CN104702262B

CN104702262B - Avoid sensing erroneous judgement structure and input unit

Info

Publication number: CN104702262B
Application number: CN201510086550.4A
Authority: CN
Inventors: 陈湘凤; 吴健民; 赵张凯; 陈飞雅; 王治安; 高黄晓
Original assignee: Darfon Electronics Suzhou Co Ltd; Darfon Electronics Corp
Current assignee: Darfon Electronics Suzhou Co Ltd; Darfon Electronics Corp
Priority date: 2015-02-17
Filing date: 2015-02-17
Publication date: 2017-12-15
Anticipated expiration: 2035-02-17
Also published as: CN104702262A

Abstract

The present invention provides a kind of input unit and its avoids sensing erroneous judgement structure.Avoid sensing erroneous judgement structure and include circuit supporting structure sheaf and inductive layer, wherein circuit supporting structure sheaf has a plurality of circuits supporting construction, and plurality of circuits supporting construction is respectively supporting piezo-activator.Inductive layer is arranged at below circuit supporting structure sheaf, and corresponds to plurality of circuits supporting construction respectively comprising a plurality of sensing units, a plurality of sensing units.Circuit supporting structure sheaf and inductive layer at least one there are a plurality of cutting grooves, a plurality of cutting grooves are with individualized plurality of circuits supporting construction and/or individualized a plurality of sensing units so that the directly not corresponding connection of sensing unit adjacent in adjacent circuit supporting structure and/or a plurality of sensing units in plurality of circuits supporting construction.The avoidance sensing erroneous judgement structure design of the present invention can effectively reach the operational sensing separation of input unit and promote sensing correctness, while keep the integrality of input unit.

Description

Avoid sensing erroneous judgement structure and input unit

Technical field

The present invention avoids sensing erroneous judgement structure on one kind, and specifically, the present invention can avoid sensing from judging by accident on one kind The input unit and its avoidance sensing erroneous judgement structure of generation.

Background technology

Increasingly increase with the slimming requirement of electronic installation, applicable press-key structure highly significant reduces.Therefore, it is known The larger mechanical key structure of pressing stroke is gradually substituted by small Stroke Key or touching formula button.However, button chi Very little diminution also illustrates that the induction arrays of input unit also reduce accordingly so that the chance for sensing erroneous judgement is consequently increased.Practise Know keyboard and limited usually using additional physical arrangement the opereating specification of button, the volume for causing device overall can not effectively contract Subtract.

Furthermore the known slight keyboard with touch-controlled key generally allows the direct contact induction array of user, or only exist Thin film is set on induction arrays, lacks the structure for avoiding multiplex induction or false touch.That is, when modes such as use finger touches During triggering sensing block, easily occur to trigger the situation of multiple sensing blocks simultaneously；It is or noninductive in touch sensor array when being intended to When answering the space of block, false touch easily occurs and causes sensing to judge by accident.

Therefore, how effectively to reach in the case where not increasing device volume and avoid the main themes that sensing is mistaken for research and development One of.

The content of the invention

It is an object of the present invention to provide a kind of avoidance of input unit sensing erroneous judgement structure, it is by circuit supporting Structure sheaf and/or inductive layer form cutting groove to reach the separation in each sensing units sense while can keep on global shape Integrality.

The two of the object of the invention are the avoidance sensing erroneous judgement structure for providing a kind of input unit, and it is by cutting channel opening The design in face is not faced each other, to lift sensing unit in the separating effect in sensing.

In an embodiment, the avoidance sensing erroneous judgement structure of input unit of the invention, input unit has a plurality of piezoelectricity Actuator, comprising circuit supporting structure sheaf and inductive layer, wherein circuit supporting structure sheaf has plurality of circuits supporting construction, and The plurality of circuits supporting construction is respectively supporting a plurality of piezo-activators；Inductive layer is arranged at circuit supporting structure sheaf Lower section, and inductive layer includes a plurality of sensing units, a plurality of sensing units correspond to plurality of circuits supporting construction respectively.Circuit At least one has a plurality of cutting grooves for support structure layers and inductive layer, and a plurality of cutting grooves are with individualized a plurality of electricity Road supporting construction and/or individualized a plurality of sensing units so that adjacent circuit branch in the plurality of circuits supporting construction The directly not corresponding connection of adjacent sensing unit in support structure and/or a plurality of sensing units.

In an embodiment, a plurality of cutting grooves are formed at the circuit supporting structure sheaf, and a plurality of cutting grooves enclose respectively Around the plurality of circuits supporting construction so that the plurality of circuits supporting construction is connected with each other by an at least connecting portion respectively, And in the plurality of circuits supporting construction the adjacent circuit supporting structure an at least connecting portion stagger setting.

In an embodiment, a plurality of cutting grooves are into the inductive layer, and a plurality of cutting grooves to surround the plural number respectively Individual sensing unit so that a plurality of sensing units are connected with each other by an at least connecting portion respectively, and a plurality of sensings are single At least connecting portion stagger setting for the adjacent sensing unit in member.

In an embodiment, a plurality of cutting grooves are at least one annular cutting groove of opening, and the annular cutting groove of the opening is square Shape ring or circular rings.

In an embodiment, a plurality of cutting grooves are formed at the circuit supporting structure sheaf, a plurality of cutting groove difference positions Around the plurality of circuits supporting construction so that the adjacent circuit supporting structure in the plurality of circuits supporting construction At least a side is mutually not attached to.

In an embodiment, a plurality of cutting grooves are formed at the inductive layer, and a plurality of cutting grooves are located at the plural number respectively Around individual sensing unit so that an at least side for the adjacent sensing unit is mutually not attached in a plurality of sensing units.

In an embodiment, a plurality of cutting grooves are plural bar straight cuts groove, and wherein the plural bar straight cuts groove is extremely Rare one end does not connect mutually.

In another embodiment, the present invention provides a kind of input unit for having and avoiding sensing erroneous judgement structure, wherein input dress Put and include a plurality of piezo-activators, circuit supporting structure sheaf and inductive layer.A plurality of piezo-activators are used to receive pressing Power.Circuit supporting structure sheaf has a plurality of circuits supporting construction, and plurality of circuits supporting construction is a plurality of to support respectively Piezo-activator.Inductive layer is arranged at below circuit supporting structure sheaf, and inductive layer includes a plurality of sensing units with right respectively Answer plurality of circuits supporting construction.At least one has a plurality of cutting grooves for circuit supporting structure sheaf and inductive layer, plural number Individual cutting groove is with individualized plurality of circuits supporting construction and/or individualized a plurality of sensing units so that the plurality of circuits Sensing unit adjacent in adjacent circuit supporting structure and/or a plurality of sensing units is not directly corresponding in supporting construction connects Connect.When one of a plurality of piezo-activators receive pressing force, the pressing force is transmitted to the corresponding plurality of circuits branch For one of support structure to trigger one of corresponding a plurality of sensing units, a plurality of cutting grooves avoid the pressing Power is delivered to sensing unit corresponding to the piezo-activator not being pressed.

In an embodiment, a plurality of cutting grooves are formed at circuit supporting structure sheaf, and a plurality of cutting grooves are respectively around plural number Individual circuit supporting structure so that plurality of circuits supporting construction is respectively connected with each other by an at least connecting portion, and plurality of circuits An at least connecting portion stagger setting for adjacent circuit supporting structure in supporting construction.

In an embodiment, a plurality of cutting grooves are formed at inductive layer, and a plurality of cutting grooves are single around a plurality of sensings respectively Member so that a plurality of sensing units are respectively connected with each other by an at least connecting portion, and sensing adjacent in a plurality of sensing units An at least connecting portion stagger setting for unit.

In an embodiment, a plurality of cutting grooves are at least one annular cutting groove of opening, and open annular cutting groove is rectangle Ring or circular rings.

In an embodiment, a plurality of cutting grooves are formed at circuit supporting structure sheaf, and a plurality of cutting grooves point are respectively positioned at multiple Around several circuit supporting structures so that an at least side system for adjacent circuit supporting structure is mutual in a plurality of cutting grooves point It is not attached to.

In an embodiment, a plurality of cutting grooves are formed at inductive layer, and a plurality of cutting grooves are single positioned at a plurality of sensings respectively Around member so that an at least side for adjacent sensing unit is mutually not attached in a plurality of sensing units.

In an embodiment, a plurality of cutting grooves are plural bar straight cuts groove, wherein plural bar straight cuts groove is at least One end does not connect mutually.

Compared to known techniques, press-key structure of the invention and input unit reach the spy of slimming by stepped construction Property, while pressing feedback is provided as user's operation indicating by piezo-activator.Furthermore press-key structure of the invention and defeated Enter device by integrated circuit footpath in supporting construction and as the circuit supporting structure (layer) of modularity multiple-level stack, not only increase The manufacturability of circuit supporting structure (layer), more can be by being stacked with and effectively reach different power path layers between layers Electrically isolate, effectively prevent short-circuit generation.In addition, the input unit of the present invention is integrated into list by a plurality of piezo-activators One part piezo-activator combination, piezo-activator is stacked and placed on circuit supporting structure easily and reach electric connection and Purpose is supported, to simplify fabrication schedule and save cost.Furthermore avoidance sensing erroneous judgement structure design of the invention can effectively reach Sensing correctness is promoted in the operational sensing separation of input unit, while keeps the integrality of input unit.

Brief description of the drawings

Figure 1A and the press-key structure of one embodiment of the invention explosive view

Figure 1B is the profile of the press-key structure in Figure 1A of the present invention；

Fig. 1 C are the pressing illustrative view of Figure 1B press-key structure；

Fig. 1 D are the profile of the press-key structure of another embodiment of the present invention；

Fig. 2 is the explosive view of the circuit supporting structure in Figure 1A press-key structure；

Fig. 3 A are the explosive view of the circuit supporting structure of another embodiment of the present invention；

Fig. 3 B are the stereogram of the circuit supporting structure of another embodiment of the present invention；

The explosive view of the circuit supporting structure of Fig. 3 C further embodiment of this invention；

Fig. 3 D are the stereogram of the circuit supporting structure of further embodiment of this invention；

Fig. 4 A are the explosive view of the input unit of one embodiment of the invention；

Fig. 4 B to Fig. 4 E are the supporting layer of the circuit supporting structure sheaf in the input unit in Fig. 4 A of the present invention, first path The schematic diagram of layer, the second path layer and protective layer；

Fig. 4 F are the supporting layer of circuit supporting structure sheaf in the input unit in Fig. 4 A of the present invention, first path layer and the Top view after the superposition of two path layers；

Fig. 4 G are the supporting layer of circuit supporting structure sheaf in the input unit in Fig. 4 A of the present invention, first path layer, the Top view after two path layers and protective layer superposition；

Fig. 5 A to Fig. 5 E are the supporting layer of the circuit supporting structure sheaf in the input unit of another embodiment of the present invention, first Path first layer, first path second layer, the schematic diagram of the second path layer and protective layer；

Fig. 6 is the schematic diagram that the piezo-activator of one embodiment of the invention combines；

Fig. 7 A to Fig. 7 C are respectively supporting layer, the electricity of the circuit supporting structure sheaf in further embodiment of this invention input unit The schematic diagram of path layer and protective layer；

Fig. 7 D are the combination diagram of the circuit supporting structure sheaf shown in Fig. 7 A to Fig. 7 C of the present invention；

Fig. 8 A to Fig. 8 C are respectively the avoidance sensing erroneous judgement structure setting of the present invention in the embodiment schematic diagram of diverse location；

Fig. 9 A to Fig. 9 C are respectively that the input unit of one embodiment of the invention has different shape in circuit supporting structure sheaf Cutting groove schematic diagram；

Figure 10 A to Figure 10 C are respectively that the input unit of another embodiment of the present invention has of different shapes cut in inductive layer Cut the schematic diagram of groove.

Embodiment

The present invention provides a kind of input unit and its avoids sensing erroneous judgement structure.Specifically, input unit of the invention Can be any input unit with press-key structure, such as independent key board unit, the input unit (example for being integrated in electronic product Such as running gear, the button of tablet personal computer outfit or keyboard etc.), but be not limited.After by taking keyboard as an example, with reference to schema Describe the avoidance sensing erroneous judgement structure of the embodiment of the present invention and the details of input unit in detail.

As illustrated in figures 1A and ib, piezo-activator 110, circuit are included in an embodiment, press-key structure 100 of the invention Supporting construction 120, sensing unit 130 and control circuit 160 (see Figure 1B), wherein piezo-activator 110 are stacked and placed on circuit supporting In structure 120, sensing unit 130 is arranged at the lower section of circuit supporting structure 120, and control circuit 160 couple sensing unit 130 and Piezo-activator 110.Specifically, circuit supporting structure 120 to support piezo-activator 110 and provide driving it is piezoelectric actuated The power path of device 110 so that control circuit 160 can electrically connect piezo-activator 110 by circuit supporting structure 120.Sensing is single Member 130 is switching regulator sensing unit, when sensing unit 130 is pressed triggering, the exportable triggering signal T of sensing unit 130, is entered And control circuit 160 is produced (1) user and input character or the sensor signal of instruction, and (2) produce driving piezo-activator The driving signal D (as described later in detail) of 110 vibrations.Circuit supporting structure 120 have accommodation space 120a, the first contact portion 120b and Second contact portion 120c, wherein the first contact portion 120b electrically isolates with the second contact portion 120c.Piezo-activator 110 has quilt Drive division 114 and piezoelectric part 112, wherein piezoelectric part 112 are arranged in accommodation space 120a and power supply the first contact portion of connection 120b, driven part 114 are supported by circuit supporting structure 120, and the second contact portion 120c of connection that powers.Sensing unit 130 Exportable triggering signal T when being triggered, and control circuit 160 understands output driving signal D to piezoelectricity after triggering signal T is received Actuator 110, to drive piezo-activator 110 that vibrations (related description for being specified in Fig. 1 C) occur.

In addition, as illustrated in figures 1A and ib, press-key structure 100 can further include basalis 140, clad 150.Yu Yi Embodiment, basalis 140 is arranged at the lower section of sensing unit 130, to promote the overall construction intensity of press-key structure 100.In other words, Basalis 140 is preferably the larger material (such as sheet metal, rigid plastics or polymeric layer) of relative stiffness, to maintain button The intensity of structure 100 and be unlikely to bending damage.Basalis 140 can be according to the structural strength selectivity of circuit supporting structure 120 Set.In other words, when the structural strength of circuit supporting structure 120 is enough to support press-key structure 100 to be unlikely to bending damage, then Basalis 140 need not be set.In an embodiment, as shown in Figure 1B, clad 150 is covered on piezo-activator 110, wherein wrapping Coating 150 has character or pattern 150a (see Figure 1A) using the key cap layer as press-key structure 100.Character or pattern 150a can be by By printing, imprinting, the mode such as pasting and be formed at clad 150, but it is not limited.In another embodiment, as shown in figure iD, bag Coating 150 ' is designed such as piezo-activator 110, circuit supporting structure 120, sensing unit 130 and basalis 140 (or even Together with control circuit 160) it is coated on completely in clad 150 '.In other words, clad 150,150 ' can be used as button The key cap layer of structure 100, while can be used to other elements (such as piezo-activator, the circuit supporting of protection structure press-key structure Structure, sensing unit, basalis and control circuit).Clad 150,150 ' is preferably flexible material (such as silicagel pad), with Increase the comfort of user's pressing keys structure 100.In an embodiment (not shown), when clad 150 is only covered in piezoelectricity When key cap layer is used as on actuator 110, press-key structure 100 is alternative have by each element (such as 110,120,130,140, 150th, the housing 160) integrated so that each element is arranged in housing and exposes clad 150 and operated for user.In addition, Above-mentioned housing can also combine with basalis 140 so that the bottom of housing is as basalis.

Furthermore control circuit 160 can be arranged at any suitable position according to practical application request, such as also be coated on In clad 150 ', or it is arranged at outside clad 150.For example, control circuit 160 may be disposed on basalis 140, wrap Under coating 150,150 ' or control circuit 160 may be disposed in clad 150,150 ', but be not limited.Piezo-activator 110 can be fixed on circuit supporting structure 120 and/or clad 150,150 ' by adhesive means, or can by clad 150, 150 ' are located between clad 150,150 ' and circuit supporting structure 120, but are not limited.In this embodiment, piezoelectricity causes Dynamic device 110 is preferably partly fixed on circuit supporting structure 120 in accommodation space 120a side so that piezo-activator 110 Between holding element be oppositely arranged position in the case of, still possess considerable degree of cantilever spring.Furthermore press-key structure 100 Each element (such as clad 150, piezo-activator 110, circuit supporting structure 120, sensing unit 130, basalis 140 etc.) Between can also be fixed by adhesive means, to position the relative position of each interelement.In the rear thin portion structure that each element is described in detail and Interaction.

In an embodiment, as illustrated in figures 1A and ib, piezo-activator 110 is film-type piezo-activator, and it includes quilt Drive division 114 and piezoelectric part 112.Driven part 114 can be conductive film/sheet form, and piezoelectric part 112 is by piezoelectric shape Into and be arranged in driven part 114.In this embodiment, driven part 114 is preferably conductive metal layer, such as, but not limited to copper Piece.In other embodiment, driven part 114 can be conductive non-metals layer.In this embodiment, piezoelectric part 112 can be piezoelectric ceramics Material layer and it is arranged at the side of driven part 114 and forms unilateral piezo-activator, but is not limited.According to actual demand, in Other embodiment, piezoelectric part 112 may be disposed at the both sides of driven part 114 and form bilateral piezo-activator.As shown in Figure 1B, When piezo-activator 110 is stacked and placed in circuit supporting structure 120, peripheral part of driven part 114 is stacked and placed on circuit supporting In structure 120, and supported by circuit supporting structure 120 to electrically connect the second contact portion 120c, and under driven part 114 The piezoelectric part 112 of face center part is substantially vacantly arranged at circuit supporting structure 120 towards accommodation space 120a projections To electrically connect the first contact portion 120b in accommodation space 120a.

Circuit supporting structure 120 can be the circuit branch of the rectangle with accommodation space 120a, circle or any suitable shape Support structure.In this embodiment, accommodation space 120a can be the groove or opening for being formed at circuit supporting structure 120, and accommodating sky Between 120a shape, size preferably with accommodating piezoelectric part 112 be design consideration.First contact 120b and the second contact 120c difference To transmit two contacts electrically isolated on the power path of driving signal.In other words, the first contact 120b is electrical connection piezoelectric part The contact of 112 the first power path (such as piezoelectricity path), and the second contact 120c is the second electricity of electrical connection driven part 114 The contact in path (such as by driving path).In this embodiment, as shown in Figure 1A, circuit supporting structure 120 preferably has protrusion Portion 120d, wherein protuberance 120d form cantilever design from accommodation space 120a side towards accommodation space 120a centers protrusion, So that protuberance 120d can the up/down displacement in accommodation space 120a relative to the body of circuit supporting structure 120.First contact portion 120b is arranged on protuberance 120d and (is preferably located at protuberance 120d ends) so that the first contact portion 120b stretches into accommodation space 120a.Second contact portion 120c may be disposed in the circuit supporting structure 120 around accommodation space 120a.In this embodiment, quilt Drive division 114 is not supported by circuit supporting structure 120 by the part that piezoelectric part 112 covers and connect simultaneously to electrically connect second Point portion 120c, and piezoelectric part 112 faces accommodation space 120a down and electrically connects the first contact portion for stretching into accommodation space 120a 120b.By the available elastic displacement characteristics of cantilevered protuberance 120d, when piezo-activator 110 shakes, protuberance 120d and the first contact portion 120b set thereon can shake with piezo-activator 110 in accommodation space 120a, increase knot Structure elasticity.

As shown in Figure 1 C, when the external world applies pressing force F, pressing force F is through piezo-activator 110, circuit supporting structure 120 transmit downwards to trigger sensing unit 130 so that the output of sensing unit 130 triggering signal T to control circuit 160.Control electricity Road 160 receives triggering signal T and exportable driving signal D shakes to piezo-activator 110 and then driving piezo-activator 110 It is dynamic.That is, when user's pressing keys structure 100 (such as when pressing on clad 150,150 '), by circuit supporting knot The architectural characteristic of structure 120 is pressed down against triggering sensing unit 130 and sends triggering signal T, on the one hand triggering signal T presses as operation Bond structure 100 also drives signal D indicating signal to input the sensor signal of corresponding character or instruction as generation, So that control circuit 160 receives triggering signal T and sends driving signal D.When piezo-activator 110 is via circuit supporting structure 120 power path (such as the first power path in rear narration and second circuit footpath) receives the driving from control circuit 160 During signal D, piezo-activator 110 can produce vibrations in accommodation space 120a, and the vibrations for confirming pressing to provide user are returned Feedback.

In this embodiment, as shown in Fig. 2 circuit supporting structure 120 can be sandwich construction, it includes supporting layer 122, first The path layer 126 of path layer 124 and second, wherein supporting layer 122, the path layer 126 of first path layer 124 and second preferably with Adhesive means are fixed, to be integrated into modularity multi-layered circuits supporting construction.Specifically, supporting layer 122 has holding part 122a, space is supported and shakes to provide piezo-activator 110.Supporting layer 122 preferably has relatively large rigidity and had Default thickness, with limit piezo-activator 110 it is depressed when deformation limit so that piezo-activator 110 be unlikely to by Huge external force and excessive deformation damage.In other words, the deflection that piezo-activator 110 shakes relative to circuit supporting structure 120, Preferably controlled by the rigidity and thickness of supporting layer 122 or holding part 122a depth.Herein it may be noted that when supporting layer 122 When structural strength is enough to support the press-key structure do not bend damage because of pressing, supporting layer 122 can provide the work of basalis 140 simultaneously With and cause press-key structure basalis 140 need not be set.First path layer 124 is stacked and placed on supporting layer 122, and the second path Layer 126 is stacked and placed on first path layer 124, to provide the power path for electrically connecting piezo-activator 110.In this embodiment, circuit The power path of supporting construction 120 is designed as two layers of path layer, and wherein first path layer 124 has the first power path 124c, the Two path layers 126 have second circuit footpath 126b.First path layer 124 be insulating barrier on formed with the first power path 124c can Flexible thin film's path layer；Second path layer 126 is preferably the pliability film road formed with second circuit footpath 126b on insulating barrier Footpath layer.The power path of first power path 124c connections piezoelectric part 112, it includes the first contact portion 120b, and second circuit footpath The power path of 126b connections driven part 114, it includes the second contact portion 120c.

Specifically, the holding part 122a of supporting layer 122 can be the opening or groove for being formed at supporting layer 122.The first via Footpath layer 124 has the first opening 124a and tongue 124b, wherein the first opening 124a corresponds to the holding part 122a of supporting layer 122. Tongue 124b forms cantilever design from the first opening 124a side towards the first opening 124a center projections, and tongue 124b makees For above-mentioned protuberance 120d floor portions.First power path 124c extend to tongue 124b with formed the first contact portion 120b in Tongue 124b end.Correspondingly, the second path layer 126 has the second opening 126a, wherein the second opening 126a corresponding first Be open 124a and holding part 122a.Second opening 126a, the first opening 124a and holding part 122a are preferably size, shape essence It is identical, but be not limited.Second path layer 126 preferably has more extension 126c, and wherein extension 126c is open from second 126a side is towards the second opening 126a center projections, and an extension 126c maskings tongue 124b part is to expose first Contact portion 120b.That is, extension 126c development length is less than tongue 124b development length, and tongue is arranged to expose First contact portion 120b of 124b ends.In this embodiment, top sections of the extension 126c as above-mentioned protuberance 120d.

With reference to figure 1A and Fig. 2, when supporting layer 122, the path layer 126 of first path layer 124 and second are from bottom to top sequentially folded When putting, holding part 122a, the first opening 124a and the second opening 126a are mutually aligned connection to be collectively forming accommodation space 120a, And second path layer 126 when being stacked and placed on first path layer 124, the second preferably masking of path layer 126 removes the first contact portion 120b The first outer power path 124c, and the first contact portion 120b and the second contact portion 120c is exposed, to be electrically connected piezoelectricity cause The piezoelectric part 112 and driven part 114 of dynamic device 110.That is, supporting layer 122, the path layer 126 of first path layer 124 and second compared with It is good that there is substantially identical external form so that each layer main body is superimposed with each other, and drives the extension 126c overlappings of the second path layer 126 In the tongue 124b of first path layer 124.In this embodiment, first path layer is covered by the thin dielectric film of the second path layer The first power path, can effectively electrically isolate second circuit footpath and the first power path so that power path, which is distributed, is preferably matched somebody with somebody Put.

Herein it may be noted that circuit supporting structure is designed according to power path and the requirement of support strength can have different embodiment party Formula.As shown in Fig. 3 A and Fig. 3 B, in another embodiment, circuit supporting structure 120 ' is except above-mentioned supporting layer 122, first path layer 124th, the second path layer 126 ', separation layer 128 is further included, wherein separation layer 128 is arranged at the path of first path layer 124 and second To be electrically isolated the first power path 124c and second circuit footpath 126b between layer 126 '.In this embodiment, coordinate setting for separation layer 128 Put, the second path layer 126 ' there can be different forms, wherein the second path layer 126 ' has the second opening 126a ', and second The corresponding holding part 122a of the 126a ' that is open.Separation layer 128 has the 3rd opening 128a and shielding portion 128b, wherein the 3rd opening The corresponding first opening 124a of 128a, the second opening 126a ' and holding part 122a.Shielding portion 128b is arranged at the 3rd opening 128a's Side, to cover a tongue 124b part and expose the first contact portion 120b.In this embodiment, shielding portion 128b is as upper State protuberance 120d top section.When supporting layer 122, first path layer 124, the path layer 126 ' of separation layer 128 and second by When being sequentially stacked on down, holding part 122a, the first opening 124a, the 3rd opening 128a and the second opening 126a ' systems are mutually right Quasi- connection is to be collectively forming accommodation space 120a, when wherein separation layer 128 is stacked and placed on first path layer 124, shielding portion 128b It is superimposed on the first power path 124c of tongue 124b and the preferable essence masking of separation layer 128 in addition to the first contact portion 120b.In This embodiment, by the setting of separation layer 128, the first power path 124 and the electric isolution in second circuit footpath 126 are not only can reach, It more can further increase the structural strength of circuit supporting structure, in case piezo-activator excessive deformation damages.

At this it may be noted that in Fig. 3 A and Fig. 3 B embodiment, the selection of the second path layer 126 ' is not provided with above-mentioned extension Portion 126c, and make it that the second path layer 126 ' preferably exposes shielding portion to the second path layer 126 ' when being stacked and placed on separation layer 128 128b, the first contact portion 120b and the second contact portion 120c, to keep protuberance 120d elasticity.However, in other embodiment, Circuit supporting structure can be by the shielding portion 128b of extension 126c and Fig. 3 B of Fig. 2 the second path layer 126 separation layer 128 At least one, the first power path 124c for coming on shaded portions tongue 124b simultaneously exposes the first of tongue 124b ends Contact portion 120b.When carrying out shaded portions tongue 124b using extension 126c and shielding portion 128b simultaneously, shielding portion 128b is Protuberance 120d mid layer section, and extension 126c is protuberance 120d top section.

Furthermore, can be by above-mentioned the when circuit supporting structure is enough big or when power path is simpler as the area of power path One power path and second circuit footpath are integrated in same power path layer, to reduce the power path number of plies and then save cost.In another Embodiment, as shown in Fig. 3 C and Fig. 3 D, circuit supporting structure 120 " includes above-mentioned supporting layer 122 and power path layer 124 ', its Middle power path layer 124 ' is stacked and placed on supporting layer 122 to form accommodation space 120a, and power path layer 124 ' with holding part 122a There is the first power path 124c and second circuit footpath 126b simultaneously.Similarly, the first power path 124c includes the first contact portion 120b, and second circuit footpath 126b includes the second contact portion 120c.Specifically, power path layer 124 ' has the first opening 124a And tongue 124b, wherein the first opening 124a correspond to holding part 122a, and tongue 124b from first be open 124a side towards the One opening 124a center projections form cantilever design, and the first contact portion 120b is arranged at tongue 124b.In this embodiment, first Power path 124c extends to tongue 124b from the side of power path layer 124 ' and forms the first contact portion 120b in its end.Second Power path 126b is arranged at the opposite side (such as adjacent side) of power path layer 124 ', to reach the while the power path number of plies is simplified One power path 124c's and second circuit footpath 126b electrically isolates, and does not significantly affect piezo-activator 110 and circuit supporting knot Vibrations elasticity when structure 120 " electrically connects.

In addition, circuit supporting structure 120 " further includes protective layer 129, wherein protective layer 129 is arranged at power path layer 124 ' On to cover second circuit footpath exposed in addition to the first contact portion 120b and the second contact portion 120c

126b and the first power path 124c.In this embodiment, protective layer 129 is insulating barrier, and with the 4th opening 129a And shielding portion 129b, its split shed 129a correspond to the opening 124a of holding part 122a and first, shielding portion 129b is arranged at the 4th and opens Mouthful 129a side and from the lateral 4th opening 129b center extensions.When supporting layer 122, power path layer 124 ' and protective layer 129 from bottom to top sequentially be stacked when, holding part 122a, first opening 124a and the 4th opening 129a be mutually aligned connection with common Accommodation space 120a is formed, wherein shielding portion 129b is superimposed on tongue 124b, to cover a tongue 124b part and expose First contact portion 120b.Herein it may be noted that in this embodiment, the 4th opening 129a of protective layer 129 is more than power path layer 124 ' First opening 124a so that when protective layer 129 is stacked and placed on power path layer 124 ', can expose and be arranged at the first contact portion 120b Second contact portion 120c of sides adjacent, but be not limited.In other embodiment (not shown), protective layer removes corresponding holding part Outside 122a opening, can also have extra contact window, wherein contact window is arranged at corresponding second contact portion 120c position, with Expose the second contact portion 120c.In addition, according to circuit design demand, circuit supporting structure 120,120 ' also can further include Similar above-mentioned protective layer, to cover second circuit footpath exposed in addition to the first contact portion 120b and the second contact portion 120c 126b and the first power path 124c.

Furthermore as shown in Figure 4 A, in another embodiment, the present invention provides a kind of pressing comprising multiple previous embodiments and is bonded The input unit 1 of structure.Herein it may be noted that in this embodiment, input unit 1 is with the array ways of 3x 3 comprising 9 press-key structures Spread configuration illustrates, but in other embodiment, input unit can include more than one press-key structure and with any suitable Mode configure, not to be limited shown in embodiment.Furthermore in this embodiment, input unit 1 has circuit branch with Figure 1A and Figure 1B Illustrate exemplified by the press-key structure of support structure 120, but be not limited.That is, input unit of the invention can be by with circuit branch Multiple press-key structures of support structure 120,120 ' and/or 120 " are formed.Specifically, as shown in Figure 4 A, input unit 1 includes A plurality of (such as 9) piezo-activator 110, circuit supporting structure sheaf 12, inductive layer 13 and control circuits 16.Circuit supporting Structure sheaf 12 has plurality of circuits supporting construction 120, and inductive layer 13 includes a plurality of sensing units 130.In other words, when multiple When press-key structure is integrated into input unit 1 (such as keyboard), the element of each press-key structure, which can correspond to, is integrated into single part layer, example As plurality of circuits supporting construction 120 can be integrated in circuit supporting structure sheaf 12 so that each circuit supporting structure 120 can be considered electricity A circuit supporting unit, a plurality of sensing units 130 in road support structure layers 12 can be integrated in inductive layer 13, and can be by Single control circuit 16 controls multiple buttons, to simplify fabrication schedule and assembly program, but is not limited.

As shown in Figure 4 A, a plurality of piezo-activators 110 are correspondingly arranged in plurality of circuits supporting construction 120 respectively. Inductive layer 13 is arranged at the lower section of circuit supporting structure sheaf 12 so that a plurality of sensing units 130 correspond to plurality of circuits branch respectively Support structure 120, and each sensing unit 130 can be produced corresponding triggering signal by independent triggers.Control circuit 16 is coupled to multiple Several sensing units 130 and a plurality of piezo-activators 110.Specifically, control circuit 16 is supported by plurality of circuits and tied Structure 120 is electrically connected corresponding piezo-activator 110 so that control circuit 16 receive sensing unit 130 triggering signal and Exportable driving signal gives corresponding piezo-activator 110, and then piezo-activator 110 corresponding to driving shakes.In this Embodiment, a plurality of piezo-activators 110, plurality of circuits supporting construction 120 and a plurality of sensing units 130 are preferably one-to-one It is mutually corresponding to form similar to above-mentioned a plurality of press-key structures 100 and multiple by bond by the independent control of control circuit 16 Structure, but be not limited.For example, in other embodiment, according to size, quantity and the circuit complexity of button, an electricity Road supporting construction 120 can support more than one piezo-activator (referring to Fig. 5 A to Fig. 5 E embodiment), and can be by one Control circuit above controls multiple press-key structures.

Furthermore similar above-mentioned, input unit 1 can further include basalis 14 and clad 15, and wherein basalis 14 is arranged at The lower section of inductive layer 13, to promote the structural strength of input unit 1.Herein it may be noted that basalis 14 preferably has corresponding sensing The size (i.e. the size of input unit 1) of layer 13, and there is the property similar to above-mentioned basalis 140, repeated no more in this.Bag Coating 15 is covered on a plurality of piezo-activators 110, and there is clad 15 a plurality of characters or pattern 150a to set respectively In a plurality of keycap areas 152, wherein a plurality of keycap areas 152 correspond to plurality of circuits supporting construction 120 respectively so that clad 15 can be used as key cap layer.Herein it may be noted that clad 15 can have be similar to clad 150 or 150 " structure and property, example As clad 15 can be only covered on a plurality of piezo-activators, or it is designed as a plurality of piezo-activators 110, circuit branch Support structure layer 12, inductive layer 13 and basalis 14 (or even including control circuit 16) are coated in clad completely, in this Repeat no more.

Similar Fig. 2 embodiment, each circuit supporting structure 120 have accommodation space 120a, the first contact portion 120b and the Two point portion 120c, wherein the first contact portion 120b stretches into accommodation space 120a and electrically isolated with the second contact portion 120c.Change Yan Zhi, the first contact portion 120b and the second contact portion 120c are located at accommodation space 120a inner side and outside respectively so that first Contact portion 120b is in accommodation space 120a in the drop shadow spread on sensing unit 130, and the second contact portion 120c is in accommodating sky Between 120a in outside the drop shadow spread on sensing unit 130.Each piezo-activator 110 has driven part 114 and piezoelectric part 112, Wherein piezoelectric part 112 is arranged at driven part 114 with corresponding accommodation space 120a and the first contact portion 120b of connection that powers, and by Drive division 114, which is supported and powered by circuit supporting structure 120, connects the second contact portion 120c.When the external world applies pressing force to multiple Several press-key structures one of them when, pressing force passes through piezo-activator 110, circuit supporting structure 120 and transmit downwards with touch Sensing unit 130 is sent out, makes the output triggering signal of sensing unit 130, and then corresponding piezo-activator 110 is received control electricity Road 16 export driving signal and shake.Herein it may be noted that the piezo-activator 110 of each press-key structure, circuit supporting knot Structure 120, the CONSTRUCTED SPECIFICATION of sensing unit 130 and its between control circuit 16 refer to above-mentioned figure as flowing mode between each other 1A to Fig. 1 C related description, is repeated no more in this.Following embodiment is that the power path of circuit supporting structure sheaf is matched somebody with somebody emphatically Put and supporting construction details.

As shown in Fig. 4 A and Fig. 4 B to Fig. 4 G, circuit supporting structure sheaf 12 is sandwich construction, and it includes supporting layer 210, the One path layer 220 and the second path layer 230.As shown in Figure 4 B, supporting layer 210 has a plurality of (such as 9) holding parts 210a corresponds to a plurality of piezo-activators 110 respectively.A plurality of holding part 210a are the plurality of openings for being formed at supporting layer 220 Or groove.In an embodiment, a plurality of holding part 210a are preferably formed at opening substantially identical on supporting layer 220 or recessed Groove, but be not limited.In other embodiment, according to design requirement, a plurality of holding part 210a can be to be formed at supporting layer 220 Upper identical or different shape, the opening of size or groove (with reference to figure 5A).In this embodiment, the circuit of circuit supporting structure sheaf 12 Footpath is designed as two layers of path layer (such as the path layer 230 of first path layer 220 and second), and wherein first path layer 220 is stacked In on supporting layer 210, and the second path layer 230 is stacked and placed on first path layer 220.As shown in Figure 4 C, first path layer 220 has There is the first power path 222, and the first power path 222 includes a plurality of first contact portion 120b.As shown in Figure 4 D, the second path layer 230 have second circuit footpath 232, and second circuit footpath 232 includes a plurality of second contact portion 120c.First contact portion 120b and Second contact portion 120c respectively be located at holding part 210a inner side and outside so that the first contact portion 120b holding part 210a in In drop shadow spread on sensing unit 130, and the second contact portion 120c in holding part 210a in the projection model on sensing unit 130 Enclose outer.

Similar Fig. 2 embodiment, first path layer 220 have a plurality of first opening 220a and a plurality of tongues 226, its In it is a plurality of first opening 220a correspond to a plurality of holding part 210a respectively.In other words, it is a plurality of first opening 220a number, Size, position correspond to a plurality of holding part 210a respectively.A plurality of tongues 226 correspond to respectively it is a plurality of first opening 220a and from It is corresponding first opening 220a side towards first opening 220a center projections.That is, each first opening 220a preferably has one Individual tongue 226 protrudes to form cantilever design from opening lateral margin towards open center.A plurality of first contact portion 120b are respectively arranged at A plurality of tongues 226.In other words, as shown in Figure 4 C, the first power path 222 has the power path (such as 9 of corresponding number of keys Bar), extend to each tongue 226 with electrically isolating respectively to form corresponding first contact portion 120b in the end of tongue 226.

As shown in Figure 4 D, the second path layer 230 has a plurality of second opening 230a and a plurality of extensions 234, wherein A plurality of second opening 230a correspond to a plurality of first opening 220a and a plurality of holding part 210a respectively.A plurality of extensions 234 corresponding a plurality of second opening 230a and self-corresponding second opening 230a side are towards the second opening 230a center projections. In this embodiment, second circuit footpath 232 is used as grounding path, therefore second circuit footpath 232 is designed to reticulation circuit footpath so that the Two power paths 232 are at least distributed in each second opening 230a side, with the second contact portion 120c corresponding to formation.

Such as Fig. 4 F and as shown in Fig. 4 G top view, when supporting layer 210, the path layer 230 of first path layer 220 and second by When being sequentially stacked on down, a plurality of holding part 210a, a plurality of first opening 220a and a plurality of second opening 230a difference Connection is mutually aligned, and corresponding holding part 210a, the first opening 220a and the second opening 230a are collectively forming accommodation space 120a.When second path layer 230 is stacked and placed on first path layer 220, the insulating barrier for forming the second path layer 230 is covered in the first via First power path 222 of footpath layer 220, and expose the second circuit footpath 232 being formed on insulating barrier and its a plurality of second connect Point portion 120c, wherein each tongue 226 is only covered by the corresponding part of extension 234, and expose a plurality of first contact portion 120b.

As shown in Figure 4 E, circuit supporting structure 12 can further include protective layer 240, and wherein protective layer 240 is arranged at the second tunnel To cover second circuit exposed in addition to a plurality of first contact portion 120b and a plurality of second contact portion 120c on footpath layer 230 The power path 222 (if not covered by the second path layer 230) of footpath 232 and first, short circuit is avoided the formation of or because naked with protection circuit footpath Reveal and be damaged.In this embodiment, protective layer 240 has an opening 240a, and the 240a that is open be designed such as it is a plurality of (such as 9) circuit supporting structure 120 all exposes from same opening 240a.However, in other embodiment, protective layer can have Plurality of openings, to correspond to plurality of circuits supporting construction 120 respectively, and cause 120 self-corresponding opening of circuit supporting structure In expose (embodiment for referring to Fig. 7 A to Fig. 7 D).In addition, similar to Fig. 3 A and Fig. 3 B circuit supporting structure, circuit supporting Structure sheaf 12 can further include separation layer, and wherein separation layer is arranged between the path layer 230 of first path layer 220 and second, To electrically isolate the first power path 222 and second circuit footpath 232, repeated no more in this.

In addition, when input unit the increase of press-key structure number and make it that the first power path layout is more complicated, and can not When being configured at single first path layer, circuit supporting structure sheaf may be designed as the first path layer with multiple-level stack.Such as Fig. 5 A Shown in Fig. 5 E, in an embodiment, power path support structure layers are used for the input unit for example with 81 press-key structures, and wrap Containing supporting layer 310, first path first layer 320, first path second layer 330, the second path layer 340 and protective layer 350.Need herein Pay attention to, supporting layer 310, first path first layer 320, first path second layer 330, the knot of the second path layer 340 and protective layer 350 Structure details and effect refer to the explanation of each counter element of foregoing circuit support structure layers 12, only different with regard to the present embodiment after Part illustrates.As shown in Figure 5A, supporting layer 310 has a plurality of holding part 310a, wherein according to corresponding press-key structure Size, a plurality of holding parts (such as 310a, 310a ', 310a ") can be of different sizes and different shapes.

Furthermore in this embodiment, the first path layout layer of circuit supporting structure sheaf is two layers of first path layer, such as First path first layer 320 and first path second layer 330, and then cause a plurality of first contact portions of plurality of circuits supporting construction It is grouped into first group of first contact portion 324 and second group of first contact portion 334.As shown in Figure 5 B, first path first layer 320 has First power path first 322, wherein the first power path first 322 includes first group of the first contact portion 324.Specifically, the first via Footpath first layer 320 has a plurality of first openings (such as 320a, 320b), to correspond to a plurality of holding parts of supporting layer 310 respectively 310a, wherein the first opening 320a is the opening for being provided with tongue 326, and the second opening 320b is to be not provided with opening for tongue 326 Mouthful.At least one first tongue 326 is from the first opening 320a side towards the first opening 320a center projections, for setting first to connect Point portion 324.In other words, preferably only it is being intended to set the correspondence of the first contact portion 324 to open in this embodiment, first path first layer 320 Mouth (such as 320a) sets the first tongue 326, and is then not provided with remaining opening (such as 320b) for being not provided with the first contact portion First tongue.In addition, according to button size, corresponding to big holding part 310a ', the first opening 320a ' may be provided with a plurality of the One tongue 326, for electrically connecting more than one piezo-activator 110.

Similarly, as shown in Figure 5 C, first path second layer 330 has the first power path second 332, wherein the first power path second 332 include second group of the first contact portion 334.Specifically, first path second layer 330 have a plurality of second opening 330a, 330b, to correspond to a plurality of first opening 320b, 320a of first path first layer 320 respectively, wherein the second opening 330a is to set The opening of the second tongue 336 is put, and the second opening 330b is the opening for setting shielding portion 338.At least one second tongue 336 is from Two opening 330a side is towards the second opening 330a center projections, for setting the first contact portion 334.Furthermore at least one masking Portion 338 is from the second opening 330b side towards the second opening 330b center projections, for covering the first of first path first layer 320 A part for tongue 324 is to expose the first contact 324.In other words, the second tongue 336 is arranged at and first path first layer 320 Be not provided with corresponding to the opening (such as 320b) of tongue the side of the second opening (such as 330a), and shielding portion 338 be arranged at First path first layer 320 is provided with the second opening (such as 330b) corresponding to the first opening (such as 320a) of the first tongue 326 Side.In this embodiment, corresponding first opening 320a, 320b and second opening 330b, 330a preferably have identical shape Shape, size, and the first tongue 326 and the second tongue 336 preferably have identical development length.Corresponding to this, shielding portion 338 Development length is less than the development length of the second tongue 336.Similarly, according to button size, corresponding to big holding part 310a ", the Two opening 330a ' may be provided with a plurality of second tongues 336, for electrically connecting more than one piezo-activator 110, and it is corresponding The shielding portion 338 of corresponding number is may be provided with the big first opening 320a ' the second opening 330b ', corresponding to covering respectively A part for first tongue 326 and expose the first contact portion 324 thereon.

As shown in Figure 5 D, the second path layer 340 have a plurality of three opening 340a, 340b, it is a plurality of to correspond to respectively Second opening 330a, 330b, wherein the 3rd opening 340a is the opening for being provided with extension 346, and the 3rd opening 340b is not The opening of extension 346 is set.An at least shielding portion 346 is prominent from the 3rd opening 340a side towards the 3rd opening 340a centers Stretch, for covering a part for the second tongue 336 of first path second layer 330 to expose the first contact 334.In other words, prolong Extending portion 346 is arranged at second opening (such as 330a) the corresponding 3rd that the second tongue 336 is provided with first path second layer 330 The side of opening (such as 340a).Second path layer 340 has second circuit footpath 342 using as grounding path, therefore the second electricity Path 342 is designed to reticulation circuit footpath so that second circuit footpath 342 is at least distributed in each 3rd opening 340a, 340b side, With the second contact portion 344 corresponding to formation.

As shown in fig. 5e, protective layer 350 is stacked and placed on the second path layer 340, and first group of first contact portion is removed with masking 324th, power path exposed beyond first group of second contact portion 334 and a plurality of second contact portions 344 (such as second circuit footpath 342nd, the first power path second 332, the first power path first 322).Protective layer 350 can be according to the exposed power path for being intended to cover/protect It is distributed and there is different shapes, and protective layer 350 can be by single pantostrat or the combination being made up of multiple separation protection sections Layer.

When supporting layer 310, first path first layer 320, first path second layer 330, the second path layer 340 and protective layer 350 when being from bottom to top sequentially stacked, a plurality of holding part 310a, first opening 320a, 320b, second opening 330b, 330a, the Three opening 340b, 340a are mutually aligned connection to be collectively forming corresponding accommodation space 120a, and first group of first contact portion 324 And second group of first contact portion 334 preferably in the orientation of a plurality of press-key structures (or in piezo-activator 110) staggeredly Set, to cause the first power path first 322 and the first power path second 332 that there is preferably layout to be distributed.In other words, with the first via For footpath first layer 320, a plurality of first opening 320a and the first opening 320b are preferably arranged at intervals, and first path second layer 330 The second opening 330a and the second opening 330b be accordingly arranged at intervals, and it is looser make it that the first complicated power path has Layout area, increase the manufacturability of circuit supporting structure.Herein it may be noted that first group of first contact portion 324 and second group The configuration mode of one contact portion 334 can change according to actual design.For example, in other embodiment, first group of first contact Portion 324 and second group of first contact portion 334 can be configured to the mode that interval is embarked on journey or is staggeredly spaced in column, or between each two contact Every mode staggeredly, but it is not limited.

In addition, make the power path design of circuit supporting structure sheaf relatively easy when input unit has a fewer keys structure When, circuit supporting structure sheaf can have the first power path and second circuit footpath to be integrated in the power path layer of simple layer.Such as Fig. 7 A extremely Shown in Fig. 7 D, circuit supporting structure sheaf 12 ' includes supporting layer 710, power path layer 720 and protective layer 730.Herein it may be noted that branch Support layer 710, power path layer 720 and the CONSTRUCTED SPECIFICATION of protective layer 730 and effect refer to each of foregoing circuit support structure layers 12 The explanation of counter element, only the different place of the present embodiment is illustrated after.As shown in Figure 7 A, supporting layer 710 has plural number Individual (such as 9) holding part 710a.As shown in Figure 7 B, circuit layer 720 is stacked and placed on supporting layer 710, and with corresponding number First opening 720a and a plurality of tongues 726.A plurality of first opening 720a correspond to a plurality of holding part 710a respectively, with common Form a plurality of accommodation space 120a.The side that a plurality of tongues 726 distinguish self-corresponding first opening 720a is open towards first The projection of 720a centers.First power path 722 is extended respectively in the first opening 720a comprising plural bar (such as 9) power path Corresponding tongue 726, to form the first contact 120b in the end of tongue 726.Second circuit footpath 728 is used as grounding path, therefore Two power paths 728 are designed to reticulation circuit footpath so that second circuit footpath 728 is at least distributed in each opening 710a side, with shape Into corresponding second contact portion 120c.In this embodiment, the side of 722 preferable concentrated setting power path layer 720 of the first power path (such as left side), and second circuit footpath 728 from the opposite side (such as right side) of power path layer 720 stretch into adjacent apertures 710a it Between so that the first power path 722 and second circuit footpath 728 are electrically isolated from one another.

As seen in figure 7 c, protective layer 730 is arranged on power path layer 720, and a plurality of first contact portion 120b are removed with masking And the exposed power path 722 of second circuit footpath 728 and first outside a plurality of second contact portion 120c.Specifically, in this reality Example is applied, protective layer 730 has a plurality of four opening 730a and a plurality of shielding portions 734, wherein a plurality of 4th opening 730a First opening 720a of corresponding circuits footpath layer 720 respectively, so that the self-corresponding 4th opening 730a of each power path supporting construction is naked Expose for electrically connecting piezo-activator 110, as illustrated in fig. 7d.

Furthermore a plurality of piezo-activators of input unit can also be integrated into single piezo-activator combination, with simplification Assembly program.As shown in fig. 6, piezo-activator combination 11 corresponds to Fig. 5 A to Fig. 5 E circuit supporting structure sheaf, it includes multiple Several (such as 82) piezo-activators 110 and connector 116, wherein connector 116 connect a plurality of piezo-activators 110. As illustrated, each piezo-activator 110 has driven part 114 and piezoelectric part 112, and piezoelectric part 112 is arranged at driven part On 114.In addition, the size according to corresponding button, piezo-activator 110 can have more than one piezoelectric part 112 be arranged at by On drive division 114.Connector 116 is connected to the same side of the driven part 114 of a plurality of piezo-activators 110, multiple to cause Several piezo-activators 110 arrange connection with array way and each piezo-activator 110 can independently be put relative to connector 116 It is dynamic.In this embodiment, connector 116 can be the frame shape connector with the parallel connection strap 116a of plural bar.A plurality of piezoelectricity cause Dynamic device 110 is spaced along connection strap 116a, and preferably with the same side (such as upside) of driven part 114 and connection strap 116a Connect.As illustrated, each driven part 114 is rectangular shape, and a plurality of driven part 114 are only with a side of rectangular shape (such as horizontal upper side) is connected with each other with connection strap 116a.Herein it may be noted that the shape of connector 116 and connection strap 116a Number and configuration, it can change according to design requirement, not to be limited shown in embodiment.

Furthermore for another viewpoint, the combination of piezo-activator shown in Fig. 6 can be considered comprising conducting strip 11a (such as but It is not limited to copper sheet) and a plurality of piezoelectric elements (i.e. piezoelectric part 112), wherein conducting strip 11a has a plurality of cutting grooves 118 to define Go out a plurality of driven part 114, and a plurality of driven part 114 are connected with each other with side, form cantilevered plural lamellar body.It is multiple Several piezoelectric elements 112 are respectively arranged at a plurality of driven part 114, to form a plurality of piezo-activators 110.In other words, it is multiple Conducting strip 11a is cut into a plurality of piezo-activators 110 and connector 116 by several cutting grooves 118.Using rectangle driven part as Example, a plurality of cutting grooves 118 include an at least comb teeth-shaped cutting groove, and wherein comb teeth-shaped cutting groove 118 has major trough 118a and answered Several broach groove 118b.A plurality of broach groove 118b connection major trough 118a are simultaneously arranged in parallel along major trough 118a bearing of trend, its Middle major trough 118a is located at the side of a plurality of driven part 114, and broach groove 118b is stretched between adjacent driven part 114.When When piezo-activator combination 11 is stacked and placed on circuit supporting structure sheaf, master can be located at by bar 116a or conducting strip 11a is fixedly connected with The part of groove 118a opposite sides is in circuit supporting structure sheaf, you can reaches a plurality of piezo-activators 110 and is supported with corresponding circuits The connection of structure 120.

Herein it may be noted that when each element of multiple press-key structures is integrated into corresponding component layer, pressed in order to avoid adjacent Interference or false touch between bond structure and influence the sensing of sensing unit, input unit, which can have, avoids sensing erroneous judgement structure.Such as Shown in Fig. 8 A to Fig. 8 C embodiment, circuit supporting structure sheaf 12 and inductive layer 13 at least one there are a plurality of cutting grooves 170th, 170a, 170b, with individualized plurality of circuits supporting construction 120 and/or individualized a plurality of sensing units 130 so that Adjacent circuit supporting structure 120 and/or the directly not corresponding connection of adjacent sensing unit 130.

In an embodiment, as shown in Figure 8 A, a plurality of cutting groove 170a are formed at circuit supporting structure sheaf 12, with individualized Plurality of circuits supporting construction (or unit) 120 so that the directly not corresponding connection of adjacent circuit supporting structure, it is multiple to reduce Gearing between several circuit supporting structures 120.Specifically, cutting groove 170a through circuit supporting structure sheaf 12 (such as Through above-mentioned supporting layer, first path layer, the second path layer, protective layer etc.), to cause each circuit supporting structure 120 at least There is a side to separate with adjacent circuit supporting structure 120 by cutting groove 170a.That is, a plurality of cutting groove 170a difference positions Around plurality of circuits supporting construction 120 so that an at least side for adjacent circuit supporting structure 120 is mutually not attached to (i.e. with gap).For another viewpoint, a plurality of cutting groove 170a surround plurality of circuits supporting construction 120 so that phase Adjacent circuit supporting structure 120 is respectively connected with each other by an at least connecting portion 172, and adjacent circuit supporting structure 120 is extremely Few stagger setting of a connecting portion 172.As illustrated, corresponding to the circuit supporting structure 120 of rectangle, cutting groove 170a is with one The opening of the open annular cutting groove of rectangle of individual opening, wherein connecting portion 172 positioned at open annular cutting groove so that each electricity The cantilevered circuit supporting structure 120 that road supporting construction 120 is formed on circuit supporting structure sheaf 12.Furthermore a plurality of cutting grooves 170a is all in a manner of opening is above around corresponding circuit supporting structure 120 so that adjacent circuit supporting construction 120 Connecting portion 172 is not connected directly to one another.That is, a plurality of cutting groove 170a are arranged to make it that cutting groove 170a opening is direct Face-to-face.

When the external world applies pressing force, in the structure of circuit supporting structure 120 that is pressed with adjacent circuit supporting structure 120 separate but do not separate really, sensing unit 130 corresponding to lower section can be effectively triggered, without driving adjacent circuit False touch operation occurs for supporting construction 120.

In another embodiment, as shown in Figure 8 B, a plurality of cutting groove 170b are formed at inductive layer 13, with individualized a plurality of Sensing unit 130 so that the directly not corresponding connection of adjacent sensing unit 130, to reduce between a plurality of sensing units 130 Gearing property.In this embodiment, cutting groove 170b has the configuration substantially identical with Fig. 8 A cutting groove 170a so that adjacent sense Answer an at least side for unit 130 to be mutually not attached to, repeated no more in this.

In another embodiment, as shown in Figure 8 C, a plurality of cutting groove 170a and 170b are respectively formed in circuit supporting structure Layer 12 and inductive layer 13, with individualized plurality of circuits supporting construction 120 and a plurality of sensing units 130 so that adjacent electricity The directly not corresponding connection of the sensing unit 130 of road supporting construction 120/, to reduce the sensing unit of plurality of circuits supporting construction 120/ Gearing between 130.Herein it may be noted that when cutting groove 170 is formed at circuit supporting structure sheaf 12 and inductive layer 13 simultaneously, The cutting groove 170a and 170b being formed at around corresponding circuits supporting construction 120 and sensing unit 130 preferably have corresponding property Shape, size and location so that corresponding cutting groove 170a and 170b can be connected for while through circuit supporting structure sheaf 12 and sensing The cutting groove 170 of layer 13.

Furthermore cutting groove can have different aspects according to actual demand.As shown in Fig. 9 A and Figure 10 A, circuit is formed at The cutting groove 180a of support structure layers 12 and inductive layer 13, for the annular cutting groove of opening with two openings, two of which connects Socket part 182 is located at cutting groove 180a two openings, and the company of the adjacent sensing unit 130 of circuit supporting structure 120/ respectively The stagger setting of socket part 182, i.e. opening are arranged to not directly facing face.

As shown in Fig. 9 B and Figure 10 B, the cutting groove 180b for being formed at circuit supporting structure sheaf 12 and inductive layer 13 is plural number Bar straight cuts groove, wherein plural bar straight cuts groove 180b at least one end does not connect mutually.In this embodiment, circuit supporting knot Structure 120 and sensing unit 130 surround (i.e. four cutting groove 180b are formed at its surrounding) by four cutting groove 180b, and every Any two in four cutting groove 180b do not connect mutually so that the sensing unit 130 of circuit supporting structure 120/ is by four companies Socket part 186 is connected with other sensing units 130 of circuit supporting structure 120/.In this embodiment, four connecting portions 186 are located at respectively Four corners of the sensing unit 130 of circuit supporting structure 120/, but be not limited., can be multiple by setting in other embodiment The straight cuts groove that several length are different, connected mode is different changes around the sensing unit 130 of circuit supporting structure 120/ Become the position of connecting portion.

As shown in Fig. 9 C and Figure 10 C, in this embodiment, the sensing unit 130 of adjacent circuit supporting structure 120/ in it extremely Few side has common cutting groove 180d, and other sides are provided with respective cutting groove 180c.That is, adjacent circuit branch It can be separated between the sensing unit 130 of support structure 120/ by one or more cutting grooves.In this embodiment, circuit supporting structure 120/ Sensing unit 130 can be also performed as described above described in example by four connecting portions 186 and other sensing units of circuit supporting structure 120/ 130 connections.Four connecting portions 186 respectively be located at the sensing unit 130 of circuit supporting structure 120/ four corners, but not as Limit.

Herein it may be noted that cutting groove is preferably around an other circuit supporting structure/sensing unit, and the length of cutting groove is got over It is long to be more advantageous to avoid sensing erroneous judgement.In addition, the shape of cutting groove shown in embodiment not to be limited.It is corresponding in other embodiment The shape of press-key structure, cutting groove can be the annular cutting groove of opening of circular rings form or other geometric formats.Furthermore avoid sense The other structures layer that structure can be formed between the outside trigger source of input unit and inductive layer should be judged by accident, be not limited to above-mentioned implementation Circuit supporting structure sheaf (such as shown in Fig. 4 A, Fig. 5 A to Fig. 5 E, Fig. 7 D), the inductive layer of example.That is, cutting groove can be formed at tool There are the support structure layers of other circuit designs, to reach the operational separation of each sensing unit, while also keep global shape On integrality.

The present invention is described by above-described embodiment, but above-described embodiment is only to illustrate purpose not for limitation. This ripe those skilled in the art can have other of illustrative embodiments to repair when knowing in the case where not departing from spirit of the invention, in the embodiment of this special instruction Change.Therefore, scope is also covered such modification and only limited by appended claim.

Claims

1. a kind of avoidance sensing erroneous judgement structure of input unit, the input unit have a plurality of piezo-activators, its feature exists In the avoidance sensing erroneous judgement structure of the input unit includes：

Circuit supporting structure sheaf, it has a plurality of circuits supporting construction, and the plurality of circuits supporting construction is respectively propping up Support a plurality of piezo-activators；And

Inductive layer, the inductive layer are arranged at below the circuit supporting structure sheaf, and the inductive layer includes a plurality of sensing units, and this is multiple Several sensing units are respectively to should plurality of circuits supporting construction；

Wherein, at least one of the circuit supporting structure sheaf and the inductive layer have a plurality of cutting grooves, and this is a plurality of to cut Groove is cut with the individualized plurality of circuits supporting construction and/or individualized a plurality of sensing units so that the plurality of circuits Sensing unit adjacent in adjacent circuit supporting structure and/or a plurality of sensing units is not directly corresponding in supporting construction connects Connect；

Wherein, a plurality of cutting grooves are formed at the circuit supporting structure sheaf, and a plurality of cutting grooves are a plurality of around this respectively Circuit supporting structure so that the plurality of circuits supporting construction is connected with each other by an at least connecting portion respectively, and this is a plurality of At least connecting portion stagger setting for the adjacent circuit supporting structure in circuit supporting structure.

2. the avoidance sensing erroneous judgement structure of the input unit as described in claim 1, it is characterised in that a plurality of cutting grooves Into in the inductive layer, a plurality of cutting grooves to surround a plurality of sensing units respectively so that a plurality of sensing units point It is not connected with each other by an at least connecting portion, and at least one connection of the sensing unit adjacent in a plurality of sensing units Portion's stagger setting.

3. the avoidance sensing erroneous judgement structure of the input unit as described in claim 2, it is characterised in that a plurality of cutting grooves It is at least one annular cutting groove of opening, the annular cutting groove of the opening is straight-flanked ring or circular rings.

4. a kind of avoidance sensing erroneous judgement structure of input unit, the input unit have a plurality of piezo-activators, its feature exists In the avoidance sensing erroneous judgement structure of the input unit includes：

Wherein, a plurality of cutting grooves are into the inductive layer, a plurality of cutting grooves to surround a plurality of sensing units respectively, So that a plurality of sensing units are connected with each other by an at least connecting portion respectively, and it is adjacent in a plurality of sensing units should An at least connecting portion stagger setting for sensing unit.

5. the avoidance sensing erroneous judgement structure of the input unit as described in claim 4, it is characterised in that a plurality of cutting grooves It is at least one annular cutting groove of opening, the annular cutting groove of the opening is straight-flanked ring or circular rings.

6. a kind of avoidance sensing erroneous judgement structure of input unit, the input unit have a plurality of piezo-activators, its feature exists In the avoidance sensing erroneous judgement structure of the input unit includes：

Wherein, a plurality of cutting grooves are formed at the circuit supporting structure sheaf, and a plurality of cutting grooves are a plurality of positioned at this respectively Around circuit supporting structure so that an at least side for the adjacent circuit supporting structure in the plurality of circuits supporting construction Mutually it is not attached to.

7. the avoidance sensing erroneous judgement structure of the input unit as described in claim 6, it is characterised in that a plurality of cutting grooves The inductive layer is formed at, a plurality of cutting grooves are respectively around a plurality of sensing units so that a plurality of sensings An at least side for the adjacent sensing unit is mutually not attached in unit.

8. the avoidance sensing erroneous judgement structure of the input unit as described in claim 7, it is characterised in that a plurality of cutting grooves For plural bar straight cuts groove, the wherein plural bar straight cuts groove at least one end does not connect mutually.

9. a kind of avoidance sensing erroneous judgement structure of input unit, the input unit have a plurality of piezo-activators, its feature exists In the avoidance sensing erroneous judgement structure of the input unit includes：

Wherein, a plurality of cutting grooves are formed at the inductive layer, and a plurality of cutting grooves are located at a plurality of sensing units respectively Around so that an at least side for the adjacent sensing unit is mutually not attached in a plurality of sensing units.

10. the avoidance sensing erroneous judgement structure of the input unit as described in claim 9, it is characterised in that a plurality of cuttings Groove is plural bar straight cuts groove, and wherein the plural bar straight cuts groove at least one end does not connect mutually.

11. a kind of input unit, it is characterised in that the input unit includes：

A plurality of piezo-activators, it is used to receive pressing force；

Circuit supporting structure sheaf, it has plurality of circuits supporting construction, and the plurality of circuits supporting construction is respectively supporting A plurality of piezo-activators；And

Inductive layer, it is arranged at below the circuit supporting structure sheaf, and the inductive layer includes a plurality of sensing units, a plurality of senses Answer unit respectively to should plurality of circuits supporting construction,

Wherein, the circuit supporting structure sheaf and the inductive layer at least one there are a plurality of cutting grooves, a plurality of cutting grooves With the individualized plurality of circuits supporting construction and/or individualized a plurality of sensing units so that the plurality of circuits supports The directly not corresponding connection of sensing unit adjacent in adjacent circuit supporting structure and/or a plurality of sensing units in structure, When one of a plurality of piezo-activators receive the pressing force, the pressing force is transmitted to the corresponding plurality of circuits branch For one of support structure to trigger one of corresponding a plurality of sensing units, a plurality of cutting grooves avoid the pressing force It is delivered to sensing unit corresponding to the piezo-activator not being pressed；

12. the input unit as described in claim 11, it is characterised in that a plurality of cutting grooves are formed at the inductive layer, A plurality of cutting grooves surround a plurality of sensing units respectively so that a plurality of sensing units are respectively by least one connection Portion is connected with each other, and an at least connecting portion for a plurality of sensing units adjacent in a plurality of sensing units staggers and set Put.

13. the input unit as described in claim 12, it is characterised in that a plurality of cutting grooves are at least one opening annular Cutting groove, the annular cutting groove of the opening are straight-flanked ring or circular rings.

14. a kind of input unit, it is characterised in that the input unit includes：

A plurality of piezo-activators, it is used to receive pressing force；

Wherein, a plurality of cutting grooves are formed at the inductive layer, and a plurality of cutting grooves surround a plurality of sensing units respectively, So that a plurality of sensing units are connected with each other by an at least connecting portion respectively, and it is adjacent in a plurality of sensing units should An at least connecting portion stagger setting for a plurality of sensing units.

15. the input unit as described in claim 14, it is characterised in that a plurality of cutting grooves are at least one opening annular Cutting groove, the annular cutting groove of the opening are straight-flanked ring or circular rings.

16. a kind of input unit, it is characterised in that the input unit includes：

A plurality of piezo-activators, it is used to receive pressing force；

17. the input unit as described in claim 16, it is characterised in that a plurality of cutting grooves are formed at the inductive layer, A plurality of cutting grooves to be located at around a plurality of sensing units respectively so that it is adjacent in a plurality of sensing units should An at least side for sensing unit is mutually not attached to.

18. the input unit as described in claim 17, it is characterised in that a plurality of cutting grooves are plural bar straight cuts Groove, the wherein plural bar straight cuts groove at least one end do not connect mutually.

19. a kind of input unit, it is characterised in that the input unit includes：

A plurality of piezo-activators, it is used to receive pressing force；

Wherein, a plurality of cutting grooves are formed at the inductive layer, and a plurality of cutting grooves are single to be located at a plurality of sensings respectively Around member so that an at least side for the adjacent sensing unit is mutually not attached in a plurality of sensing units.

20. the input unit as described in claim 19, it is characterised in that a plurality of cutting grooves are plural bar straight cuts Groove, the wherein plural bar straight cuts groove at least one end do not connect mutually.