary anti-oxidant is 0.1-0.5 parts, preferably 0.1-0.3 parts.
Lubricant of the present invention is：The bimonthly osmanthus of N, N- ethylene bis stearamide, calcium stearate, zinc stearate, ethylene
One or several mixture in the double oleamides of acid amides, oleamide, ethylene or pentaerythritol stearate.It is preferred that
Lubricant is N, N- ethylene bis stearamides or pentaerythritol stearate, more preferably pentaerythritol stearate.This
The consumption of invention lubricant is 0.1-0.5 parts, preferably 0.2-0.3 parts.
Filler of the present invention is：Calcium carbonate, diatomite, montmorillonite, clay, mica powder, talcum powder, titanium dioxide, glass
Glass powder etc. one or more；Preferred filler is montmorillonite or titanium dioxide, more preferably titanium dioxide；The use of described filler
Amount is 1-5 parts, preferably 1-4 parts, more preferably 2-3 parts.
The beneficial effects of the invention are as follows：The polyimide compositions of present invention generation, form in the circuit board, can pass through
Induced with laser carries out chemical plating, and upper patterned copper coating is deposited on polyimide surface, high without contaminative in traditional handicraft
Etch process.
The etch process of transmission is：Substrate is placed in etching solution and is etched, dry film is protected according to the place for having etch-resistance, epiphragma
Beneath copper has been protected, and the copper for being exposed at appearance is etched, material is thus formed the figure with dry film and with copper.This process is very
Not environmentally.
Specific embodiment
Further describe with reference to embodiments.
Embodiment one
In having an electric mixer to device on 2000mL three-necked bottles, 200.24 grams of ODA are added（1mol）, 218.12 grams of PMDA
（1mol）And 300mLNMP is stirred at room temperature to diamine after being completely dissolved, 50 grams of Sanlaser PI900Y of light activating agent are added
（The miscellaneous pink salt compounds of sieve and silica-sesquioxide Erbium-doped, three combination work Products）, 2 grams of primary antioxidants 1010（It is commercially available）, 1 gram of auxiliary anti-oxidant
168（It is commercially available）, 3 grams of lubricant pentaerythritol stearates（It is commercially available）With 20 grams of titanium dioxides（It is commercially available）Reaction is stirred at room temperature
24h must contain the nmp solution of light activating agent polyamic acid.Polyamic acid solution is poured over smooth, clean carrier（Dry glass
Piece）Casting films are gone up to obtain, 180 DEG C, 3h are heated in heating furnace, carry out imidizate, naturally cooled to room temperature and obtain to obtain hot imines
The polyimide film of change.
Embodiment two
Device has electric mixer on 2000mL three-necked bottles.Add 200.24 grams of ODA（1mol）, 294.22 grams of BPDA
（1mol）And 300mLNMP is stirred at room temperature to diamines after being completely dissolved, 80 grams of Sanlaser PI900Y of light activating agent are added（Silicon
The miscellaneous pink salt compounds of aluminum oxide Erbium-doped, three combination work Products）, 2 grams of antioxidant 1010s（It is commercially available）, 1 gram of auxiliary anti-oxidant 168
（It is commercially available）, 3 grams of lubricant pentaerythritol stearates（It is commercially available）With 20 grams of titanium dioxides（It is commercially available）Reaction 24h is stirred at room temperature to obtain
Nmp solution containing light activating agent polyamic acid.Polyamic acid solution is poured over smooth, clean carrier（Dry glass piece）On
Casting films are obtained, 250 DEG C, 3h are heated in heating furnace, carry out imidizate, naturally cool to the polyamides Asia that room temperature obtains hot imidization
Amine film.
Comparative example three
During device has electric mixer on the 2000mL three-necked bottles, 198.3 grams of DDM are added（1mol）, 218.12 grams of PMDA
（1mol）And 280mLNMP is stirred at room temperature to diamines after being completely dissolved, 65 grams of Sanlaser PI900Y of light activating agent are added（Silicon
The miscellaneous pink salt compounds of aluminum oxide Erbium-doped, three combination work Products）, 2 grams of antioxidant 1010s（It is commercially available）, 1 gram of auxiliary anti-oxidant 168
（It is commercially available）, 3 grams of lubricant pentaerythritol stearates（It is commercially available）With 30 grams of titanium dioxides（It is commercially available）Reaction 24h is stirred at room temperature to obtain
Nmp solution containing light activating agent polyamic acid.Polyamic acid solution is poured over smooth, clean carrier（Dry glass piece）On
Casting films are obtained, 260 DEG C, 3h are heated in heating furnace, carry out imidizate, naturally cool to the polyamides Asia that room temperature obtains hot imidization
Amine film.
Example IV
During device has electric mixer on the 2000mL three-necked bottles, 198.3 grams of DDM are added（1mol）, 294.22 grams of BPDA
（1mol）And 300mLDMF is stirred at room temperature to diamines after being completely dissolved, 80 grams of Sanlaser PI900Y of light activating agent are added（Sial
The miscellaneous pink salt compounds of oxide Erbium-doped, three combination work Products）, 2 grams of antioxidant 1010s（It is commercially available）, 1 gram of auxiliary anti-oxidant 168（City
Sell）, 3 grams of lubricant pentaerythritol stearates（It is commercially available）With 30 grams of titanium dioxides（It is commercially available）Reaction 24h is stirred at room temperature must be contained
The nmp solution of light activating agent polyamic acid.Polyamic acid solution is poured over smooth, clean carrier（Dry glass piece）Upper
Casting films, heat 280 DEG C, 3h in heating furnace, carry out imidizate, naturally cool to the polyimides that room temperature obtains hot imidization
Film.
Comparative example five
During device has electric mixer on the 2000mL three-necked bottles, 200.24 grams of ODA are added（1mol）, 147.11 grams of BPDA
（0.5mol）With 109.06 grams of PMDA（0.5mol）And 300mLDMF is stirred at room temperature to diamines after being completely dissolved and is separately added into light work
80 grams of Sanlaser PI900Y of agent（The miscellaneous pink salt compounds of sieve and silica-sesquioxide Erbium-doped, three combination work Products）, 2 grams of antioxidant
1010（It is commercially available）, 1 gram of auxiliary anti-oxidant 168（It is commercially available）, 3 grams of lubricant pentaerythritol stearates（It is commercially available）With 30 grams of titanium dioxides
（It is commercially available）Reaction 24h is stirred at room temperature must contain the nmp solution of light activating agent polyamic acid.Polyamic acid solution is poured over light
Casting films are obtained on sliding, clean dry glass piece, 280 DEG C, 3h are heated in heating furnace, carry out imidizate, naturally cooled to
Room temperature obtains the polyimide film of hot imidization.
Comparative example six
During device has electric mixer on the 2000mL three-necked bottles, 200.24 grams of ODA are added（1mol）, 294.22 grams of BPDA
（1mol）And 300mLDMF is stirred at room temperature to diamines after being completely dissolved and is separately added into 80 grams of Sanlaser PI940 of light activating agent（Copper
Salt compound, three combination work Products）, 2 grams of antioxidant 1010s（It is commercially available）, 1 gram of auxiliary anti-oxidant 168（It is commercially available）, 3 grams of lubricants
Pentaerythritol stearate（It is commercially available）With 30 grams of titanium dioxides（It is commercially available）Reaction 24h is stirred at room temperature must contain light activating agent polyamide
The nmp solution of acid.Polyamic acid solution is poured over casting films are obtained on smooth, clean dry glass piece, pressed in heating furnace
By 180 DEG C/3h, imidizate is carried out, naturally cool to the polyimide film that room temperature obtains hot imidization.
To the above embodiments, in polyimides, whether easy and film forming is carried out below table with plating complexity is changed
Compare：
| Embodiment | Film forming | Change plating property |
| Implement one | Easily | Easily |
| Implement two | Easily | Easily |
| Contrast implements three | Difference | Slightly |
| Implement four | Easily | Easily |
| Contrast implements five | Easily | It is medium |
| Comparative example six | Easily | Slightly |
.Suitable acid anhydrides and the appropriate light activating agent consumption of diamines material are selected in embodiments of the invention, in film forming
It is more obvious than effect in comparative example in plating property with changing！
Embodiment seven：
With weight part ratio to adding materials in agitator, wherein, 40 parts of dibasic acid anhydride, 30 parts of diamine, 50 parts of solvent,
It is stirred at room temperature to diamine after being completely dissolved, adds 1 part of Sanlaser PI900Y of light activating agent（The miscellaneous pink salts of sieve and silica-sesquioxide Erbium-doped
Compound, three combination work Products）, 0.5 part of primary antioxidant 1010（It is commercially available）, 0.5 part of auxiliary anti-oxidant 168（It is commercially available）, 0.1 part
Lubricant pentaerythritol stearate（It is commercially available）With 1 part of titanium dioxide（It is commercially available）Reaction is stirred at room temperature, until photoactivation must be contained
The nmp solution of agent polyamic acid.Polyamic acid solution is poured over smooth, clean carrier（Dry glass piece）On must be cast
Film, heats in heating furnace（Preferred parameter is 180 DEG C, 3h）Until carrying out imidizate, room temperature acquisition is then naturally cooled to
Obtain the polyimide film of hot imidization.
Embodiment eight：
With weight part ratio to adding materials in agitator, wherein, 60 parts of dibasic acid anhydride, 30 parts of diamine, 10 parts of solvent,
It is stirred at room temperature to diamine after being completely dissolved, adds 20 parts of Sanlaser PI900Y of light activating agent（The miscellaneous pink salts of sieve and silica-sesquioxide Erbium-doped
Compound, three combination work Products）, 0.1 part of primary antioxidant 1010（It is commercially available）, 0.1 part of auxiliary anti-oxidant 168（It is commercially available）, 0.5 part
Lubricant pentaerythritol stearate（It is commercially available）With 5 parts of titanium dioxides（It is commercially available）Reaction is stirred at room temperature, until photoactivation must be contained
The nmp solution of agent polyamic acid.Polyamic acid solution is poured over smooth, clean carrier（Dry glass piece）On must be cast
Film, heats in heating furnace（Preferred parameter is 160 DEG C, 5h）Until carrying out imidizate, room temperature acquisition is then naturally cooled to
Obtain the polyimide film of hot imidization.
Embodiment nine：
With weight part ratio to adding materials in agitator, wherein, 50 parts of dibasic acid anhydride, 45 parts of diamine, 30 parts of solvent,
It is stirred at room temperature to diamine after being completely dissolved, adds 10 parts of Sanlaser PI900Y of light activating agent（The miscellaneous pink salts of sieve and silica-sesquioxide Erbium-doped
Compound, three combination work Products）, 0.3 part of primary antioxidant 1010（It is commercially available）, 0.2 part of auxiliary anti-oxidant 168（It is commercially available）, 0.3 part
Lubricant pentaerythritol stearate（It is commercially available）With 3 parts of titanium dioxides（It is commercially available）Reaction is stirred at room temperature, until photoactivation must be contained
The nmp solution of agent polyamic acid.Polyamic acid solution is poured over smooth, clean carrier（Dry glass piece）On must be cast
Film, heats in heating furnace（Preferred parameter is 170 DEG C, 5h）Until carrying out imidizate, room temperature acquisition is then naturally cooled to
Obtain the polyimide film of hot imidization.
Embodiment ten：
With weight part ratio to adding materials in agitator, wherein, 58 parts of dibasic acid anhydride, 35 parts of diamine, 45 parts of solvent,
It is stirred at room temperature to diamine after being completely dissolved, adds 18 parts of Sanlaser PI900Y of light activating agent（The miscellaneous pink salts of sieve and silica-sesquioxide Erbium-doped
Compound, three combination work Products）, 0.2 part of primary antioxidant 1010（It is commercially available）, 0.4 part of auxiliary anti-oxidant 168（It is commercially available）, 0.45
Part lubricant pentaerythritol stearate（It is commercially available）With 2 parts of titanium dioxides（It is commercially available）Reaction is stirred at room temperature, is lived until light must be contained
The nmp solution of agent polyamic acid.Polyamic acid solution is poured over smooth, clean carrier（Dry glass piece）On must be cast
Film, heats in heating furnace（Preferred parameter is 190 DEG C, 3h）Until carrying out imidizate, room temperature acquisition is then naturally cooled to
Obtain the polyimide film of hot imidization.
Embodiment 11：
With weight part ratio to adding materials in agitator, wherein, 42 parts of dibasic acid anhydride, 48 parts of diamine, 15 parts of solvent,
It is stirred at room temperature to diamine after being completely dissolved, adds 12 parts of Sanlaser PI900Y of light activating agent（The miscellaneous pink salts of sieve and silica-sesquioxide Erbium-doped
Compound, three combination work Products）, 0.15 part of primary antioxidant 1010（It is commercially available）, 0.35 part of auxiliary anti-oxidant 168（It is commercially available）,
0.25 part of lubricant pentaerythritol stearate（It is commercially available）With 4 parts of titanium dioxides（It is commercially available）Reaction is stirred at room temperature, until that must contain
The nmp solution of light activating agent polyamic acid.Polyamic acid solution is poured over smooth, clean carrier（Dry glass piece）Upper
Casting films, heat in heating furnace（Preferred parameter is 190 DEG C, 3h）Until carrying out imidizate, room temperature is then naturally cooled to
Obtain hot imidization polyimide film.
Wherein, in embodiment seven to embodiment 11：Dibasic acid anhydride is：Pyromellitic dianhydride (PMDA), 3,3 ', 4,
4 '-BPDA (BPDA), 3,3 ', 4,4 '-benzophenone tetracarboxylic dianhydride (BTDA), 3,3 ', 4,4 '-oxydiphthalic
(ODPA) one or more mixtures and in Bisphenol A Type Diether Dianhydride BPADA.
Diamine is：4,4 '-diaminodiphenyl ether（ODA）, 4,4 ' one DADPSs（DDS）, p-phenylenediamine
(PDA), m-phenylene diamine (MPD) (m PDA), 4,4 '-MDA DDM, hexamethylene diamine (HMD) and two amidos two
Phenylate（DDE）In one or more mixing.
Solvent is 1-METHYLPYRROLIDONE（NMP）, N,N-dimethylformamide（DMF）, dimethyl sulfoxide (DMSO)（DMSO）、N,N-
Dimethylacetylamide（DMAc）, chloroform, acetone, a kind of or several solvent mixture in toluene etc., preferred solvent is N-
Methyl pyrrolidone（NMP）；N,N-dimethylformamide（DMF）, DMAC N,N' dimethyl acetamide（DMAc）In one or several
Mixture.
Claims (11)
- It is 1. a kind of to can be used for the polyimide compositions of laser direct forming, it is characterised in that：Generated by following methods：Materials bag Include（Weight portion）：Dibasic acid anhydride 40-60 parts diamine 30-50 parts light activating agent 1-20 parts solvent 10-50 parts of primary antioxidant 0.1-0.5 parts auxiliary antioxidant 0.1-0.5 parts lubricant 0.1-0.5 parts filler 1-5 parts；Wherein, first by dibasic acid anhydride, two First amine pours into stirring in solvent and is completely dissolved to diamine, adds light activating agent, primary antioxidant, auxiliary anti-oxidant, lubricant, fills out Expect, in being stirred in solvent, until obtaining the solution containing light activating agent polyamic acid, solution to be poured on carrier and is flowed Prolong film, carrying out heating to casting films makes its imidizate, then natural cooling, wherein, light activating agent adulterates for sieve and silica-sesquioxide Pink salt compound.
- It is 2. according to claim 1 a kind of to can be used for the polyimide compositions of laser direct forming, it is characterised in that：Two First acid anhydrides is：Pyromellitic dianhydride (PMDA), 3,3 ', 4,4 '-BPDA (BPDA), 3,3 ', 4,4 '-benzophenone tetracid One or more in dianhydride (BTDA), 3,3 ', 4,4 '-oxydiphthalic (ODPA) and Bisphenol A Type Diether Dianhydride BPADA Mixture.
- It is 3. according to claim 2 a kind of to can be used for the polyimide compositions of laser direct forming, it is characterised in that：Two First acid anhydrides is 3,3 ', 4,4 '-BPDA (BPDA) or pyromellitic dianhydride (PMDA) and its mixture.
- It is 4. according to claim 1 a kind of to can be used for the polyimide compositions of laser direct forming, it is characterised in that：Two First amine is：4,4 '-DADPS（DDS）, p-phenylenediamine (PDA), m-phenylene diamine (MPD) (m PDA), 4,4 '-diaminourea hexichol Methane DDM, hexamethylene diamine (HMD) and diaminodiphenyl ether（DDE）In one or more mixtures.
- It is 5. according to claim 1 a kind of to can be used for the polyimide compositions of laser direct forming, it is characterised in that：Institute The solvent stated is 1-METHYLPYRROLIDONE（NMP）, N,N-dimethylformamide（DMF）, dimethyl sulfoxide (DMSO)（DMSO）, N, N- diformazans Yl acetamide（DMAc）, chloroform, acetone, a kind of or several solvent mixture in toluene.
- It is 6. according to claim 5 a kind of to can be used for the polyimide compositions of laser direct forming, it is characterised in that：It is molten Agent is 1-METHYLPYRROLIDONE（NMP）；N,N-dimethylformamide（DMF）, DMAC N,N' dimethyl acetamide（DMAc）It is middle a kind of or Several mixtures of person.
- It is 7. according to claim 1 a kind of to can be used for the polyimide compositions of laser direct forming, it is characterised in that：Institute The primary antioxidant stated is Hinered phenols antioxidant, and the Hinered phenols antioxidant is the phenolic compound with steric restriction.
- 8. a kind of according to claim 1 or 7 can be used for the polyimide compositions of laser direct forming, and its feature exists In：Primary antioxidant is：2,6- di-tert-butyl methyl phenols (BHT), triethylene-glycol it is double [β-(3- tertiary butyl-4-hydroxies- 5- aminomethyl phenyls) propionic ester（245）, four (β-(3,5- di-tert-butyl-hydroxy phenyl) propionic acid) pentaerythritol esters（1010）, β- （3,5- di-tert-butyl-hydroxy phenyls）The positive octadecanol ester of propionic acid（1076）Middle one of which or several mixtures.
- It is 9. according to claim 1 a kind of to can be used for the polyimide compositions of laser direct forming, it is characterised in that：Institute The auxiliary anti-oxidant stated is：Thio-2 acid dibasic acid esters, double Lauryl Alcohol esters, double ten four carbon alcohols esters or double octadecanol esters；Auxiliary antioxygen Agent also includes phosphite ester, has specifically included：Three monooctyl esters, three last of the ten Heavenly stems esters, three（Lauryl Alcohol）Ester and three (16 carbon alcohol) esters.
- It is 10. according to claim 9 a kind of to can be used for the polyimide compositions of laser direct forming, it is characterised in that： Auxiliary anti-oxidant includes：Three（2,4- di-tert-butyl-phenyls）Phosphite ester（168）, double (2,4- di-tert-butyl-phenyl) propionic acid] and season penta Tetrol diphosphites, four (2,4- di-tert-butylphenol) -4,4'- xenyl diphosphites（PEPQ）In one or several Mixture.
- 11. according to claim 1 a kind of can be used for the polyimide compositions of laser direct forming, it is characterised in that： Described lubricant is：The double lauramides of N, N- ethylene bis stearamide, calcium stearate, zinc stearate, ethylene, oleamide, One or several mixture in the double oleamides of ethylene or pentaerythritol stearate；Filler is：Calcium carbonate, diatom Soil, clay, mica powder, talcum powder, titanium dioxide, one or more in glass dust.
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| CN110041871A (en) * | 2019-04-11 | 2019-07-23 | 上海东大化学有限公司 | A kind of silane modified polyether seal glue and preparation method thereof |
| CN110922754A (en) * | 2019-11-08 | 2020-03-27 | 南京湘珀新材料科技有限公司 | Preparation method and application of polyimide film |
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| US4526807A (en) * | 1984-04-27 | 1985-07-02 | General Electric Company | Method for deposition of elemental metals and metalloids on substrates |
| KR101840416B1 (en) * | 2011-12-06 | 2018-03-20 | 주식회사 동진쎄미켐 | Polyimide photosensitive composition for lazer induced thermal imaging |
| CN103450675A (en) * | 2012-05-31 | 2013-12-18 | 金发科技股份有限公司 | Resin composition having laser direct-structuring function and its preparation method and use |
| CN104387738B (en) * | 2014-11-19 | 2016-08-17 | 东莞市三条化成实业有限公司 | A kind of preparation method of the laser powder of white laser straight forming material |
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