CN104694912A - Method for chemically plating Ni-P alloy on surfaces of diamond particles - Google Patents

Abstract

The invention discloses a method for chemically plating a Ni-P alloy on surfaces of diamond particles. The method for chemically plating the Ni-P alloy on the surfaces of the diamond particles comprises the following steps: directly adding weighed diamond particles into a chemically plating Ni-P alloy solution; using a glass rod which is plated with the alloy for inducing and activating a chemically plating solution in a constant temperature water bath; or adding iron pieces which are plated with the alloy for the induction and the activation until occurring a boiling phenomenon; finishing the plating; obtaining the diamond particles plated with the Ni-P alloy element layer by means of precipitating, filtering, drying, and the like. The particles can be used as particle reinforcements for preparing metal-base composite materials. Meanwhile, the particles are a basic raw material for preparing engineering materials and functional materials.

Description

A method for chemically plating Ni-P alloy on the surface of diamond particles

technical field

The invention relates to the technical field of nanoparticle surface treatment, in particular to a method for chemically plating Ni-P alloy on the surface of diamond particles.

Background technique

At present, diamond particles are widely used as particle reinforcements to prepare metal matrix composites, and are also the basic raw materials for the preparation of engineering materials and functional materials. Many scholars at home and abroad are actively working on the application research of diamond particles. In practical applications, it is found that if bare diamond particles are directly added to the metal matrix to prepare reinforced composite materials, the interface wettability will be poor due to the essential difference between the covalent bonds of the diamond particles and the metal bonds of the metal matrix, and the diamond particles will When in contact with the metal matrix, a significant solid-phase reaction will occur at the interface above 800 ° C, resulting in the degradation of diamond particles, generating some products with complex structures at the interface, changing the microstructure of the metal matrix, thereby affecting the bonding status of the interface and The mechanical properties of the material are adversely affected, thereby greatly reducing its comprehensive performance.

If Ni or other metals are compounded on the surface of diamond particles to form a ceramic-metal composite powder, the interface wettability and chemical compatibility between the ceramic and the matrix can be improved. The composite powder is added to the surface of the metal matrix to prepare a surface composite material. The metal elements and the coating can inhibit or delay the reaction between the particles and the matrix, and at the same time form some supporting particle structures around the particles, thereby obtaining a metal matrix with excellent wear resistance. composite material. Therefore, in order to better exert the performance of diamond particles, it is generally necessary to modify the surface to improve its performance, which is also a hot research topic in the fields of materials science, interface and surface science at home and abroad.

At present, in the prior art, the composite of diamond particles and Ni or other metals is mainly realized by electroless plating. The electroless plating method uses a metal salt solution to reduce metal ions to metal under the action of a reducing agent, and obtains a metal deposition layer on the surface of the plated piece. This method has the advantages of simple process, low cost, uniform coating, and good combination with the substrate. Advantages play an important role in particle surface treatment technology. The electroless plating modification of diamond particles disclosed in the prior art requires a series of pretreatments such as oxidation, hydrophilicity, sensitization and activation on the diamond particles. The process is complicated and the drugs used are extremely expensive, which limits the practical production of this method. Applications.

Contents of the invention

In order to solve the above technical problems, the invention discloses a diamond particle whose surface is plated with Ni-P alloy after electroless plating activation treatment and an activation treatment method thereof.

The technical scheme adopted in this application is:

A method for chemically plating Ni-P alloy on the surface of diamond particles, comprising:

(1) Configure the plating solution: prepare the required plating solution for electroless Ni-P alloy plating in proportion;

(2) Heating the plating solution: heat the plating tank containing the prepared plating solution in a constant temperature water bath, and the plating temperature is 80°C to 90°C;

(3) Add diamond particles and stir: directly add the weighed diamond particles into the above-mentioned plating solution, and implement the induced activation treatment, without stirring during the induced activation process;

(4) Plating until the plating solution is tumbling: the plating time is 3 to 5 hours, and the pH value is adjusted to 4.6 to 5.0 until the tumbling phenomenon occurs in the plating solution, and the plating is stopped after the tumbling phenomenon disappears;

(5) After precipitation, filtration and drying, diamond particles coated with Ni-P alloy are obtained.

Further, the formula of plating solution described in step (1) is: nickel sulfate 20-40g/L, sodium hypophosphite 10-30g/L, citric acid 10-30g/L, sodium acetate 5-25g/L, Potassium iodate 0.01-0.05mg/L, sodium dodecylbenzenesulfonate 0.01-0.05mg/L.

Further, the formula of plating solution described in step (1) is: nickel sulfate 28g/L, sodium hypophosphite 20g/L, citric acid 20g/L, sodium acetate 15g/L, potassium iodate 0.02mg/L, Sodium dodecylbenzenesulfonate 0.02mg/L.

Further, in the step (3), a glass rod coated with Ni-P alloy or an iron sheet coated with Ni-P alloy is used to induce activation.

Further, in step (4), 1:5 ammonia water is used to adjust the pH value of the plating solution.

Beneficial effects of the present invention:

The effect of compounding Ni-P alloy on the surface of diamond particles after activation is good, avoiding the complicated treatment before adding diamond particles in the electroless plating process, and only need to activate the plating solution with glass rods or iron sheets that have been plated with Ni-P alloy. Simple process.

Description of drawings

Fig. 1 is the schematic diagram of the diamond particle that is coated with Ni-P alloy through activation treatment surface;

Fig. 2 is a flow chart of a method for chemically plating Ni-P alloy on the surface of diamond particles according to the present invention.

Detailed ways

The diamond particles coated with Ni-P alloy on the surface prepared by the method of the present invention are described in detail in conjunction with FIG. 1. The diamond particles are composed of a diamond particle matrix and a layer of Ni-P alloy elements compounded on the surface of the matrix. The particles can be used as particle reinforcements to prepare metal matrix composite materials, and at the same time, the particles are also basic raw materials for preparing engineering materials and functional materials.

The specific implementation of electroless Ni-P alloy plating on the surface of diamond particles will be described in detail below in conjunction with the accompanying drawings.

Example 1

A method for chemically plating Ni-P alloy on the surface of diamond particles, comprising: (1) configuring plating solution: preparing the required plating solution for chemically plating Ni-P alloy in proportion, and the formula of said plating solution is: nickel sulfate 20g/L , sodium hypophosphite 10g/L, citric acid 10g/L, sodium acetate 5g/L, potassium iodate 0.01mg/L, sodium dodecylbenzenesulfonate 0.01mg/L; (2) Heating the bath: put The plating tank with the prepared plating solution is heated in a constant temperature water bath, and the plating temperature is 80°C; (3) Add diamond particles and stir: directly add the weighed diamond particles into the above plating solution, use the The glass rod coated with Ni-P alloy was induced to activate; (4) Plating until the plating solution was tumbling: the plating time was 3 hours, and the pH value of the plating solution was adjusted with 1:5 ammonia water, and the pH value was adjusted to 4.6 until There is a tumbling phenomenon in the plating solution, and the plating is stopped after the tumbling phenomenon disappears; (5) After precipitation, filtration and drying, diamond particles coated with Ni-P alloy are obtained.

Example 2

A method for chemically plating Ni-P alloy on the surface of diamond particles, comprising: (1) configuring plating solution: preparing the required plating solution for chemically plating Ni-P alloy in proportion, and the formula of said plating solution is: nickel sulfate 28g/L , sodium hypophosphite 20g/L, citric acid 20g/L, sodium acetate 15g/L, potassium iodate 0.02mg/L, sodium dodecylbenzenesulfonate 0.02mg/L; (2) Heating the bath: put The plating tank with the prepared plating solution is heated in a constant temperature water bath, and the plating temperature is 85°C; (3) Add diamond particles and stir: directly add the weighed diamond particles into the above plating solution, use the The glass rod coated with Ni-P alloy was induced to activate; (4) Plating until the plating solution was tumbling: the plating time was 4 hours, and the pH value of the plating solution was adjusted with 1:5 ammonia water, and the pH value was adjusted to 4.8 until There is a tumbling phenomenon in the plating solution, and the plating is stopped after the tumbling phenomenon disappears; (5) After precipitation, filtration and drying, diamond particles coated with Ni-P alloy are obtained.

Example 3

A method for chemically plating Ni-P alloy on the surface of diamond particles, comprising: (1) configuring plating solution: preparing the required plating solution for chemically plating Ni-P alloy in proportion, and the formula of said plating solution is nickel sulfate 40g/L, Sodium hypophosphite 30g/L, citric acid 30g/L, sodium acetate 25g/L, potassium iodate 0.05mg/L, sodium dodecylbenzenesulfonate 0.05mg/L; The plating tank with the prepared plating solution is heated in a constant temperature water bath, and the plating temperature is 90°C; (3) Add diamond particles and stir: directly add the weighed diamond particles into the above plating solution, use the plated A glass rod with Ni-P alloy was used to induce activation; (4) Plating until the plating solution was tumbling: the plating time was 5 hours, and the pH value of the plating solution was adjusted with 1:5 ammonia water, and the pH value was adjusted to 5.0 until the plating solution There is a tumbling phenomenon in the liquid, and the plating is stopped after the tumbling phenomenon disappears; (5) After precipitation, filtration, and drying, diamond particles coated with Ni-P alloy are obtained.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention without limitation. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be Modifications or equivalent replacements without departing from the spirit and scope of the technical solutions of the present invention shall be covered by the claims of the present invention.

Claims (6)

1. a method for diamond particle surface chemical plating Mi-P alloy, comprising:

(1) plating solution is configured: prepare plating solution needed for chemical plating Mi-P alloy in proportion;

(2) plating solution is heated: be placed in water bath with thermostatic control heat being equipped with the coating bath preparing plating solution, plating temperature is 80 DEG C ~ 90 DEG C;

(3) add diamond particles and stir: load weighted diamond particles is directly added in above-mentioned plating solution, carrying out bringing out activation treatment, bring out in reactivation process and need not stir;

(4) plating is seethed to plating solution: plating time is 3 ~ 5 hours, and adjust ph is 4.6 ~ 5.0, until occur in plating solution seething phenomenon, namely stops plating until seethe after phenomenon disappears;

(5) through precipitation, filtration, drying, the diamond particles being coated with Ni-P alloy is obtained.

2. the method for a kind of diamond particle surface chemical plating Mi-P alloy as claimed in claim 1, it is characterized in that: described in step (1), the formula of plating solution is: single nickel salt 20-40g/L, inferior sodium phosphate 10-30g/L, citric acid 10-30g/L, sodium-acetate 5-25g/L, Potassium Iodate 0.01-0.05mg/L, Sodium dodecylbenzene sulfonate 0.01-0.05mg/L.

3. the method for a kind of diamond particle surface chemical plating Mi-P alloy as claimed in claim 1, it is characterized in that: described in step (1), the formula of plating solution is: single nickel salt 28g/L, inferior sodium phosphate 20g/L, citric acid 20g/L, sodium-acetate 15g/L, Potassium Iodate 0.02mg/L, Sodium dodecylbenzene sulfonate 0.02mg/L.

4. the method for a kind of diamond particle surface chemical plating Mi-P alloy as claimed in claim 1, is characterized in that: in step (3), employing has been coated with the glass stick of Ni-P alloy or has adopted the iron plate being coated with Ni-P alloy to implement to bring out activation.

5. the method for a kind of diamond particle surface chemical plating Mi-P alloy as claimed in claim 1, is characterized in that: adopt the ammoniacal liquor of 1: 5 to regulate bath pH value in step (4).

6. the method for a kind of diamond particle surface chemical plating Mi-P alloy as claimed in claim 1, is characterized in that: the diamond particles of the surface chemical plating Ni-P alloy particle that the method prepares is made up of diamond body and the Ni-P alloying element layer that is compounded in matrix surface.