CN104694912A - Method for chemically plating Ni-P alloy on surfaces of diamond particles - Google Patents
Method for chemically plating Ni-P alloy on surfaces of diamond particles Download PDFInfo
- Publication number
- CN104694912A CN104694912A CN201510118258.6A CN201510118258A CN104694912A CN 104694912 A CN104694912 A CN 104694912A CN 201510118258 A CN201510118258 A CN 201510118258A CN 104694912 A CN104694912 A CN 104694912A
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- alloy
- plating
- plating solution
- diamond particles
- diamond
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Links
- 238000007747 plating Methods 0.000 title claims abstract description 91
- 239000002245 particle Substances 0.000 title claims abstract description 63
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 54
- 239000010432 diamond Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 31
- 229910018104 Ni-P Inorganic materials 0.000 title claims abstract description 25
- 229910018536 Ni—P Inorganic materials 0.000 title claims abstract description 25
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 24
- 239000000956 alloy Substances 0.000 title claims abstract description 24
- 230000004913 activation Effects 0.000 claims abstract description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 6
- 238000001914 filtration Methods 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052742 iron Inorganic materials 0.000 claims abstract description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 21
- 239000000126 substance Substances 0.000 claims description 21
- 229910001096 P alloy Inorganic materials 0.000 claims description 19
- 239000011159 matrix material Substances 0.000 claims description 11
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 7
- 150000002815 nickel Chemical class 0.000 claims description 7
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 claims description 7
- 229940093930 potassium iodate Drugs 0.000 claims description 7
- 235000006666 potassium iodate Nutrition 0.000 claims description 7
- 239000001230 potassium iodate Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 239000001632 sodium acetate Substances 0.000 claims description 7
- 229960004249 sodium acetate Drugs 0.000 claims description 7
- 235000017281 sodium acetate Nutrition 0.000 claims description 7
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 7
- 239000001488 sodium phosphate Substances 0.000 claims description 7
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 7
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 5
- 238000001556 precipitation Methods 0.000 claims description 5
- 238000011282 treatment Methods 0.000 claims description 4
- 238000005275 alloying Methods 0.000 claims description 2
- 230000007420 reactivation Effects 0.000 claims description 2
- 239000002131 composite material Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 6
- 239000008204 material by function Substances 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 3
- 230000003213 activating effect Effects 0.000 abstract description 2
- 238000009835 boiling Methods 0.000 abstract 1
- 230000006698 induction Effects 0.000 abstract 1
- 230000001939 inductive effect Effects 0.000 abstract 1
- 230000001376 precipitating effect Effects 0.000 abstract 1
- 230000002787 reinforcement Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 35
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000010671 solid-state reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Abstract
The invention discloses a method for chemically plating a Ni-P alloy on surfaces of diamond particles. The method for chemically plating the Ni-P alloy on the surfaces of the diamond particles comprises the following steps: directly adding weighed diamond particles into a chemically plating Ni-P alloy solution; using a glass rod which is plated with the alloy for inducing and activating a chemically plating solution in a constant temperature water bath; or adding iron pieces which are plated with the alloy for the induction and the activation until occurring a boiling phenomenon; finishing the plating; obtaining the diamond particles plated with the Ni-P alloy element layer by means of precipitating, filtering, drying, and the like. The particles can be used as particle reinforcements for preparing metal-base composite materials. Meanwhile, the particles are a basic raw material for preparing engineering materials and functional materials.
Description
Technical field
The present invention relates to nanoparticle surface processing technology field, especially relate to a kind of method of diamond particle surface chemical plating Mi-P alloy.
Background technology
At present, diamond particles is widely used as reinforced particulate to prepare metal-base composites, is also the basic raw material of preparation engineering material, functional materials simultaneously.Domestic and international many scholars are in the applied research being actively devoted to diamond particles.Find in practical application: prepare reinforced composite if directly naked diamond particles added in metallic matrix, boundary moisture performance can be caused poor because of the essential distinction between the covalent linkage of diamond particles and the metallic bond of metallic matrix, and when diamond particles contacts with metallic matrix, significant solid state reaction can be there is in interface more than 800 DEG C, diamond particles is caused to be degraded, the product that some have complex construction is generated in interface, change the microstructure of metallic matrix, thus disadvantageous effect is caused to the bonding state at interface and the mechanical property of material, thus greatly reduce its over-all properties.
If form ceramic-metal composite granule at diamond particle surface compound Ni or other metal, then can improve the interface wet ability between pottery and matrix and chemical compatibility.Composite granule is joined in metallic matrix top layer and prepare composite surface material, metallic element and coating can suppress or delay the reaction of particle and matrix, form at particle periphery the tissue that some support particle simultaneously, thus obtain the excellent metal-base composites of wear resisting property.Therefore, in order to play the performance of diamond particles better, generally need to modify to improve its performance to its surface, this is also a large hot research problem in the fields such as domestic and international Materials science, interface and Surface Science.
Realize the compound of diamond particles and Ni or other metal mainly through electroless plating in currently available technology.Electroless plating method utilizes metal salt solution to make reducing metal ions become metal under the effect of reductive agent, the surface of plating piece obtains the settled layer of metal, the method has that technique is simple, with low cost, coating evenly, with the advantage such as matrix is combined, there is very consequence in the process for treating surface of particle.Electroless plating disclosed in prior art modifies diamond particles technique all will implement a series of pre-treatments such as oxidation, hydrophilic, sensitization and activation to diamond particles, and process is numerous and diverse, and medicine used is extremely expensive, limits the application of this method in actual production.
Summary of the invention
For solving the problems of the technologies described above, the invention discloses a kind of diamond particles and the activating treatment process thereof that are coated with Ni-P alloy through electroless plating activation treatment rear surface.
The technical scheme that the application adopts is:
A method for diamond particle surface chemical plating Mi-P alloy, comprising:
(1) plating solution is configured: prepare plating solution needed for chemical plating Mi-P alloy in proportion;
(2) plating solution is heated: be placed in water bath with thermostatic control heat being equipped with the coating bath preparing plating solution, plating temperature is 80 DEG C ~ 90 DEG C;
(3) add diamond particles and stir: load weighted diamond particles is directly added in above-mentioned plating solution, implementing to bring out activation treatment, bring out in reactivation process and need not stir;
(4) plating is seethed to plating solution: plating time is 3 ~ 5 hours, and adjust ph is 4.6 ~ 5.0, until occur in plating solution seething phenomenon, namely stops plating until seethe after phenomenon disappears;
(5) through precipitation, filtration, drying, the diamond particles being coated with Ni-P alloy is obtained.
Further, described in step (1), the formula of plating solution is: single nickel salt 20-40g/L, inferior sodium phosphate 10-30g/L, citric acid 10-30g/L, sodium-acetate 5-25g/L, Potassium Iodate 0.01-0.05mg/L, Sodium dodecylbenzene sulfonate 0.01-0.05mg/L.
Further, described in step (1), the formula of plating solution is: single nickel salt 28g/L, inferior sodium phosphate 20g/L, citric acid 20g/L, sodium-acetate 15g/L, Potassium Iodate 0.02mg/L, Sodium dodecylbenzene sulfonate 0.02mg/L.
Further, in step (3), employing has been coated with the glass stick of Ni-P alloy or has adopted the iron plate being coated with Ni-P alloy to implement to bring out activation.
Further, the ammoniacal liquor of 1:5 is adopted to regulate bath pH value in step (4).
Beneficial effect of the present invention:
Diamond particle surface compound Ni-P alliage effect after activation is good, avoids the complex process of carrying out add diamond particles in plating process before, only need with glass stick or the iron plate activation plating solution being coated with Ni-P alloy, and technique is simple.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that activated treat surface is coated with the diamond particles of Ni-P alloy;
Fig. 2 is the method flow diagram of a kind of diamond particle surface chemical plating Mi-P alloy of the present invention.
Embodiment
Composition graphs 1 describes the diamond particles adopting the method for the invention this surface of preparing to be coated with Ni-P alloy in detail, and this diamond particles is made up of diamond particles matrix and the Ni-P alloying element layer that is compounded in matrix surface.This particle can be used as reinforced particulate to prepare metal-base composites, and this particle is also the basic raw material of preparation engineering material, functional materials simultaneously.
The embodiment of diamond particle surface chemical plating Mi-P alloy is described in detail below in conjunction with accompanying drawing.
Embodiment 1
A kind of method of diamond particle surface chemical plating Mi-P alloy, comprise: (1) configuration plating solution: prepare plating solution needed for chemical plating Mi-P alloy in proportion, the formula of described plating solution is: single nickel salt 20g/L, inferior sodium phosphate 10g/L, citric acid 10g/L, sodium-acetate 5g/L, Potassium Iodate 0.01mg/L, Sodium dodecylbenzene sulfonate 0.01mg/L; (2) plating solution is heated: be placed in water bath with thermostatic control heat being equipped with the coating bath preparing plating solution, plating temperature is 80 DEG C; (3) add diamond particles and stir: load weighted diamond particles is directly added in above-mentioned plating solution, adopting the glass stick being coated with Ni-P alloy to carry out bringing out activation; (4) plating is seethed to plating solution: plating time is 3 hours, and adopts the ammoniacal liquor of 1:5 to regulate bath pH value, and adjust ph is 4.6, until occur in plating solution seething phenomenon, namely stops plating until seethe after phenomenon disappears; (5) through precipitation, filtration, drying, the diamond particles being coated with Ni-P alloy is obtained.
Embodiment 2
A kind of method of diamond particle surface chemical plating Mi-P alloy, comprise: (1) configuration plating solution: prepare plating solution needed for chemical plating Mi-P alloy in proportion, the formula of described plating solution is: single nickel salt 28g/L, inferior sodium phosphate 20g/L, citric acid 20g/L, sodium-acetate 15g/L, Potassium Iodate 0.02mg/L, Sodium dodecylbenzene sulfonate 0.02mg/L; (2) plating solution is heated: be placed in water bath with thermostatic control heat being equipped with the coating bath preparing plating solution, plating temperature is 85 DEG C; (3) add diamond particles and stir: load weighted diamond particles is directly added in above-mentioned plating solution, adopting the glass stick being coated with Ni-P alloy to carry out bringing out activation; (4) plating is seethed to plating solution: plating time is 4 hours, and adopts the ammoniacal liquor of 1:5 to regulate bath pH value, and adjust ph is 4.8, until occur in plating solution seething phenomenon, namely stops plating until seethe after phenomenon disappears; (5) through precipitation, filtration, drying, the diamond particles being coated with Ni-P alloy is obtained.
Embodiment 3
A kind of method of diamond particle surface chemical plating Mi-P alloy, comprise: (1) configuration plating solution: prepare plating solution needed for chemical plating Mi-P alloy in proportion, the formula of described plating solution is single nickel salt 40g/L, inferior sodium phosphate 30g/L, citric acid 30g/L, sodium-acetate 25g/L, Potassium Iodate 0.05mg/L, Sodium dodecylbenzene sulfonate 0.05mg/L; (2) plating solution is heated: be placed in water bath with thermostatic control heat being equipped with the coating bath preparing plating solution, plating temperature is 90 DEG C; (3) add diamond particles and stir: load weighted diamond particles is directly added in above-mentioned plating solution, adopting the glass stick being coated with Ni-P alloy to carry out bringing out activation; (4) plating is seethed to plating solution: plating time is 5 hours, and adopts the ammoniacal liquor of 1: 5 to regulate bath pH value, and adjust ph is 5.0, until occur in plating solution seething phenomenon, namely stops plating until seethe after phenomenon disappears; (5) through precipitation, filtration, drying, the diamond particles being coated with Ni-P alloy is obtained.
Finally it should be noted that, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not departing from the spirit and scope of technical solution of the present invention, it all should be encompassed in the middle of right of the present invention.
Claims (6)
1. a method for diamond particle surface chemical plating Mi-P alloy, comprising:
(1) plating solution is configured: prepare plating solution needed for chemical plating Mi-P alloy in proportion;
(2) plating solution is heated: be placed in water bath with thermostatic control heat being equipped with the coating bath preparing plating solution, plating temperature is 80 DEG C ~ 90 DEG C;
(3) add diamond particles and stir: load weighted diamond particles is directly added in above-mentioned plating solution, carrying out bringing out activation treatment, bring out in reactivation process and need not stir;
(4) plating is seethed to plating solution: plating time is 3 ~ 5 hours, and adjust ph is 4.6 ~ 5.0, until occur in plating solution seething phenomenon, namely stops plating until seethe after phenomenon disappears;
(5) through precipitation, filtration, drying, the diamond particles being coated with Ni-P alloy is obtained.
2. the method for a kind of diamond particle surface chemical plating Mi-P alloy as claimed in claim 1, it is characterized in that: described in step (1), the formula of plating solution is: single nickel salt 20-40g/L, inferior sodium phosphate 10-30g/L, citric acid 10-30g/L, sodium-acetate 5-25g/L, Potassium Iodate 0.01-0.05mg/L, Sodium dodecylbenzene sulfonate 0.01-0.05mg/L.
3. the method for a kind of diamond particle surface chemical plating Mi-P alloy as claimed in claim 1, it is characterized in that: described in step (1), the formula of plating solution is: single nickel salt 28g/L, inferior sodium phosphate 20g/L, citric acid 20g/L, sodium-acetate 15g/L, Potassium Iodate 0.02mg/L, Sodium dodecylbenzene sulfonate 0.02mg/L.
4. the method for a kind of diamond particle surface chemical plating Mi-P alloy as claimed in claim 1, is characterized in that: in step (3), employing has been coated with the glass stick of Ni-P alloy or has adopted the iron plate being coated with Ni-P alloy to implement to bring out activation.
5. the method for a kind of diamond particle surface chemical plating Mi-P alloy as claimed in claim 1, is characterized in that: adopt the ammoniacal liquor of 1: 5 to regulate bath pH value in step (4).
6. the method for a kind of diamond particle surface chemical plating Mi-P alloy as claimed in claim 1, is characterized in that: the diamond particles of the surface chemical plating Ni-P alloy particle that the method prepares is made up of diamond body and the Ni-P alloying element layer that is compounded in matrix surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510118258.6A CN104694912B (en) | 2015-03-18 | 2015-03-18 | A kind of method of diamond particle surface Electroless Plating Ni P alloys |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510118258.6A CN104694912B (en) | 2015-03-18 | 2015-03-18 | A kind of method of diamond particle surface Electroless Plating Ni P alloys |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104694912A true CN104694912A (en) | 2015-06-10 |
| CN104694912B CN104694912B (en) | 2018-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510118258.6A Expired - Fee Related CN104694912B (en) | 2015-03-18 | 2015-03-18 | A kind of method of diamond particle surface Electroless Plating Ni P alloys |
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| Country | Link |
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| CN (1) | CN104694912B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109576687A (en) * | 2019-01-21 | 2019-04-05 | 中原工学院 | A kind of formula and technique of diadust chemical nickel plating |
| CN112063874A (en) * | 2020-09-21 | 2020-12-11 | 广东省科学院新材料研究所 | Diamond composite material and preparation method and application thereof |
| CN113832510A (en) * | 2021-09-09 | 2021-12-24 | 张家口原轼新型材料有限公司 | Steel grit with high-phosphorus nickel alloy plated on surface, plating solution, plating process, plating device and steel wire containing steel grit |
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| CN101962765A (en) * | 2010-10-29 | 2011-02-02 | 宁波江丰电子材料有限公司 | Nickel plating method |
| CN102392231A (en) * | 2011-09-30 | 2012-03-28 | 许鹤鸣 | Method for coating membranes on artificial diamond particles |
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| CN103882492A (en) * | 2014-02-24 | 2014-06-25 | 哈尔滨工程大学 | Chemical plating posttreatment method of metallic matrix |
-
2015
- 2015-03-18 CN CN201510118258.6A patent/CN104694912B/en not_active Expired - Fee Related
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109576687A (en) * | 2019-01-21 | 2019-04-05 | 中原工学院 | A kind of formula and technique of diadust chemical nickel plating |
| CN112063874A (en) * | 2020-09-21 | 2020-12-11 | 广东省科学院新材料研究所 | Diamond composite material and preparation method and application thereof |
| CN113832510A (en) * | 2021-09-09 | 2021-12-24 | 张家口原轼新型材料有限公司 | Steel grit with high-phosphorus nickel alloy plated on surface, plating solution, plating process, plating device and steel wire containing steel grit |
| CN113832510B (en) * | 2021-09-09 | 2023-03-10 | 张家口原轼新型材料股份有限公司 | Steel grit with surface plated with high-phosphorus nickel alloy, plating solution, plating process, plating device and steel wire containing steel grit |
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| Publication number | Publication date |
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| CN104694912B (en) | 2018-04-10 |
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