CN104659192A - Glue dispensing method for LED and manufacturing method for high-power LED lamps - Google Patents

Glue dispensing method for LED and manufacturing method for high-power LED lamps Download PDF

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Publication number
CN104659192A
CN104659192A CN201510074959.4A CN201510074959A CN104659192A CN 104659192 A CN104659192 A CN 104659192A CN 201510074959 A CN201510074959 A CN 201510074959A CN 104659192 A CN104659192 A CN 104659192A
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Prior art keywords
glue
temperature
dispensing method
baking
led
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CN201510074959.4A
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CN104659192B (en
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潘小和
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Silicon Photoelectric (xiamen) Co Ltd
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Silicon Photoelectric (xiamen) Co Ltd
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Abstract

The invention provides a glue dispensing method for an LED and a manufacturing method for high-power LED lamps. The glue dispensing method for the LED comprises the following steps: detecting glue dispensing and baking temperature in real time during dispensing and baking glue; reversely adjusting the change value of the preset temperature when judging that the glue dispensing and baking temperature of the dispensed glue exceeds a preset temperature threshold range. By virtue of the adoption of the scheme, the glue dispensing and baking temperature can be effectively and extremely accurately controlled; the low glue-dispensing yield rate caused by over-high or over-low temperature can be avoided; the glue dispensing method for the LED has a high practical value.

Description

The dispensing method of LED and the manufacture method of high-powered LED lamp
Technical field
The present invention relates to the gluing process of LED, in particular, the dispensing method of a kind of LED and the manufacture method of high-powered LED lamp.
Background technology
Along with the development of technology, the gluing process of LED has tended to ripe.
Such as, Chinese patent 201010019287.4 discloses a kind of gluing process of white light LEDs, specifically openly one can improve white light LEDs color set neutrality and reliability, make rational use of resources to greatest extent and the method for the energy, step is mix and blend fluorescent material and glue, and---constant temperature preserves fluorescent material and glue mixture---to be stirred the fluorescent material and glue mixture preserved through constant temperature and---fluorescent material and glue mixture is poured in the adjustable syringe of temperature---to send constant temperature roaster to special thermal-insulating type magazine to toast---with mechanical screws adhesive dispensing device point glue and shortens baking time and export and be kept in thermal-insulating type bin.Utilize process of the present invention can improve the consistency of white light LEDs glow color, chromaticity coordinate and colour temperature, improve yields and the reliability of product, shorten the production technology cycle of white light LEDs, energy savings, makes rational use of resources, and reduces production cost.
And for example, Chinese patent 201210562429.0 discloses a kind of dispensing method of white light LEDs, by diffusant, A glue, B glue mixes in proportion, use centrifugal vacuum pump mixes, in mixture, add fluorescent material mix according to certain mass ratio, colour temperature as required, to diffusant, A glue, dissimilar fluorescent material is added in proportion in the mixture of B glue and fluorescent material, stir with centrifugal vacuum pump, by airtight cavity vacuum state, slough the bubble in said mixture, utilize the adjustable syringe of temperature by said mixture point on support, the support having put glue is put into oven cooking cycle, then first preheating heats up, toast the follow-up temperature baking of continuing rising of certain hour at such a temperature, finally lower the temperature, white light LEDs glow color can be improved, the consistency of brightness and colour temperature, improve yields and the reliability of product, eliminate dazzle.
And for example, Chinese patent 201410305500.6 relates to LED technical field, especially a LED point glue packaging technology, comprises the steps: first to be dispersed in by nano metal powder in UV fluid sealant, then carries out manual spot-gluing with UV fluid sealant to Side-LED; Again by LED complete for manual spot-gluing at UV-irradiation 5-10 minute, make LED sealing glue solidifying, obtain LED semi-finished product; Finally LED semi-finished product are moved in the baking oven of 80-100 DEG C and toast 20-40 minute, finally obtain a LED for rubber seal dress.A kind of LED point glue packaging technology provided by the invention, by high-speed stirred technique, nano metal powder is dispersed in UV fluid sealant, by a rubber seal dress, the LED obtained has good heat energy elicitation effect, can effectively prevent from causing because chip heat gathers chip operation that local overheating affects, and delay product Heat Ageing.
But in a glue process, prior art cannot Timeliness coverage temperature anomaly, also effectively cannot adjust the temperature of a glue.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of dispensing method of new LED and the manufacture method of high-powered LED lamp.
Technical scheme of the present invention is as follows: the dispensing method of a kind of LED, and it comprises the following steps: when a glue toasts, real-time test point glue baking temperature, when judging that it exceedes preset temperature threshold range, and oppositely adjustment preset temperature changing value.
Such as, oppositely after adjustment preset temperature changing value, continue real-time test point glue baking temperature, judge whether it exceedes preset temperature threshold range.
Such as, when judging point glue baking temperature exceedes preset temperature threshold range, alarm signal is sent.When sending alarm signal, also send warning message to default instrument.
Such as, when judging point glue baking temperature exceedes preset temperature threshold range, send temperature information to default instrument; Wherein, described temperature information comprises the difference of a glue baking temperature and preset temperature threshold range.Such as, described default instrument is terminal or server; Such as, described default instrument is mobile terminal; And for example, described default instrument is Cloud Server.Preferably, during each oppositely adjustment preset temperature changing value, adjustment information is sent to default instrument; Wherein, described adjustment information comprises adjustment direction, preset temperature changing value, regulation time.
Preferably, before a glue, sending point glue information is to default instrument; Wherein, described glue information comprise spot gluing equipment, vacuumize, the information such as fluorescent glue, LED chip; Such as, spot gluing equipment information comprises device name, model, specification, date of manufacture etc.; And for example, LED chip information comprises producer, crystal grain, expansion crystalline substance etc.Preferably, described glue information also comprises a general image for glue environment; Preferably, after sending point glue information to described default instrument, described default instrument feedback operation director information.
Preferably, classification adjustment preset temperature changing value.Such as, when judging point glue baking temperature exceedes preset first threshold value scope, oppositely adjustment the first temperature change value; When judging point glue baking temperature exceedes default Second Threshold scope, oppositely adjustment the second temperature change value.Preferably, when judging point glue baking temperature exceedes default 3rd threshold range, oppositely adjustment the 3rd temperature change value.
Such as, when a glue toasts, time synchronisation, judging point glue baking time reaches Preset Time, then halt glue operation.Then naturally cool.During the operation of halt glue, also transmit completion signal default instrument.Such as, the mobile phone of designated user is transmitted completion signal.
Such as, described default instrument sending controling instruction, oppositely adjustment preset temperature changing value.Preferably, described preset temperature changing value revised by described default instrument.Preferably, after authentication is passed through, described default instrument sends described control command, and/or described preset temperature changing value revised by described default instrument.
Preferably, in point gum machine, perform described some glue step.
Preferably, before a glue, the relative position of gum outlet and support is also set.
Preferably, before a glue, also detect fluorescent glue temperature.
Preferably, after detecting fluorescent glue temperature, also test fluorescent glue viscosity.
Preferably, after test fluorescent glue viscosity, before placement fluorescent glue, also fluorescent glue groove is cleaned.
Preferably, after cleaning fluorescent glue groove, before placement fluorescent glue, described fluorescent glue groove is also dried.
Preferably, fluorescent glue groove described in hot-air seasoning is adopted.
Preferably, the temperature of described hot blast is lower than 40 degrees Celsius.
The another technical scheme of the present invention is as follows: a kind of manufacture method of high-powered LED lamp, and it comprises arbitrary above-mentioned dispensing method.
Adopt such scheme, the present invention can effective control point glue baking temperature, especially accurately, causes a glue yields low, have very high practical value when avoiding too high or too low for temperature.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of an embodiment of dispensing method of the present invention.
Embodiment
For the ease of understanding the present invention, below in conjunction with the drawings and specific embodiments, the present invention will be described in more detail.But the present invention can be realized by many different forms, is not limited to the embodiment described by this specification.It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.
Unless otherwise defined, all technology of using of this specification and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention in this specification just in order to describe specific embodiment is not for limiting the present invention.The term "and/or" that this specification uses comprises arbitrary and all combinations of one or more relevant Listed Items.
As shown in Figure 1, one embodiment of the present of invention are, the dispensing method of a kind of LED, and it comprises the following steps: when a glue toasts, real-time test point glue baking temperature, when judging that it exceedes preset temperature threshold range, and oppositely adjustment preset temperature changing value.Such as, oppositely after adjustment preset temperature changing value, continue real-time test point glue baking temperature, judge whether it exceedes preset temperature threshold range.And for example, the dispensing method of a kind of LED, it comprises the following steps: when a glue toasts, real-time test point glue baking temperature when judging that it exceedes preset temperature threshold range, is oppositely adjust preset temperature changing value, otherwise continues real-time test point glue baking temperature.Wherein, in real time described, be shorter time cycle, the such as described time cycle in real time for being not less than 1 time/second, such as, detection per second 1 time, 2 times, 3 times, 5 times, 10 times, 30 times or 100 inferior.Wherein, oppositely adjustment preset temperature changing value is exceeding direction and determining when exceeding preset temperature threshold range according to a glue baking temperature.Preferably, adopt moving machine mechanical arm, within the scope of a desired guiding trajectory, move with uniform velocity, set temperature meter in moving machine mechanical arm, real-time test point glue temperature.Like this, uniform, overall, that deviation is little temperature data can be obtained, and can find that whether the Temperature Distribution of point gum machine is homogeneous.
Temperature threshold scope given below is as just example, and actual temperature threshold range is determined according to material and consumption thereof, can arrange different preset temperature threshold values in different environments; Such as, preset temperature threshold range is 115 degrees Celsius to 125 degrees Celsius.Such as, preset temperature threshold range is 120 degrees Celsius to 130 degrees Celsius, and preset temperature changing value is 1 degree Celsius, point glue baking temperature is 132 degrees Celsius, point glue baking temperature exceedes preset temperature threshold range and is greater than preset temperature threshold range, then reduce the temperature of some glue, reduce by 1 degree Celsius; Then real-time test point glue baking temperature is continued; And for example, some glue baking temperature is 117 degrees Celsius, and some glue baking temperature exceedes preset temperature threshold range and is less than preset temperature threshold range, then the temperature of elevated point glue, raises 1 degree Celsius; Then real-time test point glue baking temperature is continued.And for example, preset temperature threshold range is 115 degrees Celsius to 135 degrees Celsius, and preset temperature changing value is 2 degrees Celsius, point glue baking temperature is 138 degrees Celsius, point glue baking temperature exceedes preset temperature threshold range and is greater than preset temperature threshold range, then reduce the temperature of some glue, reduce by 2 degrees Celsius; Then real-time test point glue baking temperature is continued; And for example, some glue baking temperature is 114 degrees Celsius, and some glue baking temperature exceedes preset temperature threshold range and is less than preset temperature threshold range, then the temperature of elevated point glue, raises 2 degrees Celsius; Then real-time test point glue baking temperature is continued.By that analogy.Such as, in described some glue process, comprise gluing and dry glue.
Such as, when judging point glue baking temperature exceedes preset temperature threshold range, alarm signal is sent.Such as, send alarm sound, or alarm lamp is luminous or flicker, to remind operator to note, such as, timely inspection apparatus equipment, determines whether production is normal.Preferably, when sending alarm signal, also send warning message to default instrument.Such as, described default instrument is terminal and/or server; Such as, described default instrument is mobile terminal, such as mobile phone or flat board, notebook computer etc., and like this, user or administrative staff or boss can understand production status the very first time, solve a problem promptly, and promote yields, avoid production accident; And for example, described default instrument is Cloud Server, like this, can realize large data management, being especially applicable to producer provides follow-up guide service, notifies client in time when there is problem, client can be warned, the driver etc. of spot gluing equipment of can also upgrading in time before generation problem.
Preferably, before a glue baking, further comprising the steps of: at least one default instrument is set, for temperature information and/or the warning message of the baking of acceptance point glue; Such as, mobile terminal or server are set, the temperature information of acceptance point glue baking or warning message etc.Preferably, when a glue toasts, further comprising the steps of: the temperature of real time record point glue roasting plant controls and situation of change, is sent to described default instrument; Preferably, described temperature also controls by default instrument and situation of change generates temperature control change curve, compares, when judging that the deviation value of described temperature control change curve and historical record exceedes preset range, send alarm signal with historical record.Like this, the operating mode of Timeliness coverage and even in advance anticipation point glue roasting plant whether can there is exception, when occurring abnormal, notify user in time, being dealt carefully with by user.Such as, putting glue roasting plant is point gum machine; And for example, put glue roasting plant and also comprise ultraviolet generater.
Such as, when judging point glue baking temperature exceedes preset temperature threshold range, send temperature information to default instrument; Wherein, described temperature information comprises the difference of a glue baking temperature and preset temperature threshold range, such as+5 degrees Celsius, and for example-3 degrees Celsius etc.Preferably, during each oppositely adjustment preset temperature changing value, adjustment information is sent to default instrument; Wherein, described adjustment information comprises adjustment direction, preset temperature changing value, regulation time.Such as, default instrument is one or more mobile terminals of producers, section chief, group leader and/or middle administrative staff, and and for example, default instrument is the mobile terminal that several pre-set; Like this, production line employee can understand in time, process in time, and invocation point glue is carried out all the time under controllable environment, and, if when production development is abnormal, supervisor at different levels can process in time, and boss also can Timeliness coverage.
For different spot gluing equipments, preferably, before a glue, sending point glue information is to default instrument; Wherein, described glue information comprise spot gluing equipment, vacuumize, the information such as fluorescent glue, LED chip; Such as, spot gluing equipment information comprises device name, model, specification, date of manufacture etc.; And for example, LED chip information comprises producer, crystal grain, expansion crystalline substance etc.Like this, each some glue environment of contrast or some adhesive tape part can be analyzed, obtain data message accurately, analyze weak point, avoid wasting material.Preferably, described glue information also comprises a general image for glue environment; Like this, the crystal grain situation treating a glue can be well understood to, be particularly suitable for generation of preventing accident in advance, and the analysis after having an accident, in order to avoid accident reconstruction.Preferably, after sending point glue information to default instrument, described default instrument feedback operation director information.Such as, described default instrument is Cloud Server, like this, can carry out large data analysis, make production controlled at any time, data upgrade in time, contribute to realizing the production innovation of the controlled production of user, safety in production and producer, also contribute to administrative staff's monitoring, there is fabulous using value.
Preferably, classification adjustment preset temperature changing value.Such as, when judging point glue baking temperature exceedes preset first threshold value scope, oppositely adjustment the first temperature change value; When judging point glue baking temperature exceedes default Second Threshold scope, oppositely adjustment the second temperature change value.And for example, when judging that oppositely the some glue baking temperature adjusted after the first temperature change value exceedes default Second Threshold scope, oppositely adjustment the second temperature change value.Preferably, constantly carry out adjusting until put glue baking temperature to be no more than preset threshold range.Such as, constantly carry out oppositely adjusting the second temperature change value until some glue baking temperature is no more than default Second Threshold scope; And for example, constantly carry out oppositely adjusting the first temperature change value until some glue baking temperature is no more than preset first threshold value scope.Like this, when variations in temperature is larger, can adjust rapidly, timely temperature control, result of use is very good.Such as, preset first threshold value scope is 118 to 122 degrees Celsius, and the first temperature change value is 1 degree Celsius; Preset Second Threshold scope and be 115 to 125 degrees Celsius, the second temperature change value is 2 degrees Celsius; By that analogy; Such as, when point glue baking temperature is 124 degrees Celsius, reduce by 1 degree Celsius, it is less than 125 degrees Celsius, then without the need to adopting the second temperature change value to lower the temperature; And for example, when point glue baking temperature is 128 degrees Celsius, 2 degrees Celsius are reduced; Or when point glue baking temperature is 128 degrees Celsius, first reduce by 1 degree Celsius, then 127 degrees Celsius are reduced by 2 degrees Celsius again; And for example, when point glue baking temperature is 117 degrees Celsius, raise 1 degree Celsius, it is not less than 118 degrees Celsius, then without the need to adopting the second temperature change value to heat up; And for example, when point glue baking temperature is 114 degrees Celsius, raise 1 degree Celsius, then 115 degrees Celsius raise 2 degrees Celsius again; By that analogy, until some glue baking temperature is no more than preset threshold range, preset first threshold value scope is namely no more than.Preferably, when judging point glue baking temperature exceedes default 3rd threshold range, oppositely adjustment the 3rd temperature change value, specifically same as above.
Such as, when a glue toasts, time synchronisation, judging point glue baking time reaches Preset Time, then halt glue operation.Then naturally cool.During the operation of halt glue, also transmit completion signal default instrument.Such as, the mobile phone of designated user is transmitted completion signal.Like this, automatically can complete, without the need to manual intervention, thus realize automation mechanized operation.Further, workman on duty or group leader, after a glue completes, can process in time, very convenient.
For the ease of adopting large data analysis process, such as, described default instrument sending controling instruction, oppositely adjustment preset temperature changing value.Preferably, described preset temperature changing value revised by described default instrument.Like this, keeper, when noting abnormalities, can adopt effective measure to avoid the generation of production accident; But also preset temperature changing value can be adjusted according to knowhow.Preferably, described default instrument also sending controling instruction, adjustment preset temperature threshold range.Preferably, described temperature threshold scope revised by described default instrument, and such as, temperature threshold scope comprises the first temperature threshold scope, the second temperature threshold scope etc.Preferably, before a glue baking, also step is performed: pre-set a glue baking user right; Preferably, a point rank pre-sets a glue baking user right; Such as, different operators, has different operation ranks, does not have user right or user right limited users, such as new employee etc., does not put glue baking authority, can not operate separately the baking of execution point glue; And for example, the user that user right is lower, only has on a small scale, small lot carries out an authority for glue baking, or, a certain specific glue baking laboratory apparatus can only be operated, can not the baking of operating point glue formally produce instruments; Preferably, after pre-seting a glue baking user right, before a glue baking, also perform step: user logs in and carries out subscription authentication, such as, input username and password carries out authentication, and for example, input fingerprint and key carry out authentication etc., and the user of failed authentication cannot start or the baking of execution point glue; Like this, greatly strengthen the safety management of production, improve yields, avoid the improper economic loss that may cause of neophyty operation.Preferably, after authentication is passed through, described default instrument sends described control command, and/or described preset temperature changing value revised by described default instrument, and/or, revise described temperature threshold scope.Like this, only have the authorized user of predetermined right just can send described control command, and/or, revise described preset temperature changing value, and/or, revise described temperature threshold scope, common operator can only operate in the baking of execution point glue, does not have the people of authority the baking of execution point glue to operate, thus avoids the generation of malicious operation or misoperation, also producers can be impelled to strengthen study, be conducive to maintenance customer's rights and interests.
Such as, in point gum machine, perform described some glue step.Such as, before a glue, the relative position of gum outlet and support is also set.Preferably, before a glue, also detect fluorescent glue temperature, in order to avoid fluorescent glue is just directly reached the standard grade without thawing after refrigerator takes out.Such as, fluorescent glue comprises elargol.Preferably, after detecting fluorescent glue temperature, also test fluorescent glue viscosity.Such as, judge whether described fluorescent glue viscosity meets the requirements, and is, continue operation, otherwise terminating operation, preferably, during terminating operation, also send fluorescent glue viscosity and be correlated with the information such as lot number, undesirable reason and terminating operation time to default instrument.Such as, after test fluorescent glue viscosity, before placement fluorescent glue, also fluorescent glue groove is cleaned.Such as, after cleaning fluorescent glue groove, before placement fluorescent glue, described fluorescent glue groove is also dried.Such as, fluorescent glue groove described in hot-air seasoning is adopted.Such as, the temperature of described hot blast is lower than 40 degrees Celsius.
Adopt dispensing method described in above-mentioned any embodiment, another example of the present invention is, a kind of manufacture method of high-powered LED lamp, and it comprises arbitrary above-mentioned dispensing method.
Further, embodiments of the invention also comprise, each technical characteristic of the various embodiments described above, the dispensing method of the LED be mutually combined to form and the manufacture method of high-powered LED lamp.
It should be noted that, above-mentioned each technical characteristic continues combination mutually, is formed not in above-named various embodiment, is all considered as the scope that specification of the present invention is recorded; Further, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.

Claims (10)

1. a dispensing method of LED, is characterized in that, comprises the following steps:
When a glue toasts, real-time test point glue baking temperature, when judging that it exceedes preset temperature threshold range, oppositely adjustment preset temperature changing value.Such as, oppositely after adjustment preset temperature changing value, continue real-time test point glue baking temperature, judge whether it exceedes preset temperature threshold range.
2. dispensing method according to claim 1, is characterized in that, perform described some glue step in point gum machine.
3. dispensing method according to claim 2, is characterized in that, before a glue, also arrange the relative position of gum outlet and support.
4. dispensing method according to claim 3, is characterized in that, before a glue, also detects fluorescent glue temperature.
5. dispensing method according to claim 4, is characterized in that, after detecting fluorescent glue temperature, also tests fluorescent glue viscosity.
6. dispensing method according to claim 5, is characterized in that, after test fluorescent glue viscosity, before placement fluorescent glue, also cleans fluorescent glue groove.
7. dispensing method according to claim 6, is characterized in that, after cleaning fluorescent glue groove, before placement fluorescent glue, also dries described fluorescent glue groove.
8. dispensing method according to claim 7, is characterized in that, adopts fluorescent glue groove described in hot-air seasoning.
9. dispensing method according to claim 8, it is characterized in that, the temperature of described hot blast is lower than 40 degrees Celsius.
10. a manufacture method for high-powered LED lamp, is characterized in that, comprise as arbitrary in claim 1 to 9 as described in dispensing method.
CN201510074959.4A 2015-02-12 2015-02-12 LED dispensing method and the manufacture method of high-powered LED lamp Expired - Fee Related CN104659192B (en)

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CN115241091A (en) * 2022-07-22 2022-10-25 成都郭李照明电器有限公司 LED lamp production manufacturing process on-line monitoring analysis cloud platform based on industrial internet

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CN115241091B (en) * 2022-07-22 2024-01-26 成都郭李照明电器有限公司 LED lamp production manufacturing process on-line monitoring analysis cloud platform based on industrial Internet

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