CN104658943A - A material processing method and device during abnormal state of semiconductor apparatus - Google Patents
A material processing method and device during abnormal state of semiconductor apparatus Download PDFInfo
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- CN104658943A CN104658943A CN201310577369.4A CN201310577369A CN104658943A CN 104658943 A CN104658943 A CN 104658943A CN 201310577369 A CN201310577369 A CN 201310577369A CN 104658943 A CN104658943 A CN 104658943A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
An embodiment of the present invention provides a material processing method and device during an abnormal state of a semiconductor apparatus. The semiconductor apparatus includes a process module and a transmission module. The method includes: creating a state variable for a current task, wherein the state variable includes an inactive state and an active state, the inactive state is used to indicate that the process module or the transmission module is in a normal state, and the active state is used to indicate the process module or the transmission module is in an abnormal state; changing the state variable from an initial inactive state to the active state, and recalculating a transmission path of a material when monitoring the process module or the transmission module related to the current task is in the abnormal state, wherein the transmission path includes a source position and a target position; using the transmission path to transmit the material from the source position to the target position; and if the material is successfully transmitted, changing the state variable from the active state to the inactive state. The method and device of the present invention reduce operation complexity, and save transmission time.
Description
Technical field
The present invention relates to the control technology field of semiconductor equipment, particularly relate to a kind of semiconductor equipment abnormal time material processing method and a kind of semiconductor equipment abnormal time material handling apparatus.
Background technology
In art production process, by the technique transfer process pre-established, semiconductor equipment ensures that material can be delivered to preposition according to this flow process and carry out explained hereafter processing by all materials in an orderly manner, and the material machined is delivered to the position of specifying store.
When semiconductor equipment is abnormal, such as when the parts of semiconductor equipment carry out process task, when not meeting interlocking condition and cause technique to stop, or the parts of semiconductor equipment by manual termination time, often need the position manually material of the existence in semiconductor equipment being passed to material storing.
In manually operated process, need according to the distributing position of material in semiconductor equipment, one by one material is passed to the position of material storing, need manually operated translational speed and the position of observing semiconductor equipment materials inside simultaneously, adjust manually operated amplitude.
Above-mentioned manual operation complex procedures, reduces efficiency of transmission, and easily causes misoperation; In operation, because manual operation accuracy is low, easily collide between material and equipment in operating process, cause the damage of material and equipment.
Summary of the invention
Embodiment of the present invention technical problem to be solved is to provide material processing method during a kind of semiconductor equipment exception, to realize the automatic business processing when semiconductor equipment is abnormal.
Present invention also offers material handling apparatus during a kind of semiconductor equipment exception, in order to ensure the implementation and application of said method.
In order to solve the problem, the embodiment of the invention discloses material processing method during a kind of semiconductor equipment exception, described semiconductor equipment comprises technical module and transport module, and described method comprises:
For current task creation state variable; Described state variable comprises unactivated state and state of activation, and described unactivated state is used to indicate technical module or transport module is normal condition, and described state of activation is used to indicate technical module or transport module is abnormality;
When monitoring technical module that current task relates to or transport module occurs abnormal, described state variable being changed to state of activation from initial unactivated state, and recalculates the transmission path of material; Described transmission path comprises source position and target location;
Adopt described transmission path that described material is transferred to described target location from described source position;
If described material transferring success, then change to unactivated state by described state variable from state of activation.
Preferably, described transport module comprises loading chamber, atmospheric robot, transfer chamber and/or vacuum robot, and described technical module comprises processing chamber.
Preferably, described target location comprises loading chamber, and described transmission path comprises the first transmission path, the second transmission path, the 3rd transmission path and/or the 4th transmission path;
The described step recalculating the transmission path of material comprises:
When described atmospheric robot there being material, setting described atmospheric robot is source position, and recalculates described first transmission path; Described first transmission path is that described material is directly transferred to the transmission path of described loading chamber from described atmospheric robot;
And/or,
When there is material described transfer chamber indoor, setting described transfer chamber is source position, and recalculates described second transmission path; Described second transmission path is that described material is transferred to described atmospheric robot from described transfer chamber, then is transferred to the transmission path of described loading chamber;
And/or,
When described vacuum robot there being material, setting described vacuum robot is source position, and recalculates described 3rd transmission path; Described 3rd transmission path is that described material is transferred to described transfer chamber from described vacuum robot, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber;
And/or,
When there being material in described processing chamber, setting described processing chamber is source position, and recalculates the 4th transmission path; Described 4th transmission path is that described material is transferred to described vacuum robot from described processing chamber, is then transferred to described transfer chamber, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber.
Preferably, the step that described material is transferred to target location by the described transmission path of described employing from source position comprises:
Described transmission path is adopted to generate corresponding transfer instruction;
Described transfer instruction is sent to described transport module; Described transport module is for adopting described transfer instruction by described material transferring to described target location.
Preferably, when described transmission path is described first transmission path, the transfer instruction of generation comprises the first transfer instruction; Described first transfer instruction is that described atmospheric robot is directly by the transfer instruction of described material transferring to described loading chamber;
When described transmission path is described second transmission path, the transfer instruction of generation comprises the second transfer instruction; Described second transfer instruction is that described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
When described transmission path is described 3rd transmission path, the transfer instruction of generation comprises the 3rd transfer instruction; Described 3rd transfer instruction be described vacuum robot by described material transferring to described transfer chamber, described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
When described transmission path is described 4th transmission path, the transfer instruction of generation comprises the 4th transfer instruction; Described 4th transfer instruction be described vacuum robot take out from described processing chamber described material, again by described material transferring to described transfer chamber, described atmospheric robot takes out described material, is transferred to the transfer instruction of the transmission path of described loading chamber again from described transfer chamber.
The embodiment of the invention also discloses material handling apparatus during a kind of semiconductor equipment exception, described semiconductor equipment comprises technical module and transport module, and described device comprises:
State variable creation module, for for current task creation state variable; Described state variable comprises unactivated state and state of activation, and described unactivated state is used to indicate technical module or transport module is normal condition, and described state of activation is used to indicate technical module or transport module is abnormality;
State of activation change module, for when monitoring technical module that current task relates to or transport module occurs abnormal, changes to state of activation by described state variable from initial unactivated state;
Transmission path computing module, for recalculating the transmission path of material; Described transmission path comprises source position and target location;
Transport module, is transferred to described target location by described material from described source position for adopting described transmission path;
Unactivated state change module, if for described material transferring success, then change to unactivated state by described state variable from state of activation.
Preferably, described transport module comprises loading chamber, atmospheric robot, transfer chamber and/or vacuum robot, and described technical module comprises processing chamber.
Preferably, described target location comprises loading chamber, and described transmission path comprises the first transmission path, the second transmission path, the 3rd transmission path and/or the 4th transmission path;
Described transmission path computing module comprises:
First transmission path calculating sub module, during for there being material on described atmospheric robot, setting described atmospheric robot is source position, and recalculates described first transmission path; Described first transmission path is that described material is directly transferred to the transmission path of described loading chamber from described atmospheric robot;
And/or,
Second transmission path calculating sub module, during for there being a material in described transfer chamber indoor, setting described transfer chamber is source position, and recalculates described second transmission path; Described second transmission path is that described material is transferred to described atmospheric robot from described transfer chamber, then is transferred to the transmission path of described loading chamber;
And/or,
3rd transmission path calculating sub module, during for there being material in described vacuum robot, setting described vacuum robot is source position, and recalculates described 3rd transmission path; Described 3rd transmission path is that described material is transferred to described transfer chamber from described vacuum robot, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber;
And/or,
4th transmission path calculating sub module, during for there being material in described processing chamber, setting described processing chamber is source position, and recalculates the 4th transmission path; Described 4th transmission path is that described material is transferred to described vacuum robot from described processing chamber, is then transferred to described transfer chamber, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber.
Preferably, described transport module comprises:
Transfer instruction generates submodule, generates corresponding transfer instruction for adopting described transmission path;
Transfer instruction sends submodule, for described transfer instruction is sent to described transport module; Described transport module is for adopting described transfer instruction by described material transferring to described target location.
Preferably, when described transmission path is described first transmission path, the transfer instruction of generation comprises the first transfer instruction; Described first transfer instruction is that described atmospheric robot is directly by the transfer instruction of described material transferring to described loading chamber;
When described transmission path is described second transmission path, the transfer instruction of generation comprises the second transfer instruction; Described second transfer instruction is that described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
When described transmission path is described 3rd transmission path, the transfer instruction of generation comprises the 3rd transfer instruction; Described 3rd transfer instruction be described vacuum robot by described material transferring to described transfer chamber, described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
When described transmission path is described 4th transmission path, the transfer instruction of generation comprises the 4th transfer instruction; Described 4th transfer instruction be described vacuum robot take out from described processing chamber described material, again by described material transferring to described transfer chamber, described atmospheric robot takes out described material, is transferred to the transfer instruction of the transmission path of described loading chamber again from described transfer chamber.
Compared with background technology, the present invention includes following advantage:
The present invention by recalculating the transmission path of material, and then passes target location back, achieves the automatic process when exception, reduce manually-operated complexity, and save the transmission time, decrease the possibility of misoperation, then reduce the semiconductor equipment caused by misoperation and damage and material damage.
Accompanying drawing explanation
The flow chart of steps of material processing method embodiment when Fig. 1 is a kind of semiconductor equipment exception of the present invention;
Fig. 2 is the structural representation of a kind of APCVD equipment of the present invention;
Fig. 3 is a kind of materiel machining path flow chart in the APCVD equipment shown in Fig. 2;
Fig. 4 is the flow chart of a kind of preferred material process example of the present invention;
The structured flowchart of material handling apparatus embodiment when Fig. 5 a kind of semiconductor equipment of the present invention is abnormal.
Embodiment
For enabling above-mentioned purpose, the feature and advantage of the embodiment of the present invention more become apparent, below in conjunction with the drawings and specific embodiments, the embodiment of the present invention is described in further detail.
With reference to Fig. 1, show a kind of semiconductor equipment of the present invention abnormal time the flow chart of steps of material processing method embodiment, described semiconductor equipment comprises technical module and transport module, and described method specifically can comprise the steps:
Step 101, for current task creation state variable;
Described state variable comprises unactivated state and state of activation, and described unactivated state is used to indicate technical module or transport module is normal condition, and described state of activation is used to indicate technical module or transport module is abnormality;
The operation of semiconductor equipment generally can relate to two modules, technical module (PMC) and transport module (TMC).PMC is the module of carrying out PROCESS FOR TREATMENT for controlling material, and TMC is then the module for controlling material transferring.
In one preferred embodiment of the invention, described transport module comprises loading chamber, atmospheric robot, transfer chamber and/or vacuum robot, and described technical module comprises processing chamber.
In actual applications, the main body of a lot of semiconductor equipment all can have loads chamber, atmospheric robot, transfer chamber, vacuum robot and/or processing chamber, such as APCVD(AtmosphericPressure Chemical Vapor Deposition, normal pressure chemical vapor phase deposition) equipment, PVD(Physical Vapor Deposition, physical vapour deposition (PVD)) equipment, etching apparatus etc.
Certainly, PMC and TMC of different semiconductor equipments also not merely comprises above-mentioned loading chamber, atmospheric robot, transfer chamber, vacuum robot and processing chamber, can also comprise different valves, conveyer belt, gas pipeline etc., embodiment of the present invention contrast is not described in detail one by one.
For making those skilled in the art understand the present invention better, below provide APCVD equipment that application implementation procedure of the present invention is exemplarily described.
With reference to Fig. 2, show the structural representation of a kind of APCVD equipment of the present invention.As shown in Figure 2, this APCVD comprises:
Two LoadPort: load chamber (LP), for the container of loaded material, comprise multiple groove, each groove can hold a sheet material, inside have 25 Slot(can place the position of a placement material in the container of material), the material wherein deposited comprises 5 cun, 6 cun and 8 cun of three kinds of forms;
A LoadLock: transfer chamber (LL), is the container that can seal, transmits material and play cushioning effect between air and vacuum parts, can place 1 sheet material;
An ExternalValve a: valve between LoadPort and LoadLock, only have when this valve opening, material could transmit between LoadPort and LoadLock;
A Transfor Cambe: vacuum chamber (TC), for the formation of vacuum environment, the chamber at vacuum end single arm robot place, its periphery is equipped with multiple processing chamber;
An InternalValve a: valve between LoadLock and TC, only have when this valve opening, material could transmit between LoadLock and TC chamber;
A ProcessModule: processing chamber (PM), for carrying out corresponding technological operation, for the material of different size, the material number deposited in pallet is also inconsistent.Can put 5 at most for 8 cun, can put 8 at most for 6 cun, can put 10 at most for 5 cun, the position for depositing material in pallet is called " Pocket ";
A GateValve: the valve between TC and processing chamber, only have when this valve opening, material could transmit between TC and PM;
An atmosphere end single arm robot (Robot), for the biography sheet between LoadPort and LoadLock
A vacuum end single arm robot (Robot), for LoadLock and TC, and the material transferring between TC and PM.
Task Job is that material transmits according to the path of setting in semiconductor equipment, and the position of specifying in transmitting procedure completes a process of technique.Job can comprise following four step: Load, puts into semiconductor equipment by material from external environment; Transmission, is sent to another position by material from certain position semiconductor equipment; Technique, material carries out PROCESS FOR TREATMENT in processing chamber; Unload, puts into material external environment from semiconductor equipment.
Before performing Job, first to define Job, comprise:
1, which Job load chamber (LoadPort, LP) and be loaded into board from;
2, corresponding in predefined loading chamber each position (slot) place the machining path of material.
With reference to Fig. 3, show a kind of materiel machining path flow chart in the APCVD equipment shown in Fig. 2.As shown in Figure 3, the machining path of material can be:
1, the material in LoadPort is placed into the upper calibration of calibrator (Aligner) by atmosphere end single arm robot (Robot);
2, ExternalValve is opened;
3, material moves in LoadLock from calibrator by atmosphere end single arm robot;
4, LoadLock completes air pressure conversion;
5, InternalValve is opened;
6, vacuum end single arm robot gets sheet from LoadLock;
7, GateValve is opened;
8, material is placed in PM by vacuum end single arm robot;
9, material is processed in PM;
10, when after completion of processing, GateValve is opened;
11, vacuum end single arm robot takes out material from PM;
12, InternalValve is opened;
13, material is placed in LoadLock by vacuum end single arm robot;
14, LoadLock completes air pressure conversion;
15, ExternalValve is opened;
16, material moves in LoadPort by atmosphere end single arm robot from LoadLock.
Since then, material completes time processing.
Step 102, when monitoring technical module that current task relates to or transport module occurs abnormal, changes to state of activation by described state variable from initial unactivated state;
When task starts, state variable is initially unactivated state, such as 0 value, the instruction technical module that relates to of current task or transport module working properly.When monitoring technical module that current task relates to or transport module occurs abnormal, such as, detect that the LL notready(that dished out is unripe in the buffer) information, then state variable is changed to state of activation, such as 1 value, the technical module that instruction current task relates to or transport module work occur abnormal.
It should be noted that, not all unusual condition can be processed automatically by semiconductor equipment, such as, detect that PM dishes out overtime alarm, then need artificial treatment in the buffer.For this reason, the embodiment of the present invention can a preset independently configuration file, can be xml((Extensible MarkupLanguage, extend markup language) file, put together with program code, this configuration file can store processing method corresponding to various exception, specifically comprises artificial treatment and process automatically.
Then in a preferred embodiment of the invention, the preferred implementation of step 102 can be:
When monitoring technical module that current task relates to or transport module occurs abnormal, in preset configuration file, search processing method corresponding to described exception; If automatically process, then described state variable is changed to state of activation from initial unactivated state;
It should be noted that, if automatically process, then state variable can not be changed to state of activation, but alarm of dishing out, there is the exception needing artificial treatment in reminding user semiconductor equipment, user then manually can perform attended operation at control end.
Step 103, recalculates the transmission path of material; Described transmission path comprises source position and target location;
When state variable is state of activation, need to recalculate the transmission path of abnormal lower material transferring to assigned address, current location is source position, and target location is then for transmitting the position (i.e. assigned address) that material needs to arrive.
In one preferred embodiment of the invention, described target location comprises loading chamber, described transmission path comprises the first transmission path, the second transmission path, the 3rd transmission path and/or the 4th transmission path, and described step 103 specifically can comprise following sub-step:
Sub-step S11, when described atmospheric robot there being material, setting described atmospheric robot is source position, and recalculates described first transmission path; Described first transmission path is that described material is directly transferred to the transmission path of described loading chamber from described atmospheric robot;
In actual applications, atmospheric robot (Robot1) can have slot variable to indicate whether to have material, such as, when slot value atmospheric robot being detected in the buffer is 1, it is indicated to have material, now can set atmospheric robot is source position (srcRobot1), and target location is for loading chamber (destLP), then the first transmission path is srcRobot1 → destLP.
It should be noted that, loading chamber can have multiple, and which loading chamber of concrete setting can be determined according to the Job of this material as target location, and namely material from which device chamber enters, then transmit back which device chamber.Which certainly, set loading chamber also to set according to actual conditions as target location.Such as, which device chamber is idle, then arrange it for target location.Again such as, can arrange the loading chamber that user specifies is target location, and the present invention is not limited this.Now, the first transmission path is srcRobot1(1) → destLPA, wherein, the value in bracket is slot value, and LPA is A and loads chamber.
And/or,
Sub-step S12, when there is material described transfer chamber indoor, setting described transfer chamber is source position, and recalculates described second transmission path; Described second transmission path is that described material is transferred to described atmospheric robot from described transfer chamber, then is transferred to the transmission path of described loading chamber;
Similarly, transfer chamber (LL) also can have slot variable to indicate whether to have material, such as, when slot value transfer chamber being detected in the buffer is 1, indicate it to have material, now can set transfer chamber is source position (srcLL), target location is for loading chamber (destLPA), then the second transmission path is srcLL(1) → Robot1(0) → destLPA, wherein, the value in bracket is slot value.
And/or,
Sub-step S13, when described vacuum robot there being material, setting described vacuum robot is source position, and recalculates described 3rd transmission path; Described 3rd transmission path is that described material is transferred to described transfer chamber from described vacuum robot, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber;
Similarly, vacuum robot (Robot2) also can have slot variable to indicate whether to have material, such as, when slot value vacuum robot being detected in the buffer is 1, indicate it to have material, now can set vacuum robot is source position (srcRobot2), target location is for loading chamber (destLPA), then the 3rd transmission path is srcRobot2(1) → LL(0) → Robot1(1) → destLPA, wherein, the value in bracket is slot value.
And/or,
Sub-step S14, when there being material in described processing chamber, setting described processing chamber is source position, and recalculates the 4th transmission path; Described 4th transmission path is that described material is transferred to described vacuum robot from described processing chamber, is then transferred to described transfer chamber, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber.
Similarly, processing chamber (PM) also can have slot variable to indicate whether to have material, such as, when slot value processing chamber being detected in the buffer is 1, it is indicated to have material, now can set processing chamber is source position (srcPM), and target location is for loading chamber (destLPA), then the 4th transmission path is srcPM → Robot2 → LL → Robot1 → destLPA.
It should be noted that, processing chamber can have multiple, and concrete which processing chamber of setting needs to carry out according to actual conditions as source position and determines.When material is positioned at X processing chamber, arranging PMX is source position, then the 4th transmission path is srcPMX(1) → Robot2(0) → LL(0) → Robot1(0) → destLPA, wherein, the value in bracket is slot value.When multiple processing chamber all has material, it is passed the order of loading chamber back and can determine according to its Job, and the material namely entering processing chamber later is preferably taken away.
In one preferred embodiment of the invention, step 103 specifically can also comprise following sub-step:
Sub-step S21, judges whether described atmospheric robot has material, if so, then performs sub-step S11;
Sub-step S22, judges whether described transfer chamber indoor have material, if so, then performs sub-step S12;
Sub-step S23, judges whether described vacuum robot has material, if so, then performs sub-step S13;
Sub-step S24, judges whether have material in described processing chamber, if so, then performs sub-step S14.
In specific implementation, can detect in the buffer and whether there is material according to the sequence detection of Robot1, LL, Robot2, PM, and recalculate corresponding transmission path according to this order, ensure from load chamber more close to material preferentially take away, can all pass all materials back loading chamber, and prevent from material from colliding causing unnecessary loss.
Then transmission path is srcPMX(slot) → Robot2(slot) → LL(slot) → Robot1(slot) → destLPA.
Step 104, adopts described transmission path that described material is transferred to described target location from described source position;
After material transferring to loading chamber, user can take material away from loading chamber, is further processed.
In one preferred embodiment of the invention, described step 104 specifically can comprise following sub-step:
Sub-step S31, adopts described transmission path to generate corresponding transfer instruction;
TMC directly can not resolve transmission path, needs transmission path to be decomposed into the executable transfer instruction of TMC.And in actual applications, different transmission path can to there being different transfer instructions.
In one preferred embodiment of the invention, described sub-step S31 can comprise following sub-step further:
Sub-step S311, when described transmission path is described first transmission path, the transfer instruction of generation comprises the first transfer instruction; Described first transfer instruction is that described atmospheric robot is directly by the transfer instruction of described material transferring to described loading chamber;
In specific implementation, for different semiconductor equipments, the concrete meaning of the first transfer instruction can be different.Can comprise and open different valves, use calibrator etc.
Sub-step S312, when described transmission path is described second transmission path, the transfer instruction of generation comprises the second transfer instruction; Described second transfer instruction is that described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
In specific implementation, for different semiconductor equipments, the concrete meaning of the second transfer instruction can be different.Such as, in the APCVD equipment shown in Fig. 2, the second transfer instruction specifically indicate open ExternalValve, then atmospheric robot take out from described transfer chamber material, again by material transferring to described loading chamber.
Sub-step S313, when described transmission path is described 3rd transmission path, the transfer instruction of generation comprises the 3rd transfer instruction; Described 3rd transfer instruction be described vacuum robot by described material transferring to described transfer chamber, described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
In specific implementation, for different semiconductor equipments, the concrete meaning of the 3rd transfer instruction can be different.Such as, in the APCVD equipment shown in Fig. 2,3rd transfer instruction specifically indicates opens InternalValve, vacuum robot by material transferring to transfer chamber, after transfer chamber completes air pressure conversion, open ExternalValve, then atmospheric robot take out from described transfer chamber material, again by material transferring to described loading chamber.
Sub-step S314, when described transmission path is described 4th transmission path, the transfer instruction of generation comprises the 4th transfer instruction; Described 4th transfer instruction be described vacuum robot take out from described processing chamber described material, again by described material transferring to described transfer chamber, described atmospheric robot takes out described material, is transferred to the transfer instruction of the transmission path of described loading chamber again from described transfer chamber.
In specific implementation, for different semiconductor equipments, the concrete meaning of the 4th transfer instruction can be different.Such as, in the APCVD equipment shown in Fig. 2,4th transfer instruction specifically indicates opens GateValve, vacuum robot takes out described material from processing chamber, open InternalValve, vacuum robot by material transferring to transfer chamber, transfer chamber complete air pressure change after, open ExternalValve, then atmospheric robot take out from described transfer chamber material, again by material transferring to described loading chamber.
Sub-step S32, is sent to described transport module by described transfer instruction; Described transport module is for adopting described transfer instruction by described material transferring to described target location.
After transport module receives executable transfer instruction, perform this transfer instruction, material is passed back loading chamber.
In specific implementation, the first transmission path is srcRobot1(1) → destLPA.After receiving the first transfer instruction, by the material transferring in Robot1 to LPA, change the slot value of Robot1 into 0 simultaneously.
Second transmission path is srcLL(1) → Robot1(0) → destLPA, after receiving the second transfer instruction, passes to Robot1 by the material of LL, and the slot of LL is changed into 0, changes the slot of Robot1 into 1; After the material of Robot1 is passed to LPA, the slot of Robot1 changes 0 into.
3rd transmission path is srcRobot2(1) → LL(0) → Robot1(0) → destLPA, after receiving the 3rd transfer instruction, by the material transferring of Robot2 to LL, the slot value of Robot2 is changed into 0, changes the slot of LL into 1 simultaneously; During by the material transferring of LL to Robot1, change the slot value of LL into 0, change the slot of Robot1 into 1; After the material of Robot1 is passed to LPA, change the slot of Robot1 into 0.
4th transmission path is srcPMX(1) → Robot2(0) → LL(0) → Robot1(0) → destLPA, after receiving the 4th transfer instruction, after the material transferring of PMX to Robot2, change the slot of PMX into 0, change the slot of Robot2 into 1; By the material transferring of Robot2 to LL, the slot value of Robot2 is changed into 0, changes the slot of LL into 1 simultaneously; During by the material transferring of LL to Robot1, change the slot value of LL into 0, change the slot of Robot1 into 1; After the material of Robot1 is passed to LPA, change the slot of Robot1 into 0.
Step 105, if the success of described material transferring, then changes to unactivated state by described state variable from state of activation.
In specific implementation, can judge whether the slot value of loading chamber, atmospheric robot, transfer chamber, vacuum robot and processing chamber is 0, if so, then judge material transferring success, state variable is changed to unactivated state from state of activation.
With reference to Fig. 4, show the flow chart of a kind of preferred material process example of the embodiment of the present invention.Figure as indicated at 4, when TMC/PMC occurs abnormal, if judge it is automatic process, then state variable is changed to state of activation, preferentially pass the material of Robot1 back LP, then pass the material of LL back LP, then the material of Robot2 is passed back LP, finally pass the material of PM back LP, after material all passes LP back, state variable is changed to unactivated state.
The present invention by recalculating the transmission path of material, and then passes target location back, achieves the automatic process when exception, reduce manually-operated complexity, and save the transmission time, decrease the possibility of misoperation, then reduce the semiconductor equipment caused by misoperation and damage and material damage.
For embodiment of the method, in order to simple description, therefore it is all expressed as a series of combination of actions, but those skilled in the art should know, the embodiment of the present invention is not by the restriction of described sequence of movement, because according to the embodiment of the present invention, some step can adopt other orders or carry out simultaneously.Secondly, those skilled in the art also should know, the embodiment described in specification all belongs to preferred embodiment, and involved action might not be that the embodiment of the present invention is necessary.
With reference to Fig. 5, show a kind of semiconductor equipment of the embodiment of the present invention abnormal time the structured flowchart of material handling apparatus embodiment, described semiconductor equipment comprises technical module and transport module, and described device can comprise with lower module:
State variable creation module 501, for for current task creation state variable; Described state variable comprises unactivated state and state of activation, and described unactivated state is used to indicate technical module or transport module is normal condition, and described state of activation is used to indicate technical module or transport module is abnormality;
State of activation change module 502, for when monitoring technical module that current task relates to or transport module occurs abnormal, changes to state of activation by described state variable from initial unactivated state;
Transmission path computing module 503, for recalculating the transmission path of material; Described transmission path comprises source position and target location;
Transport module 504, is transferred to described target location by described material from described source position for adopting described transmission path;
Unactivated state change module 505, if for described material transferring success, then change to unactivated state by described state variable from state of activation.
In one preferred embodiment of the invention, described transport module comprises loading chamber, atmospheric robot, transfer chamber and/or vacuum robot, and described technical module comprises processing chamber.
In one preferred embodiment of the invention, described target location comprises loading chamber, and described transmission path comprises the first transmission path, the second transmission path, the 3rd transmission path and/or the 4th transmission path;
Described transmission path computing module comprises following submodule:
First transmission path calculating sub module, during for there being material on described atmospheric robot, setting described atmospheric robot is source position, and recalculates described first transmission path; Described first transmission path is that described material is directly transferred to the transmission path of described loading chamber from described atmospheric robot;
And/or,
Second transmission path calculating sub module, during for there being a material in described transfer chamber indoor, setting described transfer chamber is source position, and recalculates described second transmission path; Described second transmission path is that described material is transferred to described atmospheric robot from described transfer chamber, then is transferred to the transmission path of described loading chamber;
And/or,
3rd transmission path calculating sub module, during for there being material in described vacuum robot, setting described vacuum robot is source position, and recalculates described 3rd transmission path; Described 3rd transmission path is that described material is transferred to described transfer chamber from described vacuum robot, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber;
And/or,
4th transmission path calculating sub module, during for there being material in described processing chamber, setting described processing chamber is source position, and recalculates the 4th transmission path; Described 4th transmission path is that described material is transferred to described vacuum robot from described processing chamber, is then transferred to described transfer chamber, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber.
In one preferred embodiment of the invention, described transport module comprises following submodule:
Transfer instruction generates submodule, generates corresponding transfer instruction for adopting described transmission path;
Transfer instruction sends submodule, for described transfer instruction is sent to described transport module; Described transport module is for adopting described transfer instruction by described material transferring to described target location.
In one preferred embodiment of the invention, when described transmission path is described first transmission path, the transfer instruction of generation comprises the first transfer instruction; Described first transfer instruction is that described atmospheric robot is directly by the transfer instruction of described material transferring to described loading chamber;
When described transmission path is described second transmission path, the transfer instruction of generation comprises the second transfer instruction; Described second transfer instruction is that described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
When described transmission path is described 3rd transmission path, the transfer instruction of generation comprises the 3rd transfer instruction; Described 3rd transfer instruction be described vacuum robot by described material transferring to described transfer chamber, described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
When described transmission path is described 4th transmission path, the transfer instruction of generation comprises the 4th transfer instruction; Described 4th transfer instruction be described vacuum robot take out from described processing chamber described material, again by described material transferring to described transfer chamber, described atmospheric robot takes out described material, is transferred to the transfer instruction of the transmission path of described loading chamber again from described transfer chamber.
For device embodiment, due to itself and embodiment of the method basic simlarity, so description is fairly simple, relevant part illustrates see the part of embodiment of the method.
Each embodiment in this specification all adopts the mode of going forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, between each embodiment identical similar part mutually see.
Although described the preferred embodiment of the embodiment of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of embodiment of the present invention scope.
Finally, also it should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or mobile device and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or mobile device.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the mobile device comprising described key element and also there is other identical element.
Material processing method when a kind of semiconductor equipment provided the embodiment of the present invention is above abnormal and a kind of semiconductor equipment abnormal time material handling apparatus, be described in detail, apply specific case herein to set forth the principle of the embodiment of the present invention and execution mode, the explanation of above embodiment is just for helping method and the core concept thereof of understanding the embodiment of the present invention; Meanwhile, for one of ordinary skill in the art, according to the thought of the embodiment of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as the restriction to the embodiment of the present invention.
Claims (10)
1. material processing method when semiconductor equipment is abnormal, it is characterized in that, described semiconductor equipment comprises technical module and transport module, and described method comprises:
For current task creation state variable; Described state variable comprises unactivated state and state of activation, and described unactivated state is used to indicate technical module or transport module is normal condition, and described state of activation is used to indicate technical module or transport module is abnormality;
When monitoring technical module that current task relates to or transport module occurs abnormal, described state variable being changed to state of activation from initial unactivated state, and recalculates the transmission path of material; Described transmission path comprises source position and target location;
Adopt described transmission path that described material is transferred to described target location from described source position;
If described material transferring success, then change to unactivated state by described state variable from state of activation.
2. material processing method when semiconductor equipment according to claim 1 is abnormal, is characterized in that, described transport module comprises loading chamber, atmospheric robot, transfer chamber and/or vacuum robot, and described technical module comprises processing chamber.
3. material processing method when semiconductor equipment according to claim 2 is abnormal, it is characterized in that, described target location comprises loading chamber, and described transmission path comprises the first transmission path, the second transmission path, the 3rd transmission path and/or the 4th transmission path;
The described step recalculating the transmission path of material comprises:
When described atmospheric robot there being material, setting described atmospheric robot is source position, and recalculates described first transmission path; Described first transmission path is that described material is directly transferred to the transmission path of described loading chamber from described atmospheric robot;
And/or,
When there is material described transfer chamber indoor, setting described transfer chamber is source position, and recalculates described second transmission path; Described second transmission path is that described material is transferred to described atmospheric robot from described transfer chamber, then is transferred to the transmission path of described loading chamber;
And/or,
When described vacuum robot there being material, setting described vacuum robot is source position, and recalculates described 3rd transmission path; Described 3rd transmission path is that described material is transferred to described transfer chamber from described vacuum robot, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber;
And/or,
When there being material in described processing chamber, setting described processing chamber is source position, and recalculates the 4th transmission path; Described 4th transmission path is that described material is transferred to described vacuum robot from described processing chamber, is then transferred to described transfer chamber, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber.
4. the material processing method when semiconductor equipment according to claim 1 or 3 is abnormal, it is characterized in that, described material is transferred to target location by the described transmission path of described employing step from source position comprises:
Described transmission path is adopted to generate corresponding transfer instruction;
Described transfer instruction is sent to described transport module; Described transport module is for adopting described transfer instruction by described material transferring to described target location.
5. material processing method when semiconductor equipment according to claim 4 is abnormal, is characterized in that,
When described transmission path is described first transmission path, the transfer instruction of generation comprises the first transfer instruction; Described first transfer instruction is that described atmospheric robot is directly by the transfer instruction of described material transferring to described loading chamber;
When described transmission path is described second transmission path, the transfer instruction of generation comprises the second transfer instruction; Described second transfer instruction is that described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
When described transmission path is described 3rd transmission path, the transfer instruction of generation comprises the 3rd transfer instruction; Described 3rd transfer instruction be described vacuum robot by described material transferring to described transfer chamber, described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
When described transmission path is described 4th transmission path, the transfer instruction of generation comprises the 4th transfer instruction; Described 4th transfer instruction be described vacuum robot take out from described processing chamber described material, again by described material transferring to described transfer chamber, described atmospheric robot takes out described material, is transferred to the transfer instruction of the transmission path of described loading chamber again from described transfer chamber.
6. material handling apparatus when semiconductor equipment is abnormal, it is characterized in that, described semiconductor equipment comprises technical module and transport module, and described device comprises:
State variable creation module, for for current task creation state variable; Described state variable comprises unactivated state and state of activation, and described unactivated state is used to indicate technical module or transport module is normal condition, and described state of activation is used to indicate technical module or transport module is abnormality;
State of activation change module, for when monitoring technical module that current task relates to or transport module occurs abnormal, changes to state of activation by described state variable from initial unactivated state;
Transmission path computing module, for recalculating the transmission path of material; Described transmission path comprises source position and target location;
Transport module, is transferred to described target location by described material from described source position for adopting described transmission path;
Unactivated state change module, if for described material transferring success, then change to unactivated state by described state variable from state of activation.
7. material handling apparatus when semiconductor equipment according to claim 6 is abnormal, is characterized in that, described transport module comprises loading chamber, atmospheric robot, transfer chamber and/or vacuum robot, and described technical module comprises processing chamber.
8. material handling apparatus when semiconductor equipment according to claim 7 is abnormal, it is characterized in that, described target location comprises loading chamber, and described transmission path comprises the first transmission path, the second transmission path, the 3rd transmission path and/or the 4th transmission path;
Described transmission path computing module comprises:
First transmission path calculating sub module, during for there being material on described atmospheric robot, setting described atmospheric robot is source position, and recalculates described first transmission path; Described first transmission path is that described material is directly transferred to the transmission path of described loading chamber from described atmospheric robot;
And/or,
Second transmission path calculating sub module, during for there being a material in described transfer chamber indoor, setting described transfer chamber is source position, and recalculates described second transmission path; Described second transmission path is that described material is transferred to described atmospheric robot from described transfer chamber, then is transferred to the transmission path of described loading chamber;
And/or,
3rd transmission path calculating sub module, during for there being material in described vacuum robot, setting described vacuum robot is source position, and recalculates described 3rd transmission path; Described 3rd transmission path is that described material is transferred to described transfer chamber from described vacuum robot, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber;
And/or,
4th transmission path calculating sub module, during for there being material in described processing chamber, setting described processing chamber is source position, and recalculates the 4th transmission path; Described 4th transmission path is that described material is transferred to described vacuum robot from described processing chamber, is then transferred to described transfer chamber, then is transferred to described atmospheric robot, is finally transferred to the transmission path of described loading chamber.
9. the material handling apparatus when semiconductor equipment according to claim 6 or 8 is abnormal, it is characterized in that, described transport module comprises:
Transfer instruction generates submodule, generates corresponding transfer instruction for adopting described transmission path;
Transfer instruction sends submodule, for described transfer instruction is sent to described transport module; Described transport module is for adopting described transfer instruction by described material transferring to described target location.
10. material handling apparatus when semiconductor equipment according to claim 9 is abnormal, is characterized in that,
When described transmission path is described first transmission path, the transfer instruction of generation comprises the first transfer instruction; Described first transfer instruction is that described atmospheric robot is directly by the transfer instruction of described material transferring to described loading chamber;
When described transmission path is described second transmission path, the transfer instruction of generation comprises the second transfer instruction; Described second transfer instruction is that described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
When described transmission path is described 3rd transmission path, the transfer instruction of generation comprises the 3rd transfer instruction; Described 3rd transfer instruction be described vacuum robot by described material transferring to described transfer chamber, described atmospheric robot takes out described material, again by the transfer instruction of described material transferring to described loading chamber from described transfer chamber;
When described transmission path is described 4th transmission path, the transfer instruction of generation comprises the 4th transfer instruction; Described 4th transfer instruction be described vacuum robot take out from described processing chamber described material, again by described material transferring to described transfer chamber, described atmospheric robot takes out described material, is transferred to the transfer instruction of the transmission path of described loading chamber again from described transfer chamber.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810618A (en) * | 2016-05-31 | 2016-07-27 | 北京七星华创电子股份有限公司 | System and method for improving wafer transmission efficiency |
| CN106591793A (en) * | 2015-10-16 | 2017-04-26 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate collecting and placing method |
| CN107346750A (en) * | 2016-05-04 | 2017-11-14 | 北京北方华创微电子装备有限公司 | A kind of semiconductor technology processing method and processing device |
| CN110938807A (en) * | 2019-11-26 | 2020-03-31 | 北京北方华创微电子装备有限公司 | Control method and system for returning wafer of PVD sputtering equipment to disc according to specified path |
| CN113651059A (en) * | 2021-07-28 | 2021-11-16 | 北京旷视机器人技术有限公司 | Abnormity processing method and device, material conveying system and robot |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101241840A (en) * | 2007-02-05 | 2008-08-13 | 东京毅力科创株式会社 | Vacuum processing apparatus and method, and storage medium |
| JP2009164256A (en) * | 2007-12-28 | 2009-07-23 | Sokudo Co Ltd | Substrate treatment apparatus |
| KR20110121806A (en) * | 2010-05-03 | 2011-11-09 | 세메스 주식회사 | Method for operating wafers processing apparatus |
-
2013
- 2013-11-18 CN CN201310577369.4A patent/CN104658943B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101241840A (en) * | 2007-02-05 | 2008-08-13 | 东京毅力科创株式会社 | Vacuum processing apparatus and method, and storage medium |
| JP2009164256A (en) * | 2007-12-28 | 2009-07-23 | Sokudo Co Ltd | Substrate treatment apparatus |
| KR20110121806A (en) * | 2010-05-03 | 2011-11-09 | 세메스 주식회사 | Method for operating wafers processing apparatus |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106591793A (en) * | 2015-10-16 | 2017-04-26 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate collecting and placing method |
| CN106591793B (en) * | 2015-10-16 | 2019-02-19 | 北京北方华创微电子装备有限公司 | A kind of folding and unfolding piece method |
| CN107346750A (en) * | 2016-05-04 | 2017-11-14 | 北京北方华创微电子装备有限公司 | A kind of semiconductor technology processing method and processing device |
| CN105810618A (en) * | 2016-05-31 | 2016-07-27 | 北京七星华创电子股份有限公司 | System and method for improving wafer transmission efficiency |
| CN105810618B (en) * | 2016-05-31 | 2018-08-10 | 北京七星华创电子股份有限公司 | Improve the system and method for wafer transfer efficiency |
| CN110938807A (en) * | 2019-11-26 | 2020-03-31 | 北京北方华创微电子装备有限公司 | Control method and system for returning wafer of PVD sputtering equipment to disc according to specified path |
| CN110938807B (en) * | 2019-11-26 | 2022-10-21 | 北京北方华创微电子装备有限公司 | Control method and system for returning wafer of PVD sputtering equipment to disc according to specified path |
| CN113651059A (en) * | 2021-07-28 | 2021-11-16 | 北京旷视机器人技术有限公司 | Abnormity processing method and device, material conveying system and robot |
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|---|---|
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