CN104594134B - Heat insulation method and heat insulation composite layer of pulp molding die - Google Patents
Heat insulation method and heat insulation composite layer of pulp molding die Download PDFInfo
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- CN104594134B CN104594134B CN201410847937.2A CN201410847937A CN104594134B CN 104594134 B CN104594134 B CN 104594134B CN 201410847937 A CN201410847937 A CN 201410847937A CN 104594134 B CN104594134 B CN 104594134B
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- high temperature
- isolation film
- temperature resistant
- thermal isolation
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Abstract
The invention relates to the technical field of die heat insulation, and discloses a heat insulation method and a heat insulation composite layer of a pulp molding die. The heat insulation method disclosed by the invention has the advantages that high-temperature conduction of the die can be effectively limited, so that production accidents such as scalding can be prevented from happening, and the personal safety of an operator can be effectively ensured; meanwhile, through the heat insulation method, the temperature loss of the die is greatly reduced, so the energy source is saved. The heat insulation composite layer disclosed by the invention is simple in structure, can be flexibly manufactured according to different protection temperatures, can be effectively applied to high temperature protection of the die and is simple in technology and convenient to use.
Description
Technical field
The present invention relates to mould heat insulation technical field, the mould heat insulation method of more particularly, to a kind of paper mould and its heat-insulated
Composite bed.
Background technology
The production process environmental protection of moulded paper pulp product, using process safety and nontoxic, it is easily recycled after use
Recycle, belong to typical green packaging products, the scope of application is increasing;Due to paper mould in process of production, typically
Need just can complete through operations such as slurrying, sizing, drying and shapings, particularly in trimming, need mould is heated,
So that the temperature of mould is reached between 150 ~ 200 DEG C, and in trimming, need workman that the moulded paper pulp product being dried is encased in
In shaping mould, because mould has higher temperature, operator place and take out product during, accidentally,
Handss will encounter mould, frequently result in workman and be burned, production development accident, and in view of this, inventor has invented a kind of paper pulp
The mould heat insulation method of moulding article, to solve the hidden danger that paper mould has production in trimming.
Content of the invention
Present invention aims to the deficiencies in the prior art, provide a kind of paper mould mould heat insulation method and its
Heat-insulated composite bed.This heat-insulating method can effectively limit the high temperature conduction of mould, thus avoiding the generation of the production accidents such as scald, has
Imitate has ensured operator's personal safety;The heat-insulated composite bed of the present invention can be effectively applied to the high temperature protection of mould, work
Skill is simple, easy to use.
For achieving the above object, a kind of mould heat insulation method of paper mould of the present invention, comprises the steps:
S1. mould is needed heat-insulated position to be cleaned;
S2. high temperature resistant bottom thermal isolation film is pasted on heat-insulated position after cleaning;
S3. the surface mount heat barrier foam layer of described high temperature bottom thermal isolation film, the thickness of described heat barrier foam layer is 0.1 ~
10mm;
S4. the surface mount high temperature resistant top layer thermal isolation film of described heat barrier foam layer.
Preferably, the high temperature resistant temperature of described high temperature resistant bottom thermal isolation film and high temperature resistant top layer thermal isolation film be 200 ~
250℃.
Preferably, in the step of S2, described high temperature resistant bottom thermal isolation film is after high-temperature plastic is pasted on cleaning
Heat-insulated position, the high temperature resistant temperature of described high-temperature plastic is 280 ~ 300 DEG C.
Preferably, the surface of described high temperature resistant bottom thermal isolation film and high temperature resistant top layer thermal isolation film is all coated with ceramic insulation
Layer.
Preferably, described ceramic thermal barrier layer is made by silicon dioxide or by porous zirconia.
Preferably, in the step of S2, described high temperature resistant bottom thermal isolation film is PET thermal isolation film;In the step of S3, institute
Stating heat barrier foam layer is heat-proof polyimide foamed materialss, and thickness is 0.1mm;In the step of S4, described high temperature resistant top layer every
Hotting mask is PET thermal isolation film.
Preferably, in the step of S2, described high temperature resistant bottom thermal isolation film is PET thermal isolation film;In the step of S3, institute
Stating heat barrier foam layer is heat-proof polyimide foamed materialss, and thickness is 5mm;In the step of S4, described high temperature resistant top layer is heat-insulated
Film is polyimides thermal isolation film.
Preferably, in the step of S2, described high temperature resistant bottom thermal isolation film is polyimides thermal isolation film;Step in S3
In, described heat barrier foam layer is heat-proof polyimide foamed materialss, and thickness is 10mm;In the step of S4, described high temperature resistant top
Layer thermal isolation film is polyimides thermal isolation film.
A kind of mould heat insulation composite bed of paper mould, including the high temperature resistant bottom thermal isolation film for being attached at die surface
With high temperature resistant top layer thermal isolation film, between described high temperature resistant bottom thermal isolation film and high temperature resistant top layer thermal isolation film, it is provided with heat barrier foam
Layer, described heat barrier foam layer is heat-proof polyimide foamed materialss, and thickness is 0.1 ~ 10mm.
Preferably, described high temperature resistant bottom thermal isolation film, the material of high temperature resistant top layer thermal isolation film are PET or polyimides,
Thickness is 1 ~ 15mm, and described high temperature resistant bottom thermal isolation film, the surface of high temperature resistant top layer thermal isolation film are all coated with ceramic thermal barrier layer.
Beneficial effects of the present invention:A kind of mould heat insulation method of paper mould of the present invention, this mould heat insulation method is first
High temperature resistant bottom thermal isolation film is pasted on mould, then heat barrier foam layer is pasted on according to certain thickness range high temperature resistant
High temperature resistant top layer thermal isolation film is finally pasted on heat barrier foam layer by bottom thermal isolation film, mould heat operationally, in conduction extremely
During high temperature resistant bottom thermal isolation film, carry out the preliminary obstruct of heat conduction, be then passed through the stop further of heat barrier foam layer, reduce
Heat conducts, and heat is greatly reduced and conducts to surface, when remaining heat is again by high temperature resistant top layer thermal isolation film, its temperature declines
Reduce to 50 DEG C about, and this temperature is suitable for the temperature contacting for staff;Obviously, this heat-insulating method can effectively limit the height of mould
Temperature conduction, thus avoiding the generation of the production accidents such as scald, has effectively ensured operator's personal safety;It is additionally, since this
Heat-insulating method substantially reduces the temperature leak of mould, also saves the energy;And the structure of the heat-insulated composite bed of the present invention is simple,
Can flexibly be manufactured according to different protection temperature, the high temperature protection of mould, process is simple, user can be effectively applied to
Just.
Brief description
Fig. 1 is the heat-insulating method step schematic diagram of the present invention.
Fig. 2 is the structural representation of the thermal insulation layer of the present invention.
Reference:High temperature resistant bottom thermal isolation film 1;Heat barrier foam layer 2;High temperature resistant top layer thermal isolation film 3;Pottery every
Thermosphere 4.
Specific embodiment
1 to 2 the present invention will be described in detail below in conjunction with the accompanying drawings.
A kind of mould heat insulation method of paper mould of the present invention, comprises the steps:
S1. mould is needed heat-insulated position to be cleaned;
S2. high temperature resistant bottom thermal isolation film 1 is pasted on heat-insulated position after cleaning;
S3. the surface mount heat barrier foam layer 2 of described high temperature bottom thermal isolation film, the thickness of described heat barrier foam layer 2 is 0.1
~10mm;
S4. the surface mount high temperature resistant top layer thermal isolation film 3 of described heat barrier foam layer 2.
This mould heat insulation method first high temperature resistant bottom thermal isolation film 1 is pasted on mould, then by heat barrier foam layer 2 according to
Certain thickness range is pasted on high temperature resistant bottom thermal isolation film 1, finally high temperature resistant top layer thermal isolation film 3 is pasted on heat barrier foam layer
2, mould heat operationally, when conduction is to high temperature resistant bottom thermal isolation film 1, carry out the preliminary obstruct of heat conduction, then
Through the stop further of heat barrier foam layer 2, reduce heat conduction, heat is greatly reduced and conducts to surface, remaining heat is again
Secondary by high temperature resistant top layer thermal isolation film 3 when, its temperature damping to 50 DEG C about, and this temperature for staff be suitable for contact temperature
Degree;Obviously, this heat-insulating method can effectively limit the high temperature conduction of mould, thus avoiding the generation of the production accidents such as scald, effectively
Ensured operator's personal safety;It is additionally, since paper mould in reforming process, need the height making mould utilize mould
Temperature, high pressure, so that moulded paper pulp product is carried out with shaping, improve the intensity of paper mould, and this heat-insulating method substantially reduces mould
Temperature leak, it is to avoid make temperature Quick diffusing because mould is externally exposed, reached the purpose of save energy.
In general, in reforming process, the temperature of its shaping mould is 150 ~ 200 DEG C about to moulded paper pulp product,
In the technical program, the high temperature resistant temperature of described high temperature resistant bottom thermal isolation film 1 and high temperature resistant top layer thermal isolation film 3 is 200 ~ 250
DEG C, so that high temperature resistant bottom thermal isolation film 1 adapts to the temperature range of shaping mould.
Further, in the step of S2, described high temperature resistant bottom thermal isolation film 1 is after high-temperature plastic is pasted on cleaning
Heat-insulated position, the high temperature resistant temperature of described high-temperature plastic is 280 ~ 300 DEG C.This high-temperature plastic can be machine silicon class glue, phenolic aldehyde tree
Fat glue, urea-formaldehyde resin adhesive, heatproof epoxy glue, polyimides glue etc..
In the technical program, in order to reduce leading of high temperature resistant bottom thermal isolation film 1 and high temperature resistant top layer thermal isolation film 3 further
Hot property, the surface of described high temperature resistant bottom thermal isolation film 1 and high temperature resistant top layer thermal isolation film 3 is all coated with ceramic thermal barrier layer 4.
Further, described ceramic thermal barrier layer 4 is made by silicon dioxide or by porous zirconia.
It is described further below in conjunction with specific embodiment:
Embodiment one.
A kind of mould heat insulation method of paper mould, comprises the steps:
S1. mould is needed heat-insulated position to be cleaned;
S2. high temperature resistant bottom thermal isolation film 1 is pasted on heat-insulated position after cleaning;
S3. the surface mount heat barrier foam layer 2 of described high temperature bottom thermal isolation film, the thickness of described heat barrier foam layer 2 is 0.1
~10mm;
S4. the surface mount high temperature resistant top layer thermal isolation film 3 of described heat barrier foam layer 2.
In the step of S2, described high temperature resistant bottom thermal isolation film 1 is PET thermal isolation film, and thickness is 1mm;In the step of S3,
Described heat barrier foam layer 2 is heat-proof polyimide foamed materialss, and thickness is 0.1mm;In the step of S4, described high temperature resistant top layer
Thermal isolation film 3 is PET thermal isolation film, and thickness is 1mm.The mould heat insulation layer of the moulded paper pulp product that the present embodiment is formed, according to reality
Border test is learnt, the temperature of high temperature resistant top layer thermal isolation film 3 is significantly lower than the temperature of die ontology, and the temperature difference reaches more than 100 DEG C.
Embodiment two.
A kind of mould heat insulation method of paper mould, comprises the steps:
S1. mould is needed heat-insulated position to be cleaned;
S2. high temperature resistant bottom thermal isolation film 1 is pasted on heat-insulated position after cleaning;
S3. the surface mount heat barrier foam layer 2 of described high temperature bottom thermal isolation film, the thickness of described heat barrier foam layer 2 is 0.1
~10mm;
S4. the surface mount high temperature resistant top layer thermal isolation film 3 of described heat barrier foam layer 2.
In the step of S2, described high temperature resistant bottom thermal isolation film 1 is PET thermal isolation film, and thickness is 5mm;In the step of S3,
Described heat barrier foam layer 2 is heat-proof polyimide foamed materialss, and thickness is 5mm;In the step of S4, described high temperature resistant top layer every
Hotting mask 3 is polyimides thermal isolation film, and thickness is 5mm.The mould heat insulation layer of the moulded paper pulp product that the present embodiment is formed, according to
Actual test is learnt, the temperature of high temperature resistant top layer thermal isolation film 3 is significantly lower than the temperature of die ontology, and the temperature difference reaches more than 130 DEG C.
Embodiment three.
A kind of mould heat insulation method of paper mould, comprises the steps:
S1. mould is needed heat-insulated position to be cleaned;
S2. high temperature resistant bottom thermal isolation film 1 is pasted on heat-insulated position after cleaning;
S3. the surface mount heat barrier foam layer 2 of described high temperature bottom thermal isolation film, the thickness of described heat barrier foam layer 2 is 0.1
~10mm;
S4. the surface mount high temperature resistant top layer thermal isolation film 3 of described heat barrier foam layer 2.
In the step of S2, described high temperature resistant bottom thermal isolation film 1 is polyimides thermal isolation film, and thickness is 10mm;S3's
In step, described heat barrier foam layer 2 is heat-proof polyimide foamed materialss, and thickness is 10mm;In the step of S4, described resistance to height
Warm top layer thermal isolation film 3 is polyimides thermal isolation film, and thickness is 10mm.The mould of the moulded paper pulp product that the present embodiment is formed every
Thermosphere, learns according to actual test, and the temperature of high temperature resistant top layer thermal isolation film 3 is significantly lower than the temperature of die ontology, and the temperature difference reaches
More than 150 DEG C.
Example IV.
A kind of mould heat insulation method of paper mould, comprises the steps:
S1. mould is needed heat-insulated position to be cleaned;
S2. high temperature resistant bottom thermal isolation film 1 is pasted on heat-insulated position after cleaning;
S3. the surface mount heat barrier foam layer 2 of described high temperature bottom thermal isolation film, the thickness of described heat barrier foam layer 2 is 0.1
~10mm;
S4. the surface mount high temperature resistant top layer thermal isolation film 3 of described heat barrier foam layer 2.
In the step of S2, described high temperature resistant bottom thermal isolation film 1 is polyimides thermal isolation film, and thickness is 15mm;S3's
In step, described heat barrier foam layer 2 is heat-proof polyimide foamed materialss, and thickness is 10mm;In the step of S4, described resistance to height
Warm top layer thermal isolation film 3 is polyimides thermal isolation film, and thickness is 15mm.The mould of the moulded paper pulp product that the present embodiment is formed every
Thermosphere, learns according to actual test, and the temperature of high temperature resistant top layer thermal isolation film 3 is significantly lower than the temperature of die ontology, and the temperature difference reaches
More than 170 DEG C.
Present invention also offers a kind of mould heat insulation composite bed of paper mould, including for being attached at the resistance to of die surface
High temperature bottom thermal isolation film 1 and high temperature resistant top layer thermal isolation film 3, described high temperature resistant bottom thermal isolation film 1 and high temperature resistant top layer thermal isolation film 3 it
Between be provided with heat barrier foam layer 2, described heat barrier foam layer 2 be heat-proof polyimide foamed materialss, thickness be 0.1 ~ 10mm.This every
Hot composite bed is due to employing high temperature resistant bottom thermal isolation film 1, heat barrier foam layer 2 and high temperature resistant top layer thermal isolation film 3, its mold heat
In conduction, heat attenuation is carried out respectively by high temperature resistant bottom thermal isolation film 1, heat barrier foam layer 2 and high temperature resistant top layer thermal isolation film 3
Conductive performance, so that high temperature cannot conduct to outside, this heat-insulated composite bed not only can guarantee safe production, and permissible
Energy efficient, in sum, the structure of the heat-insulated composite bed of the present invention is simple, flexibly can be made according to different protection temperature
Make, can be effectively applied to the high temperature protection of all kinds of moulds, process is simple, easy to use.
In the technical program, described high temperature resistant bottom thermal isolation film 1, the material of high temperature resistant top layer thermal isolation film 3 are PET or poly-
Acid imide, thickness is 1 ~ 15mm, and described high temperature resistant bottom thermal isolation film 1, the surface of high temperature resistant top layer thermal isolation film 3 are all coated with pottery
Thermal insulation layer 4.Wherein, described thickness, according to different temperature requirement of shelter, can be accordingly increased or be reduced, typically be come
Say, when mold temperature is 200 DEG C, the thickness of high temperature resistant bottom thermal isolation film 1, high temperature resistant top layer thermal isolation film 3 can be set to 10mm,
At this moment, the temperature that high temperature resistant top layer thermal isolation film 3 records is 50 DEG C, and in addition described ceramic thermal barrier layer 4 is for silicon dioxide or by porous
Zirconium oxide is made.
Above content is only presently preferred embodiments of the present invention, for those of ordinary skill in the art, according to the present invention's
Thought, all will change in specific embodiments and applications, and this specification content should not be construed as to the present invention
Restriction.
Claims (8)
1. a kind of paper mould mould heat insulation method it is characterised in that:Comprise the steps:
S1. mould is needed heat-insulated position to be cleaned;
S2. high temperature resistant bottom thermal isolation film is pasted on heat-insulated position after cleaning;Described high temperature resistant bottom thermal isolation film is that PET is heat-insulated
Film;
S3. the surface mount heat barrier foam layer of described high temperature bottom thermal isolation film, the thickness of described heat barrier foam layer is 0.1 ~ 10mm;
Described heat barrier foam layer is heat-proof polyimide foamed materialss;
S4. the surface mount high temperature resistant top layer thermal isolation film of described heat barrier foam layer, described high temperature resistant top layer thermal isolation film is that PET is heat-insulated
Film;The surface of described high temperature resistant bottom thermal isolation film and high temperature resistant top layer thermal isolation film is all coated with ceramic thermal barrier layer;Described ceramic insulation
Layer is made up of silicon dioxide.
2. a kind of paper mould according to claim 1 mould heat insulation method it is characterised in that:Described high temperature resistant bottom
The high temperature resistant temperature of thermal isolation film and high temperature resistant top layer thermal isolation film is 200 ~ 250 DEG C.
3. a kind of paper mould according to claim 1 mould heat insulation method it is characterised in that:In the step of S2,
Heat-insulated position after high-temperature plastic is pasted on cleaning for the described high temperature resistant bottom thermal isolation film, the high temperature resistant temperature of described high-temperature plastic
Spend for 280 ~ 300 DEG C.
4. a kind of paper mould according to claim 1 mould heat insulation method it is characterised in that:Described heat barrier foam layer
Thickness is 0.1mm.
5. a kind of paper mould according to claim 1 mould heat insulation method it is characterised in that:Described heat barrier foam layer
Thickness is 5mm.
6. a kind of paper mould according to claim 1 mould heat insulation method it is characterised in that:Described heat barrier foam layer
Thickness is 10mm.
7. a kind of paper mould usage right requires the mould heat insulation composite bed that heat-insulating method described in 1 ~ 6 any one is formed, and it is special
Levy and be:Including for being attached at the high temperature resistant bottom thermal isolation film of die surface and high temperature resistant top layer thermal isolation film, described high temperature resistant
It is provided with heat barrier foam layer, described heat barrier foam layer is heat-proof polyimide between bottom thermal isolation film and high temperature resistant top layer thermal isolation film
Foamed materialss, thickness is 0.1 ~ 10mm, and described high temperature resistant bottom thermal isolation film, the material of high temperature resistant top layer thermal isolation film are PET.
8. a kind of paper mould according to claim 7 mould heat insulation composite bed it is characterised in that:Described high temperature resistant bottom
Layer thermal isolation film, the thickness of high temperature resistant top layer thermal isolation film are 1 ~ 15mm, and described high temperature resistant bottom thermal isolation film, high temperature resistant top layer are heat-insulated
The surface of film is all coated with ceramic thermal barrier layer.
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Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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DE4401692A1 (en) * | 1994-01-21 | 1995-07-27 | Kulmbacher Klimageraete | Heat insulation for electric storage heater |
KR100375295B1 (en) * | 2000-12-30 | 2003-03-10 | 득금물산(주) | Manufacturing method of multilayer-coated fabric having heat-accumulating and keeping-warm property |
JP2011211521A (en) * | 2010-03-30 | 2011-10-20 | Mitsubishi Electric Corp | Flying object radome |
JP2012001707A (en) * | 2010-06-17 | 2012-01-05 | Dengiken:Kk | Adhesive tape made of electrical insulation material |
SG11201400407YA (en) * | 2011-09-05 | 2014-05-29 | Polyplastics Co | Mold |
CN202718299U (en) * | 2012-03-15 | 2013-02-06 | 广东宝丽雅金属建材有限公司 | Novel heat insulation ring environment-friendly composite board |
CN203527714U (en) * | 2013-08-29 | 2014-04-09 | 界首市恒信塑料制品有限公司 | Heat insulation device on shoe sole forming mold |
CN203782927U (en) * | 2014-04-04 | 2014-08-20 | 江苏德丰建设集团有限公司 | Energy-saving environment-friendly wall body inner structure |
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Inventor after: Tan Wei Inventor after: Yuan Zhiqing Inventor before: Yuan Zhiqing |
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Address after: 523000 Building 2, 20 Dakang Road, Qiaotou town, Dongguan City, Guangdong Province Patentee after: Guangdong Huilin Packaging Technology Group Co.,Ltd. Address before: 523581, Guangdong City, Dongguan province Qiaotou village, the first industrial zone Patentee before: HUILIN PACKING DONGGUAN Co.,Ltd. |
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