CN104698913A - Intelligent granary monitoring node - Google Patents
Intelligent granary monitoring node Download PDFInfo
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- CN104698913A CN104698913A CN201410574215.4A CN201410574215A CN104698913A CN 104698913 A CN104698913 A CN 104698913A CN 201410574215 A CN201410574215 A CN 201410574215A CN 104698913 A CN104698913 A CN 104698913A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D27/00—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
- G05D27/02—Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
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Abstract
The invention discloses an intelligent granary monitoring node. The prior art is complex in monitoring process, low in accuracy and poor in real-time performance. The intelligent granary monitoring node comprises a controller module, a power management module, a storage device module, a signal acquisition module, a communication module and a display module. According to the monitoring node, the signal acquisition module acquires humiture of a granary and grain piles automatically and sends information to the controller module in a digital signal mode. The controller module displays humiture values of the air and the grain piles via a liquid crystal display, and the information is stored in the storage device module according to needs or transmitted to the upper computer via a ZigBee module for a monitoring person to observe. The intelligent granary monitoring node has the advantages of low cost, high accuracy, long service time, convenience in equipment layout, less influence on granary environment, real-time data feedback and the like.
Description
Technical field
The invention belongs to embedded system field, be specifically related to a kind of intelligent silo monitoring node.
Background technology
Grain is the basis of human survival and development, and food problem is related to the development of Chinese national economy, and the stable and compatible of society and nation's security are livelihood issues, a national strategy problem especially.Silo is the memory carrier of grain, is directly connected to grain security.The storage environment of grain depot is the problem that grain security must be paid close attention to.Along with the development of science and technology, silo monitoring equipment arises at the historic moment, but traditional silo monitoring equipment take thermistor as temperature sensing device, and its circuit is complicated, degree of accuracy is not high, is difficult to adapt to completely modern silo to the high precision of temperature-humidity monitoring, the requirement such as real-time.
Summary of the invention
The present invention be directed to the deficiency of above-mentioned monitoring equipment and the one intelligence silo monitoring node that proposes.
A kind of intelligent silo monitoring node of the present invention is by controller module, and power management module, memory module, signal acquisition module, communication module and display module form.Power management module comprises 3.3V circuit and 5V circuit, and wherein 5V circuit is controller module, and signal acquisition module and display module are powered; 3.3V circuit is 5V circuit, and memory module and communication module are powered.Signal acquisition module gathers the humiture in the humiture of air in silo and grain heap automatically, and information is sent to controller module with the form of digital signal, controller module by air and grain heap in warm and humid angle value pass through liquid crystal display, as required these information are kept at memory module simultaneously, or be sent to host computer by ZigBee module, for monitoring personal observations.
Described controller module electricity route processors U2 STC12C5A16S2, the 3rd filter capacitor C3, the 4th filter capacitor C4, the 5th filter capacitor C5, the 6th filter capacitor C6, the tenth filter capacitor C10, the first resistance R1 and crystal oscillator Y1 form.4 pins of processor U2 STC12C5A16S2, one end of the first resistance R1 are connected with one end of the tenth filter capacitor C10, the other end ground connection of the first resistance R1, and the other end of the tenth filter capacitor C10 is connected with VDD5.0; One end of 14 pins of processor U2 STC12C5A16S2, one end of crystal oscillator Y1, the 6th filter capacitor C6 is connected; One end of 15 pins of processor U2 STC12C5A16S2, the other end of crystal oscillator Y1, the 3rd filter capacitor C3 is connected; 16 pins of processor U2 STC12C5A16S2, the other end of the 3rd filter capacitor C3 are connected with the other end of the 6th filter capacitor C6 and ground connection; One end of 38 pins of processor U2 STC12C5A16S2, one end of the 5th filter capacitor C5, the 4th filter capacitor C4 is connected with VDD5.0; The other end of the 5th filter capacitor C5, the other end of the 4th filter capacitor C4 are connected and ground connection.
Described 5V electricity router chip U1 LM2596S-5.0, the first polar capacitor C1, inductance L 1, voltage stabilizing diode D1 and the second polar capacitor C2 form.1 pin of chip U1 LM2596S-5.0, the anode of the first polar capacitor C1 are connected with VDD12; 3 pins of chip U1 LM2596S-5.0,5 pins, the negative electrode of the first polar capacitor C1, the anode of voltage stabilizing diode D1 are connected with the negative electrode of the second polar capacitor C2 and ground connection; 2 pins of chip U1 LM2596S-5.0, the negative electrode of voltage stabilizing diode D1 are connected with one end of inductance L 1; The anode of 4 pins of chip U1 LM2596S-5.0, the other end of inductance L 1, the second polar capacitor C2 is connected with VDD5.0.
Described 3.3V electricity router chip U3 SPX1117M3-3.3, the 3rd polar capacitor C9, the 7th filter capacitor C7, the 8th filter capacitor C8 form.One end of 1 pin of chip U3 SPX1117M3-3.3, the anode of the 3rd polar capacitor C9, the 7th filter capacitor C7 is connected with VDD5.0; The other end of 2 pins of chip U3 SPX1117M3-3.3, the negative electrode of the 3rd polar capacitor C9, the 7th filter capacitor C7 is connected with one end of the 8th filter capacitor C8 and ground connection; 3 pins of chip U3 SPX1117M3-3.3, the other end of the 8th filter capacitor C8 are connected with VDD3.3.
Described memory module circuit is made up of storage chip U4 AT45DB161D, the second resistance R2, the 3rd resistance R3 and the 11 filter capacitor C11.1 pin of storage chip U4 AT45DB161D is connected with the P4.1 of processor U2 STC12C5A16S2; 2 pins of storage chip U4 AT45DB161D are connected with the P4.3 of processor U2 STC12C5A16S2; 4 pins of storage chip U4 AT45DB161D are connected with the P4.0 of processor U2 STC12C5A16S2; 8 pins of storage chip U4 AT45DB161D are connected with the P4.2 of processor U2 STC12C5A16S2; The 7 pin ground connection of storage chip U4 AT45DB161D; 5 pins of storage chip U4 AT45DB161D, the P4.4 of processor U2 STC12C5A16S2 are connected with one end of the 3rd resistance R3; 3 pins of storage chip U4 AT45DB161D are connected with one end of the second resistance R2; 6 pins of storage chip U4 AT45DB161D, the other end of the second resistance R2, the other end of the 3rd resistance R3, one end of the 11 electric capacity C11 are connected with VDD3.3; The other end ground connection of the 11 electric capacity C11.
Described signal acquisition module circuit is made up of Temperature Humidity Sensor probe socket JP2 and aerial temperature and humidity sensor socket JP3.1 pin of Temperature Humidity Sensor probe JP2 is connected with VDD5.0; 2 pins of Temperature Humidity Sensor probe socket JP2 are connected with the P4.5 of processor U2 STC12C5A16S2; 3 pins of Temperature Humidity Sensor probe socket JP2 are connected with the P4.7 of processor U2 STC12C5A16S2; The 4 pin ground connection of Temperature Humidity Sensor probe socket JP2; 1 pin of aerial temperature and humidity sensor socket JP3 is connected with VDD5.0; 2 pins of aerial temperature and humidity sensor socket JP3 are connected with the P4.6 of processor U2 STC12C5A16S2; The 3 pin ground connection of aerial temperature and humidity sensor socket JP3.
Described communication module circuit is ZigBee socket CON1 circuit.13 pins of ZigBee socket CON1,15 pins, 17 pins are connected with VDD3.3; 21 pins of ZigBee socket CON1,23 pins, 25 pins, 27 pins are connected and ground connection; 18 pins of ZigBee socket CON1 are connected with the U0TX of processor U2 STC12C5A16S2; 20 pins of ZigBee socket CON1 are connected with the U0RX of processor U2 STC12C5A16S2; All the other pins of ZigBee socket CON1 are maked somebody a mere figurehead.
Described display module is made up of liquid crystal socket JP1, the 4th resistance R4, the 5th resistance R5.The 1 pin ground connection of liquid crystal socket JP1; 2 pins of liquid crystal socket JP1, one end of the 4th resistance R4 are connected with VDD5.0; 3 pins of liquid crystal socket JP1, the other end of the 4th resistance R4 are connected with one end of the 5th resistance R5; 4 pins of liquid crystal socket JP1 are connected with the P0.0 of processor U2 STC12C5A16S2; 5 pins of liquid crystal socket JP1 are connected with the P0.1 of processor U2 STC12C5A16S2; 6 pins of liquid crystal socket JP1 are connected with the P0.2 of processor U2 STC12C5A16S2; 7 pins of liquid crystal socket JP1 are connected with the P0.3 of processor U2 STC12C5A16S2; 8 pins of liquid crystal socket JP1 are connected with the P0.4 of processor U2 STC12C5A16S2; 9 pins of liquid crystal socket JP1 are connected with the P0.5 of processor U2 STC12C5A16S2; 10 pins of liquid crystal socket JP1 are connected with the P0.6 of processor U2 STC12C5A16S2; 11 pins of liquid crystal socket JP1 are connected with the P0.7 of processor U2 STC12C5A16S2; 12 pins of liquid crystal socket JP1 are connected with the P1.0 of processor U2 STC12C5A16S2; 13 pins of liquid crystal socket JP1 are connected with the P1.1 of processor U2 STC12C5A16S2; 14 pins of liquid crystal socket JP1 are connected with the P1.4 of processor U2 STC12C5A16S2; 15 pins of liquid crystal socket JP1 are connected with the other end of the 5th resistance R5 and ground connection; 16 pins of liquid crystal socket JP1 are connected with VDD5.0.
Beneficial effect of the present invention: this node device cost is low, precision is high, service time is long, and equipment layout is convenient, little to silo environmental impact, can real-time feedback data.
Accompanying drawing explanation.
Fig. 1 is hardware configuration schematic diagram of the present invention.
Fig. 2 is controller module circuit theory diagrams of the present invention.
Fig. 3 is 5V circuit theory diagrams of the present invention.
Fig. 4 is 3.3V circuit theory diagrams of the present invention.
Fig. 5 is memory module circuit theory diagrams of the present invention.
Fig. 6 is signal acquisition module circuit theory diagrams of the present invention.
Fig. 7 is communication module circuit theory diagrams of the present invention.
Fig. 8 is display module circuit theory diagrams of the present invention.
Embodiment
Below in conjunction with accompanying drawing, specific description is done to modules in the present invention.
As shown in Figure 1, a kind of intelligent silo monitoring node of the present invention is by controller module 1, and power management module 2, memory module 3, signal acquisition module 4, communication module 5 and display module 6 form.Power management module 2 comprises 3.3V circuit 2-1 and 5V circuit 2-2, and wherein 5V circuit 2-2 is controller module 1, and signal acquisition module 4 and display module 6 are powered; 3.3V circuit 2-1 is 5V circuit 2-2, and memory module 1 and communication module 5 are powered.Signal acquisition module 4 automatically gathers the humiture in the humiture of air in silo and grain heap, and information is sent to controller module 1 with the form of digital signal, controller module 1 by air and grain heap in warm and humid angle value pass through liquid crystal display, as required these information are kept at memory module 3 simultaneously, or be sent to host computer by ZigBee module, for monitoring personal observations.
As shown in Figure 2, described controller module electricity route processors U2 STC12C5A16S2, the 3rd filter capacitor C3, the 4th filter capacitor C4, the 5th filter capacitor C5, the 6th filter capacitor C6, the tenth filter capacitor C10, the first resistance R1 and crystal oscillator Y1 form.4 pins of processor U2 STC12C5A16S2, one end of the first resistance R1 are connected with one end of the tenth filter capacitor C10, the other end ground connection of the first resistance R1, and the other end of the tenth filter capacitor C10 is connected with VDD5.0; One end of 14 pins of processor U2 STC12C5A16S2, one end of crystal oscillator Y1, the 6th filter capacitor C6 is connected; One end of 15 pins of processor U2 STC12C5A16S2, the other end of crystal oscillator Y1, the 3rd filter capacitor C3 is connected; 16 pins of processor U2 STC12C5A16S2, the other end of the 3rd filter capacitor C3 are connected with the other end of the 6th filter capacitor C6 and ground connection; One end of 38 pins of processor U2 STC12C5A16S2, one end of the 5th filter capacitor C5, the 4th filter capacitor C4 is connected with VDD5.0; The other end of the 5th filter capacitor C5, the other end of the 4th filter capacitor C4 are connected and ground connection.
As shown in Figure 3, described 5V electricity router chip U1 LM2596S-5.0, the first polar capacitor C1, inductance L 1, voltage stabilizing diode D1 and the second polar capacitor C2 form.1 pin of chip U1 LM2596S-5.0, the anode of the first polar capacitor C1 are connected with VDD12; 3 pins of chip U1 LM2596S-5.0,5 pins, the negative electrode of the first polar capacitor C1, the anode of voltage stabilizing diode D1 are connected with the negative electrode of the second polar capacitor C2 and ground connection; 2 pins of chip U1 LM2596S-5.0, the negative electrode of voltage stabilizing diode D1 are connected with one end of inductance L 1; The anode of 4 pins of chip U1 LM2596S-5.0, the other end of inductance L 1, the second polar capacitor C2 is connected with VDD5.0.
As shown in Figure 4, described 3.3V electricity router chip U3 SPX1117M3-3.3, the 3rd polar capacitor C9, the 7th filter capacitor C7, the 8th filter capacitor C8 form.One end of 1 pin of chip U3 SPX1117M3-3.3, the anode of the 3rd polar capacitor C9, the 7th filter capacitor C7 is connected with VDD5.0; The other end of 2 pins of chip U3 SPX1117M3-3.3, the negative electrode of the 3rd polar capacitor C9, the 7th filter capacitor C7 is connected with one end of the 8th filter capacitor C8 and ground connection; 3 pins of chip U3 SPX1117M3-3.3, the other end of the 8th filter capacitor C8 are connected with VDD3.3.
As shown in Figure 5, described memory module circuit is made up of storage chip U4 AT45DB161D, the second resistance R2, the 3rd resistance R3 and the 11 filter capacitor C11.1 pin of storage chip U4 AT45DB161D is connected with the P4.1 of processor U2 STC12C5A16S2; 2 pins of storage chip U4 AT45DB161D are connected with the P4.3 of processor U2 STC12C5A16S2; 4 pins of storage chip U4 AT45DB161D are connected with the P4.0 of processor U2 STC12C5A16S2; 8 pins of storage chip U4 AT45DB161D are connected with the P4.2 of processor U2 STC12C5A16S2; The 7 pin ground connection of storage chip U4 AT45DB161D; 5 pins of storage chip U4 AT45DB161D, the P4.4 of processor U2 STC12C5A16S2 are connected with one end of the 3rd resistance R3; 3 pins of storage chip U4 AT45DB161D are connected with one end of the second resistance R2; 6 pins of storage chip U4 AT45DB161D, the other end of the second resistance R2, the other end of the 3rd resistance R3, one end of the 11 electric capacity C11 are connected with VDD3.3; The other end ground connection of the 11 electric capacity C11.
As shown in Figure 6, described signal acquisition module circuit is made up of Temperature Humidity Sensor probe socket JP2 and aerial temperature and humidity sensor socket JP3.1 pin of Temperature Humidity Sensor probe JP2 is connected with VDD5.0; 2 pins of Temperature Humidity Sensor probe socket JP2 are connected with the P4.5 of processor U2 STC12C5A16S2; 3 pins of Temperature Humidity Sensor probe socket JP2 are connected with the P4.7 of processor U2 STC12C5A16S2; The 4 pin ground connection of Temperature Humidity Sensor probe socket JP2; 1 pin of aerial temperature and humidity sensor socket JP3 is connected with VDD5.0; 2 pins of aerial temperature and humidity sensor socket JP3 are connected with the P4.6 of processor U2 STC12C5A16S2; The 3 pin ground connection of aerial temperature and humidity sensor socket JP3.
As shown in Figure 7, described communication module circuit is ZigBee socket CON1 circuit.13 pins of ZigBee socket CON1,15 pins, 17 pins are connected with VDD3.3; 21 pins of ZigBee socket CON1,23 pins, 25 pins, 27 pins are connected and ground connection; 18 pins of ZigBee socket CON1 are connected with the U0TX of processor U2 STC12C5A16S2; 20 pins of ZigBee socket CON1 are connected with the U0RX of processor U2 STC12C5A16S2; All the other pins of ZigBee socket CON1 are maked somebody a mere figurehead.
As shown in Figure 8, described display module is made up of liquid crystal socket JP1, the 4th resistance R4, the 5th resistance R5.The 1 pin ground connection of liquid crystal socket JP1; 2 pins of liquid crystal socket JP1, one end of the 4th resistance R4 are connected with VDD5.0; 3 pins of liquid crystal socket JP1, the other end of the 4th resistance R4 are connected with one end of the 5th resistance R5; 4 pins of liquid crystal socket JP1 are connected with the P0.0 of processor U2 STC12C5A16S2; 5 pins of liquid crystal socket JP1 are connected with the P0.1 of processor U2 STC12C5A16S2; 6 pins of liquid crystal socket JP1 are connected with the P0.2 of processor U2 STC12C5A16S2; 7 pins of liquid crystal socket JP1 are connected with the P0.3 of processor U2 STC12C5A16S2; 8 pins of liquid crystal socket JP1 are connected with the P0.4 of processor U2 STC12C5A16S2; 9 pins of liquid crystal socket JP1 are connected with the P0.5 of processor U2 STC12C5A16S2; 10 pins of liquid crystal socket JP1 are connected with the P0.6 of processor U2 STC12C5A16S2; 11 pins of liquid crystal socket JP1 are connected with the P0.7 of processor U2 STC12C5A16S2; 12 pins of liquid crystal socket JP1 are connected with the P1.0 of processor U2 STC12C5A16S2; 13 pins of liquid crystal socket JP1 are connected with the P1.1 of processor U2 STC12C5A16S2; 14 pins of liquid crystal socket JP1 are connected with the P1.4 of processor U2 STC12C5A16S2; 15 pins of liquid crystal socket JP1 are connected with the other end of the 5th resistance R5 and ground connection; 16 pins of liquid crystal socket JP1 are connected with VDD5.0.
A kind of groundwork process of intelligent silo monitoring node is as follows: signal acquisition module gathers the humiture in the humiture of air in silo and grain heap automatically, and information is sent to controller module with the form of digital signal, controller module by air and grain heap in warm and humid angle value pass through liquid crystal display, as required these information are kept at memory module simultaneously, or be sent to host computer by ZigBee module, for monitoring personal observations.
Claims (1)
1. intelligent silo monitoring node is by controller module, power management module, memory module, signal acquisition module, communication module and display module composition; Power management module comprises 3.3V circuit and 5V circuit, and wherein 5V circuit is controller module, and signal acquisition module and display module are powered; 3.3V circuit is 5V circuit, and memory module and communication module are powered; Signal acquisition module gathers the humiture in the humiture of air in silo and grain heap automatically, and information is sent to controller module with the form of digital signal, controller module by air and grain heap in warm and humid angle value pass through liquid crystal display, as required these information are kept at memory module simultaneously, or be sent to host computer by ZigBee module, for monitoring personal observations;
Described controller module electricity route processors U2 STC12C5A16S2, the 3rd filter capacitor C3, the 4th filter capacitor C4, the 5th filter capacitor C5, the 6th filter capacitor C6, the tenth filter capacitor C10, the first resistance R1 and crystal oscillator Y1 form;
4 pins of processor U2 STC12C5A16S2, one end of the first resistance R1 are connected with one end of the tenth filter capacitor C10, the other end ground connection of the first resistance R1, and the other end of the tenth filter capacitor C10 is connected with VDD5.0; One end of 14 pins of processor U2 STC12C5A16S2, one end of crystal oscillator Y1, the 6th filter capacitor C6 is connected; One end of 15 pins of processor U2 STC12C5A16S2, the other end of crystal oscillator Y1, the 3rd filter capacitor C3 is connected; 16 pins of processor U2 STC12C5A16S2, the other end of the 3rd filter capacitor C3 are connected with the other end of the 6th filter capacitor C6 and ground connection; One end of 38 pins of processor U2 STC12C5A16S2, one end of the 5th filter capacitor C5, the 4th filter capacitor C4 is connected with VDD5.0; The other end of the 5th filter capacitor C5, the other end of the 4th filter capacitor C4 are connected and ground connection;
Described 5V electricity router chip U1 LM2596S-5.0, the first polar capacitor C1, inductance L 1, voltage stabilizing diode D1 and the second polar capacitor C2 form; 1 pin of chip U1 LM2596S-5.0, the anode of the first polar capacitor C1 are connected with VDD12; 3 pins of chip U1 LM2596S-5.0,5 pins, the negative electrode of the first polar capacitor C1, the anode of voltage stabilizing diode D1 are connected with the negative electrode of the second polar capacitor C2 and ground connection; 2 pins of chip U1 LM2596S-5.0, the negative electrode of voltage stabilizing diode D1 are connected with one end of inductance L 1; The anode of 4 pins of chip U1 LM2596S-5.0, the other end of inductance L 1, the second polar capacitor C2 is connected with VDD5.0;
Described 3.3V electricity router chip U3 SPX1117M3-3.3, the 3rd polar capacitor C9, the 7th filter capacitor C7, the 8th filter capacitor C8 form; One end of 1 pin of chip U3 SPX1117M3-3.3, the anode of the 3rd polar capacitor C9, the 7th filter capacitor C7 is connected with VDD5.0; The other end of 2 pins of chip U3 SPX1117M3-3.3, the negative electrode of the 3rd polar capacitor C9, the 7th filter capacitor C7 is connected with one end of the 8th filter capacitor C8 and ground connection; 3 pins of chip U3 SPX1117M3-3.3, the other end of the 8th filter capacitor C8 are connected with VDD3.3;
Described memory module circuit is made up of storage chip U4 AT45DB161D, the second resistance R2, the 3rd resistance R3 and the 11 filter capacitor C11; 1 pin of storage chip U4 AT45DB161D is connected with the P4.1 of processor U2 STC12C5A16S2; 2 pins of storage chip U4 AT45DB161D are connected with the P4.3 of processor U2 STC12C5A16S2; 4 pins of storage chip U4 AT45DB161D are connected with the P4.0 of processor U2 STC12C5A16S2; 8 pins of storage chip U4 AT45DB161D are connected with the P4.2 of processor U2 STC12C5A16S2; The 7 pin ground connection of storage chip U4 AT45DB161D; 5 pins of storage chip U4 AT45DB161D, the P4.4 of processor U2 STC12C5A16S2 are connected with one end of the 3rd resistance R3; 3 pins of storage chip U4 AT45DB161D are connected with one end of the second resistance R2; 6 pins of storage chip U4 AT45DB161D, the other end of the second resistance R2, the other end of the 3rd resistance R3, one end of the 11 electric capacity C11 are connected with VDD3.3; The other end ground connection of the 11 electric capacity C11;
Described signal acquisition module circuit is made up of Temperature Humidity Sensor probe socket JP2 and aerial temperature and humidity sensor socket JP3; 1 pin of Temperature Humidity Sensor probe JP2 is connected with VDD5.0; 2 pins of Temperature Humidity Sensor probe socket JP2 are connected with the P4.5 of processor U2 STC12C5A16S2; 3 pins of Temperature Humidity Sensor probe socket JP2 are connected with the P4.7 of processor U2 STC12C5A16S2; The 4 pin ground connection of Temperature Humidity Sensor probe socket JP2; 1 pin of aerial temperature and humidity sensor socket JP3 is connected with VDD5.0; 2 pins of aerial temperature and humidity sensor socket JP3 are connected with the P4.6 of processor U2 STC12C5A16S2; The 3 pin ground connection of aerial temperature and humidity sensor socket JP3;
Described communication module circuit is ZigBee socket CON1 circuit; 13 pins of ZigBee socket CON1,15 pins, 17 pins are connected with VDD3.3; 21 pins of ZigBee socket CON1,23 pins, 25 pins, 27 pins are connected and ground connection; 18 pins of ZigBee socket CON1 are connected with the U0TX of processor U2 STC12C5A16S2; 20 pins of ZigBee socket CON1 are connected with the U0RX of processor U2 STC12C5A16S2; All the other pins of ZigBee socket CON1 are maked somebody a mere figurehead;
Described display module is made up of liquid crystal socket JP1, the 4th resistance R4, the 5th resistance R5; The 1 pin ground connection of liquid crystal socket JP1; 2 pins of liquid crystal socket JP1, one end of the 4th resistance R4 are connected with VDD5.0; 3 pins of liquid crystal socket JP1, the other end of the 4th resistance R4 are connected with one end of the 5th resistance R5; 4 pins of liquid crystal socket JP1 are connected with the P0.0 of processor U2 STC12C5A16S2; 5 pins of liquid crystal socket JP1 are connected with the P0.1 of processor U2 STC12C5A16S2; 6 pins of liquid crystal socket JP1 are connected with the P0.2 of processor U2 STC12C5A16S2; 7 pins of liquid crystal socket JP1 are connected with the P0.3 of processor U2 STC12C5A16S2; 8 pins of liquid crystal socket JP1 are connected with the P0.4 of processor U2 STC12C5A16S2; 9 pins of liquid crystal socket JP1 are connected with the P0.5 of processor U2 STC12C5A16S2; 10 pins of liquid crystal socket JP1 are connected with the P0.6 of processor U2 STC12C5A16S2; 11 pins of liquid crystal socket JP1 are connected with the P0.7 of processor U2 STC12C5A16S2; 12 pins of liquid crystal socket JP1 are connected with the P1.0 of processor U2 STC12C5A16S2; 13 pins of liquid crystal socket JP1 are connected with the P1.1 of processor U2 STC12C5A16S2; 14 pins of liquid crystal socket JP1 are connected with the P1.4 of processor U2 STC12C5A16S2; 15 pins of liquid crystal socket JP1 are connected with the other end of the 5th resistance R5 and ground connection; 16 pins of liquid crystal socket JP1 are connected with VDD5.0.
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|---|---|---|---|
| CN201410574215.4A CN104698913A (en) | 2014-10-24 | 2014-10-24 | Intelligent granary monitoring node |
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| CN201410574215.4A CN104698913A (en) | 2014-10-24 | 2014-10-24 | Intelligent granary monitoring node |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105005333A (en) * | 2015-08-05 | 2015-10-28 | 成都点石创想科技有限公司 | Humidity monitoring and adjusting system applied to intelligent warehouse management |
| CN109429744A (en) * | 2018-11-12 | 2019-03-08 | 郑州源创智控有限公司 | Silo Multifunction ventilated system controller |
-
2014
- 2014-10-24 CN CN201410574215.4A patent/CN104698913A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105005333A (en) * | 2015-08-05 | 2015-10-28 | 成都点石创想科技有限公司 | Humidity monitoring and adjusting system applied to intelligent warehouse management |
| CN109429744A (en) * | 2018-11-12 | 2019-03-08 | 郑州源创智控有限公司 | Silo Multifunction ventilated system controller |
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Application publication date: 20150610 |