CN104674055A - Novel copper-alloy mold material - Google Patents
Novel copper-alloy mold material Download PDFInfo
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- CN104674055A CN104674055A CN201310613660.2A CN201310613660A CN104674055A CN 104674055 A CN104674055 A CN 104674055A CN 201310613660 A CN201310613660 A CN 201310613660A CN 104674055 A CN104674055 A CN 104674055A
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- alloy
- novel copper
- mold material
- resistance
- alloy mold
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Abstract
The invention discloses a novel copper-alloy mold material. The novel copper-alloy mold material comprises the following components by weight percent: 13.0%-16.0% of Al, 2.0%-4.0% of Fe, 0.8%-1.0% of Mn, 0.01%-0.5% of Re, 0.1%-1.2% of Ti, 0.6%-2.0% of Co and the balance of Cu, and the total amount is 100%. The novel copper-alloy mold material disclosed by the invention has the advantages that due to a proper amount of added rare soil, the casting performance of alloy is improved, the liquidity of alloy melting liquid is improved, the tendency to hole shrinkage, air holes, segregation and cracks is reduced, further the rare soil has the modifying action on a metal surface, the oxidation resistance, hydrogen embrittlement resistance, wearing resistance and corrosion resistance of the alloy are obviously improved and the service life of the alloy is prolonged.
Description
Technical field
The present invention relates to a kind of alloy material, be specifically related to a kind of Novel copper alloy moulding stock.
Background technology
Copper and its alloy has high heat conduction, conduction, corrosion resistance nature, and good manufacture processing characteristics, is thus widely used in many fields such as electric power, electrician, machinery, space flight.But along with these new and high technologies are day by day harsh to the requirement of material property, traditional copper alloy material can not meet service requirements in certain fields, especially need to meet the over-all properties such as high strength & high electric-conduction, anti-oxidant heat/corrosion resistance occasion, as the mould for continuous casting crystallizer such as tubing, wire rod, sheet material, billet of machine industry simultaneously; High strength lead frame copper alloy band; High-intensity high-conductivity copper alloy contact wire rod used for high-speed railway; The Cu alloy materials such as metallurgical submerged-arc furnace electrode watt plate, wiring board, omnibus bar, holder.Although done a lot of research at present in Cu alloy material, the copper alloy with high strength and high conductivity performance developed still cannot meet the demands.
Summary of the invention
The object of the invention is to, a kind of Novel copper alloy moulding stock is provided, add the castability that appropriate rare earth improves alloy, improve the mobility of alloy molten liquid, reduce the tendency of casting shrinking hole, pore, segregation and crackle, simultaneously rare earth has modifying function to metallic surface, can significantly improve the oxidation-resistance of alloy, anti-hydrogen embrittlement, resistance to wear, corrosion resistance, extends the work-ing life of alloy.
Described Novel copper alloy moulding stock, comprises the composition of following weight percent:
Al:13.0%-16.0%, Fe:2.0%-4.0%, Mn:0.8%-1.0%, Re:0.01%-0.5%, Ti:0.1%-1.2%, Co:0.6%-2.0%, surplus is Cu, and total amount is 100%.
Novel copper alloy moulding stock provided by the invention, its beneficial effect is, add the castability that appropriate rare earth improves alloy, improve the mobility of alloy molten liquid, decrease the tendency of casting shrinking hole, pore, segregation and crackle, simultaneously rare earth has modifying function to metallic surface, significantly improves the oxidation-resistance of alloy, anti-hydrogen embrittlement, resistance to wears, corrosion resistance, extends the work-ing life of alloy.
Embodiment
Below in conjunction with an embodiment, Novel copper alloy moulding stock provided by the invention is described in detail.
Embodiment
Described Novel copper alloy moulding stock, comprises the composition of following weight percent:
Al:13.0%-16.0%, Fe:2.0%-4.0%, Mn:0.8%-1.0%, Re:0.01%-0.5%, Ti:0.1%-1.2%, Co:0.6%-2.0%, surplus is Cu, and total amount is 100%.
Claims (1)
1. a Novel copper alloy moulding stock, is characterized in that: it comprises the composition of following weight percent:
Al:13.0%-16.0%, Fe:2.0%-4.0%, Mn:0.8%-1.0%, Re:0.01%-0.5%, Ti:0.1%-1.2%, Co:0.6%-2.0%, surplus is Cu, and total amount is 100%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310613660.2A CN104674055A (en) | 2013-11-28 | 2013-11-28 | Novel copper-alloy mold material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310613660.2A CN104674055A (en) | 2013-11-28 | 2013-11-28 | Novel copper-alloy mold material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104674055A true CN104674055A (en) | 2015-06-03 |
Family
ID=53309636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310613660.2A Pending CN104674055A (en) | 2013-11-28 | 2013-11-28 | Novel copper-alloy mold material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104674055A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105349825A (en) * | 2015-11-15 | 2016-02-24 | 丹阳市德源精密工具有限公司 | Novel boron alloy die material |
| CN105349823A (en) * | 2015-11-15 | 2016-02-24 | 丹阳市德源精密工具有限公司 | Novel manganese-alloy mould material |
| CN105349824A (en) * | 2015-11-15 | 2016-02-24 | 丹阳市德源精密工具有限公司 | Novel copper alloy die material |
-
2013
- 2013-11-28 CN CN201310613660.2A patent/CN104674055A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105349825A (en) * | 2015-11-15 | 2016-02-24 | 丹阳市德源精密工具有限公司 | Novel boron alloy die material |
| CN105349823A (en) * | 2015-11-15 | 2016-02-24 | 丹阳市德源精密工具有限公司 | Novel manganese-alloy mould material |
| CN105349824A (en) * | 2015-11-15 | 2016-02-24 | 丹阳市德源精密工具有限公司 | Novel copper alloy die material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150603 |