CN104576578A - 包括包含集成电路芯片的堆叠电子器件的电子系统 - Google Patents

包括包含集成电路芯片的堆叠电子器件的电子系统 Download PDF

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Publication number
CN104576578A
CN104576578A CN201410497515.7A CN201410497515A CN104576578A CN 104576578 A CN104576578 A CN 104576578A CN 201410497515 A CN201410497515 A CN 201410497515A CN 104576578 A CN104576578 A CN 104576578A
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Prior art keywords
substrate wafer
electrical connection
electronic device
chip
connection network
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CN201410497515.7A
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R·科菲
R·布雷希尼亚克
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STMicroelectronics Grenoble 2 SAS
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STMicroelectronics Grenoble 2 SAS
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Publication of CN104576578A publication Critical patent/CN104576578A/zh
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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Abstract

一种电子系统包括第一集成电路芯片和第二集成电路芯片。第一衬底晶片被定位于第一集成电路芯片与第二集成电路芯片之间并且被配置有用于与第一集成电路芯片形成电连接的第一连接网络。被配置有用于与第二集成电路芯片形成电连接的第二连接网络的第二衬底晶片被定位成面向第一衬底晶片。第一衬底晶片和第二衬底晶片的连接网络通过连接结构电连接。包括第三连接网络的第三衬底晶片与第一集成电路芯片热接触并且通过其它连接结构电连接至第一衬底晶片的第一连接网络。其它连接结构可以使用另一衬底晶片来形成。

Description

包括包含集成电路芯片的堆叠电子器件的电子系统
优先权要求
本申请要求于2013年10月15日提交的第1360006号法国专利申请的优先权，其公开内容通过引用并入本文。
技术领域
本发明涉及微电子领域。
背景技术
构造包括堆叠于彼此之上并且彼此电连接的电子器件的电子系统是已知的，每个电子器件包括至少一个集成电路芯片。
电子器件的堆叠尤其具有改进电连接的性能以及减小尺寸的优点。然而，在一些情况下，出现了一些集成电路芯片产生热，并且所产生的热使其它集成电路芯片变热，并且随后使其它集成电路芯片的性能退化。这尤其是当第一电子器件包括处理器芯片并且堆叠在第一电子器件上的第二电子器件包括存储器芯片时的情况，该处理器芯片产生热，该存储器芯片的功能尤其在其温度升高时退化。
在本文中所描述的情形成为提高电子系统的性能的障碍，尤其是程序执行速度。然而，当前存在于电子系统所需的性能和它们的尺寸之间进行折中的情况并不令人满意，尤其是在手持设备(诸如移动电话)领域。
发明内容
一个实施例提供了一种电子系统，其包括至少一个第一集成电路芯片和至少一个第二集成电路芯片，至少一个衬底晶片在至少一个第一集成电路芯片和至少一个第二集成电路芯片之间延伸，以及另一衬底晶片与芯片中的与衬底晶片有关的芯片被布置在相同侧。
所提出的电子系统可以包括：第一电子器件，包括第一衬底晶片，第一衬底晶片设置有第一电连接网络并且在一个面下方承载连接至该第一电连接网络的至少一个第一集成电路芯片；第二电子器件，包括第二衬底晶片，第二衬底晶片设置有第二电连接网络并且承载连接至该第二电连接网络的至少一个第二集成电路芯片；以及第三电子器件，包括第三衬底晶片，第三衬底晶片设置有第三电连接网络。
第一电子器件和第二电子器件可以在使得第一衬底晶片和第二衬底晶片在第一芯片和第二芯片之间延伸的位置被布置在彼此上方。
第三衬底晶片可以在与第一芯片相同侧被布置在第一电子器件上方。
电连接元件可以介于第一电子器件与第二电子器件之间，并且连接第一电连接网络和第二电连接网络。
电连接元件可以介于第一电子器件与第三衬底之间，并且可以连接第一电连接网络和第三电连接网络。
第三电连接网络可以包括外部电连接焊盘，外部电连接焊盘被布置在第三衬底晶片的面上。
导热材料层可以介于第一芯片和第三衬底晶片之间。
介于第一电子器件和第三衬底之间的电连接元件可以包括设置有电连接网络的衬底晶片，该电连接网络连接第一电连接网络和第三电连接网络。
第三电子器件的衬底晶片可以包括位于第一电子器件的芯片的区域中的金属过孔。
附图说明
现在将借由非限制性示例来描述根据本发明的具体实施例的电子系统，并且该电子系统由附图图示出，在附图中：
图1呈现了电子系统的截面；以及
图2以截面呈现了图1的电子系统的备选实施例。
具体实施方式
如图1中所示，电子系统1包括堆叠的第一电子器件2、第二电子器件3和补充的第三电子器件4，第二电子器件3被布置在电子器件2的一个面2a上方，第三电子器件4被布置在电子器件2的相对面2b上方。
第一电子器件2包括由绝缘材料制成的第一衬底晶片5，第一衬底晶片5设置有用于将一个面电连接至另一个面的第一金属网络6，第一金属网络6可选地包括由金属过孔连接的一个或多个集成的金属化层。
第一电子器件2包括至少一个集成电路芯片7，至少一个集成电路芯片7借由电连接元件8被安装在衬底晶片5的面2b的中心部分上方，电连接元件8将芯片7电连接至第一电连接网络6的焊盘6a。绝缘材料9介于衬底晶片5的面2b与芯片7之间，以用于包封电连接元件8。
第二电子器件3包括由绝缘材料制成的第二衬底晶片10，第二衬底晶片10具有与衬底晶片5的面2a相邻的一个面10a以及相对的面10b，并且第二衬底晶片10设置有用于将一个面电连接至另一个面的第二金属网络11，第二金属网络11可选地包括用于电连接的一个或多个集成的金属层。
第二电子器件3包括至少一个集成电路芯片12，至少一个集成电路芯片12例如通过粘合剂被固定在衬底晶片10的面10b的中心部分上，并且其借由电连接线13被连接至第二金属电连接网络11。芯片12和电连接线13被嵌入在包封材料14中，包封材料14设置在衬底晶片10的面10b上。
第二电子器件3借由金属电连接元件15(诸如焊珠)被安装在第一电子器件2上，电连接元件15电连接第一电连接网络6的焊盘6b与第二电连接网络11的焊盘11a。
第三电子器件4包括由绝缘材料制成的第三衬底晶片16，其具有与衬底晶片5的面2b相邻的一个面16a(使得芯片7紧邻电子器件4的衬底晶片16延伸)以及相对的面16b，并且其设置有用于将一个面电连接至另一个面的第三金属网络17，第三金属网络17可选地包括由金属过孔连接的一个或多个集成的金属化层。
第三电子器件4借由金属电连接元件18(诸如焊珠)被安装在第一电子器件2上，电连接元件18被布置在芯片12周围并且电连接第一电连接网络6的焊盘6c与第三电连接网络17的焊盘17a。
电子系统1可以在使得衬底晶片16的面16b与印刷电路板19相邻的位置借由金属电连接元件20(诸如焊珠)被安装印刷电路板19上，金属电连接元件20电连接第三电连接网络17的外部电连接焊盘17b与印刷电路板19的焊盘19a。
根据一个备选实施例，被布置在电子器件2的衬底晶片5与电子器件4的衬底晶片16之间的芯片7可以与该衬底晶片16的面16a接触。
根据一个备选实施例，芯片7可以距衬底晶片16的面16a较短距离，并且导热材料的层21(诸如热粘合剂)可以介于芯片7与衬底晶片16的面16a之间。
通过以上描述可知，衬底晶片5和10在芯片7和12之间延伸，芯片7和12因此彼此相距一定距离并且通过衬底晶片5、衬底晶片10以及分隔开这些衬底晶片5和10的空间而分隔开，并且衬底晶片16构成用于安装堆叠的第一和第二电子器件2和3的中介装置以及用于电连接至印刷电路板19的中介装置。
芯片7可以是发出热的处理器芯片，并且芯片12可以是存储器芯片。
借由示例在上文中描述的器件具有以下优点。
由芯片7产生的热优选地在背离芯片12的位置的一侧、可选地经由导热层21扩散到衬底晶片16中，以及扩散到金属电连接网络17中，随后经由电连接元件20扩散到印刷电路板19中。有利地，电子器件4的衬底晶片16可以设置有从一个面到另一面的、特定的直接或间接金属过孔17c，金属过孔17c位于芯片7的区域中并且可选地位于芯片7的热区域的区域中，以便有助于热从芯片7向印刷电路板19传送。这些金属过孔17c可以可选地形成电连接网络17的一部分。
由芯片7产生的热在被排放到外界之前也扩散到分隔开电子器件2和电子器件3的空间中，扩散到分隔开电子器件2和电子器件4的空间中，以及扩散到分隔开电子器件4和印刷电路板19的空间中。
因此，芯片7被冷却，并且由电子器件2的芯片7产生的热在电子器件3的芯片12的方向上的扩散受限，使得芯片12被保护以免其温度的任何过度升高。
从以上描述可知，设置有金属网络17(包括过孔17c)的第三电子器件4与设置有芯片7和12的电子器件2和3一起构成用于优选的收集和用于向印刷电路板19传送由与其紧邻的电子器件2的芯片7产生的热的中介装置，以及用于将电子器件2和3电连接至这一印刷电路板19的中介装置。
根据在图2中所示的备选实施例，中介电连接元件18被省略并且利用中介衬底晶片22替换，中介衬底晶片22被放置在衬底晶片5和衬底晶片16之间并且距它们一定距离，中介衬底晶片22设置有用于将一个面电连接至另一个面的金属网络23，中介衬底晶片22在一方面借由电连接元件24电连接至电连接网络6，并且在另一方面借由电连接元件25电连接至电连接网络17。
由于电连接网络24和25的截面小于之前示例的电连接焊珠18的截面的事实，有可能增加它们的密度并且因此增加在电连接网络6与电连接网络17之间的电连接的数目。
本发明并不限于如上所述的示例。具体而言，第二电子器件3的芯片12可以与电子器件2被布置在相同侧。芯片12可以借由金属电连接元件被安装在衬底晶片10上并且被连接至衬底晶片10。电子器件2可以包括包围芯片7的绝缘材料层，在绝缘材料中布置开口以用于放置电连接元件18。许多其它备选实施例在不背离本发明的范围的情况下是可能的。

Claims (18)

1.一种电子系统，包括：
第一集成电路芯片；
第二集成电路芯片；
第一衬底晶片，所述第一衬底晶片在所述第一集成电路芯片与所述第二集成电路芯片之间延伸；以及
第二衬底晶片，被布置为面向所述第一衬底晶片并且与所述第一衬底晶片相邻，以在所述第一集成电路芯片与所述第二集成电路芯片之间延伸。
2.根据权利要求1所述的系统，其中所述第一集成电路芯片和所述第一衬底晶片形成第一电子器件，所述第一电子器件包括在所述第一衬底晶片内的第一电连接网络，并且其中所述第二集成电路芯片和所述第二衬底晶片形成第二电子器件，所述第二电子器件包括在所述第二衬底晶片内的第二电连接网络。
3.根据权利要求2所述的系统，还包括：
第一电连接元件，介于所述第一电子器件与所述第二电子器件之间，并且电连接所述第一电连接网络和所述第二电连接网络。
4.根据权利要求2所述的系统，还包括第三电子器件，所述第三电子器件包括第三衬底晶片，所述第三衬底晶片设置有第三电连接网络。
5.根据权利要求4所述的系统，还包括：
第二电连接元件，介于所述第一电子器件与所述第三衬底晶片之间，并且电连接所述第一电连接网络和所述第三电连接网络。
6.根据权利要求4所述的系统，其中所述第三电子器件还包括外部电连接焊盘，所述外部电连接焊盘被布置在所述第三衬底晶片的与所述第一集成电路器件相对的面上。
7.根据权利要求4所述的系统，其中所述第一集成电路芯片与所述第三衬底晶片的表面热接触。
8.根据权利要求7所述的系统，还包括将所述第一集成电路芯片耦合至所述第三衬底晶片的所述表面的热粘合剂。
9.根据权利要求7所述的系统，其中所述第三衬底晶片包括金属过孔，所述金属过孔从所述第三衬底晶片的与所述第一集成电路芯片热接触的所述表面延伸通过第三衬底晶片。
10.根据权利要求4所述的系统，其中所述第二电连接元件包括：设置有另一电连接网络的另一衬底晶片，所述另一电连接网络电连接所述第一电连接网络与所述第三电连接网络。
11.一种电子系统，包括：
第一电子器件，包括第一衬底晶片，所述第一衬底晶片设置有第一电连接网络并且在其一个表面下方承载电连接至所述第一电连接网络的第一集成电路芯片；
第二电子器件，包括第二衬底晶片，所述第二衬底晶片设置有第二电连接网络并且承载电连接至所述第二电连接网络的第二集成电路芯片；
第三电子器件，包括第三衬底晶片，所述第三衬底晶片设置有第三电连接网络；
其中所述第一电子器件和所述第二电子器件在使得所述第一衬底晶片和所述第二衬底晶片二者在所述第一集成电路芯片与所述第二集成电路芯片之间延伸的位置被布置在彼此上方；
其中所述第三衬底晶片被布置为使得所述第一集成电路芯片在所述第一衬底晶片与所述第三衬底晶片之间；
第一电连接元件，介于所述第一电子器件与所述第二电子器件之间，并且电连接所述第一电连接网络和所述第二电连接网络；
第二电连接元件，介于所述第一电子器件与所述第三衬底晶片之间，并且电连接所述第一电连接网络和所述第三电连接网络；以及
其中所述第三电连接网络包括外部电连接焊盘，所述外部电连接焊盘被布置在所述第三衬底晶片的与所述第一集成电路器件相对的面上。
12.根据权利要求11所述的系统，其中导热材料层介于所述第一集成电路芯片与所述第三衬底晶片之间。
13.根据权利要求11所述的系统，其中介于所述第一电子器件与所述第三衬底之间的所述第二电连接元件包括：设置有另一电连接网络的另一衬底晶片，所述另一电连接网络电连接所述第一电连接网络与所述第三电连接网络。
14.根据权利要求11所述的系统，其中所述第三电子器件的所述衬底晶片包括位于所述第一电子器件的所述芯片的区域中的金属过孔。
15.一种系统，包括：
第一电子器件，包括第一衬底晶片，所述第一衬底晶片设置有第一电连接网络并且在其一个表面下方承载电连接至所述第一电连接网络的第一集成电路芯片；
第二电子器件，包括第二衬底晶片，所述第二衬底晶片设置有第二电连接网络；
其中所述第二衬底晶片的表面与所述第一集成电路芯片热接触；
电连接元件，介于所述第一电子器件与所述第二衬底晶片之间，并且电连接所述第一电连接网络和所述第二电连接网络；
其中所述第二电连接网络包括外部电连接焊盘，所述外部电连接焊盘被布置在所述第二衬底晶片的与所述第一集成电路器件相对的面上。
16.根据权利要求15所述的系统，还包括将所述第一集成电路芯片耦合至所述第二衬底晶片的所述表面的热粘合剂。
17.根据权利要求15所述的系统，其中介于所述第一电子器件与所述第二衬底晶片之间的所述电连接元件包括：设置有另一电连接网络的另一衬底晶片，所述另一电连接网络电连接所述第一电连接网络与所述第二电连接网络。
18.根据权利要求15所述的系统，其中所述第二衬底晶片包括金属过孔，所述金属过孔从所述第二衬底晶片的与所述第一集成电路芯片热接触的所述表面延伸通过所述第二衬底晶片。
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