CN104679190A - Radiator for CPU - Google Patents
Radiator for CPU Download PDFInfo
- Publication number
- CN104679190A CN104679190A CN201310632418.XA CN201310632418A CN104679190A CN 104679190 A CN104679190 A CN 104679190A CN 201310632418 A CN201310632418 A CN 201310632418A CN 104679190 A CN104679190 A CN 104679190A
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- CN
- China
- Prior art keywords
- heat
- cpu
- radiator
- conducting plate
- heating radiator
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention provides a radiator for a CPU. The radiator for the CPU comprises a heat conducting plate (1) and foamed aluminum (2) and is characterized in that the foamed aluminum (2) is a cubic porous foamed aluminum metal material. The heat conducting plate (1) and the foamed aluminum (2) are bonded and fixed through heat conducting glue to form a whole.
Description
Technical field
The present invention relates to thermal conduction study field, particularly relate to a kind of heating radiator for CPU.
Background technology
In the market common to cpu heat have water-filled radiator, heat-pipe radiator and aluminum fin-stock heating radiator.Water-filled radiator and heat-pipe radiator are two kinds of heating radiators that effectiveness comparison is good in the middle of cpu heat, but water-filled radiator is heavier, back-up system is comparatively large, and installs trouble, if there is the life security that can threaten computer system of leaking, price is not low yet comparatively speaking.Heat-pipe radiator is the heating radiator that a kind of radiating efficiency is higher, and cooling-down effect is fine, but its strict manufacture craft determines it can not realize low cost, expensive, is a kind of burden for low and middle-end public users.Aluminum fin-stock heating radiator is a kind of popular heating radiator, deals with primary processor overclocking no problem, due to low price, becomes the first-selection in low and middle-end heating radiator market.But aluminum fin-stock heating radiator is due to the restriction by solid metal structure, and radiating efficiency is affected to a certain extent, and the processing from section bar to product is not also saved trouble comparatively speaking.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides a kind of heating radiator for CPU, the heat-conducting plate of this heating radiator and porous foam aluminum metallic material adopt heat-conducting glue to be adhesively fixed and form one, and process costs is low, easy to manufacture; Radiator air permeability is good, and area of dissipation is large, and radiating efficiency is high.
The technical scheme that the present invention solves the problems of the technologies described above comprises: heat-conducting plate (1) and foamed aluminium (2); Described heat-conducting plate (1) is foursquare aluminium sheet, the porous foam aluminum metallic material that described foamed aluminium (2) is square, the planar dimension of foamed aluminium (2) and the square dimensions of heat-conducting plate (1) in the same size, heat-conducting plate (1) and foamed aluminium (2) are adhesively fixed by heat-conducting glue and form one; The baseplane of heat-conducting plate (1) is accomplished smooth, bright and clean.
Technique effect of the present invention is: the heat-conducting plate (1) of this heating radiator and foamed aluminium (2) adopt heat-conducting glue to be adhesively fixed shaping, heat-conducting glue has superior shock absorption and stability, there is remarkable cohesive strength and good adhesion, and the high-and low-temperature resistance performance of excellence and heat resistanceheat resistant alternation performance, not only play excellent sealing but also there is excellent bonding and conductive force simultaneously, the fixing heating radiator process costs that can make of heat-conducting glue bonding is used to drop into less comparatively speaking, manufacture craft is simpler, and cost price is cheaper; Heat-conducting plate (1) and foamed aluminium (2) are the good aluminum of heat conductivility, compared with copper material, its specific heat capacity and coefficient of heat conductivity are only second to copper, but due to the characteristic that aluminium material specific heat capacity is relatively low, the rapid heat dissipation of aluminium, good heat dissipation effect, and the unit volume proportion of aluminium and the market price are starkly lower than copper material, price and the weight of heating radiator have clear superiority; The even temperature effect of heat-conducting plate (1) has the ability expanding efficiently radiates heat area on local heat source face, plays very large help to raising heat-sinking capability; Foamed aluminium (2) density of material is little, and specific surface area is large, and porosity is high, and air permeability is good, and heat-sinking capability is strong, and radiating efficiency is high; Because heat is taken away by the air flowing through heating radiator, the high porosity of foamed aluminium (2) enhances the permeability of air, more cold airflow can be allowed to pass through, and horizontal air flow effect can be obtained, to further disturbance cooling draught, improve radiating efficiency and played unique effect.And porous foam aluminum has larger specific surface area, the fin air-cooled radiator that the heat-sinking capability in unit volume is more traditional improves a lot; The high porosity of porous foam aluminum metallic material and the low characteristic of aluminium material unit volume proportion, greatly can alleviate the weight of heating radiator and effectively reduce the cost of heating radiator.Compared with existing air-cooled radiator, a kind of heating radiator for CPU provided by the invention, for the cost reducing heating radiator further, improve the heat-sinking capability of CPU, obtain the balance of radiator performance and price-proportion simultaneously, meet low and middle-end public users CPU radiating requirements, there is wide market using value and obvious competitive edge.
Accompanying drawing explanation
Fig. 1 is a kind of schematic perspective view for cpu heat provided by the invention.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figure 1, heat-conducting plate (1) is foursquare aluminium sheet, heat-conducting plate (1) is provided with foamed aluminium (2), heat-conducting plate (1) and foamed aluminium (2) are adhesively fixed by high-performance thermal conductive and form one; The porous foam aluminum metallic material that foamed aluminium (2) is square, the planar dimension of foamed aluminium (2) and the square dimensions of heat-conducting plate (1) in the same size.
Principle of work of the present invention: the present invention is used for the heating radiator of CPU in use, in order to reduce thermal resistance, heat-conducting plate (1) and the surface of contact of CPU smear appropriate heat-conducting silicone grease, directly the middle position of heating radiator bottom surface is placed on CPU, with buckle, heating radiator and CPU are fixed, the heat on CPU surface passes to foamed aluminium (2) by heat-conducting plate (1), utilize the skeleton structure expanded surface area heat-sinking capability of foamed aluminium (2), under radiator fan drives, make air produce forced flow, by Forced Air Convection, the heat of foamed aluminium heat-delivery surface is dispersed into rapidly in air, reach the object of CPU cooling.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement, all should be included within protection scope of the present invention.
Claims (2)
1. for a heating radiator of CPU, comprising: heat-conducting plate (1) and foamed aluminium (2); It is characterized in that, the porous foam aluminum metallic material that foamed aluminium (2) is square, heat-conducting plate (1) and foamed aluminium (2) are adhesively fixed by heat-conducting glue and form one.
2. a kind of heating radiator for CPU according to claim 1, it is characterized in that, described heat-conducting plate (1) is foursquare aluminium sheet, the planar dimension of heat-conducting plate (1) and the planar dimension of foamed aluminium (2) in the same size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310632418.XA CN104679190A (en) | 2013-11-28 | 2013-11-28 | Radiator for CPU |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310632418.XA CN104679190A (en) | 2013-11-28 | 2013-11-28 | Radiator for CPU |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104679190A true CN104679190A (en) | 2015-06-03 |
Family
ID=53314396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310632418.XA Pending CN104679190A (en) | 2013-11-28 | 2013-11-28 | Radiator for CPU |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104679190A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455446A (en) * | 2016-10-28 | 2017-02-22 | 曙光信息产业(北京)有限公司 | Heating element cooling device and manufacturing method thereof |
-
2013
- 2013-11-28 CN CN201310632418.XA patent/CN104679190A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455446A (en) * | 2016-10-28 | 2017-02-22 | 曙光信息产业(北京)有限公司 | Heating element cooling device and manufacturing method thereof |
| CN106455446B (en) * | 2016-10-28 | 2019-02-15 | 曙光信息产业(北京)有限公司 | The cooling device of heater element and the manufacturing method of cooling device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150603 |