CN104616999A - Adhesive dispensing device for IC chip - Google Patents
Adhesive dispensing device for IC chip Download PDFInfo
- Publication number
- CN104616999A CN104616999A CN201510012133.5A CN201510012133A CN104616999A CN 104616999 A CN104616999 A CN 104616999A CN 201510012133 A CN201510012133 A CN 201510012133A CN 104616999 A CN104616999 A CN 104616999A
- Authority
- CN
- China
- Prior art keywords
- screw thread
- bracing frame
- cylinder
- positioning seat
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title abstract 8
- 230000001070 adhesive effect Effects 0.000 title abstract 8
- 239000003292 glue Substances 0.000 claims description 33
- 238000010068 moulding (rubber) Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 abstract description 4
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 230000005611 electricity Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- 238000012356 Product development Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses an adhesive dispensing device for an IC chip. The adhesive dispensing device for the IC chip comprises a support frame, a support seat, a support plate, a connecting rod, an adhesive storage device, a cylinder, a locating seat and a limit block. Compared with the prior art, an adhesive dispensing die is placed in the locating seat, the cylinder pushes the locating seat to the center of the lower end of the adhesive storage device, the electricity is charged through an electromagnetic relay, a flow rate regulating switch is turned on, liquid flows into the adhesive dispensing die through the flow rate regulating switch, the IC chip is placed on the adhesive and fixed to avoid dislocation, the processing quality of the next procedure is guaranteed, and the scrapping is avoided.
Description
Technical field
The present invention relates to a kind of point glue equipment, particularly relate to a kind of IC chip point glue equipment.
Background technology
Along with the development of science and technology, electronic product is more and more advanced, volume is more and more less, and a large amount of uses being at all IC chip of electronic product development, because electronic chip volume is minimum, need by epoxy-ester encapsulate before use, make its volume become large, easy to use, chip volume is minimum, well do not locate in epoxy-ester, thus cause cutting to chip and scrapping when causing epoxy-ester to cut into small pieces.In view of above-mentioned defect, be necessary to design a kind of IC chip point glue equipment in fact.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of IC chip point glue equipment, solve the problem of IC chip rejection.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of IC chip point glue equipment, comprise bracing frame, comprise supporting seat, supporting bracket, connecting rod, storage glue device, cylinder, positioning seat, guide vane end stop, described supporting seat is positioned at bracing frame top center left end, the two screw thread is connected, described supporting bracket is positioned at supporting seat right center place, it is connected with bracing frame screw thread, described connecting rod is positioned at supporting seat right-hand member center, itself and supporting bracket are movably connected, be weldingly connected with supporting seat, described storage glue device is positioned at connecting rod right-hand member center, the two screw thread is connected, described cylinder is positioned at bracing frame top center left end, the two screw thread is connected, described positioning seat is positioned at cylinder left end center, itself and bracing frame are movably connected, be connected with cylinder screw thread, described guide vane end stop is positioned at positioning seat left end center, it is connected with bracing frame screw thread.
Further, be also provided with electromagnetic relay on the right side of described storage glue device lower end, the two screw thread is connected.
Further, be also provided with flow control valve on the right side of described storage glue device lower end, the two screw thread is connected.
Further, described positioning seat and bracing frame junction are also provided with guide rail, and it is connected with bracing frame screw thread.
Further, described cylinder and positioning seat junction are also provided with pull bar, and it is connected with positioning seat, cylinder screw thread.
Further, described positioning seat top center place is also provided with a rubber moulding, and the two is movably connected.
Compared with prior art, a rubber moulding is put in positioning seat, cylinder promotes positioning seat to storage glue device lower center place, and be energized by electromagnetic relay, flow control valve is opened, liquid glue flows in some rubber moulding by flow control valve, again IC chip is placed on above glue, is fixed, place dislocation, ensure the crudy of next sequence, avoid and scrap.
Accompanying drawing explanation
Fig. 1 is the front view of device
Bracing frame 1 supporting seat 2
Supporting bracket 3 connecting rod 4
Storage glue device 5 cylinder 6
Positioning seat 7 guide vane end stop 8
Guide rail 101 electromagnetic relay 501
Flow control switch 502 pull bar 601
Point rubber moulding 701
Following embodiment will further illustrate in conjunction with above-mentioned accompanying drawing.
Embodiment
Hereinafter, set forth multiple specific detail, to provide the thorough understanding to the concept forming described embodiment basis.But to one skilled in the art, embodiment described obviously can be put into practice when not have in these specific detail some or all.In other cases, well-known treatment step is not specifically described.
As shown in Figure 1, comprise bracing frame 1, supporting seat 2, supporting bracket 3, connecting rod 4, storage glue device 5, cylinder 6, positioning seat 7, guide vane end stop 8, described supporting seat 2 is positioned at bracing frame 1 top center left end, the two screw thread is connected, described supporting bracket 3 is positioned at supporting seat 2 right center place, it is connected with bracing frame 1 screw thread, described connecting rod 4 is positioned at supporting seat 2 right-hand member center, itself and supporting bracket 3 are movably connected, be weldingly connected with supporting seat 2, described storage glue device 5 is positioned at connecting rod 4 right-hand member center, the two screw thread is connected, described cylinder 6 is positioned at bracing frame 1 top center left end, the two screw thread is connected, described positioning seat 7 is positioned at cylinder 6 left end center, itself and bracing frame 1 are movably connected, be connected with cylinder 6 screw thread, described guide vane end stop 8 is positioned at positioning seat 7 left end center, it is connected with bracing frame 1 screw thread.Also be provided with electromagnetic relay 501 on the right side of described storage glue device 5 lower end, the two screw thread is connected.Also be provided with flow control valve 502 on the right side of described storage glue device 5 lower end, the two screw thread is connected.Described positioning seat 7 is also provided with guide rail 101 with bracing frame 1 junction, and it is connected with bracing frame 1 screw thread.Described cylinder 6 is also provided with pull bar 601 with positioning seat 7 junction, and it is connected with positioning seat 7, cylinder 6 screw thread.Described positioning seat 7 top center place is also provided with a rubber moulding 701, and the two is movably connected.Wherein bracing frame 1, supporting seat 2, supporting bracket 3, connecting rod 4 is support fixed mechanisms of this device of composition, liquid glue is loaded in storage glue device 5, a rubber moulding 701 is put in positioning seat 7, cylinder 6 promotes the guide rail 101 of positioning seat 7 in frame 1 slides by pull bar 601, when sliding into storage glue device 5 lower center place, be energized by electromagnetic relay 501, flow control valve 502 is opened, liquid glue flows in some rubber moulding 701 by flow control valve 502, again IC chip is placed on above glue, be fixed, place dislocation, ensure the crudy of next sequence, avoid and scrap.
The present invention is not limited to above-mentioned concrete execution mode, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion made, all drop within protection scope of the present invention.
Claims (6)
1. an IC chip point glue equipment, comprise bracing frame, it is characterized in that comprising supporting seat, supporting bracket, connecting rod, storage glue device, cylinder, positioning seat, guide vane end stop, described supporting seat is positioned at bracing frame top center left end, the two screw thread is connected, described supporting bracket is positioned at supporting seat right center place, it is connected with bracing frame screw thread, described connecting rod is positioned at supporting seat right-hand member center, itself and supporting bracket are movably connected, be weldingly connected with supporting seat, described storage glue device is positioned at connecting rod right-hand member center, the two screw thread is connected, described cylinder is positioned at bracing frame top center left end, the two screw thread is connected, described positioning seat is positioned at cylinder left end center, itself and bracing frame are movably connected, be connected with cylinder screw thread, described guide vane end stop is positioned at positioning seat left end center, it is connected with bracing frame screw thread.
2. a kind of IC chip point glue equipment as claimed in claim 1, is characterized in that also being provided with electromagnetic relay on the right side of described storage glue device lower end, and the two screw thread is connected.
3. a kind of IC chip point glue equipment as claimed in claim 2, is characterized in that also being provided with flow control valve on the right side of described storage glue device lower end, and the two screw thread is connected.
4. a kind of IC chip point glue equipment as claimed in claim 3, it is characterized in that described positioning seat and bracing frame junction are also provided with guide rail, it is connected with bracing frame screw thread.
5. a kind of IC chip point glue equipment as claimed in claim 4, it is characterized in that described cylinder and positioning seat junction are also provided with pull bar, it is connected with positioning seat, cylinder screw thread.
6. a kind of IC chip point glue equipment as claimed in claim 5, it is characterized in that described positioning seat top center place is also provided with a rubber moulding, the two is movably connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510012133.5A CN104616999A (en) | 2015-01-09 | 2015-01-09 | Adhesive dispensing device for IC chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510012133.5A CN104616999A (en) | 2015-01-09 | 2015-01-09 | Adhesive dispensing device for IC chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104616999A true CN104616999A (en) | 2015-05-13 |
Family
ID=53151393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510012133.5A Pending CN104616999A (en) | 2015-01-09 | 2015-01-09 | Adhesive dispensing device for IC chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104616999A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110299315A (en) * | 2019-08-06 | 2019-10-01 | 马鞍山正复安电子科技有限公司 | A kind of integrated circuit automatic encapsulation device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201063335Y (en) * | 2007-04-06 | 2008-05-21 | 均豪精密工业股份有限公司 | Device with multiple feeding guide rails for installing semiconductor chip |
| CN201408746Y (en) * | 2009-04-03 | 2010-02-17 | 晶诚（郑州）科技有限公司 | Device for improving glue dispensing system on die bonder in semiconductor encapsulation |
| CN201644319U (en) * | 2010-02-03 | 2010-11-24 | 吕立华 | Table type automatic dispensing machine |
| CN202123043U (en) * | 2011-06-15 | 2012-01-25 | 深圳市创益科技发展有限公司 | Glue dispensing machine used for solar cells |
| CN203664110U (en) * | 2013-11-15 | 2014-06-25 | 陕西宝优电子制造有限公司 | Automatic glue-dispensing device |
-
2015
- 2015-01-09 CN CN201510012133.5A patent/CN104616999A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201063335Y (en) * | 2007-04-06 | 2008-05-21 | 均豪精密工业股份有限公司 | Device with multiple feeding guide rails for installing semiconductor chip |
| CN201408746Y (en) * | 2009-04-03 | 2010-02-17 | 晶诚（郑州）科技有限公司 | Device for improving glue dispensing system on die bonder in semiconductor encapsulation |
| CN201644319U (en) * | 2010-02-03 | 2010-11-24 | 吕立华 | Table type automatic dispensing machine |
| CN202123043U (en) * | 2011-06-15 | 2012-01-25 | 深圳市创益科技发展有限公司 | Glue dispensing machine used for solar cells |
| CN203664110U (en) * | 2013-11-15 | 2014-06-25 | 陕西宝优电子制造有限公司 | Automatic glue-dispensing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110299315A (en) * | 2019-08-06 | 2019-10-01 | 马鞍山正复安电子科技有限公司 | A kind of integrated circuit automatic encapsulation device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150513 |
|
| RJ01 | Rejection of invention patent application after publication |