CN104681275A - Novel metallized film for capacitor - Google Patents

Novel metallized film for capacitor Download PDF

Info

Publication number
CN104681275A
CN104681275A CN201510123205.3A CN201510123205A CN104681275A CN 104681275 A CN104681275 A CN 104681275A CN 201510123205 A CN201510123205 A CN 201510123205A CN 104681275 A CN104681275 A CN 104681275A
Authority
CN
China
Prior art keywords
region
sheet resistance
area
metallized film
resistance value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510123205.3A
Other languages
Chinese (zh)
Inventor
严文清
黄海荣
李钢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NANTONG SUNION ELECTRONIC CO Ltd
Original Assignee
NANTONG SUNION ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NANTONG SUNION ELECTRONIC CO Ltd filed Critical NANTONG SUNION ELECTRONIC CO Ltd
Priority to CN201510123205.3A priority Critical patent/CN104681275A/en
Publication of CN104681275A publication Critical patent/CN104681275A/en
Priority to PCT/CN2016/075765 priority patent/WO2016150298A1/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/008Selection of materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/015Special provisions for self-healing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors 

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention discloses a novel metallized film for a capacitor. The novel metallized film comprises a base film and a metal layer, wherein the metal layer is evaporated on the base film 1; the metal layer is an aluminum layer, a zinc layer or a zinc-aluminum alloy layer; a blank area without a metallized layer is arranged at one end in the width direction the base film 1; the metal layer consists of an area 1, an area 2 and an area 3 according to square resistance values, the area 1 is an edge thickening area, the area 2 is a low square resistance area, the area 3 is located on the metallized film, the square resistance of the area 3 is greater than or equal to that of the area 2, the square resistance of the area 2 is greater than or equal to that of the area 1, and the square resistance values are in a step form. The novel metallized film has the advantages of high voltage resistance and high resistance to ripple current.

Description

A kind of novel capacitor metallized film
technical field:
The present invention relates to capacitor technology field, particularly a kind of novel capacitor metallized film.
background technology:
Existing metallic film capacitor, at membrane surface even evaporation layer of metal layer, edge thickeies one deck once again, have the following disadvantages: (1) is withstand voltage high product, because coating is thinner, bear ripple current scarce capacity, and product in use easily oxidation cause product capacity decline, loss rise; (2) bear the product that ripple current ability is strong, because coating is thicker, self-healing ability is poor, causes that product is resistance to be forced down.Existing metallic film capacitor presses resistance to and bear in ripple current ability and can not get both, and there is inverse ratio phenomenon, withstand voltage higher, and it is poorer to bear ripple current ability; Otherwise, better.Existing withstand voltage high product coating is generally zinc-aluminium simultaneously, and sheet resistance is generally at 30 more than Ω, and coating is thin, is very easily oxidized, and causes product premature failure.
summary of the invention:
The object of the invention is to overcome above deficiency, relating to a kind of novel metal film for making capacitor, thus make product have withstand voltage height simultaneously, to bear ripple current ability strong, and the advantage such as not oxidizable.
Object of the present invention is achieved through the following technical solutions: a kind of novel capacitor metallized film, comprise basement membrane and metal level, on basement membrane, evaporation has metal level, metal level is aluminium lamination, zinc layers or allumen layer, and the limit, one end of the Width of basement membrane is provided with the clear area of non-metal cladding, and the width of described clear area is 2-4mm, metal level is made up of region 1, region 2 and region 3 according to sheet resistance value size, region 1 is thickened area, edge, and width is 3 ~ 10mm, and sheet resistance value is 3-8 Ω; Region 2 is low square resistance district, and width is 1/4 ~ 1/2 of basement membrane overall length, and sheet resistance value is 4-20 Ω; Region 3 is high square resistance district, and sheet resistance value is greater than 10 Ω; And on a metallized film, region 3 sheet resistances >=region 2 sheet resistances >=region 1 sheet resistance, sheet resistance value presents stepped.
The advantage that the present invention compared with prior art has:
1, this staged evaporation mode, thickened area, edge 2-1 is wider than the thickened area of conventional evaporation mode, and sheet resistance is lower, so equivalent series resistance is little on electrode is drawn, the loss of product is little;
2, this kind of structure capacitor core that reels out, its self-healing ability, withstand voltage level determine primarily of high square resistance district, region 3, the employing fine aluminium evaporation in region 3, and coating is thin, and sheet resistance is high, and self-healing ability will be stronger, and withstand voltage will be higher;
3, this staged evaporation mode, region 1, region 2 coating all thickeies, the coat of metal on the whole resistance shows less than conventional evaporation mode, therefore product is when bearing same ripple current, heating will be less, and temperature rise will be lower, so it will be stronger that kind structure bears ripple current ability;
4, this staged evaporation mode, region 1 and region 2 are for being generally the thicker zinc-aluminium metal level of the less coating of sheet resistance, and the film of the same voltage withstand class of conventional evaporation mode is generally the thinner zinc-aluminium metal level of the higher coating of sheet resistance, zinc metal is very easily oxidized in malaria, therefore the thinner embodiment of the higher coating of sheet resistance is more obvious, so staged evaporation mode in oxidation resistance advantageously.
accompanying drawing illustrates:
Fig. 1 is structural representation of the present invention;
Fig. 2 is sectional drawing of the present invention;
Number in the figure: 1-basement membrane, 2-metal level, 3-clear area, 2-1-region 1,2-2-region 2,2-3-region 3.
embodiment:
In order to deepen the understanding of the present invention, below in conjunction with embodiment and accompanying drawing, the invention will be further described, and this embodiment only for explaining the present invention, does not form limiting the scope of the present invention.
As Fig. 1-2 shows the embodiment of a kind of novel capacitor metallized film of the present invention:
Embodiment 1
Comprise basement membrane 1 and metal level 2, on basement membrane 1, evaporation has metal level 2, metal level 2 is aluminium lamination, zinc layers or allumen layer, the limit, one end of the Width of basement membrane 1 is provided with the clear area 3 of non-metal cladding 2, the width of clear area 3 is 2mm, and metal level 2 is made up of region 1, region 2 and region 3 according to sheet resistance value size, and region 1 is thickened area, edge, width is 3mm, and sheet resistance value is 3 Ω; Region 2 is low square resistance district, and width is 1/4 ~ 1/2 of basement membrane 1 overall length, and sheet resistance value is for being 4 Ω; Region 3 is high square resistance district, and sheet resistance value is 11 Ω; And on a metallized film, region 3 sheet resistances >=region 2 sheet resistances >=region 1 sheet resistance, sheet resistance value presents stepped.
Embodiment 2
Comprise basement membrane 1 and metal level 2, on basement membrane 1, evaporation has metal level 2, metal level 2 is aluminium lamination, zinc layers or allumen layer, the limit, one end of the Width of basement membrane 1 is provided with the clear area 3 of non-metal cladding 2, the width of clear area 3 is 3mm, and metal level 2 is made up of region 1, region 2 and region 3 according to sheet resistance value size, and region 1 is thickened area, edge, width is 5mm, and sheet resistance value is 4 Ω; Region 2 is low square resistance district, and width is 1/4 ~ 1/2 of basement membrane 1 overall length, and sheet resistance value is for being 10 Ω; Region 3 is high square resistance district, and sheet resistance value is 20 Ω; And on a metallized film, region 3 sheet resistances >=region 2 sheet resistances >=region 1 sheet resistance, sheet resistance value presents stepped.
Embodiment 3
Comprise basement membrane 1 and metal level 2, on basement membrane 1, evaporation has metal level 2, metal level 2 is aluminium lamination, zinc layers or allumen layer, the limit, one end of the Width of basement membrane 1 is provided with the clear area 3 of non-metal cladding 2, the width of clear area 3 is 3.5mm, and metal level 2 is made up of region 1, region 2 and region 3 according to sheet resistance value size, and region 1 is thickened area, edge, width is 7.5mm, and sheet resistance value is 6 Ω; Region 2 is low square resistance district, and width is 1/4 ~ 1/2 of basement membrane 1 overall length, and sheet resistance value is for being 15 Ω; Region 3 is high square resistance district, and sheet resistance value is 30 Ω; And on a metallized film, region 3 sheet resistances >=region 2 sheet resistances >=region 1 sheet resistance, sheet resistance value presents stepped.
Embodiment 4
Comprise basement membrane 1 and metal level 2, on basement membrane 1, evaporation has metal level 2, metal level 2 is aluminium lamination, zinc layers or allumen layer, the limit, one end of the Width of basement membrane 1 is provided with the clear area 3 of non-metal cladding 2, the width of clear area 3 is 4mm, and metal level 2 is made up of region 1, region 2 and region 3 according to sheet resistance value size, and region 1 is thickened area, edge, width is 10mm, and sheet resistance value is 8 Ω; Region 2 is low square resistance district, and width is 1/4 ~ 1/2 of basement membrane 1 overall length, and sheet resistance value is for being 20 Ω; Region 3 is high square resistance district, and sheet resistance value is 50 Ω; And on a metallized film, region 3 sheet resistances >=region 2 sheet resistances >=region 1 sheet resistance, sheet resistance value presents stepped.
Edge of the present invention thickened area 2-1 is wider than the thickened area of conventional evaporation mode, and sheet resistance is lower, so equivalent series resistance is little on electrode is drawn, the loss of product is little; Winding capacitor core out, its self-healing ability, withstand voltage level determine primarily of high square resistance district, region 3, the employing fine aluminium evaporation in region 3, and coating is thin, and sheet resistance is high, and self-healing ability will be stronger, and withstand voltage will be higher; Region 1, region 2 coating all thickeies, and the coat of metal on the whole resistance shows less than conventional evaporation mode, therefore product is when bearing same ripple current, heating will be less, and temperature rise will be lower, so it will be stronger that kind structure bears ripple current ability; Region 1 and region 2 are for being generally the thicker zinc-aluminium metal level of the less coating of sheet resistance, and the film of the same voltage withstand class of conventional evaporation mode is generally the thinner zinc-aluminium metal level of the higher coating of sheet resistance, zinc metal is very easily oxidized in malaria, therefore the thinner embodiment of the higher coating of sheet resistance is more obvious, so staged evaporation mode in oxidation resistance advantageously.
The another statement of applicant, the present invention illustrates implementation method of the present invention and apparatus structure by above-described embodiment, but the present invention is not limited to above-mentioned execution mode, does not namely mean that the present invention must rely on said method and structure could be implemented.Person of ordinary skill in the field should understand, any improvement in the present invention, replaces and the interpolation of step, concrete way choice etc., all drop within protection scope of the present invention and scope of disclosure implementation method equivalence selected by the present invention.The present invention is not limited to above-mentioned execution mode, and all employings and analog structure of the present invention and method thereof realize all modes of the object of the invention, all within protection scope of the present invention.

Claims (7)

1. a novel capacitor metallized film, comprises basement membrane (1) and metal level (2), it is characterized in that: have metal level (2) at the upper evaporation of described basement membrane (1), metal level (2) is aluminium lamination, zinc layers or allumen layer.
2. a kind of novel capacitor metallized film according to claim 1, is characterized in that: the limit, one end of the Width of described basement membrane (1) is provided with the clear area (3) of non-metal cladding (2), and the width of described clear area (3) is 2-4mm.
3. a kind of novel capacitor metallized film according to claim 2, it is characterized in that: metal level (2) according to sheet resistance value size by region 1(2-1), region 2(2-2) and region 3(2-3) form, described region 1(2-1) be thickened area, edge, width is 3 ~ 10mm, and sheet resistance value is 3-8 Ω; Described region 2(2-2) be low square resistance district, width is 1/4 ~ 1/2 of basement membrane (1) overall length, and sheet resistance value is for being 4-20 Ω; Described region 3(2-3) be high square resistance district, sheet resistance value is greater than 10 Ω; And on a metallized film, described region 3(2-3) sheet resistance >=region 2 sheet resistances >=region 1 sheet resistance, sheet resistance value presents stepped.
4. a kind of novel capacitor metallized film according to claim 2, is characterized in that: the width of described clear area (3) is 2mm.
5. a kind of novel capacitor metallized film according to claim 3, is characterized in that: the sheet resistance value of thickened area, described edge is 4 Ω.
6. a kind of novel capacitor metallized film according to claim 3, is characterized in that: described region 3(2-3) be high square resistance district, sheet resistance value is 10-50 Ω.
7. a kind of novel capacitor metallized film according to claim 6, is characterized in that: described region 3(2-3) be high square resistance district, sheet resistance value is 30 Ω.
CN201510123205.3A 2015-03-20 2015-03-20 Novel metallized film for capacitor Pending CN104681275A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201510123205.3A CN104681275A (en) 2015-03-20 2015-03-20 Novel metallized film for capacitor
PCT/CN2016/075765 WO2016150298A1 (en) 2015-03-20 2016-03-07 Novel metallized film for capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510123205.3A CN104681275A (en) 2015-03-20 2015-03-20 Novel metallized film for capacitor

Publications (1)

Publication Number Publication Date
CN104681275A true CN104681275A (en) 2015-06-03

Family

ID=53316190

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510123205.3A Pending CN104681275A (en) 2015-03-20 2015-03-20 Novel metallized film for capacitor

Country Status (2)

Country Link
CN (1) CN104681275A (en)
WO (1) WO2016150298A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016150298A1 (en) * 2015-03-20 2016-09-29 南通新三能电子有限公司 Novel metallized film for capacitor
CN110289165A (en) * 2019-07-23 2019-09-27 安徽纽艾新能源技术有限公司 A kind of explosion-proof metallized polypropylene film of high voltage

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7193070B2 (en) * 2018-02-05 2022-12-20 株式会社指月電機製作所 Film capacitor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201829351U (en) * 2010-10-30 2011-05-11 安徽铜峰电子股份有限公司 Ultrahigh square-resistance metallized film
CN103578754A (en) * 2013-10-15 2014-02-12 铜陵其利电子材料有限公司 Aluminum zinc metallized film with gradually-changing sheet resistance and for capacitor
CN104143434A (en) * 2014-08-06 2014-11-12 安徽源光电器有限公司 Small novel capacitor with gradient plating
CN104252969A (en) * 2014-09-28 2014-12-31 宁国市裕华电器有限公司 Trapezoidal evaporation metalizing polypropylene film capacitor
CN204497059U (en) * 2015-03-20 2015-07-22 南通新三能电子有限公司 A kind of novel capacitor metallized film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9817120D0 (en) * 1998-08-07 1998-10-07 Abb Power T & D Limited Improvements in or relating to electronic components
CN203434000U (en) * 2013-07-15 2014-02-12 南通江森电子科技有限公司 Trapezoid zinc thickened high-square-resistance aluminum film
CN104681275A (en) * 2015-03-20 2015-06-03 南通新三能电子有限公司 Novel metallized film for capacitor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201829351U (en) * 2010-10-30 2011-05-11 安徽铜峰电子股份有限公司 Ultrahigh square-resistance metallized film
CN103578754A (en) * 2013-10-15 2014-02-12 铜陵其利电子材料有限公司 Aluminum zinc metallized film with gradually-changing sheet resistance and for capacitor
CN104143434A (en) * 2014-08-06 2014-11-12 安徽源光电器有限公司 Small novel capacitor with gradient plating
CN104252969A (en) * 2014-09-28 2014-12-31 宁国市裕华电器有限公司 Trapezoidal evaporation metalizing polypropylene film capacitor
CN204497059U (en) * 2015-03-20 2015-07-22 南通新三能电子有限公司 A kind of novel capacitor metallized film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016150298A1 (en) * 2015-03-20 2016-09-29 南通新三能电子有限公司 Novel metallized film for capacitor
CN110289165A (en) * 2019-07-23 2019-09-27 安徽纽艾新能源技术有限公司 A kind of explosion-proof metallized polypropylene film of high voltage

Also Published As

Publication number Publication date
WO2016150298A1 (en) 2016-09-29

Similar Documents

Publication Publication Date Title
JP4660222B2 (en) Solid electrolytic capacitor and manufacturing method thereof
CN204497059U (en) A kind of novel capacitor metallized film
CN104681275A (en) Novel metallized film for capacitor
TW200608428A (en) Solid electrolytic capacitor, stacked capacitor using the same, and fabrication method thereof
CN105428725B (en) The preparation method and trapezoidal battery core of the trapezoidal battery core of takeup type
JP2018082008A (en) Solid electrolytic capacitor and method for manufacturing the same
CN203456296U (en) Double-surface aluminum-metalized polyester film with middle edges
CN203456293U (en) Single-surface aluminum-and-zinc metalized film with single reserved edge
JP4770750B2 (en) Solid electrolytic capacitor and manufacturing method thereof
CN103456492B (en) High-sheet-resistancaluminum aluminum membrane
JP5340092B2 (en) Solid electrolytic capacitor
JP2011176232A (en) Solid electrolytic capacitor and method for manufacturing the same
CN202025648U (en) Super-high sheet resistance metalized film
CN203706877U (en) High-sheet-resistance safety metalized film
CN104347272A (en) Organic thin-film capacitor
EP0986078A3 (en) Aluminum electrolytic capacitor and its manufacturing method
CN103680946A (en) High-sheet-resistance safe metallized film
CN102682966A (en) Amorphous alloy three-dimensional rolled iron core capable of reducing noise
CN202523569U (en) Electrolytic capacitor
CN207052458U (en) A kind of three-level step type evaporation metal film
CN207052453U (en) A kind of high square resistance Wave-cut metallized film
CN205264514U (en) High charge and discharge performance film capacitor of low -loss
JPS5821316A (en) Method of producing solid electrolytic condenser
JP3826153B1 (en) Multilayer solid electrolytic capacitor and method for forming cathode lead layer in multilayer solid electrolytic capacitor
CN208538704U (en) Big capacity electrolyte capacitor

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20150603