CN104659639A - High-power optical fiber amplifier with high heat dissipation rate - Google Patents
High-power optical fiber amplifier with high heat dissipation rate Download PDFInfo
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- CN104659639A CN104659639A CN201310589100.8A CN201310589100A CN104659639A CN 104659639 A CN104659639 A CN 104659639A CN 201310589100 A CN201310589100 A CN 201310589100A CN 104659639 A CN104659639 A CN 104659639A
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Abstract
The invention relates to a high-power optical fiber amplifier with high heat dissipation rate and belongs to the technical field of optical fibers. The high-power optical fiber amplifier comprises a front-stage optical path and a rear-stage optical path, wherein the rear-stage optical path comprises a beam combiner, a second active optical fiber, a cladding pumped power detacher and a third isolator which are connected in sequence; a low-refractive index glue coating point is formed at the coupling position of the output end of the beam combiner and the second active optical fiber. The high-power optical fiber amplifier further comprises an optical fiber plate and a metal heat-radiating plate, wherein the optical fiber plate is closely jointed with the metal heat-radiating plate; the second active optical fiber is wound on the optical fiber plate; the low-refractive index glue coating point and the active optical fiber behind the low-refractive index glue coating point are closely attached onto the metal heat-radiating plate, so that the low-refractive index glue coating point and the second active optical fiber can obtain the best heat-radiating effect, and further the problem of active optical fiber combustion is effectively solved. The high-power optical fiber amplifier with high heat dissipation rate, provided by the invention, is simple in structure, low in cost and very wide in application scope.
Description
Technical field
The present invention relates to technical field of optical fiber, particularly fiber optical amplifier technology field, specifically refer to a kind of high-power fiber amplifier with high rate of heat dissipation.
Background technology
High power (5W and more than) fiber amplifier is the amplifier of a kind of permanent output, power adjustable, pure optical fiber structure, owing to having the advantages such as high-gain, low noise, good beam quality factor, have great application prospect in fields such as FTTH, high speed optical fiber communication, optics coherence tomography, atom cooling, non-linear researchs.
Existing high power (5W and more than) fiber amplifier is the amplifier of a kind of all optical fibre structure be made into based on multistage unidirectional structure for amplifying principle mostly.Prime light path adopts common single mode structure for amplifying, and power output, in mW magnitude, does not need to consider heat dissipation problem substantially.But for rear class light path, because power output is at more than 1W, need to consider heat dissipation problem wherein, therefore rear class light path generally needs to be placed on heat dissipation plate.At present, for the 2W amplifier of this structure fabrication, its rear class light path is placed on general heat dissipation plate, does not need to do special processing again to low-refraction glue application point.But for the amplifier of more high power (5W and more than), due to very large (the general employing 975nm pumping source of rear class pump power used, the rear class pump power that 1550nm5W amplifier needs is about 20W), adopt common heat treatment mode often to cause low-refraction glue application point or Active Optical Fiber poor heat radiation thereafter, cause the problem of burning.Therefore, how to improve the radiating effect of low-refraction glue application point and Active Optical Fiber in high-power fiber amplifier rear class light path, become problem demanding prompt solution in the art.
Summary of the invention
The object of the invention is to overcome above-mentioned shortcoming of the prior art, a kind of good heat dissipation effect is provided, effectively can avoid rear class light path low-refraction glue application point and subsequent the too high problem that burning occurs of Active Optical Fiber temperature, and structure is simple, with low cost, the high-power fiber amplifier with high rate of heat dissipation applied widely.
In order to realize above-mentioned object, the high-power fiber amplifier with high rate of heat dissipation of the present invention has following formation:
This has the high-power fiber amplifier of high rate of heat dissipation, comprises the prime light path and rear class light path that are linked in sequence.Described rear class light path comprises the bundling device be linked in sequence, second Active Optical Fiber, cladding pumping power stripper and the 3rd isolator, the prime light path described in input coupling of described bundling device, the output of this bundling device has low-refraction glue application point with the second described Active Optical Fiber place of coupling, this high-power fiber amplifier also comprises fiber reel, the second described Active Optical Fiber is wound on described fiber reel, and this high-power fiber amplifier also comprises heat dissipation metal dish, described fiber reel fits tightly in described heat dissipation metal dish, described low-refraction glue application point is close on described heat dissipation metal dish.
This has in the high-power fiber amplifier of high rate of heat dissipation, and described the second Active Optical Fiber be wound on fiber reel does not overlap each other.
This has in the high-power fiber amplifier of high rate of heat dissipation, and described fiber reel is aluminium alloy disk.
This has in the high-power fiber amplifier of high rate of heat dissipation, and described bundling device is multimode pump combiner; The 3rd described isolator is high power single-stage polarization irrelevant isolator.
This has in the high-power fiber amplifier of high rate of heat dissipation, described prime light path comprises the seed source, the first isolator, wavelength division multiplexer, the first Active Optical Fiber and the second isolator that are linked in sequence, the input of the bundling device described in output coupling of the second described isolator.
This has in the high-power fiber amplifier of high rate of heat dissipation, and the first described isolator and the second isolator are single-stage polarization irrelevant isolator.
Have employed the high-power fiber amplifier with high rate of heat dissipation of this invention, because its rear class light path comprises the bundling device be linked in sequence, second Active Optical Fiber, cladding pumping power stripper and the 3rd isolator, the prime light path described in input coupling of described bundling device, the output of this bundling device has low-refraction glue application point with the second described Active Optical Fiber place of coupling, this high-power fiber amplifier also comprises fiber reel, the second described Active Optical Fiber is wound on described fiber reel, and this high-power fiber amplifier also comprises heat dissipation metal dish, described fiber reel fits tightly in described heat dissipation metal dish, described low-refraction glue application point is close on described heat dissipation metal dish, thus make low-refraction glue application point and the second Active Optical Fiber can obtain best radiating effect, and then effectively avoid rear class light path low-refraction glue application point and subsequent the too high problem that burning occurs of Active Optical Fiber temperature, and the high-power fiber amplifier structure with high rate of heat dissipation of the present invention is simple, with low cost, the scope of application is also quite extensive.
Accompanying drawing explanation
Fig. 1 is the schematic diagram with the high-power fiber amplifier of high rate of heat dissipation of the present invention.
Fig. 2 is the structural representation that fiber reel in the high-power fiber amplifier with high rate of heat dissipation of the present invention and heat dissipation metal dish are fitted.
Embodiment
In order to more clearly understand technology contents of the present invention, describe in detail especially exemplified by following examples.
Referring to shown in Fig. 1, is the schematic diagram with the high-power fiber amplifier of high rate of heat dissipation of the present invention.
In one embodiment, this high-power fiber amplifier with high rate of heat dissipation comprises the prime light path and rear class light path that are linked in sequence.
Wherein, prime light path comprises seed source 1, first isolator 2, wavelength division multiplexer 3, first Active Optical Fiber 4 and the second isolator 5 that are linked in sequence, the input of the bundling device 6 of the output coupling rear class light path of the second described isolator 5, the first described isolator 2 and the second isolator 5 are single-stage polarization irrelevant isolator.Rear class light path then comprises bundling device 6, second Active Optical Fiber 8, cladding pumping power stripper 9 and the 3rd isolator 10 that are linked in sequence, and described bundling device 6 is multimode pump combiner; The 3rd described isolator 11 is high power single-stage polarization irrelevant isolator.The output of the second isolator 5 of the prime light path described in input coupling of described bundling device 6, the output of this bundling device 6 has low-refraction glue application point 7 with the second described Active Optical Fiber 8 place of coupling.
As shown in Figure 2, this high-power fiber amplifier also comprises fiber reel 11 and heat dissipation metal dish 12, and described fiber reel 11 and heat dissipation metal dish 12 all can adopt aluminium alloy to make.The second described Active Optical Fiber 8 is wound on described fiber reel 11, and the second Active Optical Fiber 8 be wound on fiber reel 11 is not overlapping each other.Described fiber reel 11 fits tightly in described heat dissipation metal dish 12, and described low-refraction glue application point 7 and the one end of the second Active Optical Fiber 8 connected after it are all close on described heat dissipation metal dish 12.
In the application of reality, the high-power fiber amplifier with high rate of heat dissipation of the present invention adopts high-power fiber amplifier (5W) structure of the unidirectional structure for amplifying of typical two-stage, as shown in Figure 1.
Prime light channel structure adopts common forward pumping structure for amplifying, and namely seed signal light is coupled into Active Optical Fiber after isolator, WDM, and after Active Optical Fiber amplifies, power output is at about 100mW, does not need to consider heat dissipation problem.
The 100mW that prime exports is amplified to 5W by rear class light path, need very high pump power, heat radiation is the problem that must solve, therefore whole rear class light path needs to carry out on heat dissipation plate, its amplification principle is similar with prime, just change fibre core pump coupling mode into double clad pump mode, so just, multimode laser diode array can be used as pumping source, pump light will be injected into the inner cladding of Active Optical Fiber in the mode of oblique incidence, and repeatedly pass through fibre core in the mode of broken line, thus cause pump light to be absorbed by the rare earth ion in fibre core, realize high-power Laser output.By prime export light as flashlight, by bundling device, multimode coupling pump light is entered to be mixed with in the Active Optical Fiber of rare earth ion, then through isolator export just can obtain 5W high power laser light export.In this grade of light path, after bundling device and Active Optical Fiber welding, the glue of general employing low-refraction carries out applying and through ultraviolet irradiation solidification, the pump light entering covering through bundling device can be made like this to reveal, all enter Active Optical Fiber and amplify flashlight.But because this application point is in the front end that pump light injects, pumping light power is very high, heat can bulk deposition near low-refraction glue application point, if the heat dissipation problem at this place can not be processed well, be easy to cause that optical fiber is herein on fire to be burnt.
The solution that the present invention adopts is that first, Active Optical Fiber can not be placed directly on heat dissipation plate, need closely around on metal aluminum alloy disk customized, and around process in can not there is the overlap of Active Optical Fiber, otherwise cause the accumulation of heat, thus burn optical fiber.Secondly, be the heat dissipation problem of low-refraction glue application point, low-refraction glue application point and subsequent one section of Active Optical Fiber, owing to bearing very high-power pump light, therefore must be close on heat dissipation plate, can not there is any gap.For rear class light path, find when high-power fiber amplifier, the gap of the 6mm that has an appointment between the optical fiber disc base of conventional design and heat dissipation plate, the Active Optical Fiber of amplifier after working long hours near this gap can be scorched jaundice and even burn.Reason there is certain gap between the Active Optical Fiber of gap location and heat dissipation plate, causes the heat radiation in this place bad.Namely this gap is only have 1mm, also similar phenomenon can occur.In order to address this problem, in the present invention, optical fiber disc structure is transformed, make there is not any gap between its base and heat dissipation plate, adjacent like this low-refraction glue application point one section of Active Optical Fiber below just can be close to heat dissipation plate and optical fiber disk, and its heat is just released by heat dissipation plate.Found by great many of experiments, this improving one's methods solves the heat dissipation problem of low-refraction glue application point and Active Optical Fiber in high power (5W and more than) fiber amplifier rear class light path well, makes more high-power fiber amplifier realize becoming possibility.
Have employed the high-power fiber amplifier with high rate of heat dissipation of this invention, because its rear class light path comprises the bundling device be linked in sequence, second Active Optical Fiber, cladding pumping power stripper and the 3rd isolator, the prime light path described in input coupling of described bundling device, the output of this bundling device has low-refraction glue application point with the second described Active Optical Fiber place of coupling, this high-power fiber amplifier also comprises fiber reel, the second described Active Optical Fiber is wound on described fiber reel, and this high-power fiber amplifier also comprises heat dissipation metal dish, described fiber reel fits tightly in described heat dissipation metal dish, described low-refraction glue application point and subsequent the second Active Optical Fiber are close on described heat dissipation metal dish, thus make low-refraction glue application point and the second Active Optical Fiber can obtain best radiating effect, and then effectively avoid rear class light path low-refraction glue application point and subsequent the too high problem that burning occurs of Active Optical Fiber temperature, and the high-power fiber amplifier structure with high rate of heat dissipation of the present invention is simple, with low cost, the scope of application is also quite extensive.
In this description, the present invention is described with reference to its specific embodiment.But, still can make various amendment and conversion obviously and not deviate from the spirit and scope of the present invention.Therefore, specification and accompanying drawing are regarded in an illustrative, rather than a restrictive.
Claims (6)
1. one kind has the high-power fiber amplifier of high rate of heat dissipation, it comprises the prime light path and rear class light path that are linked in sequence, described rear class light path comprises the bundling device be linked in sequence, second Active Optical Fiber, cladding pumping power stripper and the 3rd isolator, the prime light path described in input coupling of described bundling device, the output of this bundling device has low-refraction glue application point with the second described Active Optical Fiber place of coupling, this high-power fiber amplifier also comprises fiber reel, the second described Active Optical Fiber is wound on described fiber reel, it is characterized in that, this high-power fiber amplifier also comprises heat dissipation metal dish, described fiber reel fits tightly in described heat dissipation metal dish, described low-refraction glue application point is close on described heat dissipation metal dish.
2. the high-power fiber amplifier with high rate of heat dissipation according to claim 1, is characterized in that, described the second Active Optical Fiber be wound on fiber reel does not overlap each other.
3. the high-power fiber amplifier with high rate of heat dissipation according to claim 1, is characterized in that, described fiber reel is aluminium alloy disk.
4. the high-power fiber amplifier with high rate of heat dissipation according to any one of claim 1 to 3, is characterized in that, described bundling device is multimode pump combiner; The 3rd described isolator is high power single-stage polarization irrelevant isolator.
5. the high-power fiber amplifier with high rate of heat dissipation according to claim 1, it is characterized in that, described prime light path comprises the seed source, the first isolator, wavelength division multiplexer, the first Active Optical Fiber and the second isolator that are linked in sequence, the input of the bundling device described in output coupling of the second described isolator.
6. the high-power fiber amplifier with high rate of heat dissipation according to claim 5, is characterized in that, the first described isolator and the second isolator are single-stage polarization irrelevant isolator.
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| CN201310589100.8A CN104659639A (en) | 2013-11-21 | 2013-11-21 | High-power optical fiber amplifier with high heat dissipation rate |
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| CN201310589100.8A CN104659639A (en) | 2013-11-21 | 2013-11-21 | High-power optical fiber amplifier with high heat dissipation rate |
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Cited By (3)
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| CN106451041A (en) * | 2016-09-20 | 2017-02-22 | 光惠（上海）激光科技有限公司 | Novel modular dust-proof and damp-proof high-efficiency high-power optical fiber winding plate structure |
| CN112563870A (en) * | 2020-12-10 | 2021-03-26 | 长飞光纤光缆股份有限公司 | Wide-spectrum optical fiber amplification system |
| CN113783089A (en) * | 2021-08-20 | 2021-12-10 | 安徽光智科技有限公司 | High-conversion-efficiency optical fiber laser |
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| CN101276030A (en) * | 2007-03-27 | 2008-10-01 | Jds尤尼弗思公司 | Optical fiber holder and heat sink |
| CN101350677A (en) * | 2007-03-28 | 2009-01-21 | 日本电气株式会社 | Optical direct amplifier for WDM optical transmission |
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Cited By (4)
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| CN106451041A (en) * | 2016-09-20 | 2017-02-22 | 光惠（上海）激光科技有限公司 | Novel modular dust-proof and damp-proof high-efficiency high-power optical fiber winding plate structure |
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| CN112563870A (en) * | 2020-12-10 | 2021-03-26 | 长飞光纤光缆股份有限公司 | Wide-spectrum optical fiber amplification system |
| CN113783089A (en) * | 2021-08-20 | 2021-12-10 | 安徽光智科技有限公司 | High-conversion-efficiency optical fiber laser |
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Application publication date: 20150527 |