CN104619113A - Circuit board and air conditioner - Google Patents
Circuit board and air conditioner Download PDFInfo
- Publication number
- CN104619113A CN104619113A CN201510039030.8A CN201510039030A CN104619113A CN 104619113 A CN104619113 A CN 104619113A CN 201510039030 A CN201510039030 A CN 201510039030A CN 104619113 A CN104619113 A CN 104619113A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- power device
- radiator
- plate body
- multiple power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
Abstract
The invention discloses a circuit board and an air conditioner. The circuit board comprises a board body (1); a plurality of power devices (3), disposed on the plate (1), at least partially disposed between the power device (3) and the plate (1) has a plurality of power devices (3) having the same height of the insulating mat (2); a radiator (4), disposed on one side of the plurality of power devices (3) remote from the plate (1). The circuit board of the invention can solve the power devices in the prior art circuit boards in the cartridge when the height of inconsistency.
Description
Technical field
The present invention relates to circuit board and lay technical field, in particular to a kind of circuit board and air conditioner.
Background technology
Power device operationally can produce very large loss, and these losses will be discharged by the mode of outwardly function of environment heat emission, and this adopts suitable heat abstractor to conduct heat to external environment condition with regard to needing.
There is many deficiencies in the mounting structure of existing power device and radiator, such as: each power device height is inconsistent causes the installation between radiator to coordinate inconvenience, affects radiating effect; Because electrical safety is apart from too small and cause short circuit phenomenon between power device and circuit board; Beat in screw process, the device inside caused owing to artificially clamping undue force damages; The phenomenon such as short circuit, sparking that insulation paster damages or area deficiency causes.
Summary of the invention
A kind of circuit board is provided, problem highly inconsistent when the power device that can solve in prior art on circuit board carries out plug-in mounting in the embodiment of the present invention.
For solving the problems of the technologies described above, the embodiment of the present invention provides a kind of circuit board, comprising: plate body; Multiple power device, is arranged on plate body, is provided with and makes multiple power device have mutually level insulation cushion between at least part of power device with plate body; Radiator, is arranged on the side away from plate body of multiple power device.
As preferably, insulation cushion is provided with the screwed hole for being connected with radiator and plate body.
As preferably, multiple power device comprises discrete device and integrated device, and insulation cushion pad is located between discrete device and plate body.
As preferably, between multiple power device and radiator, be provided with the paster that both isolated whole to be insulated.
As preferably, insulation paster is equipped with thermal grease towards the side of radiator.
As preferably, insulation cushion is chock.
According to a further aspect in the invention, provide a kind of air conditioner, comprise circuit board, this circuit board is above-mentioned circuit board.
Apply technical scheme of the present invention, circuit board comprises: plate body; Multiple power device, is arranged on plate body, is provided with and makes multiple power device have mutually level insulation cushion between at least part of power device with plate body; Radiator, is arranged on the side away from plate body of multiple power device.By arranging insulation cushion between power device and plate body, the height of each power device can be changed, highly consistent when making power device carry out plug-in mounting, can and radiator between realize good contact matching relationship, improve the radiating effect of circuit board.
Accompanying drawing explanation
Fig. 1 is the structural representation of the circuit board of the embodiment of the present invention;
Fig. 2 is the element height design sketch after the circuit board of the embodiment of the present invention installs insulation cushion additional;
Fig. 3 is the structural representation overlooked from plate body direction after plate body removed by the circuit board of the embodiment of the present invention;
Fig. 4 is the structural representation overlooked from radiator direction after radiator removed by the circuit board of the embodiment of the present invention.
Description of reference numerals:
1, plate body; 2, insulation cushion; 3, power device; 4, radiator; 5, screwed hole; 6, discrete device; 7, integrated device; 8, insulate paster.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail, but not as a limitation of the invention.
See shown in Fig. 1 to Fig. 4, according to embodiments of the invention, circuit board comprises plate body 1, multiple power device 3 and radiator 4.Plate body 1 is pcb board, and multiple power device 3 is arranged on plate body 1, is provided with and makes multiple power device 3 have mutually level insulation cushion 2, for the high consistency of Modulating Power device 3 between at least part of power device 3 with plate body 1.Radiator 4 is arranged on the side away from plate body 1 of multiple power device 3, for dispelling the heat to power device 3.
By arranging insulation cushion between power device 3 and plate body 1, the height of each power device 3 can be changed, make all power devices 3 needing radiator 4, height when carrying out plug-in mounting is consistent, can and radiator 4 between realize good contact matching relationship, improve the integral heat sink effect of circuit board, also circuit board can be reduced with the inconsistent components and parts damage problem caused of element height, reduce the complexity of power device plug-in mounting, improve production efficiency, shorten the construction cycle.
Insulation cushion 2 being provided with the screwed hole 5 for being connected with radiator 4 and plate body 1, by radiator 4 and plate body 1 being clamped and the power component arranged therebetween can be fixed by fixtures such as screws, and not needing to open screwed hole on power unit device.Screwed hole is opened on insulation cushion 2, compared with screw being beaten on components and parts with prior art, have following benefit: 1, can prevent because of when clamping power device 3 with radiator 4, the damage of undue force and the components and parts that cause and built-in electrical insulation device, improves the yields of circuit board; 2, when occurring to cause components and parts built-in electrical insulation device to damage because of undue force, due to the insulation effect of insulation cushion 2, can well prevent the components and parts caused because of components and parts short circuit from burning, improving the fail safe that circuit board uses; 3, components and parts damage probability can be reduced; Because power device 3 is arranged on insulation cushion 2, and screwed hole is opened on insulation cushion 2, the connection that can realize between power device 3 and radiator 4 by insulation cushion 2, makes the number of openings reduce by one times, save production cost, reduce the time waste caused because of device reason.
Multiple power device 3 comprises discrete device 6 and integrated device 7, and insulation cushion 2 pad is located between discrete device 6 and plate body 1.In conjunction with shown in Figure 2, due to generally, discrete device 6 has different height from integrated device 7, therefore when installing this two kinds of devices, the height of integrated device 7 is higher, make discrete device 6 cannot preferably with realize between radiator 4 coordinating, affect the radiating effect of discrete device 6.And after increasing insulation cushion 2, make discrete device 6 have the height identical with integrated device 7, can with integrated device 7 together with realize between radiator contacting, reduce the complexity of power device plug-in mounting, improve production efficiency, improve the heat dispersion of discrete device 6.
Multiple power device 3 and radiator 4 be provided with the paster 8 that both isolated whole to be insulated.In the prior art, each power device 3 is all attachment monolithic insulation pasters, therefore in artificial attachment process, the phenomenon that easy generation paster departs from or damages, this can cause being short-circuited between power device 3 and radiator 4, and then the phenomenons such as sparking occur, and damages device; Also can be inadequate because of insulating paper paving area, the electrical distance of the pin distances radiator 4 of power device 3 is too small, when carrying out power on operation, the phenomenon of sparking occurring, causes the damage of device and circuit board.
And be provided with whole the paster 8 that insulate that both is isolated between multiple power device 3 and radiator 4 after, because insulation paster 8 becomes overall structure, therefore not easily depart from the process of operation, and be more easy to operation, reduce the probability that insulation paster 8 damages, also the insulation between power device 3 and radiator 4 can be realized better, thus effectively can prevent the phenomenon that the power device 3 caused because insulation paster 8 damages is short-circuited with radiator 4, the area because of paving insulation paster 8 can also be prevented inadequate, and safe distance between the device pin caused and radiator 4 is too small, damage the problem of device and circuit board, improve safety and reliability when circuit board uses.
Insulation paster 8 is equipped with thermal grease towards the side of radiator 4, can improve the radiating effect of radiator 4 further.
Preferably, insulation cushion 2 is chock.Chock should be selected has higher mechanical strength, good insulating properties, heat-resisting, corrosion-resistant, and lower-cost material, can meet preferably and use needs.
According to embodiments of the invention, air conditioner comprises circuit board, and this circuit board is above-mentioned circuit board.
Certainly, be more than the preferred embodiment of the present invention.It should be pointed out that for those skilled in the art, under the prerequisite not departing from its general principles, can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (7)
1. a circuit board, is characterized in that, comprising:
Plate body (1);
Multiple power device (3), be arranged on described plate body (1), be provided with between at least part of described power device (3) with described plate body (1) and make described multiple power device (3) have mutually level insulation cushion (2);
Radiator (4), is arranged on the side away from described plate body (1) of described multiple power device (3).
2. circuit board according to claim 1, is characterized in that, described insulation cushion (2) is provided with the screwed hole (5) for being connected with described radiator (4) and described plate body (1).
3. circuit board according to claim 1, it is characterized in that, described multiple power device (3) comprises discrete device (6) and integrated device (7), and described insulation cushion (2) pad is located between described discrete device (6) and described plate body (1).
4. circuit board according to any one of claim 1 to 3, is characterized in that, is provided with the paster (8) that both isolated whole to be insulated between described multiple power device (3) and described radiator (4).
5. circuit board according to claim 4, is characterized in that, described insulation paster (8) is equipped with thermal grease towards the side of described radiator (4).
6. circuit board according to any one of claim 1 to 3, is characterized in that, described insulation cushion (2) is chock.
7. an air conditioner, comprises circuit board, it is characterized in that, the circuit board of described circuit board according to any one of claim 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510039030.8A CN104619113B (en) | 2015-01-26 | 2015-01-26 | Circuit board and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510039030.8A CN104619113B (en) | 2015-01-26 | 2015-01-26 | Circuit board and air conditioner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104619113A true CN104619113A (en) | 2015-05-13 |
| CN104619113B CN104619113B (en) | 2018-10-23 |
Family
ID=53153314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510039030.8A Active CN104619113B (en) | 2015-01-26 | 2015-01-26 | Circuit board and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104619113B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111081661A (en) * | 2019-12-23 | 2020-04-28 | 珠海格力电器股份有限公司 | Heat dissipation structure based on power semiconductor device and mounting method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5661902A (en) * | 1993-10-08 | 1997-09-02 | Northern Telecom Limited | Methods of making printed circuit boards and heat sink structures |
| CN201266607Y (en) * | 2008-09-10 | 2009-07-01 | 海尔集团公司 | Discrete power module |
| CN101720183A (en) * | 2008-12-12 | 2010-06-02 | 四川虹欧显示器件有限公司 | Heat radiating method for circuit board |
| CN103069930A (en) * | 2010-08-25 | 2013-04-24 | 罗伯特·博世有限公司 | Method for populating a circuit board with a plurality of components and electrical circuit having a circuit board and a plurality of components mounted thereon |
| CN103096636A (en) * | 2012-12-27 | 2013-05-08 | 华为技术有限公司 | Manufacture method and manufacture device of heat conduction structural component and heat conduction structural component |
| CN203951727U (en) * | 2014-07-15 | 2014-11-19 | 杭州华三通信技术有限公司 | A kind of bracing or strutting arrangement of radiator and there is its electronic installation |
| CN204482151U (en) * | 2015-01-26 | 2015-07-15 | 珠海格力电器股份有限公司 | Circuit board and air conditioner |
-
2015
- 2015-01-26 CN CN201510039030.8A patent/CN104619113B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5661902A (en) * | 1993-10-08 | 1997-09-02 | Northern Telecom Limited | Methods of making printed circuit boards and heat sink structures |
| CN201266607Y (en) * | 2008-09-10 | 2009-07-01 | 海尔集团公司 | Discrete power module |
| CN101720183A (en) * | 2008-12-12 | 2010-06-02 | 四川虹欧显示器件有限公司 | Heat radiating method for circuit board |
| CN103069930A (en) * | 2010-08-25 | 2013-04-24 | 罗伯特·博世有限公司 | Method for populating a circuit board with a plurality of components and electrical circuit having a circuit board and a plurality of components mounted thereon |
| CN103096636A (en) * | 2012-12-27 | 2013-05-08 | 华为技术有限公司 | Manufacture method and manufacture device of heat conduction structural component and heat conduction structural component |
| CN203951727U (en) * | 2014-07-15 | 2014-11-19 | 杭州华三通信技术有限公司 | A kind of bracing or strutting arrangement of radiator and there is its electronic installation |
| CN204482151U (en) * | 2015-01-26 | 2015-07-15 | 珠海格力电器股份有限公司 | Circuit board and air conditioner |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111081661A (en) * | 2019-12-23 | 2020-04-28 | 珠海格力电器股份有限公司 | Heat dissipation structure based on power semiconductor device and mounting method |
| CN111081661B (en) * | 2019-12-23 | 2021-05-25 | 珠海格力电器股份有限公司 | Heat dissipation structure based on power semiconductor device and mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104619113B (en) | 2018-10-23 |
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