CN104640401A - Fixing device for electronic component - Google Patents
Fixing device for electronic component Download PDFInfo
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- CN104640401A CN104640401A CN201310560276.0A CN201310560276A CN104640401A CN 104640401 A CN104640401 A CN 104640401A CN 201310560276 A CN201310560276 A CN 201310560276A CN 104640401 A CN104640401 A CN 104640401A
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- cantilever
- electronic component
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- fixture
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Abstract
A fixing device for an electronic component comprises a fixing body and a clamping hook. The electronic component is contained in the fixing body which comprises a guide groove and a retaining block. The guide groove is formed in one side wall of the fixing body, and the retaining block with a retaining face is arranged on one side of the guide groove. The clamping hook is arranged in the guide groove and used for fixing the electronic component and comprises a body, a pressure portion, a suspension arm and a buffering structure. The pressure portion is formed at one end of the body, the suspension arm is provided with a contact face for abutting against the retaining face, and two end of the buffering structure are connected with the other end of the body and the suspension arm respectively.
Description
Technical field
The present invention relates to a kind of fixture, particularly a kind of fixture for fixed electronic element.
Background technology
The fixed form of general electronic component, be that the periphery of storage tank has coupler construction by being placed in storage tank, and snap fit body extends from the periphery of storage tank, the top of snap fit body has the hook part of protrusion.After storage tank inserted by electronic component, snap fit body can be fitted the sidewall of electronic component, and the end face of hook part pressing electronic component, so that electronic component is fixed in storage tank.
Generally speaking, the structure that storage tank and snap fit are formed in one, therefore in assembling and disassemble in the process of electronic component, after must first being pulled open toward the outside of storage tank by snap fit, electronic component can be inserted/shift out in storage tank.But in the process pulled open toward the outside of storage tank by snap fit, the body for snap fit will produce great stress, and then makes the part of the body of snap fit easily produce the situation damaging fracture.At present only by the dynamic balance between meticulous calculating snap fit, storage tank and electronic component three, reduce the situation that snap fit is damaged by this, so, limited efficiency.
In addition, for making the end face of the lucky contact electronic component in hook part, even if make electronic component be given a shock, also too large rocking can not be produced, make the configuration of snap fit must coordinate the configuration of electronic component, in other words, the length of the body part of snap fit must change to some extent according to the difference of the height of electronic component.And once have tolerance between snap fit and storage tank, then fixed electronic element that cannot be firm, that is the structure of known snap fit and storage tank, the tolerance for assembling tolerance is quite low, and then improves manufacturing cost.
Therefore, how to provide a kind of fixture of electronic component, can be novel and design easily, make in assembling or disassemble in the process of electronic component, fixture can bear less strength, to improve the useful life of fixture, becomes one of important topic.
Summary of the invention
Because above-mentioned problem, object of the present invention, can be novel and design easily for providing the fixture of electronic component, and make in assembling or disassemble in the process of electronic component, fixture can bear less strength, to improve the useful life of fixture.
For reaching above-mentioned purpose, according to the fixture of a kind of electronic component of the present invention, comprise a fixed body and a snap fit.Fixed body holding electronic element, fixed body comprises a guide channel and a block.Guide channel is arranged at a sidewall of fixed body.Block is arranged at the side of guide channel, and has a stopping surface.Snap fit is arranged at guide channel, and in order to fixed electronic element, snap fit comprises a body, a nip portion, a cantilever and a buffer structure.Nip portion is arranged at an end of body.Cantilever has a contact-making surface with contact stopping surface.The two ends of buffer structure connect the other end and the cantilever of body respectively.
In one embodiment, body has a recess near one end of cantilever, and buffer structure is arranged at recess and is connected to body, and the length of recess is greater than the length of cantilever.
In one embodiment, snap fit is dismountable is arranged at guide channel.
In one embodiment, cantilever has a suspended wall root and is connected to buffer structure, and the size of suspended wall root and buffer structure is less than the size of cantilever and body.
In one embodiment, stopping surface has one first coarse structure.
In one embodiment, the contact-making surface of cantilever has one second coarse structure.
In one embodiment, stopping surface is inclined-plane or cambered surface.
In one embodiment, when snap fit fixed electronic element, nip portion fastens the top of electronic component, and the contact-making surface contact stopping surface of cantilever.
In one embodiment, when snap fit fixed electronic element, cantilever and stopping surface have an angle, and angle is between 60 to 100 degree.
In one embodiment, nip portion and cantilever extend from two ends of body respectively.
In one embodiment, nip portion and cantilever extend from different directions corresponding to body.
In one embodiment, fixed body more comprises an opening, opening be arranged at fixed body one bottom or sidewall.
In one embodiment, wherein fixture more comprises and disassembles utensil, by opening with contact cantilever.
In one embodiment, body has one first plane and contacts with electronic component, and suspended wall leans on the side into electronic component to have one second plane, and the second plane does not contact with electronic component.
In one embodiment, the second plane comparatively the first plane away from electronic component.
In one embodiment, the width of body is greater than the width of suspended wall.
In one embodiment, buffer structure comprises elastic material.
In one embodiment, elastic material comprises plastics, rubber, silica gel or its combination.
For reaching above-mentioned purpose, according to the fixture of another kind of electronic component of the present invention, comprise a fixed body and a snap fit.The accommodating electronic component of fixed body, fixed body comprises a guide channel and a block.Guide channel is arranged at a sidewall of fixed body.Block is arranged at the side of guide channel, and has a stopping surface.Snap fit is in order to fixed electronic element, and snap fit comprises a body, a nip portion, a cantilever and a buffer structure.Body has a recess.Nip portion is arranged at an end of body.Cantilever has a contact-making surface.The two ends of buffer structure connect the other end and the cantilever of body respectively.Wherein, when snap fit inserts guide channel, cantilever is compressed to recess by block, when nip portion fixed electronic element, and the contact-making surface contact stopping surface of cantilever.
From the above, the fixture of electronic component of the present invention, it is by fixed body holding electronic element, and fixed body has guide channel, it is arranged between fixed body and electronic component, snap fit can be inserted in guide channel, and snap fit is moved to nip portion can the degree on top of pressing electronic component, by this electronic component is fixed in fixed body.And after electronic component first inserted fixed body by this kind, again snap fit being inserted in guide channel, in the process of assembling electronic component, can insert electronic component without the need to the body by pulling open snap fit, the wearing and tearing for snap fit or consume can be reduced, to improve the useful life of fixture and snap fit.
Accompanying drawing explanation
Figure 1A is a kind of fixture of one embodiment of the invention and the decomposing schematic representation of electronic component.
Figure 1B is the enlarged diagram of the snap fit shown in Figure 1A.
Fig. 2 A for the fixed body shown in Figure 1A and electronic component assemble after schematic diagram.
Fig. 2 B is the schematic diagram after the fixture shown in Figure 1A and electronic component assembling.
The action schematic diagram that Fig. 3 A to Fig. 3 C is the fixture shown in Figure 1A.
Fig. 4 is the schematic diagram at another visual angle of snap fit shown in Figure 1B.
Fig. 5 is the enlarged diagram of the a-quadrant of the fixture shown in Fig. 3 C.
Fig. 6 is the schematic diagram of a kind of fixture of another embodiment of the present invention.
The schematic diagram of utensil is disassembled in the cooperation that Fig. 7 is the fixture shown in Fig. 2 B.
Wherein, description of reference numerals is as follows:
1,1a: fixed body
11,11a: guide channel
111,111a, 13,13a: sidewall
12,12a: block
121,121a: stopping surface
122: opening
14: bottom
2,2a: snap fit
21,21a: body
211: recess
212: the first planes
22,22a: nip portion
23,23a: cantilever
231,231a: contact-making surface
232: cantilever root
233: the second planes
24,24a: buffer structure
3: disassemble utensil
A, B: region
D: distance
E: electronic component
F: fixture
R1: the first coarse structure
R2: the second coarse structure
S: space
W1, W2: width
X: direction
Y: direction
Z: direction
θ: angle
Embodiment
Hereinafter with reference to correlative type, the fixture of a kind of electronic component according to present pre-ferred embodiments is described, wherein identical element is illustrated with identical reference marks.
Figure 1A is a kind of fixture of one embodiment of the invention and the decomposing schematic representation of electronic component, please refer to shown in Figure 1A.The fixture F of the electronic component E of the present embodiment, namely in order to fixed electronic element E, and fixture F comprises fixed body 1 and a snap fit 2.Wherein, fixed body 1 has the space S of holding electronic element E, in order to put electronic component E.And fixed body 1 also comprises guide channel 11 and a block 12.Wherein, guide channel 11 is arranged at the sidewall 13 that fixed body 1 corresponds to this side of space S.Snap fit 2 comprises body 21, nip portion 22, cantilever 23 and a buffer structure 24.Nip portion 22 is arranged at an end of body 21, and buffer structure 24 is connected to the other end of body 21, and in other words, nip portion 22 and buffer structure 24 are arranged at two ends of body 21 respectively, and extend from two ends of body 21 respectively.And other one end of buffer structure 24 is connected to cantilever 23, that is the two ends of buffer structure 24 connect end and the cantilever 23 of body 21 respectively.As shown in Figure 1A, with vertical direction Y, snap fit 2 is formed by nip portion 22, body 21, buffer structure 24 and cantilever 23 sequential.
Figure 1B is the enlarged diagram of the snap fit shown in Figure 1A, and the snap fit 2 of the present embodiment connects body 21 and cantilever 23 by buffer structure 24.Wherein one end of cantilever 23 has a contact-making surface 231, and the other end has a cantilever root 232 is connected to buffer structure 24, and the size of suspended wall root 232 and buffer structure 24 is less than the size of cantilever 23 and body 21.In addition, buffer structure 24 comprises elastic material, can such as but not limited to plastics, rubber, silica gel or its combination.And the entirety of the snap fit 2 of the present embodiment (comprising buffer structure 24) is for plastic material, be connected between cantilever 23 and body 21 by suspended wall root 232 and buffer structure 24 with less size, suspended wall root 232 and buffer structure 24 can be made to be formed there is flexible structure.Preferably, the cantilever root 232 of the present embodiment is the structure that wall thickness is thinner, makes to have more flexible cushioning effect between body 21 and cantilever 23, to increase the flexibility ratio of cantilever 23 action, even if cantilever 23 can near or away from body 21 between dexterous actions.
Fig. 2 A for the fixed body shown in Figure 1A and electronic component assemble after schematic diagram, Fig. 2 B is the schematic diagram after the fixture shown in Figure 1A and electronic component assembling, please also refer to shown in Figure 1A, Fig. 2 A and Fig. 2 B, after electronic component E inserts space S, as shown in Figure 2 A, guide channel 11 is arranged between fixed body 1 and electronic component E, and block 12 is arranged at the side of guide channel 11.As shown in Figure 1A and Fig. 2 B, block 12 corresponds to guide channel 11 and has a stopping surface 121, when snap fit 2 is placed in guide channel 11, contact-making surface 231 and the stopping surface 121 of cantilever 23 contact with each other, in other words, after snap fit 2 is placed in guide channel 11, contact-making surface 231 corresponds to stopping surface 121 and arranges.In addition, nip portion 22 corresponds to body 21 with cantilever 23 and extends from different directions, specifically, the nip portion 22 of the present embodiment is extended toward direction Z from body 21, and cantilever 23 extends toward direction X from body 21, and then formation nip portion 22 is extended from different directions corresponding to body 21 with cantilever 23.And the aspect that this kind extends from different directions, can make nip portion 22 contact electronic component E, cantilever 23 can be placed in guide channel 11 simultaneously, and makes its contact-making surface 231 contact stopping surface 121.
The action schematic diagram that Fig. 3 A to Fig. 3 C is the fixture shown in Figure 1A, and Fig. 3 A those shown is aspect snap fit 2 beginning inserting fixed body 1, and Fig. 3 B and 3C is the action diagram that snap fit 2 slips into guide channel 11 downwards.As shown in Figure 3A, first snap fit 2 correspondence is placed in guide channel 11, and bestow snap fit 2 one vertically toward the power (power namely shown in Y-direction) of fixed body 1, now, cantilever 23 is subject to the compressing of block 12, by buffer structure 24 for size is less and have flexible structure, after cantilever 23 is oppressed, near body 21, the aspect that cantilever 23 is compressed can be formed.And continue the power bestowing snap fit 2 direction Y, as shown in Figure 3 B, snap fit 2 can be made to progress in guide channel 11.Preferably, the stopping surface 121 of the present embodiment is inclined-plane, namely tilt toward sidewall 111 direction away from guide channel 11, therefore when cantilever 23 enters the region of stopping surface 121, cantilever 23 is no longer compressed by block 12 and is discharged, and then make the contact-making surface 231 contact stopping surface 121 of cantilever 23, make cantilever 23 correspond to the stopping surface 121 tilted to open gradually (as Fig. 3 B to Fig. 3 C), namely cantilever 23 with buffer structure 24 for fulcrum, and open toward the direction away from body 21, until nip portion 22 can the degree (as shown in Figure 2 B) on top of pressing electronic component E, by this electronic component E is fixed in fixed body 1.In other words, as snap fit 2 fixed electronic element E, nip portion 22 fastens the top of electronic component E, and the contact-making surface 231 contact stopping surface 121 of cantilever 23.In addition, as shown in Figure 3 C, as snap fit 2 fixed electronic element E, when making contact-making surface 231 be resisted against in fact stopping surface 121, preferably, cantilever 23 and stopping surface 121 have an angle theta, and in preferred embodiment, angle theta is between 80 to 100 degree.
Now, because cantilever 23 opens away from the direction of body 21 before, and contact-making surface 231 is resisted against stopping surface 121, and snap fit 2 is sticked in guide channel 11.In addition, snap fit 2 is inserted in the process of guide channel 11 downwards, the reaction force of contact-making surface 231 contact stopping surface 121, the body 21 of snap fit 2 can be pushed toward the direction of sidewall 111, snap fit 2 can be made more firmly to be sticked in guide channel 11, other utensil just removable snap fit 2 must be utilized.Hold, the snap fit 2 of the present embodiment is dismountable is arranged at guide channel 11, and preferably, after first electronic component E being inserted space S (as shown in Figure 2 A), again snap fit 2 is inserted in guide channel 11 (as shown in Figure 2 B), when cantilever 23 enters the region of stopping surface 121, the contact-making surface 231 contact stopping surface 121 of cantilever 23, and as shown in Fig. 3 B and Fig. 3 C, cantilever 23 can buffer structure 24 be fulcrum, and open toward the direction away from body 21, in other words, the angle that body 21, buffer structure 24 and cantilever 23 three can be made to be formed increases gradually.And the snap fit 2 of the present embodiment is by the difference of cantilever 23 opening angle, namely contact-making surface 231 is resisted against the zones of different of stopping surface 121, makes nip portion 22 be positioned at different height, and then can be applicable to the electronic component E of multiple differing heights.
In addition, electronic component E is placed in the space S of fixed body 1, and when being fixed by nip portion 22, nip portion 22 can directly directly contact with electronic component E with most body 21.Please also refer to shown in Fig. 2 B and Fig. 3 B, the side that body 21 contacts with electronic component E has one first plane 212, and this cantilever 23 is that the second plane 233, second plane 233 does not contact with electronic component E near the side of electronic component E.Fig. 4 is the schematic diagram at another visual angle of snap fit shown in Figure 1B, namely from this side of suspended wall 23 toward the schematic diagram in body 21 direction, please also refer to Fig. 3 B and Fig. 4, specifically, buffer structure 24 is certainly near one end toward cantilever 23, one end of body 21, direction gradually toward guide channel 11 tilts (namely tilting toward the direction away from electronic component E as shown in Figure 2 B), to form the aspect of the first plane 212 and the second plane 233 Different Plane, and the second plane 233 is compared with the direction (namely as shown in Figure 2 B away from the direction of electronic component E) of the first plane 212 toward guide channel 11.In addition, the width W 1 of body 21 is greater than the width W 2 of suspended wall 23, and this face that cantilever 23 and body 21 contact with guide channel 11 be arranged (being same plane) in parallel, therefore when snap fit 2 is placed in guide channel 11(as shown in Figure 2 B), the aspect of the second plane 233 away from electronic component E of cantilever 23 can be formed.And the second plane 233 is compared with the setting of the first plane 212 away from electronic component E, cantilever 23 can be made not contact with electronic component E, to reduce heat transfer to cantilever 23, and then maintain the confining force of cantilever root 232, and improve the useful life of snap fit 2.
In addition, the body 21 of the present embodiment has a recess 211 near one end of cantilever 23, being arranged at recess 211 and being connected to body 21 of buffer structure 24, and the length of recess 211 is greater than the length of cantilever 23, therefore when cantilever 23 is subject to the power toward body 21 direction, namely, when cantilever 23 is subject to the compressing of block 12, buffer structure 24 and part cantilever 23 can be placed in recess 211.And the design of buffer structure 24 and recess 211, except the flexibility ratio of cantilever 23 action can be increased equally, the generation of tolerance more can be avoided.When snap fit 2 inserts guide channel 11 at the beginning (aspect of Fig. 3 A), cantilever 23 is subject to the compressing of block 12, if body 21 does not have the structure of recess 211, cantilever 23 then can be made too near body 21, and then produce a stress and the entirety of snap fit 2 is upwards passed, and the height of nip portion 22 is upwards improved, and produce tolerance and cannot effective pressing electronic component E.
Structure except recess 211 can avoid the generation of tolerance, and the fixture F of the present embodiment has more other structural design to reduce tolerance.Fig. 5 is the enlarged diagram of the a-quadrant of the fixture shown in Fig. 3 C, please also refer to shown in Fig. 3 C and Fig. 5.The stopping surface 121 of the block 12 of the present embodiment has one first coarse structure R1, and the contact-making surface 231 of cantilever 23 has one second coarse structure R2, and preferably, the first coarse structure R1 and the second coarse structure R2 cooperatively interacts.The coarse structure that this kind cooperatively interacts, when not bestowing other external force, can fix the relative position of snap fit 2 and fixed body 1, make the nip portion 22 of snap fit 2 in contact and fixed electronic element E time, snap fit 2 not easily has the phenomenon of displacement to occur.In addition, the first coarse structure R1 of the present embodiment and the second coarse structure R2 is the structure of multiple profile of tooth arranged in parallel, and the present invention does not limit the distance D of each profile of tooth, and preferably, distance D is less than 0.1mm, and in other words, the distance D of the cusp of adjacent two profiles of tooth of the present embodiment is less than 0.1mm.Therefore, after assembling fixture F and electronic component E (as shown in Figure 2 B), the tolerance between nip portion 22 and electronic component E can be less than 0.1mm.Specifically, when nip portion 22 is after electronic component E, can the distance D of a profile of tooth be unit, by moving down the distance D of one or more profile of tooth, nip portion 22 is made more to fit in electronic component E, therefore the distance D of each profile of tooth of the first coarse structure R1 and the second coarse structure R2 is less, the tolerance between nip portion 22 and electronic component E is less.
Fig. 6 is the schematic diagram of a kind of fixture of another embodiment of the present invention, please refer to shown in Fig. 6.The block 12a of the present embodiment, its stopping surface 121a is the structure of cambered surface, and preferably, stopping surface 121a is the cambered surface toward block 12a inner recess, that is cave in toward the direction away from sidewall 111a, also can reach aforesaid cantilever 23a with buffer structure 24a for fulcrum, and open toward the direction away from body 21a, the present invention is not as limit.
The schematic diagram of utensil is disassembled in the cooperation that Fig. 7 is the fixture shown in Fig. 2 B, please refer to shown in Fig. 7.The fixed body 1 of the present embodiment more comprises an opening 122, and opening 122 can be arranged at bottom 14 or the sidewall 13 of fixed body 1, also can be directly fixed body 1 itself for line configuring to outward opening, the present invention, not as limit, only needs to provide one to disassemble utensil 3 by opening 122 with the opening 122 of contact snap fit 2.And the opening 122 of the present embodiment corresponds to the bottom that stopping surface 121 is arranged at guide channel 11, and can for disassembling utensil 3 by opening 122 with touching also contact snap fit 2, the cantilever 23 of better contact snap fit 2, the direction forcing cantilever 23 toward body 21 is moved, make cantilever 23 can be placed in recess 211, and then take out snap fit 2.Wherein, disassemble utensil 3 can rise such as but not limited to a word or rub the face type utensils such as cutter with the hands.And this kind takes out the mode of snap fit 2, in the process disassembling electronic component E, namely can take out electronic component E without the need to the body 21 by pulling open snap fit 2 equally, to reduce wearing and tearing for body 21 or consume." opening 122 corresponds to stopping surface 121 " of the present invention, and indefinite opening 122 must be positioned at immediately below stopping surface 121, in other embodiment, also opening 122 can be arranged at the sidewall of fixed body 1, only needing to make to disassemble utensil 3 can contact cantilever 23, goodly touch stopping surface 121, to guarantee that disassembling utensil 3 can force cantilever 23 to move toward the direction of body 21.
In sum, the fixture of electronic component of the present invention, it is by fixed body holding electronic element, and fixed body has guide channel, it is arranged between fixed body and electronic component, snap fit can be inserted in guide channel, and snap fit is moved to nip portion can the degree on top of pressing electronic component, by this electronic component is fixed in fixed body.And after electronic component first inserted fixed body by this kind, again snap fit being inserted in guide channel, in the process of assembling electronic component, can insert electronic component without the need to the body by pulling open snap fit, the wearing and tearing for snap fit or consume can be reduced, to improve the useful life of fixture and snap fit.
In addition, the contact-making surface of cantilever can the stopping surface of contact guide channel, snap fit is made to be placed in the process of guide channel, cantilever is opened gradually, namely the distance with body is increased, to reduce body because the heat transfer directly contacted with the electronic component of heating is to cantilever, and then maintain the confining force of cantilever, and improve the useful life of snap fit.
The foregoing is only illustrative, but not be restricted person.Anyly do not depart from spirit of the present invention and category, and to its equivalent modifications of carrying out or change, all should be contained in the scope of appending claims.
Claims (19)
1. a fixture for electronic component, comprising:
One fixed body, an accommodating electronic component, this fixed body comprises:
One guide channel, is arranged at a sidewall of this fixed body; And
One block, is arranged at the side of this guide channel, and has a stopping surface; And
One snap fit, is arranged at this guide channel, and in order to fix this electronic component, this snap fit comprises:
One body;
One nip portion, is arranged at an end of this body;
One cantilever, has a contact-making surface with this stopping surface of contact; And
One buffer structure, its two ends connect the other end and this cantilever of this body respectively.
2. fixture as claimed in claim 1, wherein this body has a recess near one end of this cantilever, and this buffer structure is arranged at this recess and is connected to this body, and the length of this recess is greater than the length of this cantilever.
3. fixture as claimed in claim 1, wherein this snap fit is dismountable is arranged at this guide channel.
4. fixture as claimed in claim 1, wherein this cantilever has a suspended wall root and is connected to this buffer structure, and the size of this suspended wall root and this buffer structure is less than the size of this cantilever and this body.
5. fixture as claimed in claim 1, wherein this stopping surface has one first coarse structure.
6. fixture as claimed in claim 1, wherein this contact-making surface of this cantilever has one second coarse structure.
7. fixture as claimed in claim 1, wherein this stopping surface is inclined-plane or cambered surface.
8. fixture as claimed in claim 1, wherein when this snap fit fixes this electronic component, this nip portion fastens the top of this electronic component, and this this stopping surface of contact-making surface contact of this cantilever.
9. fixture as claimed in claim 1, wherein when this snap fit fixes this electronic component, this cantilever and this stopping surface have an angle, and this angle is between 60 to 100 degree.
10. fixture as claimed in claim 1, wherein this nip portion and this cantilever extend from two ends of this body respectively.
11. fixtures as claimed in claim 10, wherein this nip portion and this cantilever extend from different directions corresponding to this body.
12. fixtures as claimed in claim 1, wherein this fixed body also comprises an opening, this opening be arranged at this fixed body one bottom or this sidewall.
13. fixtures as claimed in claim 12, wherein this fixture also comprises:
One disassembles utensil, by this opening with this cantilever of contact.
14. fixtures as claimed in claim 1, wherein this body has one first plane and contacts with this electronic component, and this cantilever has one second plane near the side of this electronic component, and this second plane does not contact with this electronic component.
15. fixtures as claimed in claim 14, wherein this second plane comparatively this first plane away from this electronic component.
16. fixtures as claimed in claim 14, wherein the width of this body is greater than the width of this suspended wall.
17. fixtures as claimed in claim 1, wherein this buffer structure comprises elastic material.
18. fixtures as claimed in claim 17, wherein this elastic material comprises plastics, rubber, silica gel or its combination.
The fixture of 19. 1 kinds of electronic components, comprising:
One fixed body, an accommodating electronic component, this fixed body comprises:
One guide channel, is arranged at a sidewall of this fixed body; And
One block, is arranged at the side of this guide channel, and has a stopping surface; And
One snap fit, in order to fix this electronic component, this snap fit comprises:
One body, has a recess;
One nip portion, is arranged at an end of this body;
One cantilever, has a contact-making surface; And
One buffer structure, its two ends connect the other end and this cantilever of this body respectively; Wherein, when this snap fit inserts this guide channel, this cantilever is compressed to this recess by this block, when this nip portion fixes this electronic component, and this this stopping surface of contact-making surface contact of this cantilever.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310560276.0A CN104640401A (en) | 2013-11-12 | 2013-11-12 | Fixing device for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310560276.0A CN104640401A (en) | 2013-11-12 | 2013-11-12 | Fixing device for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104640401A true CN104640401A (en) | 2015-05-20 |
Family
ID=53218562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310560276.0A Pending CN104640401A (en) | 2013-11-12 | 2013-11-12 | Fixing device for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104640401A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2805123Y (en) * | 2005-03-09 | 2006-08-09 | 美国莫列斯股份有限公司 | Electronic card connector |
| US20100284157A1 (en) * | 2009-05-05 | 2010-11-11 | Chi Mei Communication Systems, Inc. | Storage card lock and portable electronic device using the same |
| CN103092270A (en) * | 2011-11-04 | 2013-05-08 | 英业达股份有限公司 | Electronic device |
-
2013
- 2013-11-12 CN CN201310560276.0A patent/CN104640401A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2805123Y (en) * | 2005-03-09 | 2006-08-09 | 美国莫列斯股份有限公司 | Electronic card connector |
| US20100284157A1 (en) * | 2009-05-05 | 2010-11-11 | Chi Mei Communication Systems, Inc. | Storage card lock and portable electronic device using the same |
| CN103092270A (en) * | 2011-11-04 | 2013-05-08 | 英业达股份有限公司 | Electronic device |
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Application publication date: 20150520 |