CN104637569A - Lead-free nano conductive paste material - Google Patents
Lead-free nano conductive paste material Download PDFInfo
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- CN104637569A CN104637569A CN201310548436.XA CN201310548436A CN104637569A CN 104637569 A CN104637569 A CN 104637569A CN 201310548436 A CN201310548436 A CN 201310548436A CN 104637569 A CN104637569 A CN 104637569A
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Abstract
A lead-free nano conductive paste material contains a colloidal material, a kind of conductive metal powder, and a nano-scale additive material. The conductive metal powder and the nano-scale additive material are mixed in the colloid material to form a colloidal composition and obtain a lead-free conductive paste material. A lead-free nano conductive paste material of another embodiment contains a colloidal material, a kind of conductive metal powder, a nano-scale additive material, and a heat conduction material. The conductive metal powder, the nano-scale additive material and the heat conduction material are mixed in the colloid material to form a colloidal composition and obtain another lead-free conductive paste material. By adoption of the nano-scale additive material, the lead-free nano conductive paste material of the invention has better conductive performance. Thus, a lead-free conductive paste material can be provided to improve the existing conductive paste material.
Description
Technical field
The present invention relates to a kind of unleaded conductive nano pulp material, particularly about the unleaded nanometer tin of one, zinc conductive paste material, more especially to dispel the heat unleaded conductive nano pulp material about a kind of gain.
Background technology
Existing conductive paste material, announce as TaiWan, China the low temperature that I232352 patent of invention 〝 is applied to the electrode of chip type resistance, electric capacity, inductance and wire splice terminal and burn type electrocondution slurry 〞, it discloses a kind of low temperature being applied to the electrode of chip type resistance, electric capacity, inductance and wire splice terminal and burns type electrocondution slurry, and it mainly comprises: one first conductive powder is spherical silver powder; One second conductive powder is flakey silver powder, and one the 3rd conductive powder is nickel; One first resin is epoxy resin; One second resin is phenolic resins; One first additive is Ultramicro-powder clay; And an adjustment solvent, and to comprise one first solvent be boiling point be the solvent of more than 180 degree Celsius and one second solvent be boiling point is Celsius 80 to the 180 aromatic series hydrocarbon systems of spending.
Another known conductive pulp material, disclose No. 201024391 〝 solvent-free conductive adhesive constituent as TaiWan, China and use the application for a patent for invention case of solar cell device 〞 of this constituent, it discloses a kind of solvent-free conductive adhesive constituent and comprises: binder, initiator, glass dust and conducting powder.
Another known conductive pulp material, as TaiWan, China discloses the application for a patent for invention case that No. 201114876 〝 has the conducting resinl 〞 of surfactant, it discloses a kind of conducting resinl, and it comprises at least one metal dust, an organic carrier, a glass frit and an interfacial agent.It is Mx (R) y (Q) z that this interfacial agent has structure, wherein M is selected from a metallic element or semiconductor element, R is a kind of Qin Shui Ji ﹝ hydrophilic group ﹞, wherein can be hydrolyzed with this hydrophilic group of M bond and produce another corresponding hydrophily Guan Neng Ji ﹝ hydrophilic functional group ﹞, and Q is a kind of Qin You Ji ﹝ hydrophobic group ﹞.
Another known conductive pulp material, as TaiWan, China discloses the application for a patent for invention case of No. 201128657 〝 electroconductive alumina gel and manufacture method, solar cell and module 〞 thereof, it discloses a kind of silicon substrate electroconductive alumina gel used for solar batteries, this electroconductive alumina gel is organic carrier, aluminium powder, glass frit and metal nanoparticle are formed, the D50 particle size range of this metal nanoparticle is 10 to 1000nm, and content is 0.1 to 10 % by weight.
Another known conductive pulp material, as TaiWan, China discloses the application for a patent for invention case that No. 201137081 〝 has the manufacture method 〞 of the conducting resinl of 1-dimention nano conduction material, it discloses a kind of manufacture method of conducting resinl with 1-dimention nano conduction material, and 1-dimention nano is mainly conducted electricity material and is mixed into water-based or oily gum body forms conducting resinl by this manufacture method.
Another known conductive pulp material, the application for a patent for invention case of the solar cell device 〞 of No. 201203285 〝 aluminum paste composition and use said composition is disclosed as TaiWan, China, it discloses a kind of aluminum paste composition, and it comprises aluminium powder, glass dust, binder and dispersant.
But aforementioned TaiWan, China discloses I232352 patent, TaiWan, China discloses No. 201024391, No. 201114876, No. 201128657, No. 201137081 and No. 201203285 application for a patent for invention case does not disclose unleaded conductive nano pulp material or how to reduce the correlation technique of process temperatures.Therefore, existing conductive paste material certainly exists the demand of improvement further.Aforementioned patent applications publication is only the reference of the technology of the present invention background and current technical development state is described, the scope that it is not intended to limiting the invention.
In view of this, the present invention provides a kind of unleaded conductive nano pulp material to meet the demand, it comprises colloid material, a conductive metal powder and a nanoscale adding material, to utilize this nanoscale adding material to promote conductive characteristic, so can provide a unleaded conductive paste material, to improve existing conductive paste material.
Summary of the invention
The object of this invention is to provide a kind of unleaded conductive nano pulp material, it utilizes colloid material, a conductive metal powder and a nanoscale adding material mixing composition one colloidal state constituent, to make a unleaded conductive paste material, to reach the object providing environmental protection conductive paste material.
For achieving the above object, the present invention takes following technical scheme:
Unleaded conductive nano pulp material of the present invention comprises:
Colloid material, it comprises a binder;
One conductive metal powder, it is selected from the good lead-free of conduction; And
One nanoscale adding material, it is selected from a unleaded nano-powder material;
Wherein this conductive metal powder and nanoscale adding material are mixed in this colloidal materials, to form a colloidal state constituent, and make a unleaded conductive paste material, to promote the conductive characteristic of single polycrystalline solar cell module or element.
In addition, the unleaded conductive nano pulp material of present pre-ferred embodiments comprises:
Colloid material, it comprises a binder;
One conductive metal powder, it is selected from the good lead-free of conduction;
One nanoscale adding material, it is selected from a unleaded nano-powder material; And
One heat conducting material, it is selected from heat transfer good material;
Wherein this conductive metal powder, nanoscale adding material and heat conducting material are mixed in this colloidal materials, to form a colloidal state constituent, and make a unleaded conductive paste material, to promote the radiating efficiency of single polycrystalline solar cell module or element.
This conductive metal powder of present pre-ferred embodiments is selected from silver powder, aluminium powder, copper powders or its blend compositions several arbitrarily.
This conductive metal powder of present pre-ferred embodiments separately comprises bronze end, palladium powder or platinum powder end.
The percentage by weight of this conductive metal powder of present pre-ferred embodiments is 20% to 60%.
This nanoscale adding material of present pre-ferred embodiments is selected from a composite Nano level adding material.
This nanoscale adding material of present pre-ferred embodiments is selected from tin, zinc, tin-oxide, zinc oxide, other metal, other metal oxide or other composite oxides, and it has nano-scale from micron to hundreds of nanometer or to number nanometer.
The percentage by weight of this nanoscale adding material of present pre-ferred embodiments is 5% to 60%.
Present pre-ferred embodiments separately comprises an adding material, and this adding material is selected from silicon dioxide, and its percentage by weight is 3% to 15%.
This heat conducting material of present pre-ferred embodiments is selected from a nanoscale diamond powder, an industrial grade diamond powder, a carbon fiber thermal conductive material, a silicon carbide powder heat sink material, a metal oxide or its mixed component several arbitrarily.
This conductive metal powder of present pre-ferred embodiments adds another conductive metal powder with a covering material.
This covering material of present pre-ferred embodiments has a mesh nanometer cellular structure, and it is in order to correspond to this nanoscale adding material.
This covering material of present pre-ferred embodiments is a coating heat sink material, it has a thermal radiation property, this coating heat sink material is selected from a silicon carbide powder heat sink material, a metal oxide or its mixed component several arbitrarily, to increase thermal diffusivity, to promote the radiating efficiency of single polycrystalline solar cell module or element.
This covering material of another preferred embodiment of the present invention is a thermal paste material, and this thermal paste material comprises organic macromolecule material solution, silicon carbide powder and dispersant.High-molecular organic material solution comprises high-molecular organic material and solvent, and wherein the solid content of high-molecular organic material solution is 5 % by weight to 80 % by weight.Dispersant is scattered in high-molecular organic material solution in order to make silicon carbide powder.In thermal paste material, the content of high-molecular organic material solution is 20 % by weight to 80 % by weight, and the content of silicon carbide powder is 20 % by weight to 80 % by weight, and the content of dispersant is 0.1 % by weight to 2 % by weight.
This high-molecular organic material of another preferred embodiment of the present invention is selected from the group be made up of epoxy resin, alkyd resins, acrylic resin, polyurethane resin, phenolic resins, vinyl chloride-vinyl acetate copolymer resin and combination thereof.
This solvent of another preferred embodiment of the present invention is selected from the group be made up of aromatic hydrocarbon solvent, alcohols solvent, ketones solvent, esters solvent, alcohol ether solvent and combination thereof.
The particle diameter of this silicon carbide powder of another preferred embodiment of the present invention is 1 μm to 15 μm.
This silicon carbide powder of another preferred embodiment of the present invention has thermal radiation property, and is applicable in solar cell module by printing process, reaches efficiently radiates heat to promote the thermal emissivity rate of solar cell module.
This thermal paste material of another preferred embodiment of the present invention also comprises how meter level adding material, and the content of this how meter level adding material is 1 % by weight to 5 % by weight.
This thermal paste material of another preferred embodiment of the present invention separately comprises additive, and the content of this additive is 0.1 % by weight to 2 % by weight.
The invention has the beneficial effects as follows: the unleaded conductive nano pulp material of the present invention utilizes this nanoscale adding material, can promote conductive characteristic, a unleaded conductive paste material so can be provided, to improve existing conductive paste material.
Accompanying drawing explanation
Fig. 1: the block schematic diagram of the unleaded conductive nano pulp material of the present invention first preferred embodiment.
Fig. 2: the block schematic diagram of the unleaded conductive nano pulp material of the present invention second preferred embodiment.
Drawing reference numeral: 1: colloidal materials; 2: conductive metal powder; 3: nanoscale adding material; 4: heat conducting material; 10: unleaded conductive paste material; 10 ': unleaded conductive paste material.
Embodiment
In order to fully understand the present invention, hereafter will exemplify preferred embodiment and coordinating institute's accompanying drawings to elaborate, and itself and be not used to limit the present invention.
The unleaded conductive nano pulp material of present pre-ferred embodiments is applicable to various conductive paste material, and such as: aluminium paste, silver-colored aluminium paste and silver slurry, it is applied to various related industry, such as: solar cell manufacturing industry, but and is not used to limit the present invention.For example, when the unleaded conductive nano pulp material of present pre-ferred embodiments makes silver slurry, it is in order to make the front electrode of solar cell; When the unleaded conductive nano pulp material of present pre-ferred embodiments makes silver slurry, then it is in order to make backplate and electric field, to increase battery conversion efficiency; When the unleaded conductive nano pulp material of present pre-ferred embodiments makes silver-colored aluminium paste, then it is in order to make rear surface of solar cell, using the wire of contacting as module, but and is not used to limit the present invention.
In addition, the unleaded conductive nano pulp material of present pre-ferred embodiments is applicable to other various manufacturing industry, such as: ceramic condenser manufacturing industry, partly lead body envelope dress ﹝ semiconductor package ﹞ industry, Yin Shua electricity road plate ﹝ PCB ﹞ manufacturing industry, but and be not used to limit the present invention.
Fig. 1 discloses the block schematic diagram of the unleaded conductive nano pulp material of the present invention first preferred embodiment.Please refer to shown in Fig. 1, the unleaded conductive nano pulp material of the present invention first preferred embodiment mainly comprises colloid material material ﹝ paste material ﹞ 1, conducting metal powder ﹝ conductive metal powder material ﹞ 2 and a nanoscale to be added and adds material material ﹝ nano additive ﹞ 3.By this colloidal materials 1, conductive metal powder 2 and nanoscale adding material 3 suitably mix and blend, for example, a stirring at low speed Qi ﹝ low-speed stirrer ﹞ is utilized to carry out mix and blend, become thing ﹝ or colloidal state to lead electric group to become thing ﹞ to form a colloidal state group, and make a unleaded conductive paste material 10 further.
Making in conductive paste material processing procedure, the unleaded conductive nano pulp material of present pre-ferred embodiments can add various additive on demand, such as: inorganic Tian Chong Ji ﹝ inorganic filler ﹞, Yangization Tian Jia Ji ﹝ oxidizing additive ﹞, initial Ji ﹝ synergist ﹞ altogether, plastic Ji ﹝ plasticizer ﹞, increase Min Ji ﹝ sensitizer ﹞, Ou He Ji ﹝ coupling agent ﹞, Fen San Ji ﹝ dispersing agent ﹞, Run Shi Ji ﹝ wetting agent ﹞, Zeng Chou Ji ﹝ thickening agent ﹞, Xiao Pao Ji ﹝ deformer ﹞, shake Bian Ji ﹝ thixotropy additive ﹞ or other additive.
Shown in Fig. 1, this colloidal materials 1 comprises a binder, and this binder is selected to be made up of various Shu Zhi ﹝ resin ﹞, such as: epoxy resin.The viscosity of this binder is better to be chosen as between 10000cps to 40000cps, but and is not used to limit the present invention.
Shown in Fig. 1, this conductive metal powder 2 can be selected from silver-colored ﹝ Ag ﹞ powder, aluminium ﹝ Al ﹞ powder, copper ﹝ Cu ﹞ powder or its blend compositions several arbitrarily.This conductive metal powder 2 can be selected from granular metal powder or non-particulate metal dust.The percentage by weight of this conductive metal powder 2 can be 20% to 60%.In another preferred embodiment of the present invention, this conductive metal powder 2 separately comprises Jin ﹝ Au ﹞ powder, Ba ﹝ Pd ﹞ powder Huo Bo ﹝ Pt ﹞ powder.This conductive metal powder 2 of another preferred embodiment of the present invention can be selected to make a nano-level conducting metal dust, to promote the conductive characteristic of this unleaded conductive paste material 10.
Shown in Fig. 1, this nanoscale adding material 3 can be selected from tin ﹝ tin ﹞, zinc ﹝ zinc ﹞, tin oxygen thing ﹝ tin oxide material ﹞, zinc oxygen thing ﹝ zinc oxide material ﹞, other metal, other gold genus oxygen thing ﹝ metal oxide material ﹞ or other the various oxygen of conjunction again thing ﹝ complex oxide material ﹞, and it is in order to reduce the process temperatures of unleaded conductive nano pulp material.In another preferred embodiment of the present invention, this nanoscale adding material 3 can be selected from a composite Nano level adding material.The percentage by weight of this nanoscale adding material 3 can be 5% to 60%.
The unleaded conductive nano pulp material of another preferred embodiment of the present invention separately comprises an adding material, and this adding material can be selected from two oxygen silicon ﹝ SiO2 ﹞ or other similar materials, its percentage by weight is 3% to 15%, and it has nano-scale from micron to hundreds of nanometer or to number nanometer.
For example, when the unleaded conductive nano pulp material of the present invention first preferred embodiment is applied to solar cell manufacturing industry, can utilize wire mark Fang Shi ﹝ such as: Wang Yin Ji ﹞ forms various Tu An ﹝ pattern ﹞ in a Ji Ban ﹝ such as: on Gui Jing Yuan ﹞, wherein this pattern comprises light incident side electrode and backplate or circuit.Then, this unleaded conductive nano pulp material need be carried out drying baking and Shao Jie ﹝ such as: sintering temperature 700 DEG C is to 1000 DEG C ﹞ operations.
Fig. 2 discloses the block schematic diagram of the unleaded conductive nano pulp material of the present invention second preferred embodiment, and it corresponds to Fig. 1.Please refer to shown in Fig. 2, the unleaded conductive nano pulp material of the present invention second preferred embodiment mainly comprises colloid material 1, conductive metal powder 2, nanoscale adding material 3 and a heat transfer material material ﹝ thermal conductive material ﹞ 4, and wherein this heat conducting material 4 can be selected from various non-gold genus material material ﹝ non-metal material ﹞ or various gold genus material material ﹝ metal material ﹞.
By this colloidal materials 1, conductive metal powder 2, nanoscale adding material 3 and heat conducting material 4 suitably mix and blend, to form a colloidal state Zu Cheng Wu ﹝ or colloidal state Dao electricity Zu Cheng Wu ﹞, and make a unleaded conductive paste material 10 ' further, it has better heat conduction efficiency relative to the first embodiment.
Please refer to shown in Fig. 2, relative to the first embodiment, the unleaded conductive nano pulp material of the second embodiment separately adds this heat conducting material 4, and this heat conducting material 4 can be selected from a nanoscale diamond powder, one industrial grade diamond powder end ﹝ non-nano level bores stone powder ﹞, one carbon fiber heat conducting material ﹝ carbon fiber thermal conductive material ﹞ ﹝ is as CNT (carbon nano-tube) or nano-graphite sheet ﹞, one carbon Si powder ﹝ silicon carbide powder, SiC powder ﹞ heat sink material, one gold medal belongs to Yangization Wu ﹝ as San Yangization Er Lv ﹞ or its mixed component several arbitrarily, to promote thermal conduction characteristic or the thermal diffusivity of this unleaded conductive paste material 10 ', to promote the efficiency of single polycrystalline solar cell module or element and to reduce manufacturing cost.
In addition, relative to the first embodiment, this conductive metal powder 2 of the unleaded conductive nano pulp material of the 3rd embodiment is added another conductive metal powder and is had a coating material ﹝ coating material ﹞, and such as: its addition is 1%, it is selected from and is of a size of several nano level zinc or tin.This covering material of another embodiment of the present invention has a mesh nanometer cellular structure, and it is in order to correspond to this nanoscale adding material 3, to promote its conductivity, as: CNT (carbon nano-tube) or nano graphite flakes.
This covering material of another embodiment of the present invention is a coating heat sink material, it has a thermal radiation property, this coating heat sink material is selected from a silicon carbide powder heat sink material, a metal oxide or its mixed component several arbitrarily, to increase thermal diffusivity, to promote the radiating efficiency of single polycrystalline solar cell module or element.
For example, this conductive metal powder 2 can be selected from silver powder, aluminium powder, copper powders or its blend compositions several arbitrarily, or this conductive metal powder 2 separately comprises bronze end, palladium powder or platinum powder end.This conductive metal powder 2 can be selected from granular metal powder or non-particulate metal dust.
This covering material of another embodiment of the present invention is a thermal paste material, and this thermal paste material comprises organic macromolecule material solution, silicon carbide powder and dispersant.Each composition of this thermal paste material will be described in detail below.
High-molecular organic material solution comprises high-molecular organic material and solvent, and wherein the solid content of high-molecular organic material solution is 5 % by weight to 80 % by weight, and in thermal paste material of the present invention, the content of high-molecular organic material solution is 20 % by weight to 80 % by weight.Specifically, in the processing procedure (hereinafter will describe in detail) using thermal paste material of the present invention, high-molecular organic material in high-molecular organic material solution is in order to as carrier, can be coated with in order to thermal paste material, and in addition, by the adherence of high-molecular organic material, thermal paste material is made effectively to adhere on solar cell device.
In addition, high-molecular organic material is such as be selected from the group be made up of epoxy resin, alkyd resins, acrylic resin, polyurethane resin, phenolic resins, vinyl chloride-vinyl acetate copolymer resin and combination thereof.Solvent is such as be selected from the group be made up of aromatic hydrocarbon solvent, alcohols solvent, ketones solvent, esters solvent, alcohol ether solvent and combination thereof.In one embodiment, high-molecular organic material is such as acrylic resin, and solvent is such as esters solvent.
In thermal paste material of the present invention, the content of silicon carbide powder is 20 % by weight to 80 % by weight, and silicon carbide powder mainly provides the effect of heat radiation.Specifically, silicon carbide powder of the present invention is the high-heating radiation material with good thermal emissivity rate, therefore reaches radiating effect by thermal-radiating mode.Other one carries, and silicon carbide powder of the present invention is except having good thermal emissivity rate, and it also has good pyroconductivity.Therefore, thermal paste material of the present invention reaches radiating effect effectively by the mode of radiation and conduction.In addition, the particle diameter of silicon carbide powder is such as 1 μm to 15 μm.
In thermal paste material of the present invention, the content of dispersant is 0.1 % by weight to 2 % by weight, and dispersant is dispersed in high-molecular organic material solution in order to make silicon carbide powder, reduces radiating effect to avoid silicon carbide powder generation agglomeration.In addition, dispersant is such as phosphate (phosphate ester), Linseed oil (linseed oil) or sad (Octanoic acid), is wherein preferably phosphate.In addition, as dispersant, also various commercially available prod can be used.
Thermal paste material of the present invention also can comprise how meter level adding material if desired, and in thermal paste material, and how the content of meter level adding material is 1 % by weight to 5 % by weight.Specifically, thermal paste material of the present invention selectively uses how meter level adding material is to adjust the viscosity of thermal paste material, and it acts in detail and will illustrate in experimental example.Thus, according to the demand in fact applied, by how the viscosity of meter level adding material to thermal paste material adjusts, by making, the application of thermal paste material of the present invention is wider.How meter level adding material is such as how meter level carbon dust, the how rare powder of meter level graphite, how meter level titanium dioxide powder or siloxanes (silicone).
In addition, thermal paste material of the present invention also can comprise additive if desired, and in thermal paste material, the content of additive is 0.1 % by weight to 2 % by weight.That is, according to the demand in fact applied, various additive can be added to thermal paste material of the present invention, to increase the application of thermal paste material.Additive is such as inorganic filler (inorganic filler), oxidation additive (oxidizing additive), initiator (synergist) altogether, plasticizer (plasticizer), sensitizer (sensitizer), coupling agent (coupling agent), wetting agent (wetting agent), thickener (thickening agent), defoamer (deformer), levelling agent (levelling agent), shake and become agent (thixotropy additive) or other additive.Above-mentioned additive can be used alone according to purposes, or multiple combination can be used.In addition, as above-mentioned arbitrary additive, also various commercially available prod can be used.
In view of when screen painting, there is good print characteristic, the viscosity of thermal paste material of the present invention 25 DEG C, better under 10 rpm be such as 20000 cps to 50000 cps.
Below by way of the preparation method of the thermal paste material of detailed description one embodiment of the invention, thermal paste material of the present invention will be disclosed more clearly and completely.But the present invention is not to be limited in this disclosure.
First, the acrylic resin as high-molecular organic material is dissolved in as in the esters solvent of solvent, to form the acrylic resin soln as high-molecular organic material solution that solid content is 40 % by weight.Then, carry out premixing step, using silicon carbide powder, as the DISPERBYK-101(of dispersant manufactured by BYK company), as how meter level adding material the how rare powder of meter level graphite and add in aforesaid propylene acid resin solution as the levelling agent of additive and defoamer, after being uniformly mixed, form colloidal state constituent.Afterwards, by the colloidal state constituent of above-mentioned gained after premixing through three cylinders, and process dispersion fully with the condition that rotating speed is 500 rpm, to form thermal paste material, wherein the viscosity of thing thermal paste material is 27000 cps.In above-mentioned thermal paste material, the content of acrylic resin soln is 42 % by weight, the content of silicon carbide powder is 50 % by weight, how the content of the rare powder of meter level graphite is 5 % by weight, DISPERBYK-101(is manufactured by BYK company) content be 1 % by weight, the content of levelling agent be 1 % by weight and the content of defoamer be 1 % by weight.
What deserves to be explained is, again process in the process of dispersion at above-mentioned colloidal state constituent through three cylinders, the viscosity of colloidal state constituent is the key factor of impact for the processability of colloidal state constituent when three cylinder processing disperse.In other words, if the viscosity of colloidal state constituent is too low or too high, then all will colloidal state constituent be made cannot to obtain having the thermal paste material of predetermined viscosity by three cylinders effectively stir.In the case, during premixing step, just by using the how meter level adding material that can adjust viscosity to design the viscosity of the colloidal state constituent of gained after premixing.
Aforementioned preferred embodiment only illustrates the present invention and technical characteristic thereof, and the technology of this embodiment still suitably can carry out various essence equivalence modification and/or substitute mode is implemented; Therefore, the scope that interest field of the present invention must define depending on appended claim book is as the criterion.
Claims (10)
1. a unleaded conductive nano pulp material, it is characterized in that, it comprises:
Colloid material, it comprises a binder;
One conductive metal powder, it is selected from the good lead-free of conduction; And
One nanoscale adding material, it is selected from a unleaded nano-powder material;
Wherein this conductive metal powder and nanoscale adding material are mixed in this colloidal materials, to form a colloidal state constituent, and make a unleaded conductive paste material, to promote the conductive characteristic of module or element.
2. a unleaded conductive nano pulp material, it is characterized in that, it comprises:
Colloid material, it comprises a binder;
One conductive metal powder, it is selected from the good lead-free of conduction;
One nanoscale adding material, it is selected from a unleaded nano-powder material; And
One heat conducting material, it is selected from heat transfer good material;
Wherein this conductive metal powder, nanoscale adding material and heat conducting material are mixed in this colloidal materials, to form a colloidal state constituent, and make a unleaded conductive paste material, to promote the radiating efficiency of module or element.
3. unleaded conductive nano pulp material according to claim 1 and 2, is characterized in that, described conductive metal powder is selected from silver powder, aluminium powder, copper powders or its blend compositions several arbitrarily; Or this conductive metal powder separately comprises bronze end, palladium powder or platinum powder end.
4. unleaded conductive nano pulp material according to claim 1 and 2, is characterized in that, described conductive metal powder adds another conductive metal powder with a covering material, and this covering material has a mesh nanometer cellular structure.
5. unleaded conductive nano pulp material according to claim 1 and 2, is characterized in that, the percentage by weight of described conductive metal powder is 20% to 60%.
6. unleaded conductive nano pulp material according to claim 1 and 2, is characterized in that, described nanoscale adding material is selected from a composite Nano level adding material.
7. unleaded conductive nano pulp material according to claim 1 and 2, is characterized in that, described nanoscale adding material is selected from tin, zinc, tin-oxide or zinc oxide, and it has nano-scale from micron to hundreds of nanometer or to number nanometer.
8. unleaded conductive nano pulp material according to claim 1 and 2, is characterized in that, the percentage by weight of described nanoscale adding material is 5% to 60%.
9. unleaded conductive nano pulp material according to claim 1 and 2, it is characterized in that, separately comprise an adding material, and this adding material is selected from silicon dioxide, and its percentage by weight is 3% to 15%.
10. unleaded conductive nano pulp material according to claim 2, it is characterized in that, described heat conducting material is selected from a nanoscale diamond powder, an industrial grade diamond powder, a carbon fiber thermal conductive material, a silicon carbide powder heat sink material, a metal oxide or its mixed component several arbitrarily.
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| CN106211378A (en) * | 2016-06-30 | 2016-12-07 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of silicon carbide-containing silver palladium combined resistance slurry and preparation method thereof |
| CN110752050A (en) * | 2019-10-28 | 2020-02-04 | 中国兵器工业集团第二一四研究所苏州研发中心 | Formula and preparation method of weldable conductive platinum slurry for high-temperature co-fired ceramic |
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