CN104690839A - Improved silicon chip shovel - Google Patents

Improved silicon chip shovel Download PDF

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Publication number
CN104690839A
CN104690839A CN201310661019.6A CN201310661019A CN104690839A CN 104690839 A CN104690839 A CN 104690839A CN 201310661019 A CN201310661019 A CN 201310661019A CN 104690839 A CN104690839 A CN 104690839A
Authority
CN
China
Prior art keywords
shovel
core
silicon chip
spade
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310661019.6A
Other languages
Chinese (zh)
Inventor
武卫
闫继增
王力
石明
孙晨光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Zhonghuan Semiconductor Joint Stock Co Ltd
Tianjin Zhonghuan Advanced Material Technology Co Ltd
Original Assignee
Tianjin Zhonghuan Semiconductor Joint Stock Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin Zhonghuan Semiconductor Joint Stock Co Ltd filed Critical Tianjin Zhonghuan Semiconductor Joint Stock Co Ltd
Priority to CN201310661019.6A priority Critical patent/CN104690839A/en
Publication of CN104690839A publication Critical patent/CN104690839A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention provides an improved silicon chip shovel which comprises a shovel handle and a shovel core, wherein the shovel core is embedded in one end of the shovel handle through a connecting bolt. The improved silicon chip shovel is characterized in that the shovel core is rectangular, two connecting through holes are formed in the direction, perpendicular to the shovel handle, in the middle of the shovel core, and the two surfaces, perpendicular to the shovel handle, of the shovel core are sharp surfaces. The silicon chip shovel is improved on the structure and the materials of the shovel core based on an original technology, has the advantages of being high in wear resistance, good in toughness, long in service life and the like and particularly solves the problems of easiness in abrasion, blunting and the like when an original silicon chip shovel is in contact with a silicon chip with high hardness, the consumption of auxiliary materials is reduced, the excellent silicon chip quality rate is improved, and the production cost is reduced.

Description

A kind of silicon chip shovel of improvement
Technical field
The invention relates to a kind of silicon chip shovel of improvement.
Background technology
The acceptance rate of semiconductor monocrystal Silicon Wafer silicon wafer production line reduces the key of manufacturing cost, wherein most operation is all completed by equipment, and the download of silicon chip sheerly manual operation, due to this operation, it directly affects the acceptance rate of product, is therefore a relatively important link.And then the instrument (silicon chip shovel) downloading silicon chip also seems particularly important.In actual production, the material of silicon chip shovel after with the operation of structure and employee, specification etc. directly can cause polishing silicon chip fracture, collapse limit, rub the problems such as wound, thus directly affect the acceptance rate of product.Therefore, when employee's working specification, the material that silicon chip produces directly can affect the acceptance rate of product with structure.
The structure of silicon chip shovel is mainly divided into spade to follow shovel core.Do not have too high requirement to the material of spade with structure, and the material of shoveling core directly can affect the yield after silicon wafer polishing, if the material of shovel core is unreasonable with structure, after can directly causing polishing, silicon chip collapses limit, even fractures.The main material that present silicon chip shovel shovels core is the polymeric material of vinyl is a kind of amorphism material, uses widely, through adding stabilizing agent, lubricant, toner etc.; Make it have stability, low flammability etc.But the feature of the polymeric material of vinyl has: good mechanical performance, acid and alkali-resistance, chemical stability are good, softening point is low.Be exactly because its softening point is low, when the shovel core of silicon chip shovel easily wear and tear when contacting the silicon chip of high rigidity, rust etc.Current silicon chip shovel spade is about 14cm, and shovel core is about 5cm.Be bumped into spade be about 2cm and fix, the wide about 3cm of shovel core, sharp plane is processed in shovel core outer end, and specification is single, and the silicon chip result of use for different size is not good.In addition, as shown in Figure 3 and Figure 4, the structure of present shovel core is sharp, is embedded in spade by stubbed one side, and centre is fixed with two screws.This shovel core sharp looking like after fruit damages just need the shovel core that more renews, be unfavorable for cost-saving.
Summary of the invention
The problem that the invention will solve is the deficiency existed for prior art, provides a kind of silicon chip of improvement to shovel.
For solving the problems of the technologies described above, the technical scheme that the invention adopts is: a kind of silicon chip shovel of improvement, comprise spade 1 and shovel core 2, shovel core 2 is embedded in one end of spade 1 by connecting bolt 3, described shovel core 2 is rectangle shovel core, the direction vertical with spade 1, centre of shovel core 2 has been arranged side by side two through holes 4, and described shovel core 2 to be fixed with described spade 1 by described through hole 4 and two faces shoveling core 2 vertical with spade 1 are all sharp.
Preferably, described shovel core 2 is made by ethylene-tetrafluoroethylene copolymer.
The advantage that the invention has and good effect are: this silicon chip shovel is on the basis of original technology, the structure and material of shoveling core are improved, there is the advantages such as high-wearing feature, good toughness, long service life, especially the problems such as original silicon chip shovel easily weares and teares when contacting the silicon chip of high rigidity, rust are overcome, reduce the consumption of auxiliary material, improve the acceptance rate of Si wafer quality, and reduce production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the silicon chip shovel of the invention;
Fig. 2 is the structural representation shoveling core in the silicon chip shovel of the invention;
Fig. 3 is the structural representation of existing silicon chip shovel;
Fig. 4 is the structural representation shoveling core in the structure of existing silicon chip shovel.
Detailed description of the invention
The invention discloses a kind of silicon chip shovel of improvement, as depicted in figs. 1 and 2, comprise spade 1 and shovel core 2, shovel the centre of core 2 and the direction vertical with spade 1 be arranged side by side two through holes 4, connecting bolt 3 is embedded in one end of spade 1 through the through hole 4 shoveling core 2, shovel core 2 is rectangle shovel core, and two faces shoveling core 2 vertical with spade 1 are all sharp.The main material optimal ethylene-TFE copolymer of shovel core 2, this resin is very tough and tensile fluoropolymer, has the advantages such as heat-resisting, sliding resistance, chemical resistance, high abrasion resistance, high tenacity.
The structure of present shovel core is sharp on one side, is embedded in spade, fixes stubbed one side in the middle of stubbed one side with two screws.The two sides of shovel core is all processed into sharp by the invention, and according to the size spade reasonable in design of shovel core, in use, if after the one side of shovel core damages, can also use another side, reach the effect that is shoveled core twice use, saved cost.
In addition, the silicon chip of the invention shovel can also according in use procedure and different demand makes the shovel core and spade that are suitable for the different size applied, play the result of use of its optimum.
Above the embodiment of the invention has been described in detail, but described content being only the preferred embodiment of the invention, can not being considered to for limiting practical range of the present invention.All equalizations done according to the invention scope change and improve, and all should still belong within this patent covering scope.

Claims (2)

1. the silicon chip shovel improved, comprise spade (1) and shovel core (2), shovel core (2) is embedded in one end of spade (1) by connecting bolt (3), it is characterized in that: described shovel core (2) is rectangle shovel core, the direction vertical with spade (1), centre of shovel core (2) two through holes (4) have been arranged side by side, described shovel core (2) is fixed by described through hole (4) and described spade (1), and two faces shoveling core (2) vertical with spade (1) are all sharp.
2. silicon chip shovel according to claim 1, is characterized in that: described shovel core (2) is made by ethylene-tetrafluoroethylene copolymer.
CN201310661019.6A 2013-12-05 2013-12-05 Improved silicon chip shovel Pending CN104690839A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310661019.6A CN104690839A (en) 2013-12-05 2013-12-05 Improved silicon chip shovel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310661019.6A CN104690839A (en) 2013-12-05 2013-12-05 Improved silicon chip shovel

Publications (1)

Publication Number Publication Date
CN104690839A true CN104690839A (en) 2015-06-10

Family

ID=53338585

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310661019.6A Pending CN104690839A (en) 2013-12-05 2013-12-05 Improved silicon chip shovel

Country Status (1)

Country Link
CN (1) CN104690839A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3518758A (en) * 1967-10-24 1970-07-07 Robert A Bennett Utility knife with movable and rotatable blade
CN2299085Y (en) * 1997-04-17 1998-12-02 孟祥峰 Integral super-long glass reinforced plastic slicker
CN2345329Y (en) * 1998-06-05 1999-10-27 李洪奇 Combined double-edge kitchen knife
CN202058708U (en) * 2011-05-12 2011-11-30 上海申和热磁电子有限公司 Scraper knife for stripping silicon chip
CN202536064U (en) * 2012-04-27 2012-11-21 宿迁洪祥饲料科技有限公司 Cutting device for feed granulator
CN203125545U (en) * 2012-12-30 2013-08-14 张文强 Double-edged knife
CN203579913U (en) * 2013-12-05 2014-05-07 天津中环领先材料技术有限公司 Improved silicon wafer shovel

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3518758A (en) * 1967-10-24 1970-07-07 Robert A Bennett Utility knife with movable and rotatable blade
CN2299085Y (en) * 1997-04-17 1998-12-02 孟祥峰 Integral super-long glass reinforced plastic slicker
CN2345329Y (en) * 1998-06-05 1999-10-27 李洪奇 Combined double-edge kitchen knife
CN202058708U (en) * 2011-05-12 2011-11-30 上海申和热磁电子有限公司 Scraper knife for stripping silicon chip
CN202536064U (en) * 2012-04-27 2012-11-21 宿迁洪祥饲料科技有限公司 Cutting device for feed granulator
CN203125545U (en) * 2012-12-30 2013-08-14 张文强 Double-edged knife
CN203579913U (en) * 2013-12-05 2014-05-07 天津中环领先材料技术有限公司 Improved silicon wafer shovel

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Application publication date: 20150610