CN104681473B - The delivery track of semiconductor packaging device and its semiconductor packaging device of application - Google Patents
The delivery track of semiconductor packaging device and its semiconductor packaging device of application Download PDFInfo
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- CN104681473B CN104681473B CN201310639397.4A CN201310639397A CN104681473B CN 104681473 B CN104681473 B CN 104681473B CN 201310639397 A CN201310639397 A CN 201310639397A CN 104681473 B CN104681473 B CN 104681473B
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- packaging device
- side wall
- mat piece
- semiconductor packaging
- delivery track
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Abstract
The delivery track and semiconductor packaging device of semiconductor packaging device provided by the invention, for conveying the packaging frame equipped with semiconductor devices, track includes：Rail body, equipped with deep gouge, the deep gouge includes the side wall for being located at side and the bottom surface for transmitting the packaging frame；Mat piece is located at the rail body bottom surface and positioned at the opposite side of the side wall, and the mat piece can make the movement closer or far from the side wall in the plane of the bottom surface, and formation width coordinates the conveying trough of the semiconductor devices between the side wall；At least one elastic pressure parts, it is adjustably located at the rail body up and down and positioned at the outside of the mat piece, it is pressed in elastically deformable on the packaging frame in the conveying trough, so as to adjust the Width x Height of transmission track to adapt to various sizes of packaging frame, realize the sky high cost for simply, saving track transformation.
Description
Technical field
The present invention relates to semiconductor packaging device technical field, delivery track more particularly to semiconductor packaging device and
Its semiconductor packaging device applied.
Background technology
Existing semiconductor product mainly relies on frame to enter equipment rail in encapsulation process, and encapsulation in the process is set
For track for the length of frame, wide and thickness has special limitation, and due to there is preformed on some extraordinary encapsulating products frames
Envelope body is so as to cannot meet the requirement of equipment rail, and the thickness of plastic-sealed body has reached 8.94mm on some frames, so as to cause
Pre-plastic package frame cannot be introduced into equipment rail slot.
And if to change equipment rail, very expensive, cost greatly increases.
Invention content
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide the conveyor tracks of semiconductor packaging device
Road and its semiconductor packaging device of application solve existing semiconductor packaging device track to different scale semiconductor packaging frames
The problem of poor compatibility.
In order to achieve the above objects and other related objects, the present invention provides a kind of delivery track of semiconductor packaging device,
For conveying the packaging frame equipped with semiconductor devices, including：Rail body, equipped with deep gouge, the deep gouge includes being located at side
Side wall and bottom surface for transmitting the packaging frame；Mat piece is located at the rail body bottom surface and positioned at the side wall
Opposite side, the mat piece can make the movement closer or far from the side wall in the plane of the bottom surface, with the side
Formation width coordinates the conveying trough of the semiconductor devices between wall；At least one elastic pressure parts are adjustably located at the rail up and down
Road main body and the outside for being located at the mat piece, are pressed in elastically deformable on the packaging frame in the conveying trough.
Preferably, the mat piece is equipped with the first slide opening opened up along the vertical sidewall direction, and first slide opening is worn
The first fixing piece for having dimensional fits opposite can simultaneously slide, and first fixing piece passes through first slide opening and is fixed on described
Rail body.
Preferably, the elastic pressure parts are equipped with the second slide opening opened up along the vertical bottom surface direction, second slide opening
The second fixing piece for being equipped with dimensional fits opposite can simultaneously slide, and second fixing piece passes through second slide opening and is fixed on
The rail body.
Preferably, the packaging frame in the conveying trough includes：It splits in the semiconductor devices both sides and along the biography
Two frames that slot direction is sent to extend, two frames are respectively erected on the side wall of the deep gouge and in the mat piece,
The elastic pressure parts include at least a pair of elastic presser feet, and the pair of elasticity presser feet is pressed respectively against on two frames.
It is further preferred that the Sidewall Height of the mat piece and the deep gouge flushes.
Preferably, notch of the opening towards the elastic pressure parts is equipped on the outside of the mat piece, the notch opens up direction and puts down
Row opens up direction in first slide opening.
Preferably, the rail body has the upstream end entered for the packaging frame, the deep gouge at the upstream end
Side wall be equipped with wedge-shaped part.
Preferably, mat piece is equipped with the recessing groove for stretching into soldering tip.
Preferably, the mat piece is fixed on the rail body bottom surface by screw lock mode.
The present invention also provides a kind of semiconductor packaging device, including at least one one of above-mentioned semiconductor packaging device
Delivery track.
As described above, the delivery track and semiconductor packaging device of semiconductor packaging device provided by the invention, for defeated
The packaging frame equipped with semiconductor devices is sent, track includes：Rail body, equipped with deep gouge, the deep gouge includes being located at side
Side wall and the bottom surface for transmitting the packaging frame；Mat piece is located at the rail body bottom surface and positioned at the side wall
Opposite side, the mat piece can make the movement closer or far from the side wall in the plane of the bottom surface, with the side wall
Between formation width coordinate the conveying trough of the semiconductor devices；At least one elastic pressure parts are adjustably located at the track up and down
Main body and the outside for being located at the mat piece, are pressed in elastically deformable on the packaging frame in the conveying trough, so as to adjust
The Width x Height of transmission track is saved to adapt to various sizes of packaging frame, realizes the sky high cost for simply, saving track transformation.
Description of the drawings
Fig. 1 is the partial structural diagram of the embodiment of the delivery track of the semiconductor packaging device of the present invention.
Fig. 2 is the application principle figure of the embodiment of the delivery track of the semiconductor packaging device of the present invention.
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Disclosed content understands other advantages and effect of the present invention easily.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also be based on different viewpoints with application, without departing from
Various modifications or alterations are carried out under the spirit of the present invention.
Referring to Fig. 1, a kind of delivery track 1 of semiconductor packaging device provided by the invention, partly leads for conveying to be equipped with
The packaging frame 2 of body device 21, including：Rail body 11, mat piece 12, elastic pressure parts 13.In the present embodiment, the semiconductor
Device 21 can externally protrude out in the packaging frame 2, certainly not so limited.
The rail body 11, equipped with deep gouge, the deep gouge includes being located at the side wall 111 of side and for transmitting
State the bottom surface 112 of packaging frame 2.In the present embodiment, the bottom surface 112 can set transmission crawler belt.
The mat piece 12 is located at 11 bottom surface 112 of rail body and positioned at the opposite side of the side wall 111, described
Mat piece 12 can make the movement closer or far from the side wall 111 in the plane of the bottom surface 112, between the side wall 111
Formation width coordinates the conveying trough of the semiconductor devices 21 of the evagination, without shaking the semiconductor devices 21.At this
In embodiment, the mat piece 12 can be plate or sheet；Preferably, the mat piece 12 is equipped with along vertical 111 side of side wall
To the first slide opening 121 opened up, first slide opening 121 is equipped with the first fixing piece 122 of dimensional fits and opposite can slide,
First fixing piece 122 passes through first slide opening 121 and is fixed on the rail body 11.
The elastic pressure parts 13 are adjustably located at the rail body 11 and positioned at the outside of the mat piece 12 up and down, can
It is pressed in elastic deformation on the packaging frame 2 in the conveying trough.In the present embodiment, the elastic pressure parts 13 can be 1 or
It is multiple that meet different demands, the elastic pressure parts 13 are equipped with the second slide opening 131 opened up along vertical 112 direction of bottom surface,
Second slide opening 131 is equipped with the second fixing piece 132 of dimensional fits and opposite can slide, and second fixing piece 132 is worn
It crosses second slide opening 131 and is fixed on the rail body 11.
Preferably, in the present embodiment, first and second described fixing piece（122,132）Can be screw or bolt, and
First slide opening, 121 and second slide opening 131 can be stepped hole, the stepped hole upper dimension and the nut of screw or bolt
Cooperation, the stud dimensional fits of stepped hole lower dimension and screw, can both realize it is described it is opposite slide, can not also can allow nut
Be exposed to 121 or second slide opening 131 of the first slide opening, without because collide, hook to due to cause some adverse consequences.
It should be noted that in other embodiments, 121 and second slide opening 131 of the first slide opening or other shapes
Shape, such as T-shaped or cross, enrich the direction of the slip, and application range is wider, can all be realized with those skilled in the art
Subject to.
In the present embodiment, the packaging frame 2 in the conveying trough includes：Split in 21 both sides of semiconductor devices and
Along the conveying trough direction extend two frames, two frames be respectively erected on the side wall 111 of the deep gouge and
In the mat piece 12, the elastic pressure parts 13 include at least a pair of elastic presser feet 133, and the pair of elasticity presser feet 133 is pressed respectively
On two frames, in other embodiments, if 2 size of the packaging frame is larger, elastic presser feet can also be increased
133 quantity rather than as limit；It is further preferred that the mat piece 12 and 111 height of side wall of the deep gouge flush, such as
This can keep flat packaging frame 2, certainly not so limited without shaking.
In the present embodiment, also：
Preferably, 12 outside of mat piece is equipped with notch 123 of the opening towards the elastic pressure parts 13, the notch 123
It opens up and is oriented parallel to first slide opening 121 and opens up direction, when side wall 111 of the mat piece 12 far from the deep gouge slides
When, the elastic pressure parts 13 can enter notch 123 from the opening, and so as to keep off mat piece 12, mat piece 12 sets notch
123 be advantageous in that eliminate originally between mat piece 12 and elastic pressure parts 13 need to there are avoid keep off mat piece 12 in slip
Gap substantially reduces design difficulty.
Preferably, the rail body 11 has the upstream end entered for the packaging frame 2, heavy at the upstream end
The side wall 111 of slot is equipped with wedge-shaped part, facilitates the importing of packaging frame 2 without clashing and breaking.
Preferably, mat piece 12 is equipped with for stretching into soldering tip to the recessing groove, a depthkeeping i other words recessing groove is recessed
It spends and exposes semiconductor devices 21, so as to the processing such as weld from recessing groove without clashing and breaking soldering tip.
Preferably, the mat piece 12 is fixed on 11 bottom surface 112 of rail body by screw lock mode, as set in mat piece 12
Screw hole is put, is locked by screw in the bottom surface 112, other fixed structures can also be used certainly, as long as being moved in the mat piece 12
It can be fixed after moving to suitable position or only by the friction between above-mentioned first fixing piece, 122 and first slide opening 121
Power also may be used；Similarly, between the second fixing piece 132 and the second slide opening 131 be also can by tighten the second fixing piece 132 i.e. screw or
Bolt fixes relative position to strengthen frictional force.
As shown in Fig. 2, therefore, 1 operation principles of delivery track of semiconductor packaging device of the invention：Packaging frame 2 can
It is moved by A directions along track 1, the mat piece 12 can be moved to along B directions or negative direction needs position, and the elastic pressure parts 13 can
Being moved to along C directions or negative direction needs position.
The present invention also provides a kind of semiconductor packaging device, including at least one one of above-mentioned semiconductor packaging device
Delivery track 1, it is preferred that three tracks can be included, input section, interlude, deferent segment can only be set in the input section
1 elastic pressure parts 13, and 2 elastic pressure parts 13 are set in the interlude, elastic pressure parts 13 can be not provided in deferent segment, when
So this is only to be illustrated, not so limited.
In conclusion the delivery track and semiconductor packaging device of semiconductor packaging device provided by the invention, for defeated
The packaging frame equipped with semiconductor devices is sent, track includes：Rail body, equipped with deep gouge, the deep gouge includes being located at side
Side wall and the bottom surface for transmitting the packaging frame；Mat piece is located at the rail body bottom surface and positioned at the side wall
Opposite side, the mat piece can make the movement closer or far from the side wall in the plane of the bottom surface, with the side wall
Between formation width coordinate the conveying trough of the semiconductor devices；At least one elastic pressure parts are adjustably located at the track up and down
Main body and the outside for being located at the mat piece, are pressed in elastically deformable on the packaging frame in the conveying trough, so as to adjust
The Width x Height of transmission track is saved to adapt to various sizes of packaging frame, realizes the sky high cost for simply, saving track transformation.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as
Into all equivalent modifications or change, should by the present invention claim be covered.
Claims (9)
1. a kind of delivery track of semiconductor packaging device, for conveying the packaging frame equipped with semiconductor devices, feature exists
In, including：
Rail body, equipped with deep gouge, the deep gouge includes the side wall for being located at side and the bottom for transmitting the packaging frame
Face；
Mat piece is located at the rail body bottom surface and positioned at the opposite side of the side wall, and the mat piece can be in the bottom surface
Make the movement closer or far from the side wall in plane, formation width coordinates the biography of the semiconductor devices between the side wall
Send slot；
At least one elastic pressure parts are adjustably located at the rail body and positioned at the outside of the mat piece up and down, can elastic shape
It is pressed on the packaging frame in the conveying trough with becoming,
The elastic pressure parts are equipped with the second slide opening opened up along the vertical bottom surface direction, and second slide opening is equipped with size and matches
The second fixing piece closed opposite can simultaneously slide, and second fixing piece passes through second slide opening and is fixed on the track master
Body, the elastic pressure parts include at least a pair of elastic presser feet, and the pair of elasticity presser feet is pressed respectively against two sides of packaging frame
On frame.
2. the delivery track of semiconductor packaging device according to claim 1, which is characterized in that the mat piece is equipped with along vertical
The first slide opening that the straight sidewall direction opens up, the first fixing piece that first slide opening is equipped with dimensional fits can simultaneously be slided relatively
It is dynamic,
First fixing piece passes through first slide opening and is fixed on the rail body.
3. the delivery track of semiconductor packaging device according to claim 1, which is characterized in that the envelope in the conveying trough
The frame that frames up includes：It splits in the semiconductor devices both sides and two frames extending along the conveying trough direction, described two
Frame is respectively erected on the side wall of the deep gouge and in the mat piece.
4. the delivery track of semiconductor packaging device according to claim 3, which is characterized in that the mat piece and described heavy
The Sidewall Height of slot flushes.
5. the delivery track of semiconductor packaging device according to claim 2, which is characterized in that be equipped on the outside of the mat piece
The notch being open towards the elastic pressure parts, the notch, which opens up, to be oriented parallel to first slide opening and opens up direction.
6. the delivery track of semiconductor packaging device according to claim 1, which is characterized in that the rail body has
For the upstream end that the packaging frame enters, the side wall of the deep gouge at the upstream end is equipped with wedge-shaped part.
7. the delivery track of semiconductor packaging device according to claim 1, which is characterized in that mat piece is equipped with for stretching into weldering
The recessing groove of head.
8. the delivery track of semiconductor packaging device according to claim 1, which is characterized in that the mat piece passes through screw lock
Mode is fixed on the rail body bottom surface.
9. a kind of semiconductor packaging device, which is characterized in that such as described in any item of the claim 1 to 8 including at least one
The delivery track of semiconductor packaging device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310639397.4A CN104681473B (en) | 2013-12-02 | 2013-12-02 | The delivery track of semiconductor packaging device and its semiconductor packaging device of application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310639397.4A CN104681473B (en) | 2013-12-02 | 2013-12-02 | The delivery track of semiconductor packaging device and its semiconductor packaging device of application |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104681473A CN104681473A (en) | 2015-06-03 |
| CN104681473B true CN104681473B (en) | 2018-07-06 |
Family
ID=53316353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310639397.4A Active CN104681473B (en) | 2013-12-02 | 2013-12-02 | The delivery track of semiconductor packaging device and its semiconductor packaging device of application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104681473B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4624358A (en) * | 1983-03-07 | 1986-11-25 | Tokyo Shibaura Denki Kabushiki Kaisha | Device for transferring lead frame |
| US4958722A (en) * | 1988-08-25 | 1990-09-25 | Kabushiki Kaisha Toshiba | Transfer apparatus for lead frame |
| CN203277340U (en) * | 2013-04-28 | 2013-11-06 | 无锡华润安盛科技有限公司 | Carrier structure for semiconductor package conveying system |
-
2013
- 2013-12-02 CN CN201310639397.4A patent/CN104681473B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4624358A (en) * | 1983-03-07 | 1986-11-25 | Tokyo Shibaura Denki Kabushiki Kaisha | Device for transferring lead frame |
| US4958722A (en) * | 1988-08-25 | 1990-09-25 | Kabushiki Kaisha Toshiba | Transfer apparatus for lead frame |
| CN203277340U (en) * | 2013-04-28 | 2013-11-06 | 无锡华润安盛科技有限公司 | Carrier structure for semiconductor package conveying system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104681473A (en) | 2015-06-03 |
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