CN104576897A - Fluorescent adhesive for COB encapsulation of LED - Google Patents
Fluorescent adhesive for COB encapsulation of LED Download PDFInfo
- Publication number
- CN104576897A CN104576897A CN201410773150.6A CN201410773150A CN104576897A CN 104576897 A CN104576897 A CN 104576897A CN 201410773150 A CN201410773150 A CN 201410773150A CN 104576897 A CN104576897 A CN 104576897A
- Authority
- CN
- China
- Prior art keywords
- parts
- powder
- fluorescent
- led
- powders
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
Abstract
The invention discloses a fluorescent adhesive for COB encapsulation of an LED. The fluorescent adhesive is formed by mixing the following components in parts: 80-100 parts of allochroic silicagel, 50-60 parts of waterproof silicagel, 3-5 parts of rare earth long-acting noctilucent powder, 2-3 parts of reflecting powder, 2-3 parts of colorful flash powder, 1-3 parts of aluminium paste, 3-5 parts of resin diamond, 10-15 parts of blue fluorescent powder and 10-12 parts of yellow fluorescent powder. As the materials, such as the noctilucent powder and the reflecting powder, are added into the fluorescent adhesive for COB encapsulation of the LED, the spatial chroma uniformity of the LED is great, and the color rendering of the LED is effectively improved. The fluorescent adhesive is particularly suitable for vehicle lamps and can reduce the difference between the scene seen by a driver and the actual object state, so that the driving safety is improved.
Description
Technical field
The present invention relates to the fluorescent glue of a kind of LED, particularly relate to a kind of fluorescent glue of COB packaged LED.
Background technology
At present, in LED industry, the fluorescent material that LED adopts realizes white light and mainly contains following several method: 1. on blue LED die, coating can by blue-light excited yellow fluorescent powder, and the blue light that LED chip sends and the gold-tinted that fluorescent material sends complementation form white light; 2. coating green and red fluorescence powder on blue LED die, the green glow that the blue light sent by chip and fluorescent material are sent and ruddiness compound obtain white light; 3. on purple light or ultraviolet leds chip, apply the fluorescent material of three primary colors or multiple color, utilize the long wave ultraviolet light of chip emission or purple light carry out excitated fluorescent powder and realize white light emission.In 3 kinds of methods, effective conversion efficiency of the 2nd kind of fluorescent material used is lower, especially the efficiency of red fluorescence powder needs raising by a relatively large margin, there is Similar Problems equally in the 3rd kind of method, and the high redness of conversion efficiency and green emitting phosphor mostly are sulfide systems, this kind of light-emitting phosphor poor stability, light decay is larger.
Summary of the invention
The present invention is the defect in order to overcome prior art, object is the fluorescent glue providing a kind of COB packaged LED, the fluorescent glue of this COB packaged LED adds the material such as luminescent powder, reflective powder in fluorescent glue, make the space chromacity uniformity of LED better, the color rendering of effective lifting LED, be very suitable for car light to use, the deviation that driver observes scene and actual object state can be reduced, thus improve traffic safety performance.
The technical solution adopted for the present invention to solve the technical problems is: a kind of fluorescent glue of COB packaged LED, mixed by the component of following number and form: 80-100 part discolour silica gel, 50-60 part is water-fast silica gel, 3-5 part durable-acting rare-earth luminescent powder, the reflective powder of 2-3 part, 2-3 part seven colour flashing powder, 1-3 part aluminum paste, 3-5 part resin diamond, 10-15 part blue colour fluorescent powder, 10-12 part yellow fluorescent powder.
Further, be made up of the component of following number: 80 parts of discolour silica gels, 50 parts of water-fast silica gel, 3 parts of durable-acting rare-earth luminescent powders, 2 parts of reflective powder, 2 part of seven colour flashing powder, 1 part of aluminum paste, 3 parts of resin diamonds, 10 parts of blue colour fluorescent powders, 10 parts of yellow fluorescent powders.
Or, be made up of the component of following number: 100 parts of discolour silica gels, 60 parts of water-fast silica gel, 5 parts of durable-acting rare-earth luminescent powders, 3 parts of reflective powder, 3 part of seven colour flashing powder, 3 parts of aluminum pastes, 5 parts of resin diamonds, 15 parts of blue colour fluorescent powders, 12 parts of yellow fluorescent powders.
In sum, the fluorescent glue of COB packaged LED of the present invention adds the material such as luminescent powder, reflective powder in fluorescent glue, make the space chromacity uniformity of LED better, the color rendering of effective lifting LED, be very suitable for car light to use, the deviation that driver observes scene and actual object state can be reduced, thus improve traffic safety performance.
Embodiment
Embodiment 1
The fluorescent glue of a kind of COB packaged LED described by the embodiment of the present invention 1, mixed by the component of following number and form: 80 parts of discolour silica gels, 50 parts of water-fast silica gel, 3 parts of durable-acting rare-earth luminescent powders, 2 parts of reflective powder, 2 part of seven colour flashing powder, 1 part of aluminum paste, 3 parts of resin diamonds, 10 parts of blue colour fluorescent powders, 10 parts of yellow fluorescent powders.
Embodiment 2
The fluorescent glue of a kind of COB packaged LED described by the embodiment of the present invention 2, mixed by the component of following number and form: 100 parts of discolour silica gels, 60 parts of water-fast silica gel, 5 parts of durable-acting rare-earth luminescent powders, 3 parts of reflective powder, 3 part of seven colour flashing powder, 3 parts of aluminum pastes, 5 parts of resin diamonds, 15 parts of blue colour fluorescent powders, 12 parts of yellow fluorescent powders.
Above-described embodiment is only some preferred embodiments of the present invention, not limits the scope of the invention according to this, therefore: all various equivalence changes done according to principle of the present invention etc., all should be encompassed within protection scope of the present invention.
Claims (3)
1. the fluorescent glue of a COB packaged LED, it is characterized in that, mixed by the component of following number and form: 80-100 part discolour silica gel, 50-60 part is water-fast silica gel, 3-5 part durable-acting rare-earth luminescent powder, the reflective powder of 2-3 part, 2-3 part seven colour flashing powder, 1-3 part aluminum paste, 3-5 part resin diamond, 10-15 part blue colour fluorescent powder, 10-12 part yellow fluorescent powder.
2. the fluorescent glue of a kind of COB packaged LED according to claim 1, it is characterized in that, be made up of the component of following number: 80 parts of discolour silica gels, 50 parts of water-fast silica gel, 3 parts of durable-acting rare-earth luminescent powders, 2 parts of reflective powder, 2 part of seven colour flashing powder, 1 part of aluminum paste, 3 parts of resin diamonds, 10 parts of blue colour fluorescent powders, 10 parts of yellow fluorescent powders.
3. the fluorescent glue of a kind of COB packaged LED according to claim 1, it is characterized in that, be made up of the component of following number: 100 parts of discolour silica gels, 60 parts of water-fast silica gel, 5 parts of durable-acting rare-earth luminescent powders, 3 parts of reflective powder, 3 part of seven colour flashing powder, 3 parts of aluminum pastes, 5 parts of resin diamonds, 15 parts of blue colour fluorescent powders, 12 parts of yellow fluorescent powders.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410773150.6A CN104576897A (en) | 2014-12-16 | 2014-12-16 | Fluorescent adhesive for COB encapsulation of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410773150.6A CN104576897A (en) | 2014-12-16 | 2014-12-16 | Fluorescent adhesive for COB encapsulation of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104576897A true CN104576897A (en) | 2015-04-29 |
Family
ID=53092507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410773150.6A Pending CN104576897A (en) | 2014-12-16 | 2014-12-16 | Fluorescent adhesive for COB encapsulation of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104576897A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107579145A (en) * | 2017-08-09 | 2018-01-12 | 东莞市索菲电子科技有限公司 | A kind of LED fluorescent powder formula and preparation method thereof |
| CN112048204A (en) * | 2020-09-18 | 2020-12-08 | 刘成禹 | Energy-storage luminous paint, reflective cloth and preparation process |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1275814A (en) * | 2000-06-27 | 2000-12-06 | 复旦大学 | Packaging method for organic electroluminescence device |
| CN1674309A (en) * | 2004-03-23 | 2005-09-28 | 杨越培 | A long afterglow diode and producing method |
| CN101787273A (en) * | 2009-12-24 | 2010-07-28 | 安徽泽润光电有限公司 | Light-emitting diode (LED) fluorescent glue |
| CN103280513A (en) * | 2013-05-31 | 2013-09-04 | 广州众恒光电科技有限公司 | LED capable of secondarily exciting light and packaging technology thereof |
| CN103682053A (en) * | 2013-12-04 | 2014-03-26 | 广西玖典电子新材料有限公司 | Blue fluorescent adhesive for LED |
| CN103746061A (en) * | 2013-12-18 | 2014-04-23 | 奇瑞汽车股份有限公司 | Fluorescent glue for COB-packaged LEDs |
| CN103811638A (en) * | 2012-11-06 | 2014-05-21 | 江苏稳润光电有限公司 | White light led |
| CN103985807A (en) * | 2013-02-07 | 2014-08-13 | 罗容 | Inorganic substrate and manufacturing method thereof |
-
2014
- 2014-12-16 CN CN201410773150.6A patent/CN104576897A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1275814A (en) * | 2000-06-27 | 2000-12-06 | 复旦大学 | Packaging method for organic electroluminescence device |
| CN1674309A (en) * | 2004-03-23 | 2005-09-28 | 杨越培 | A long afterglow diode and producing method |
| CN101787273A (en) * | 2009-12-24 | 2010-07-28 | 安徽泽润光电有限公司 | Light-emitting diode (LED) fluorescent glue |
| CN103811638A (en) * | 2012-11-06 | 2014-05-21 | 江苏稳润光电有限公司 | White light led |
| CN103985807A (en) * | 2013-02-07 | 2014-08-13 | 罗容 | Inorganic substrate and manufacturing method thereof |
| CN103280513A (en) * | 2013-05-31 | 2013-09-04 | 广州众恒光电科技有限公司 | LED capable of secondarily exciting light and packaging technology thereof |
| CN103682053A (en) * | 2013-12-04 | 2014-03-26 | 广西玖典电子新材料有限公司 | Blue fluorescent adhesive for LED |
| CN103746061A (en) * | 2013-12-18 | 2014-04-23 | 奇瑞汽车股份有限公司 | Fluorescent glue for COB-packaged LEDs |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107579145A (en) * | 2017-08-09 | 2018-01-12 | 东莞市索菲电子科技有限公司 | A kind of LED fluorescent powder formula and preparation method thereof |
| CN107579145B (en) * | 2017-08-09 | 2019-08-06 | 东莞市索菲电子科技有限公司 | A kind of LED fluorescent powder formula and preparation method thereof |
| CN112048204A (en) * | 2020-09-18 | 2020-12-08 | 刘成禹 | Energy-storage luminous paint, reflective cloth and preparation process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102339937B (en) | White-light LED (Light-emitting Diode) manufactured by utilizing quantum-dot fluorescent powder and manufacturing method thereof | |
| CN101872825B (en) | Novel method for preparing high-power white LED with low color temperature and high color rendering property | |
| CN204029800U (en) | White light emitting device | |
| CN103474558A (en) | LED packaging adhesive dispensing technology and LED chip packaging structure thereof | |
| CN104868041A (en) | Full-carbon-based quantum dot mixed fluorescent powder LED and preparation method thereof | |
| CN102760821B (en) | A kind of white LED light source | |
| CN104576897A (en) | Fluorescent adhesive for COB encapsulation of LED | |
| CN104498031B (en) | A kind of phosphate yellow fluorescent powder and preparation method thereof for white light LEDs | |
| CN103236483A (en) | Light emitting diode encapsulation structure and light emitting diode encapsulation method | |
| JP5182399B2 (en) | White light emitting device | |
| CN103746061B (en) | A kind of fluorescent glue of COB encapsulation LED | |
| CN103855288A (en) | Light emitting component and light emitting device composed of light emitting component | |
| CN105789416A (en) | Multilayer three-dimensional grid light-emitting layer preparation technology and LED light-emitting device | |
| WO2007001117A2 (en) | White light emitting diode based on mixing of tri-color phosphors | |
| CN102916005A (en) | High-color-rendering LED light source based on green chip compensation | |
| CN108767096A (en) | Preparation method of L ED lamp fluorescent powder layer | |
| CN109768151B (en) | Multi-color LED for illumination and display and preparation method thereof | |
| CN202855796U (en) | Transparent ceramic white light LED packaging structure | |
| CN209183572U (en) | A kind of LED light source | |
| JP2017117853A5 (en) | ||
| CN103811628A (en) | High-color rendering index white-light LED and manufacturing method thereof | |
| CN1953216A (en) | A manufacture method for low color temperature white light LED | |
| CN103137835A (en) | Method of enhancing color rendering index of a white led | |
| CN103855287B (en) | A kind of light-emitting device and the luminescent device with the light-emitting device | |
| CN104576895A (en) | Fluorescent glue capable of packaging white light LEDs |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150429 |
|
| WD01 | Invention patent application deemed withdrawn after publication |