CN104595748A - LED lamp - Google Patents
LED lamp Download PDFInfo
- Publication number
- CN104595748A CN104595748A CN201410724822.4A CN201410724822A CN104595748A CN 104595748 A CN104595748 A CN 104595748A CN 201410724822 A CN201410724822 A CN 201410724822A CN 104595748 A CN104595748 A CN 104595748A
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- CN
- China
- Prior art keywords
- led lamp
- led
- frame wall
- circuit board
- lamp bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
Abstract
The invention discloses an LED lamp. The LED lamp comprises an LED light-emitting component (1) and a radiating component (2) for radiating the LED light-emitting component (1). The radiating component (2) comprises at least one fitting LED distribution path, and the fitting LED distribution path extends opposite to the LED light-emitting side. The LED lamp is simple in structure, low in radiating cost, and good in radiating effect.
Description
Technical field
The present invention relates to and technical field of LED illumination, particularly relate to a kind of LED lamp.
Background technology
LED, because its luminous efficiency is high, long service life, free of contamination advantage, is widely used in production and life.Because each LED lamp bead component power is little, therefore LED lamp holder is all combined by connection in series-parallel by tens of or hundreds of LED lamp bead assemblies, and therefore LED produces a large amount of heats in luminescence process, if distributed not in time, greatly can reduce the light efficiency of LED, reduce the life-span of LED simultaneously.In prior art, especially high-power LED lamp, be generally install a radiator thereon to dispel the heat, such heat abstractor makes the complex structure of LED, and manufacturing cost is high, and large by the restriction of power.
The notification number of Chinese utility model patent is that CN 202452186 U discloses a kind of LED, comprise one or more LED chip, power supply and cover in the lamp back cover on described contrary with installed surface face, described LED chip and power supply are installed on installing plate, and face contrary with the installed surface installing described LED chip and power supply on described installing plate is rough and uneven in surface; In the utility model, the described face contrary with installed surface is wavy or wavy in triangle, and the inwall of described lamp back cover and/or outer wall are wavy or wavy in triangle.LED of the present utility model is by making folding shape by installing plate one side and the inner and/or outer wall of lamp back cover, although increase certain LED chip and power supply heat sinking area, improve radiating effect to a certain extent, but still there is following defect: the prior art still takes indirect heat radiation, therefore radiating effect is not good, and, this radiating mode, complex structure, manufacturing cost is high.
Summary of the invention
The present invention is directed to deficiency of the prior art, provide that a kind of structure is simple, heat radiation cost is low, the LED lamp of good heat dissipation effect.
In order to solve the problems of the technologies described above, the present invention is solved by following technical proposals:
A kind of LED lamp, comprises LED luminescence component and carries out the radiating subassembly that dispels the heat for described LED luminescence component, and described radiating subassembly comprises at least one matching LED distribution path and to the heat dissipation channel extended to form in contrast to LED emission side.
According to the embodiment of the present invention, alternatively, the LED lamp bead of described LED lamp bead assembly to be at least one circle along the circumference of circuit board be distributed in described circuit board lower surface.
According to the embodiment of the present invention, alternatively, the emission side of described LED lamp bead assembly is downward from circuit board lower surface.
According to the embodiment of the present invention, alternatively, described heat dissipation channel be footpath phase area of section reduce gradually towards another opposite end from one end of described LED light out part to surround closed form frame wall.
According to the embodiment of the present invention, alternatively, described heat dissipation channel is that to surround phase cross section, footpath be circular frame wall.
According to the embodiment of the present invention, alternatively, described heat dissipation channel is that to surround phase cross section, footpath be square frame wall.
According to the embodiment of the present invention, alternatively, the LED lamp bead assembly that described LED luminescence component comprises circuit board and arranges on circuit boards, is provided with for conducting the shortest thermally conductive pathways between described LED luminescence component and described radiating subassembly.
According to the embodiment of the present invention, alternatively, described radiating subassembly also comprises the heat sink be connected with described frame wall lower end, and described heat sink is connected in thermo-contact mode with described LED luminescence component.
According to the embodiment of the present invention, alternatively, the thermally conductive pathways > 0.1mm between described circuit board and described frame wall, between described heat sink and described frame wall.
According to the embodiment of the present invention, alternatively, described frame wall closes on described LED luminescence component side and is transversely provided with extension one, and described heat sink is connected in the mode of thermo-contact with described extension one.
The beneficial effect that the present invention obtains:
The PN junction institute caloric value of LED lamp bead assembly is in contact with it position via for conducting the shortest thermal path to heat sink, on heat sink, heat diffuses to whole heat sink by conduction pattern, then conduct to frame wall by heat sink and spread in whole frame wall, or be directly transmitted to whole frame wall by conduction pattern, simultaneously, the surface of heat sink and frame wall also by radiation mode and convection type to function of environment heat emission, very fast heat to be distributed; Further, also because the surfaces externally and internally of whole frame wall is all smooth, therefore, heat loss through radiation also plays a significant role, and further improves heat-sinking capability.
The heat that LED lamp bead assembly produces upwards is delivered to described heat sink by circuit board, heat on heat sink is delivered to frame wall again, heat upwards carries out transmitting and spreading by frame wall, the pipeline of such heat is contrary with LED lamp bead assembly light emission direction, greatly evacuate the heat on LED lamp bead assembly, thus the temperature of LED lamp bead assembly is reduced greatly, and then improve the service life of LED lamp bead assembly, also substantially increase the power of LED lamp bead assembly; The present invention is effectively improve the radiating effect of LED lamp, also reduces light fixture cost simultaneously, simplifies assembly technology, maintains the associative perception of light fixture and radiating rate is fast, do not need extra installation of heat radiator again.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide a further understanding of the present invention, and form a application's part, schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is the front view of a kind of LED lamp embodiment one of the present invention;
Fig. 2 is the front view of a kind of LED lamp embodiment two of the present invention;
Fig. 3 is the upward view of a kind of LED lamp embodiment two of the present invention;
Fig. 4 is the front view of a kind of LED lamp embodiment three of the present invention;
Fig. 5 is the upward view of a kind of LED lamp embodiment three of the present invention;
Fig. 6 is the front view of a kind of LED lamp embodiment four of the present invention;
Fig. 7 is the front view of a kind of LED lamp embodiment five of the present invention.
Detailed description of the invention
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing of the embodiment of the present invention, the technical scheme of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is a part of embodiment of the present invention, instead of whole embodiments.Based on described embodiments of the invention, the every other embodiment that those of ordinary skill in the art obtain under without the need to the prerequisite of creative work, all belongs to the scope of protection of the invention.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature immediately below second feature and tiltedly below, or only represent that fisrt feature level height is less than second feature.
Unless otherwise defined, technical term used herein or scientific terminology should be in field belonging to the present invention the ordinary meaning that the personage with general technical ability understands." first ", " second " that use in patent application specification of the present invention and claims and similar word do not represent any order, quantity or importance, and are only used to distinguish different parts.Equally, the similar word such as " " or " " does not represent that quantity limits yet, but represents to there is at least one.
As embodiments of the invention, a kind of LED lamp, comprise LED luminescence component 1 and carry out for described LED luminescence component 1 radiating subassembly 2 that dispels the heat, described radiating subassembly 2 comprises at least one matching LED distribution path and to the heat dissipation channel extended to form in contrast to LED emission side.
Preferably, the LED lamp bead of described LED lamp bead assembly 5 to be at least one circle along the circumference of circuit board 4 be distributed in described circuit board 4 lower surface.
Preferably, the emission side of described LED lamp bead assembly 5 is downward from circuit board 4 lower surface.
Preferably, described heat dissipation channel be footpath phase area of section reduce gradually towards another opposite end from one end of described LED light out part to surround closed form frame wall 3.
Preferably, described heat dissipation channel is surround the frame wall 3 that phase cross section, footpath is circle.
Preferably, described heat dissipation channel is that to surround phase cross section, footpath be square frame wall 3.
Preferably, the LED lamp bead assembly 5 that described LED luminescence component 1 comprises circuit board 4 and arranges on the circuit board 4, is provided with for conducting the shortest thermally conductive pathways between described LED luminescence component 1 and described radiating subassembly 2.
Preferably, described radiating subassembly 2 also comprises the heat sink 5 be connected with described frame wall 3 lower end, and described heat sink 5 is connected in thermo-contact mode with described LED luminescence component 1.
Preferably, the thermally conductive pathways > 0.1mm between described circuit board 4 and described frame wall 3, between described heat sink 5 and described frame wall 3.
Preferably, described frame wall 3 closes on described LED luminescence component side and is transversely provided with extension 1, and described heat sink 5 is connected in the mode of thermo-contact with described extension 1.
Preferably, described extension 16 one-tenth be symmetrical arranged, and outwards to generate along the sidewall of frame wall 3.
Preferably, described extension 16 one-tenth be symmetrical arranged, and inwardly to generate along the sidewall of frame wall 3.
Preferably, described heat sink 5 is radially provided with extension 27, and described frame wall 3 is connected in the mode of thermo-contact with described extension 27.
The heat that LED lamp bead assembly produces upwards is delivered to described heat sink by circuit board, heat on heat sink is delivered to frame wall again, heat upwards carries out transmitting and spreading by frame wall, the pipeline of such heat is contrary with LED lamp bead assembly light emission direction, greatly evacuate the heat on LED lamp bead assembly, thus the temperature of LED lamp bead assembly is reduced greatly, and then improve the service life of LED lamp bead assembly, also substantially increase the power of LED lamp bead assembly; The present invention is effectively improve the radiating effect of LED lamp, also reduces light fixture cost simultaneously, simplifies assembly technology, maintains the associative perception of light fixture and radiating rate is fast, do not need extra installation of heat radiator again.
Embodiment one:
As shown in Figure 1, as embodiments of the invention one, a kind of LED lamp, comprise LED luminescence component 1 and carry out for described LED luminescence component 1 radiating subassembly 2 that dispels the heat, described radiating subassembly 2 comprises at least one matching LED distribution path and to the heat dissipation channel extended to form in contrast to LED emission side.
In the present embodiment, as shown in Figure 1, described heat dissipation channel be footpath phase area of section reduce gradually towards another opposite end from one end of described LED light out part to surround closed form frame wall 3; And be the effect increasing heat radiation further, therefore be connected with heat sink 5 in described frame wall 3 lower end.
In the present embodiment, the LED lamp bead assembly 5 that described LED luminescence component 1 comprises circuit board 4 and arranges on the circuit board 4, the LED lamp bead of described LED lamp bead assembly 5 to be at least one circle along the circumference of circuit board 4 be distributed in described circuit board 4 lower surface, can according to the distribution demand of LED power being carried out to LED lamp bead, and the emission side of described LED lamp bead assembly 5 carries out luminescence downwards from circuit board 4 lower surface.
In the present embodiment, the upper surface of described circuit board 4 and the lower surface of described heat sink 5 are provided with for conducting the shortest thermally conductive pathways, the upper surface of described heat sink 5 and the lower end of described frame wall 3 are provided with for conducting the shortest thermally conductive pathways, described like this radiating subassembly 2 is connected in the mode of thermo-contact with circuit board 4, in the present embodiment, preferably described for conducting the shortest thermally conductive pathways for be made up of Heat Conduction Material, and it is preferred, between described circuit board 4 and described frame wall 3, thermally conductive pathways > 0.1mm between described heat sink 5 and described frame wall 3.
In the present embodiment, the heat that LED lamp bead assembly 5 produces upwards is delivered to described heat sink 5 by circuit board 4, heat on heat sink 5 is delivered to frame wall 3 again, heat upwards carries out transmitting and spreading by frame wall 3, the pipeline of such heat is contrary with LED lamp bead assembly light emission direction, greatly evacuate the heat on LED lamp bead assembly, thus the temperature of LED lamp bead assembly is reduced greatly, and then improve the service life of LED lamp bead assembly, also the power of LED lamp bead assembly is substantially increased, and radiating rate is fast, do not need again extra installation of heat radiator.
Embodiment two:
As shown in Figure 2, as embodiments of the invention two, a kind of LED lamp, comprise LED luminescence component 1 and carry out for described LED luminescence component 1 radiating subassembly 2 that dispels the heat, described radiating subassembly 2 comprises at least one matching LED distribution path and to the heat dissipation channel extended to form in contrast to LED emission side.
In the present embodiment, as shown in Figure 2, described heat dissipation channel is that to surround phase cross section, footpath be square frame wall 3; And be the effect increasing heat radiation further, therefore being connected with heat sink 5 in described frame wall 3 lower end, described heat sink 5 is radially provided with extension 27, and described frame wall 3 is connected in the mode of thermo-contact with described extension 27.
In the present embodiment, as shown in Figure 3, the LED lamp bead assembly 5 that described LED luminescence component 1 comprises circuit board 4 and arranges on the circuit board 4, the LED lamp bead of described LED lamp bead assembly 5 to be three circles along the circumference of circuit board 4 be distributed in described circuit board 4 lower surface, certainly can according to the distribution demand of LED power being carried out to LED lamp bead, and the emission side of described LED lamp bead assembly 5 carries out luminescence downwards from circuit board 4 lower surface.
In the present embodiment, the upper surface of described circuit board 4 and the lower surface of described heat sink 5 are provided with for conducting the shortest thermally conductive pathways, the upper surface of described heat sink 5 and the lower end of described frame wall 3 are provided with for conducting the shortest thermally conductive pathways, described like this radiating subassembly 2 is connected in the mode of thermo-contact with circuit board 4, in the present embodiment, preferably described for conducting the shortest thermally conductive pathways for be made up of Heat Conduction Material, and it is preferred, between described circuit board 4 and described frame wall 3, thermally conductive pathways > 0.1mm between described heat sink 5 and described frame wall 3.
In the present embodiment, the heat that LED lamp bead assembly 5 produces upwards is delivered to described heat sink 5 by circuit board 4, heat on heat sink 5 is delivered to frame wall 3 again, heat upwards carries out transmitting and spreading by frame wall 3, the pipeline of such heat is contrary with LED lamp bead assembly light emission direction, greatly evacuate the heat on LED lamp bead assembly, thus the temperature of LED lamp bead assembly is reduced greatly, and then improve the service life of LED lamp bead assembly, also the power of LED lamp bead assembly is substantially increased, and radiating rate is fast, do not need again extra installation of heat radiator.
Embodiment three:
As shown in Figure 4, as embodiments of the invention three, a kind of LED lamp, comprise LED luminescence component 1 and carry out for described LED luminescence component 1 radiating subassembly 2 that dispels the heat, described radiating subassembly 2 comprises at least one matching LED distribution path and to the heat dissipation channel extended to form in contrast to LED emission side.
In the present embodiment, as shown in Figure 4, described heat dissipation channel is surround the frame wall 3 that phase cross section, footpath is circle; And be the effect increasing heat radiation further, therefore be connected with heat sink 5 in described frame wall 3 lower end.
In the present embodiment, described LED luminescence component 1 comprises circuit board 4 and setting LED lamp bead assembly 5 on the circuit board 4 as shown in Figure 5, the LED lamp bead of described LED lamp bead assembly 5 to be three circles along the circumference of circuit board 4 be distributed in described circuit board 4 lower surface, certainly can according to the distribution demand of LED power being carried out to LED lamp bead, and the emission side of described LED lamp bead assembly 5 carries out luminescence downwards from circuit board 4 lower surface.
In the present embodiment, the upper surface of described circuit board 4 and the lower surface of described heat sink 5 are provided with for conducting the shortest thermally conductive pathways, the upper surface of described heat sink 5 and the lower end of described frame wall 3 are provided with for conducting the shortest thermally conductive pathways, described like this radiating subassembly 2 is connected in the mode of thermo-contact with circuit board 4, in the present embodiment, preferably described for conducting the shortest thermally conductive pathways for be made up of Heat Conduction Material, and it is preferred, between described circuit board 4 and described frame wall 3, thermally conductive pathways > 0.1mm between described heat sink 5 and described frame wall 3.
In the present embodiment, the heat that LED lamp bead assembly 5 produces upwards is delivered to described heat sink 5 by circuit board 4, heat on heat sink 5 is delivered to frame wall 3 again, heat upwards carries out transmitting and spreading by frame wall 3, the pipeline of such heat is contrary with LED lamp bead assembly light emission direction, greatly evacuate the heat on LED lamp bead assembly, thus the temperature of LED lamp bead assembly is reduced greatly, and then improve the service life of LED lamp bead assembly, also the power of LED lamp bead assembly is substantially increased, and radiating rate is fast, do not need again extra installation of heat radiator.
Embodiment four:
As shown in Figure 6, as embodiments of the invention four, a kind of LED lamp, comprise LED luminescence component 1 and carry out for described LED luminescence component 1 radiating subassembly 2 that dispels the heat, described radiating subassembly 2 comprises at least one matching LED distribution path and to the heat dissipation channel extended to form in contrast to LED emission side.
In the present embodiment, as shown in Figure 6, described heat dissipation channel is surround the frame wall 3 that phase cross section, footpath is circle; And be the effect increasing heat radiation further, therefore be connected with heat sink 5 in described frame wall 3 lower end, and described frame wall 3 closes on described LED luminescence component side is transversely provided with outside bending and becomes symmetrically arranged extension 1, described heat sink 5 is connected in the mode of thermo-contact with described extension 1.
In the present embodiment, described LED luminescence component 1 comprises circuit board 4 and setting LED lamp bead assembly 5 on the circuit board 4 as shown in Figure 5, the LED lamp bead of described LED lamp bead assembly 5 to be three circles along the circumference of circuit board 4 be distributed in described circuit board 4 lower surface, certainly can according to the distribution demand of LED power being carried out to LED lamp bead, and the emission side of described LED lamp bead assembly 5 carries out luminescence downwards from circuit board 4 lower surface.
In the present embodiment, the upper surface of described circuit board 4 and the lower surface of described heat sink 5 are provided with for conducting the shortest thermally conductive pathways, the upper surface of described heat sink 5 and the lower end of described frame wall 3 are provided with for conducting the shortest thermally conductive pathways, described like this radiating subassembly 2 is connected in the mode of thermo-contact with circuit board 4, in the present embodiment, preferably described for conducting the shortest thermally conductive pathways for be made up of Heat Conduction Material, and it is preferred, between described circuit board 4 and described frame wall 3, thermally conductive pathways > 0.1mm between described heat sink 5 and described frame wall 3.
In the present embodiment, the heat that LED lamp bead assembly 5 produces upwards is delivered to described heat sink 5 by circuit board 4, heat on heat sink 5 is delivered to frame wall 3 again, heat upwards carries out transmitting and spreading by frame wall 3, the pipeline of such heat is contrary with LED lamp bead assembly light emission direction, greatly evacuate the heat on LED lamp bead assembly, thus the temperature of LED lamp bead assembly is reduced greatly, and then improve the service life of LED lamp bead assembly, also the power of LED lamp bead assembly is substantially increased, and radiating rate is fast, do not need again extra installation of heat radiator.
Embodiment five:
As shown in Figure 7, as embodiments of the invention five, a kind of LED lamp, comprise LED luminescence component 1 and carry out for described LED luminescence component 1 radiating subassembly 2 that dispels the heat, described radiating subassembly 2 comprises at least one matching LED distribution path and to the heat dissipation channel extended to form in contrast to LED emission side.
In the present embodiment, as shown in Figure 7, described heat dissipation channel is surround the frame wall 3 that phase cross section, footpath is circle; And be the effect increasing heat radiation further, therefore be connected with heat sink 5 in described frame wall 3 lower end, and described frame wall 3 closes on described LED luminescence component side is transversely provided with outside bending and becomes symmetrically arranged extension 1, described heat sink 5 is connected in the mode of thermo-contact with described extension 1.
In the present embodiment, described LED luminescence component 1 comprises circuit board 4 and setting LED lamp bead assembly 5 on the circuit board 4 as shown in Figure 5, the LED lamp bead of described LED lamp bead assembly 5 to be three circles along the circumference of circuit board 4 be distributed in described circuit board 4 lower surface, certainly can according to the distribution demand of LED power being carried out to LED lamp bead, and the emission side of described LED lamp bead assembly 5 carries out luminescence downwards from circuit board 4 lower surface.
In the present embodiment, the upper surface of described circuit board 4 and the lower surface of described heat sink 5 are provided with for conducting the shortest thermally conductive pathways, the upper surface of described heat sink 5 and the lower end of described frame wall 3 are provided with for conducting the shortest thermally conductive pathways, described like this radiating subassembly 2 is connected in the mode of thermo-contact with circuit board 4, in the present embodiment, preferably described for conducting the shortest thermally conductive pathways for be made up of Heat Conduction Material, and it is preferred, between described circuit board 4 and described frame wall 3, thermally conductive pathways > 0.1mm between described heat sink 5 and described frame wall 3.
In the present embodiment, the heat that LED lamp bead assembly 5 produces upwards is delivered to described heat sink 5 by circuit board 4, heat on heat sink 5 is delivered to frame wall 3 again, heat upwards carries out transmitting and spreading by frame wall 3, the pipeline of such heat is contrary with LED lamp bead assembly light emission direction, greatly evacuate the heat on LED lamp bead assembly, thus the temperature of LED lamp bead assembly is reduced greatly, and then improve the service life of LED lamp bead assembly, also the power of LED lamp bead assembly is substantially increased, and radiating rate is fast, do not need again extra installation of heat radiator.
Last it is noted that above embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to previous embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein portion of techniques feature; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
In a word, the foregoing is only preferred embodiment of the present invention, all equalizations done according to the present patent application the scope of the claims change and modify, and all should belong to the covering scope of patent of the present invention.
Claims (10)
1. a LED lamp, comprise LED luminescence component (1) and carry out for described LED luminescence component (1) radiating subassembly (2) that dispels the heat, it is characterized in that: described radiating subassembly (2) comprises at least one matching LED distribution path and to the heat dissipation channel extended to form in contrast to LED emission side.
2. LED lamp according to claim 1, is characterized in that: described LED lamp bead assembly (5) to be distributed in the LED lamp bead of described circuit board (4) lower surface at least one circle along the circumference of circuit board (4).
3. LED lamp according to claim 2, is characterized in that: the emission side of described LED lamp bead assembly (5) is downward from circuit board (4) lower surface.
4. LED lamp according to claim 3, is characterized in that: described heat dissipation channel be footpath phase area of section from one end of described LED light out part towards another opposite end reduce surround closed form frame wall (3).
5. LED lamp according to claim 3, is characterized in that: described heat dissipation channel is surround the frame wall (3) that phase cross section, footpath is circle.
6. LED lamp according to claim 3, is characterized in that: described heat dissipation channel is that to surround phase cross section, footpath be square frame wall (3).
7. the LED lamp according to any one of claim 1-6, it is characterized in that: described LED luminescence component (1) comprises circuit board (4) and is arranged on the LED lamp bead assembly (5) on circuit board (4), is provided with for conducting the shortest thermally conductive pathways between described LED luminescence component (1) and described radiating subassembly (2).
8. LED lamp according to claim 7, it is characterized in that: described radiating subassembly (2) also comprises the heat sink (5) be connected with described frame wall (3) lower end, and described heat sink (5) is connected in thermo-contact mode with described LED luminescence component (1).
9. LED lamp according to claim 8, is characterized in that: the thermally conductive pathways > 0.1mm between described circuit board (4) and described frame wall (3), between described heat sink (5) and described frame wall (3).
10. LED lamp according to claim 9, it is characterized in that: described frame wall (3) is closed on described LED luminescence component side and is transversely provided with extension one (6), and described heat sink (5) is connected in the mode of thermo-contact with described extension one (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410724822.4A CN104595748A (en) | 2014-12-03 | 2014-12-03 | LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410724822.4A CN104595748A (en) | 2014-12-03 | 2014-12-03 | LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104595748A true CN104595748A (en) | 2015-05-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410724822.4A Pending CN104595748A (en) | 2014-12-03 | 2014-12-03 | LED lamp |
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| Country | Link |
|---|---|
| CN (1) | CN104595748A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201069135Y (en) * | 2007-08-03 | 2008-06-04 | 王元成 | Lighting lamp |
| CN101649965A (en) * | 2009-08-20 | 2010-02-17 | 艾迪光电（杭州）有限公司 | Liquid-cooled light distribution hollow type LED lamp |
| CN202791469U (en) * | 2012-08-21 | 2013-03-13 | 中山市天鸿光电科技有限公司 | LED (Light-Emitting Diode) down lamp with good light-emitting effect |
| CN203628328U (en) * | 2013-11-13 | 2014-06-04 | 佛山市中山大学研究院 | LED light source G4 lamp |
| CN104456205A (en) * | 2014-12-01 | 2015-03-25 | 方恒 | LED lamp |
-
2014
- 2014-12-03 CN CN201410724822.4A patent/CN104595748A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201069135Y (en) * | 2007-08-03 | 2008-06-04 | 王元成 | Lighting lamp |
| CN101649965A (en) * | 2009-08-20 | 2010-02-17 | 艾迪光电（杭州）有限公司 | Liquid-cooled light distribution hollow type LED lamp |
| CN202791469U (en) * | 2012-08-21 | 2013-03-13 | 中山市天鸿光电科技有限公司 | LED (Light-Emitting Diode) down lamp with good light-emitting effect |
| CN203628328U (en) * | 2013-11-13 | 2014-06-04 | 佛山市中山大学研究院 | LED light source G4 lamp |
| CN104456205A (en) * | 2014-12-01 | 2015-03-25 | 方恒 | LED lamp |
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Application publication date: 20150506 |