CN104596646B - Workpiece temperature measuring equipment for grinding experiment - Google Patents
Workpiece temperature measuring equipment for grinding experiment Download PDFInfo
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- CN104596646B CN104596646B CN201510039900.1A CN201510039900A CN104596646B CN 104596646 B CN104596646 B CN 104596646B CN 201510039900 A CN201510039900 A CN 201510039900A CN 104596646 B CN104596646 B CN 104596646B
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- workpiece
- measured workpiece
- blind hole
- infrared radiation
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Abstract
The invention discloses a kind of workpiece temperature measuring equipment for grinding experiment, the device includes：Working gantry；Measured workpiece, measured workpiece are arranged on Working gantry, and the upper surface of measured workpiece is grinding surface, is spaced apart on the lower surface of measured workpiece formed with blind hole, the inner top surface of blind hole with the upper surface of measured workpiece；Infrared radiation temperature pop one's head in, infrared radiation temperature probe be arranged on blind hole underface and infrared radiation temperature probe thermometric focal point on the inner top surface of blind hole；Spectroanalysis instrument, spectroanalysis instrument are connected with infrared radiation temperature probe.Workpiece temperature measuring equipment for grinding experiment according to embodiments of the present invention, using infrared radiation temperature probe and spectroanalysis instrument, thus, spectroanalysis instrument accurately can immediately record the temperature change of measured workpiece subsurface stratum, and infra-red radiation is not influenceed by mechanical oscillation and external magnetic field, so as to improve the accuracy of the stability of measurement and thermometric.
Description
Technical field
The present invention relates to a kind of workpiece temperature measuring equipment for grinding experiment.
Background technology
Existing grinding thermometric generally use thermocouple wire, which is clipped among measured workpiece, to be measured.Thermocouple temperature measurement is physics
Contact, galvanic couple directly contact with emery wheel, and by insulation sleeve, there is also physical contact with workpiece.During wheel grinding workpiece, it is processed
The temperature in region can raise, and thermocouple wire also can be with heating, due to Seebeck effect be present, between the silk of two different materials
Produce thermo-electromotive force.Electric signal is transformed into temperature signal by temperature measurer, completes thermometric process.
Thermocouple wire is more sensitive to mechanical oscillation, and grinding process has strong vibration and destabilizing factor, causes
The inaccurate and poor repeatability of measurement result.Thermocouple temperature measurement part thermal resistance be present, it is necessary to which working region is completely heated
Thermo-electromotive force just can be accurately obtained afterwards, and heating is exceedingly fast in grinding process, within such short time, heat works in thermocouple
Skewness in end, causes the hysteresis quality of measurement result, and measured value lags and is less than actual temperature value.And thermocouple wire
Be thermally isolated by insulating barrier and workpiece, measurement be wheel grinding thermocouple temperature, be not workpiece skin temperature.
The content of the invention
It is contemplated that at least solves one of above-mentioned technical problem of the prior art to a certain extent.Therefore, this hair
A bright purpose is to propose a kind of workpiece temperature measuring equipment for grinding experiment, and the arrangement increases workpiece in grinding experiment
The accuracy of thermometric and the stability of measurement.
Workpiece temperature measuring equipment for grinding experiment according to embodiments of the present invention, including:Working gantry；Measured workpiece,
The measured workpiece is arranged on the Working gantry, and the upper surface of the measured workpiece is grinding surface, the measured workpiece
It is spaced apart on lower surface formed with blind hole, the inner top surface of the blind hole with the upper surface of the measured workpiece；Infrared radiation temperature
Probe, the infrared radiation temperature probe is arranged on the underface of the blind hole and the thermometric of infrared radiation temperature probe is burnt
Point is on the inner top surface of the blind hole；Spectroanalysis instrument, the spectroanalysis instrument are connected with infrared radiation temperature probe.
Workpiece temperature measuring equipment for grinding experiment according to embodiments of the present invention, using infrared radiation temperature probe and light
Analyzer is composed, during measurement, whole Working gantry is placed on mill car, measured workpiece is arranged on Working gantry, with grinding
Carry out, temperature raises rapidly, and final blind hole is saturating by mill, and spectroanalysis instrument can record measured workpiece subsurface stratum exactly immediately
Temperature change, the temperature of spectroanalysis instrument last time record is the surface temperature of grinding area.And infra-red radiation is not by machinery
The influence of vibration effect and external magnetic field, so as to improve the accuracy of the stability of measurement and thermometric.
In addition, the workpiece temperature measuring equipment for grinding experiment according to embodiments of the present invention, can also have following additional
Technical characteristic：
According to some embodiments of the present invention, the measured workpiece is tabular, and receiving is provided with the Working gantry
Groove, the measured workpiece are at least partially recessed into the holding tank.
According to some embodiments of the present invention, measured workpiece location structure, the work are provided with the measured workpiece
There is Working gantry location structure on stand, the measured workpiece location structure coordinates so that institute with the Working gantry location structure
The thermometric focal point of infrared radiation temperature probe is stated on the inner top surface of the blind hole.
According to some embodiments of the present invention, the measured workpiece location structure is positioning boss, and the Working gantry is determined
Bit architecture is positioning hole.
According to some embodiments of the present invention, the positioning boss is annular, and the blind hole is located at the positioning boss
It is interior and coaxially arranged with the positioning boss.
According to some embodiments of the present invention, the blind hole is taper.
According to some embodiments of the present invention, the inner top surface of the blind hole is plane.
According to some embodiments of the present invention, the distance of the inner top surface of the blind hole apart from the upper surface of the measured workpiece
For 0.1mm-0.5mm.
According to some embodiments of the present invention, the measured workpiece and the infrared radiation temperature probe be it is multiple, it is more
The temperature-measuring range of the individual infrared radiation temperature probe is different.
According to some embodiments of the present invention, the workpiece temperature measuring equipment for grinding experiment also includes：Position adjustments
Device, the infrared radiation temperature probe are arranged on the apparatus for adjusting position, and the apparatus for adjusting position is arranged for
Adjust the free degree of the infrared radiation temperature probe on above-below direction, left and right directions and fore-and-aft direction.
Brief description of the drawings
Fig. 1 is the workpiece temperature measuring equipment structural representation for grinding experiment according to embodiments of the present invention；
Fig. 2 is sectional view of the measured workpiece along its blind hole axis.
Reference：
Workpiece temperature measuring equipment 100 for grinding experiment；
Working gantry 1, Working gantry location structure 11；
Measured workpiece 2, measured workpiece location structure 21, blind hole 22, blind hole inner top surface 221, measured workpiece upper surface 23；
Infrared radiation temperature probe 3；
Spectroanalysis instrument 4.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Description is of the invention to be described with simplified, rather than the device or element of instruction or hint meaning must be with specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the invention, " multiple " are meant that at least two, such as two
It is individual, three etc., unless otherwise specifically defined.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation " etc.
Term should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be that machinery connects
Connect or electrically connect or can communicate with one another；Can be joined directly together, can also be indirectly connected by intermediary, can
To be connection or the interaction relationship of two elements of two element internals.For the ordinary skill in the art,
The concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
, should below with reference to Fig. 1-Fig. 2 descriptions workpiece temperature measuring equipment 100 for grinding experiment according to embodiments of the present invention
Device improves the accuracy of grinding experiment thermometric and the stability of measurement.
Workpiece temperature measuring equipment 100 for grinding experiment according to embodiments of the present invention can include：Working gantry 1, quilt
Survey workpiece 2, infrared radiation temperature probe 3 and spectroanalysis instrument 4.
As shown in figure 1, measured workpiece 2 can be arranged on Working gantry 1, measured workpiece upper surface 23 can be grinding surface,
Can be formed with blind hole 22 on lower surface.Specifically, in measurement process, Working gantry 1 can be placed on mill car, use emery wheel pair
Measured workpiece upper surface 23 is that grinding surface is ground, and blind hole inner top surface 221 can be spaced apart with measured workpiece upper surface 23, with
The progress of grinding, the spacing distance between blind hole inner top surface 221 and measured workpiece upper surface 23 reduce, final blind hole inner top surface
221 will be ground thoroughly by emery wheel.
As shown in figure 1, can be provided with infrared radiation temperature probe 3 in the underface of blind hole 22, infrared radiation temperature is visited
First 3 focus can be on blind hole inner top surface 221.Thus, focus location technology can be passed through so that infrared radiation temperature probe 3
Measured zone be blind hole 22 bosom, now, infrared radiation temperature probe 3 can be to receive the bosom of blind hole 22, i.e.,
The infrared ray that the subsurface stratum of measured workpiece 2 is radiated, the spectrum captured is then passed into spectroanalysis instrument 4, spectroanalysis instrument 4
Spectrum is analyzed, obtains the temperature of measured workpiece 2.
Spectroanalysis instrument 4 is connected with infrared radiation temperature probe 3, for example, according to one embodiment of present invention, infrared spoke
Penetrate temperature probe 3 with spectroanalysis instrument 4 by infrared ray conduction special optic fibre 5 to be connected, infrared ray conduction special optic fibre 5 can be real
Existing infrared ray is totally reflected in a fiber so that infrared ray conduction loss in infrared ray conducts special optic fibre is smaller, and infrared ray
It is fast to conduct special optic fibre conduction of velocity, final conduction enters spectrometer.In addition, there is protection on infrared ray conduction special optic fibre 5 surface
Layer can completely cut off infringement of the surrounding environment to fiber optic conduction.Wherein, spectroanalysis instrument can be infrared spectrometric analyzer.Thus, spectrum
The infrared rays that analyzer 4 can capture to infrared radiation temperature probe 3 are analyzed, so as to improve the work for grinding experiment
The thermometric accuracy of part temperature measuring equipment.
Specifically, during emery wheel is to being ground of measured workpiece 2, spectroanalysis instrument 4 can be to infra-red radiation
The infrared ray that temperature probe 3 captures is analyzed, and thus, spectroanalysis instrument 4 can be with the subsurface stratum of accurate recording measured workpiece 2
Temperature, the temperature that spectroanalysis instrument 4 the records for the last time i.e. surface temperature of grinding area.
Workpiece temperature measuring equipment 100 for grinding experiment according to embodiments of the present invention, surveyed by being provided with infra-red radiation
Temperature probe 3 and spectroanalysis instrument 4, during measurement, spectroanalysis instrument 4 can the subsurface stratum of accurate recording measured workpiece 2 immediately temperature
Change, with the progress of grinding, final blind hole 22 is saturating by mill, and the temperature that spectroanalysis instrument 4 records for the last time is exactly grinding area
The surface temperature in domain.Moreover, in grinding process, measured workpiece 2 inevitably has a certain degree of vibration, and infra-red radiation is not
Influenceed to influence with external magnetic field by mechanical oscillation, so as to can also improve the stability of measurement and the accuracy of thermometric.
According to some embodiments of the present invention, as shown in figure 1, measured workpiece 2 can be tabular, thus, it is easy to emery wheel pair
The grinding of measured workpiece 2.Holding tank is may be provided with Working gantry 1, measured workpiece 2 can at least be partially housed in holding tank
It is interior, consequently facilitating the placement of measured workpiece 2, can also be positioned to measured workpiece 2 to a certain extent.
In order to which further measured workpiece 2 is fixed and positioned, optionally, may be provided with measured workpiece 2 tested
Workpiece positioning structure 21, Working gantry location structure 11, measured workpiece location structure 21 and work are may be provided with Working gantry
Making stand location structure 11 can be connected positioning, so that the thermometric focal point of infrared radiation temperature probe 3 is in blind hole top surface 221
On.
For example, measured workpiece location structure 21 can be positioning boss, Working gantry location structure 11 can be positioning hole.Positioning
Boss can be inserted into positioning hole, and thus, positioning boss can coordinate with positioning hole to be positioned to measured workpiece 2, so as to avoid
The dislocation of measured workpiece 2 in grinding process, while also allow for infrared radiation temperature probe 3 and catch infrared ray.
Wherein, alternatively, as shown in Fig. 2 positioning boss can be annular, blind hole 22 can be located in positioning boss and with determining
Position boss is coaxially arranged.Thus, infrared radiation temperature probe 3 can receive immediately the subsurface stratum of measured workpiece 2 radiated it is infrared
Line.
According to some currently preferred embodiments of the present invention, as shown in Fig. 2 blind hole 22 can be taper, blind hole inner top surface 221 can be
Plane.Infrared radiation temperature probe 3 can accurately be fixed on the underface of bellmouth, so as to which infrared radiation temperature probe 3 is just fixed
Position is on the inner top surface of bellmouth, and according to the property of black body radiation, bellmouth is regarded as black matrix, using the black matrix spoke of bellmouth
Principle is penetrated, the temperature measurement accuracy of the workpiece temperature measuring equipment for grinding experiment can be improved.
According to some embodiments of the present invention, blind hole inner top surface 221 is spaced apart with measured workpiece upper surface 23, example
Such as, blind hole inner top surface 221 and the distance of measured workpiece upper surface 23 can be 0.1mm-0.5mm.Thus, grinding can not only be saved
The time of experiment, while can also ensure the thermometric degree of accuracy of the workpiece temperature measuring equipment for grinding experiment.
According to some currently preferred embodiments of the present invention, measured workpiece 2 and infrared radiation temperature probe 3 can be it is multiple, it is more
The temperature-measuring range of individual infrared radiation temperature probe 3 is different.For example, according to one embodiment of present invention, as shown in figure 1, infrared
Radiation temperature measurement probe 3 can have two, including high temp, infrared radiation temperature probe and middle low temperature infrared radiation temperature probe, wherein,
The temperature range of measurable 500-1500 DEG C of high temp, infrared radiation temperature probe, middle low temperature infrared radiation temperature probe can measure
20-800 DEG C of temperature range.Thus, different measured workpieces 2 can will be measured according to measurement range in progress laboratory, also may be used
Experiment measurement is carried out to multiple measured workpieces 2 simultaneously, so as to improve the degree of accuracy of thermometric.
In order to further improve the thermometric accuracy of the workpiece temperature measuring equipment 100 for grinding experiment, the device can be with
Including：Apparatus for adjusting position, infrared radiation temperature probe 3 may be provided on apparatus for adjusting position, and apparatus for adjusting position can be set
Into for adjusting infrared radiation temperature 3 free degree on above-below direction, left and right directions and fore-and-aft direction of probe.
For example, apparatus for adjusting position may include gear structure, worm gear structure etc..Certainly, for the common of this area
, can flexible design apparatus for adjusting position, such as may be referred to the feeding of lathe tool on lathe as needed for technical staff
Device is designed.
Thus, by set location adjusting means, so as to the position of adjustable infrared radiation temperature probe 3, and then cause
The focal point of infrared radiation temperature probe 3 improves the accuracy of thermometric on blind hole inner top surface 221.
Workpiece temperature measuring equipment 100 for grinding experiment according to embodiments of the present invention, using infrared radiation temperature probe 3
With spectroanalysis instrument 4, in grinding process, spectroanalysis instrument can accurate instant record measured workpiece grinding area surface
Temperature, blind hole 22 is provided with measured workpiece 2, thus, black body radiation principle can be used, so as to improve the accurate of the device thermometric
Degree.And infra-red radiation is not influenceed by mechanical oscillation, the conduction of infrared ray is not also influenceed by external magnetic field, is surveyed so as to improve
The stability of amount.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment or example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Identical embodiment or example must be directed to.Moreover, specific features, structure, material or the feature of description can be with office
What combined in an appropriate manner in one or more embodiments or example.In addition, those skilled in the art can say this
Different embodiments or example described in bright book are engaged and combined.
Although embodiments of the invention have been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, one of ordinary skill in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, changed, replacing and modification.
Claims (9)
- A kind of 1. workpiece temperature measuring equipment for grinding experiment, it is characterised in that including：Working gantry；Measured workpiece, the measured workpiece are arranged on the Working gantry, and the upper surface of the measured workpiece is grinding surface, institute State and be spaced apart on the lower surface of measured workpiece formed with blind hole, the inner top surface of the blind hole with the upper surface of the measured workpiece, The blind hole is taper；Infrared radiation temperature is popped one's head in, and the infrared radiation temperature probe is arranged on the underface of the blind hole and the infra-red radiation The thermometric focal point of temperature probe is on the inner top surface of the blind hole；Spectroanalysis instrument, the spectroanalysis instrument are connected with infrared radiation temperature probe.
- 2. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that the measured workpiece is Tabular, holding tank is provided with the Working gantry, the measured workpiece is at least partially recessed into the holding tank.
- 3. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that on the measured workpiece Measured workpiece location structure is provided with, there is Working gantry location structure, the measured workpiece location structure on the Working gantry Coordinate with the Working gantry location structure so that the thermometric focal point of infrared radiation temperature probe is in the blind hole On top surface.
- 4. the workpiece temperature measuring equipment according to claim 3 for grinding experiment, it is characterised in that the measured workpiece is determined Bit architecture is positioning boss, and the Working gantry location structure is positioning hole.
- 5. the workpiece temperature measuring equipment according to claim 4 for grinding experiment, it is characterised in that the positioning boss is Annular, the blind hole are located in the positioning boss and coaxially arranged with the positioning boss.
- 6. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that the interior top of the blind hole Face is plane.
- 7. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that the interior top of the blind hole Identity distance is from being 0.1mm-0.5mm with a distance from the upper surface of the measured workpiece.
- 8. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that the measured workpiece and The infrared radiation temperature probe is multiple, and the temperature-measuring range of multiple infrared radiation temperature probes is different.
- 9. the workpiece temperature measuring equipment according to claim 1 for grinding experiment, it is characterised in that also include：Adjust position Regulating device, the infrared radiation temperature probe are arranged on the apparatus for adjusting position, and the apparatus for adjusting position is arranged to use In the free degree of the regulation infrared radiation temperature probe on above-below direction, left and right directions and fore-and-aft direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510039900.1A CN104596646B (en) | 2015-01-27 | 2015-01-27 | Workpiece temperature measuring equipment for grinding experiment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510039900.1A CN104596646B (en) | 2015-01-27 | 2015-01-27 | Workpiece temperature measuring equipment for grinding experiment |
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| CN104596646A CN104596646A (en) | 2015-05-06 |
| CN104596646B true CN104596646B (en) | 2017-12-19 |
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| CN201510039900.1A Active CN104596646B (en) | 2015-01-27 | 2015-01-27 | Workpiece temperature measuring equipment for grinding experiment |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105105819B (en) * | 2015-09-21 | 2017-10-24 | 青岛理工大学 | A kind of bone surgery grinding experiment device cooled down with electrostatic atomization film forming |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4438598A (en) * | 1981-11-30 | 1984-03-27 | Cummins Engine Company, Inc. | Surface temperature control apparatus |
-
2015
- 2015-01-27 CN CN201510039900.1A patent/CN104596646B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4438598A (en) * | 1981-11-30 | 1984-03-27 | Cummins Engine Company, Inc. | Surface temperature control apparatus |
Non-Patent Citations (3)
| Title |
|---|
| Comparison of Methods to Measure Grinding Temperatures;Xipeng Xu et al.;《Journal of Manufacturing Science and Engineering》;20010531;第123卷;第191-195页 * |
| Experimental study on temperatures and energy partition at the diamond–granite interface in grinding;Xipeng Xu;《Tribology International》;20011231;第2部分Experimental procedure、图1 * |
| 红外测温技术及其在磨削温度测量中的应用;尤芳怡 等;《华侨大学学报(自然科学版)》;20051031;第26卷(第4期);第338-342页 * |
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