CN104574933A - Remote controller and control method thereof - Google Patents
Remote controller and control method thereof Download PDFInfo
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- CN104574933A CN104574933A CN201510024961.0A CN201510024961A CN104574933A CN 104574933 A CN104574933 A CN 104574933A CN 201510024961 A CN201510024961 A CN 201510024961A CN 104574933 A CN104574933 A CN 104574933A
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Abstract
The invention provides a remote controller, which comprises a touch key, an approach module, a microcontroller, a processing circuit, an LED display module, a backlight module and an infrared transmitting module, wherein the approach module comprises a first capacitance coil and a second capacitance coil; the first capacitance coil, the second capacitance coil and the touch key all are connected with the processing circuit; the processing circuit is connected with the microcontroller; and the LED display module, the backlight module and the infrared transmitting module are all connected with the microcontroller. The invention further provides a control method of the remote controller. The remote controller is simple in structure and low in fabrication cost; and in addition, misoperation can be avoided.
Description
Technical field
The present invention relates to bathroom technical field, particularly relate to a kind of telepilot and control method thereof.
Background technology
At present, in sanitary ware industry, telepilot all wants hand to go touching just can wake its work up; Particularly when night, when hand goes touching time, when there is no backlight, false triggering action can be easy to.Therefore present patent application introduces short distance close to sensing solutions.When hand will remove touch remote controller time, reach within the scope of certain distance, telepilot backlight can light, and avoids maloperation, and introduces some gesture operations, performs corresponding action according to gesture, can more handled easily by gesture.
Disclose in prior art " a kind of novel telepilot ", see that publication number is 203465840U; Publication date is: the Chinese patent of 2014-03-05, it comprise microprocessor, for illuminate display screen backlight, for illuminate lettering on remote controller key button LED, perception telepilot work time residing environment intensity of illumination light intensity sensor, for responding to the human body proximity sensor of human body, described microprocessor controls described backlight and described button LED according to the signal of the signal of described light intensity sensor and described human body proximity sensor.This utility model makes user clearly can identify all information on telepilot, and power consumption is little, and use cost is low, and environmental protection.But this utility model can not prevent the situation of maloperation, and the implementation of present patent application is not identical with this utility model yet.This patent is that the capacitance variations by judging capacitor shield coil has judged whether that hand is close, can prevent human body from the side through causing false triggering, to save energy; And documents passes through human body proximity sensor.
Summary of the invention
One of the technical problem to be solved in the present invention, is to provide a kind of telepilot, and structure is simple, and cost of manufacture is low, in addition, can avoid the situation of maloperation.
One of problem of the present invention is achieved in that a kind of telepilot, comprises touch key-press, close to module, microcontroller, treatment circuit, LED display module, backlight module and infrared transmission module; Describedly comprise the first capacitor shield coil and the second capacitor shield coil close to module; Described first capacitor shield coil, the second capacitor shield coil, touch key-press are all connected with treatment circuit, and described treatment circuit is connected with microcontroller, and described LED display module, backlight module, infrared transmission module are all connected with microcontroller; Described first capacitor shield coil and the second capacitor shield coil induction whether have hand or human body close, then the capacitance of the first capacitor shield coil and the second capacitor shield coil changes; Described touch key-press senses finger touch button, then capacitance sends change; Described treatment circuit detects that the capacitance of the first capacitor shield coil, the second capacitor shield coil or touch key-press changes, then treatment circuit processes signal, and its result is sent to microcontroller; Described these data of microcontroller process, response has hand to light backlight module close to function or controls corresponding LED display module and infrared transmission module operation.
Further, described treatment circuit comprises chip IC 1, resistance R25, resistance R26, resistance R27, resistance R28, resistance R29, resistance R30, resistance R33, resistance R34, electric capacity C11, electric capacity C12, electric capacity C13 and electric capacity C14; 3rd pin of described chip IC 1 is connected with the 4th pin through resistance R33, resistance R34; The 5th of chip IC 1 is drawn foot meridian capacitor C12 and is connect signal ground; The 6th of chip IC 1 is drawn foot meridian capacitor C13 and is connect signal ground; The 7th of chip IC 1 is drawn foot meridian capacitor C14 and is connect signal ground; Described resistance R26 and resistance R25 connects and is arranged between the 23rd pin of chip IC 1 and the 24th pin; Described electric capacity C11 is connected with resistance R25; Described resistance R27, resistance R28 respectively corresponding the 22nd pin with chip IC 1, the 21st pin are connected; Described resistance R29 and resistance R30 is arranged between the 22nd pin of chip IC 1 and the 21st pin after connecting.
Further, described touch key-press utilizes the copper mold of circuit board to be made into button disk; This touch key-press comprises button PAD1, button PAD2, button PAD3, button PAD4, button PAD6, button PAD8, button PAD9, button PAD10, button PAD11, button PAD12, button PAD13; Described button PAD1 is connected with the 19th pin of chip IC 1 through resistance R14; Described button PAD2 is connected with the 18th pin of chip IC 1 through resistance R15; Described button PAD3 is connected with the 17th pin of chip IC 1 through resistance R16; Described button PAD4 is connected with the 16th pin of chip IC 1 through resistance R17; Described button PAD6 is connected with the 15th pin of chip IC 1 through resistance R18; Described button PAD8 is connected with the 14th pin of chip IC 1 through resistance R19; Described button PAD9 is connected with the 13rd pin of chip IC 1 through resistance R20; Described button PAD10 is connected with the 12nd pin of chip IC 1 through resistance R21; Described button PAD11 is connected with the 11st pin of chip IC 1 through resistance R22; Described button PAD12 is connected with the 10th pin of chip IC 1 through resistance R23; Described button PAD13 is connected with the 20th pin of chip IC 1 through resistance R24.
Further, described first capacitor shield coil utilizes the copper mold of circuit board to make circle formation capacitor shield coil in the left-half of circuit board, and the second capacitor shield coil utilizes the copper mold of circuit board to make circle formation capacitor shield coil at the right half part of circuit board; Described first capacitor shield coil is connected with the 1st pin of chip IC 1 through resistance R31; Second capacitor shield coil is connected with the 2nd pin of chip IC 1 through resistance R32.
Further, described microcontroller comprises: chip U1, electric capacity C1, electric capacity C4, electric capacity C5, resistance R1 and ICSP interface; 14th, 15 pins of described chip U1 are corresponding to be respectively connected with 22,21 pins of chip IC 1; 1st pin of described chip U1 is connected with resistance R1 and electric capacity C1 respectively, and this electric capacity C1 connects signal ground; Described electric capacity C4 is connected with the 20th pin of chip U1 with after C5 parallel connection; 1st, 4,5 pins of described ICSP interface respectively corresponding and chip U1 the 1st, 28,27 pins are connected.
Further, described LED display module comprises LED 1, LED 2 and LED 3; Described LED 1 is connected with the 2nd pin of chip U1 through resistance R7, and described LED 2 is connected with the 3rd pin of chip U1 through resistance R8, and described LED 3 is connected with the 4th pin of chip U1 through resistance R9; Described backlight module comprises LED 4, LED 5, LED 6 and LED 7; Described LED 4 is connected with the 5th pin of chip U1 through resistance R10; Described LED 5 is connected with the 6th pin of chip U1 through resistance R11; Described LED 6 is connected with the 7th pin of chip U1 through resistance R12; Described LED 7 is connected with the 10th pin of chip U1 through resistance R13; Described infrared transmission module comprises infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3, resistance R2, resistance R3, resistance R4, resistance R5, resistance R6, electric capacity C3 and triode Q1; Described infrared transmitting tube IRD1 is connected with the collector of triode Q1 through resistance R2; Described infrared transmitting tube IRD2 is connected with the collector of triode Q1 through resistance R3; Described infrared transmitting tube IRD3 is connected with the collector of triode Q1 through resistance R4; Described electric capacity C3 is connected with infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3 respectively; Between the emitter that described resistance R6 is parallel to triode Q1 and base stage; The base stage of described triode Q1 is connected with the 13rd pin of chip U1 through resistance R5.
The technical problem to be solved in the present invention two, is to provide a kind of control method for remote controller, and structure is simple, and cost of manufacture is low, in addition, can avoid the situation of maloperation.
Two of problem of the present invention is achieved in that a kind of control method for remote controller, and described telepilot comprises touch key-press, close to module, microcontroller, treatment circuit, LED display module, backlight module and infrared transmission module; Describedly comprise the first capacitor shield coil and the second capacitor shield coil close to module; Described method is specially:
Hand or human body are when the first capacitor shield coil or the second capacitor shield coil, distance is in default D cm, first capacitor shield coil or the second capacitor shield coil respond in one's hands or human body is close, treatment circuit detects that the capacitance of the first capacitor shield coil or the second capacitor shield coil changes, treatment circuit carries out signal transacting, and its result is sent to microcontroller, microcontroller result data, response has hand or human body proximity function, then lights backlight module;
Hand or human body distance the first capacitor shield coil and the second capacitor shield coil beyond D cm time, the capacitance of the first capacitor shield coil and the second capacitor shield coil returns to original state again, treatment circuit detects that the capacitance of two capacitor shield coils returns to initial value, treatment circuit carries out signal transacting, its result is sent to microcontroller by treatment circuit, microcontroller result data, and after waiting for certain setting-up time T, backlight module is closed, enters dormant state;
When finger removes touch key-press, the capacitance of touch key-press disk changes, treatment circuit collects capacitance signal and changes, treatment circuit carries out signal transacting, its result is sent to microcontroller by treatment circuit, microcontroller is through result data, and then the corresponding LED display module of microprocessor controls and infrared transmission module operate;
Hand is overhead within distance telepilot D cm, when carrying out gesture paddling, the capacitance of the first capacitor shield coil can first change, then the capacitance of the second capacitor shield coil changes, treatment circuit detects the signal change procedure of the first capacitor shield coil and the second capacitor shield coil, this signal of processing circuit processes, and its result is sent to microcontroller by treatment circuit, microcontroller is through these data of process, and then the corresponding LED display module of microprocessor controls and infrared transmission module operate.
Further, described gesture paddling comprises slip from left to right, gesture motion from right to left, the clockwise gesture motion through two capacitor shield coils or the counterclockwise gesture motion through two capacitor shield coils.
Further, described treatment circuit comprises chip IC 1, resistance R25, resistance R26, resistance R27, resistance R28, resistance R29, resistance R30, resistance R33, resistance R34, electric capacity C11, electric capacity C12, electric capacity C13 and electric capacity C14; 3rd pin of described chip IC 1 is connected with the 4th pin through resistance R33, resistance R34; The 5th of chip IC 1 is drawn foot meridian capacitor C12 and is connect signal ground; The 6th of chip IC 1 is drawn foot meridian capacitor C13 and is connect signal ground; The 7th of chip IC 1 is drawn foot meridian capacitor C14 and is connect signal ground; Described resistance R26 and resistance R25 connects and is arranged between the 23rd pin of chip IC 1 and the 24th pin; Described electric capacity C11 is connected with resistance R25; Described resistance R27, resistance R28 respectively corresponding the 22nd pin with chip IC 1, the 21st pin are connected; Described resistance R29 and resistance R30 is arranged between the 22nd pin of chip IC 1 and the 21st pin after connecting.
Further, described touch key-press utilizes the copper mold of circuit board to be made into button disk; This touch key-press comprises button PAD1, button PAD2, button PAD3, button PAD4, button PAD6, button PAD8, button PAD9, button PAD10, button PAD11, button PAD12, button PAD13; Described button PAD1 is connected with the 19th pin of chip IC 1 through resistance R14; Described button PAD2 is connected with the 18th pin of chip IC 1 through resistance R15; Described button PAD3 is connected with the 17th pin of chip IC 1 through resistance R16; Described button PAD4 is connected with the 16th pin of chip IC 1 through resistance R17; Described button PAD6 is connected with the 15th pin of chip IC 1 through resistance R18; Described button PAD8 is connected with the 14th pin of chip IC 1 through resistance R19; Described button PAD9 is connected with the 13rd pin of chip IC 1 through resistance R20; Described button PAD10 is connected with the 12nd pin of chip IC 1 through resistance R21; Described button PAD11 is connected with the 11st pin of chip IC 1 through resistance R22; Described button PAD12 is connected with the 10th pin of chip IC 1 through resistance R23; Described button PAD13 is connected with the 20th pin of chip IC 1 through resistance R24.
Further, described first capacitor shield coil utilizes the copper mold of circuit board to make circle formation capacitor shield coil in the left-half of circuit board, and the second capacitor shield coil utilizes the copper mold of circuit board to make circle formation capacitor shield coil at the right half part of circuit board; Described first capacitor shield coil is connected with the 1st pin of chip IC 1 through resistance R31; Second capacitor shield coil is connected with the 2nd pin of chip IC 1 through resistance R32.
Further, described microcontroller comprises: chip U1, electric capacity C1, electric capacity C4, electric capacity C5, resistance R1 and ICSP interface; 14th, 15 pins of described chip U1 are corresponding to be respectively connected with 22,21 pins of chip IC 1; 1st pin of described chip U1 is connected with resistance R1 and electric capacity C1 respectively, and this electric capacity C1 connects signal ground; Described electric capacity C4 is connected with the 20th pin of chip U1 with after C5 parallel connection; 1st, 4,5 pins of described ICSP interface respectively corresponding and chip U1 the 1st, 28,27 pins are connected.
Further, described LED display module comprises LED 1, LED 2 and LED 3; Described LED 1 is connected with the 2nd pin of chip U1 through resistance R7, and described LED 2 is connected with the 3rd pin of chip U1 through resistance R8, and described LED 3 is connected with the 4th pin of chip U1 through resistance R9; Described backlight module comprises LED 4, LED 5, LED 6 and LED 7; Described LED 4 is connected with the 5th pin of chip U1 through resistance R10; Described LED 5 is connected with the 6th pin of chip U1 through resistance R11; Described LED 6 is connected with the 7th pin of chip U1 through resistance R12; Described LED 7 is connected with the 10th pin of chip U1 through resistance R13; Described infrared transmission module comprises infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3, resistance R2, resistance R3, resistance R4, resistance R5, resistance R6, electric capacity C3 and triode Q1; Described infrared transmitting tube IRD1 is connected with the collector of triode Q1 through resistance R2; Described infrared transmitting tube IRD2 is connected with the collector of triode Q1 through resistance R3; Described infrared transmitting tube IRD3 is connected with the collector of triode Q1 through resistance R4; Described electric capacity C3 is connected with infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3 respectively; Between the emitter that described resistance R6 is parallel to triode Q1 and base stage; The base stage of described triode Q1 is connected with the 13rd pin of chip U1 through resistance R5.
Tool of the present invention has the following advantages: the present invention is by judging that the capacitance variations of capacitor shield coil has judged whether that hand is close; Namely undertaken by the first capacitor shield coil and the second capacitor shield coil and touch key-press; And by treatment circuit, signal is processed, and then by microcontroller, control operation is carried out to LED display module, backlight module and infrared transmission module; Structure is simple, and cost of manufacture is low, in addition, can avoid the situation of maloperation.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is touch key-press structural representation of the present invention.
Fig. 3 is the structural representation of the present invention close to module.
Fig. 4 is the structural representation for the treatment of circuit of the present invention.
Fig. 5 is microcontroller architecture schematic diagram of the present invention.
Fig. 6 is the structural representation of LED display module in the present invention, backlight module and infrared transmission module.
Fig. 7 is the schematic diagram of the inventive method.
Embodiment
Refer to shown in Fig. 1 to Fig. 6, a kind of telepilot of the present invention, comprise touch key-press 1, close to module 2, microcontroller 3, treatment circuit 4, LED display module 5, backlight module 6 and infrared transmission module 7; Describedly comprise the first capacitor shield coil 21 and the second capacitor shield coil 22 close to module 2; Described first capacitor shield coil 21, second capacitor shield coil 22, touch key-press 1 are all connected with treatment circuit 4, and described treatment circuit 4 is connected with microcontroller 3, and described LED display module 5, backlight module 6, infrared transmission module 7 are all connected with microcontroller 3.Described first capacitor shield coil 21 and the second capacitor shield coil 22 respond to whether have hand or human body close, then the capacitance of the first capacitor shield coil 21 and the second capacitor shield coil 22 changes; Described touch key-press 1 senses finger touch button, then capacitance sends change; Described treatment circuit 4 detects that the capacitance of the first capacitor shield coil 21, second capacitor shield coil 22 or touch key-press 1 changes, then treatment circuit processes signal, and its result is sent to microcontroller 3; Described microcontroller 3 processes this data, and response has hand to light backlight module 6 close to function or controls corresponding LED display module 5 and infrared transmission module 7 operates.
Wherein, described treatment circuit 4 comprises chip IC 1, resistance R25, resistance R26, resistance R27, resistance R28, resistance R29, resistance R30, resistance R33, resistance R34, electric capacity C11, electric capacity C12, electric capacity C13 and electric capacity C14; 3rd pin of described chip IC 1 is connected with the 4th pin through resistance R33, resistance R34; The 5th of chip IC 1 is drawn foot meridian capacitor C12 and is connect signal ground; The 6th of chip IC 1 is drawn foot meridian capacitor C13 and is connect signal ground; The 7th of chip IC 1 is drawn foot meridian capacitor C14 and is connect signal ground; Described resistance R26 and resistance R25 connects and is arranged between the 23rd pin of chip IC 1 and the 24th pin; Described electric capacity C11 is connected with resistance R25; Described resistance R27, resistance R28 respectively corresponding the 22nd pin with chip IC 1, the 21st pin are connected; Described resistance R29 and resistance R30 is arranged between the 22nd pin of chip IC 1 and the 21st pin after connecting.
Described touch key-press 1 utilizes the copper mold of circuit board to be made into button disk; This touch key-press 1 comprises button PAD1, button PAD2, button PAD3, button PAD4, button PAD6, button PAD8, button PAD9, button PAD10, button PAD11, button PAD12, button PAD13; Described button PAD1 is connected with the 19th pin of chip IC 1 through resistance R14; Described button PAD2 is connected with the 18th pin of chip IC 1 through resistance R15; Described button PAD3 is connected with the 17th pin of chip IC 1 through resistance R16; Described button PAD4 is connected with the 16th pin of chip IC 1 through resistance R17; Described button PAD6 is connected with the 15th pin of chip IC 1 through resistance R18; Described button PAD8 is connected with the 14th pin of chip IC 1 through resistance R19; Described button PAD9 is connected with the 13rd pin of chip IC 1 through resistance R20; Described button PAD10 is connected with the 12nd pin of chip IC 1 through resistance R21; Described button PAD11 is connected with the 11st pin of chip IC 1 through resistance R22; Described button PAD12 is connected with the 10th pin of chip IC 1 through resistance R23; Described button PAD13 is connected with the 20th pin of chip IC 1 through resistance R24.
Described first capacitor shield coil 21 utilizes the copper mold of circuit board to make circle formation capacitor shield coil in the left-half of circuit board, and the second capacitor shield coil 22 utilizes the copper mold of circuit board to make circle formation capacitor shield coil at the right half part of circuit board; Described first capacitor shield coil 21 is connected with the 1st pin of chip IC 1 through resistance R31; Second capacitor shield coil 22 is connected with the 2nd pin of chip IC 1 through resistance R32.
Described microcontroller 3 comprises: chip U1, electric capacity C1, electric capacity C4, electric capacity C5, resistance R1 and ICSP interface; 14th, 15 pins of described chip U1 are corresponding to be respectively connected with 22,21 pins of chip IC 1; 1st pin of described chip U1 is connected with resistance R1 and electric capacity C1 respectively, and this electric capacity C1 connects signal ground; Described electric capacity C4 is connected with the 20th pin of chip U1 with after C5 parallel connection; 1st, 4,5 pins of described ICSP interface respectively corresponding and chip U1 the 1st, 28,27 pins are connected.
Described LED display module 5 comprises LED 1, LED 2 and LED 3; Described LED 1 is connected with the 2nd pin of chip U1 through resistance R7, and described LED 2 is connected with the 3rd pin of chip U1 through resistance R8, and described LED 3 is connected with the 4th pin of chip U1 through resistance R9;
Described backlight module 6 comprises LED 4, LED 5, LED 6 and LED 7; Described LED 4 is connected with the 5th pin of chip U1 through resistance R10; Described LED 5 is connected with the 6th pin of chip U1 through resistance R11; Described LED 6 is connected with the 7th pin of chip U1 through resistance R12; Described LED 7 is connected with the 10th pin of chip U1 through resistance R13;
Described infrared transmission module 7 comprises infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3, resistance R2, resistance R3, resistance R4, resistance R5, resistance R6, electric capacity C3 and triode Q1; Described infrared transmitting tube IRD1 is connected with the collector of triode Q1 through resistance R2; Described infrared transmitting tube IRD2 is connected with the collector of triode Q1 through resistance R3; Described infrared transmitting tube IRD3 is connected with the collector of triode Q1 through resistance R4; Described electric capacity C3 is connected with infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3 respectively; Between the emitter that described resistance R6 is parallel to triode Q1 and base stage; The base stage of described triode Q1 is connected with the 13rd pin of chip U1 through resistance R5.
Refer to shown in Fig. 1 to Fig. 7, a kind of control method for remote controller of the present invention, described telepilot comprises touch key-press 1, close to module 2, microcontroller 3, treatment circuit 4, LED display module 5, backlight module 6 and infrared transmission module 7; Describedly comprise the first capacitor shield coil 21 and the second capacitor shield coil 22 close to module 2; Described method is specially:
Hand or human body are when the first capacitor shield coil 21 or the second capacitor shield coil 22, distance is (this D value is arranged as required) in default D cm, first capacitor shield coil 21 or the second capacitor shield coil 22 responds in one's hands or human body is close, treatment circuit 4 detects that the capacitance of the first capacitor shield coil 21 or the second capacitor shield coil 22 changes, treatment circuit 4 carries out signal transacting, its result is sent to microcontroller 3, microcontroller 3 result data, response has hand or human body proximity function, then lights backlight module 6;
Hand or human body distance the first capacitor shield coil 21 and the second capacitor shield coil 22 beyond D cm time, the capacitance of the first capacitor shield coil 21 and the second capacitor shield coil 22 returns to original state again, treatment circuit 4 detects that the capacitance of two capacitor shield coils returns to initial value, treatment circuit 4 carries out signal transacting, its result is sent to microcontroller 3 by treatment circuit 4, microcontroller 3 result data, and after waiting for certain setting-up time T, backlight module 6 is closed, enters dormant state;
When finger removes touch key-press 1, the capacitance of touch key-press disk changes, treatment circuit 4 collects capacitance signal and changes, treatment circuit 4 carries out signal transacting, its result is sent to microcontroller 3 by treatment circuit 4, microcontroller 3 is through result data, and then microcontroller 3 controls corresponding LED display module 5 and infrared transmission module 7 operates;
Hand is overhead within distance telepilot D cm, when carrying out gesture paddling, the capacitance of the first capacitor shield coil 21 can first change, then the capacitance of the second capacitor shield coil 22 changes, treatment circuit 4 detects the signal change procedure of the first capacitor shield coil 21 and the second capacitor shield coil 22, treatment circuit 4 processes this signal, its result is sent to microcontroller 3 by treatment circuit 4, microcontroller 3 is through these data of process, and then microcontroller 3 controls corresponding LED display module 5 and infrared transmission module 7 operates.
Described gesture paddling comprises slip from left to right, gesture motion from right to left, the clockwise gesture motion through two capacitor shield coils or the counterclockwise gesture motion through two capacitor shield coils.
Wherein, described treatment circuit 4 comprises chip IC 1, resistance R25, resistance R26, resistance R27, resistance R28, resistance R29, resistance R30, resistance R33, resistance R34, electric capacity C11, electric capacity C12, electric capacity C13 and electric capacity C14; 3rd pin of described chip IC 1 is connected with the 4th pin through resistance R33, resistance R34; The 5th of chip IC 1 is drawn foot meridian capacitor C12 and is connect signal ground; The 6th of chip IC 1 is drawn foot meridian capacitor C13 and is connect signal ground; The 7th of chip IC 1 is drawn foot meridian capacitor C14 and is connect signal ground; Described resistance R26 and resistance R25 connects and is arranged between the 23rd pin of chip IC 1 and the 24th pin; Described electric capacity C11 is connected with resistance R25; Described resistance R27, resistance R28 respectively corresponding the 22nd pin with chip IC 1, the 21st pin are connected; Described resistance R29 and resistance R30 is arranged between the 22nd pin of chip IC 1 and the 21st pin after connecting.
Described touch key-press 1 utilizes the copper mold of circuit board to be made into button disk; This touch key-press 1 comprises button PAD1, button PAD2, button PAD3, button PAD4, button PAD6, button PAD8, button PAD9, button PAD10, button PAD11, button PAD12, button PAD13; Described button PAD1 is connected with the 19th pin of chip IC 1 through resistance R14; Described button PAD2 is connected with the 18th pin of chip IC 1 through resistance R15; Described button PAD3 is connected with the 17th pin of chip IC 1 through resistance R16; Described button PAD4 is connected with the 16th pin of chip IC 1 through resistance R17; Described button PAD6 is connected with the 15th pin of chip IC 1 through resistance R18; Described button PAD8 is connected with the 14th pin of chip IC 1 through resistance R19; Described button PAD9 is connected with the 13rd pin of chip IC 1 through resistance R20; Described button PAD10 is connected with the 12nd pin of chip IC 1 through resistance R21; Described button PAD11 is connected with the 11st pin of chip IC 1 through resistance R22; Described button PAD12 is connected with the 10th pin of chip IC 1 through resistance R23; Described button PAD13 is connected with the 20th pin of chip IC 1 through resistance R24.
Described first capacitor shield coil 21 utilizes the copper mold of circuit board to make circle formation capacitor shield coil in the left-half of circuit board, and the second capacitor shield coil 22 utilizes the copper mold of circuit board to make circle formation capacitor shield coil at the right half part of circuit board; Described first capacitor shield coil 21 is connected with the 1st pin of chip IC 1 through resistance R31; Second capacitor shield coil 22 is connected with the 2nd pin of chip IC 1 through resistance R32.
Described microcontroller 3 comprises: chip U1, electric capacity C1, electric capacity C4, electric capacity C5, resistance R1 and ICSP interface; 14th, 15 pins of described chip U1 are corresponding to be respectively connected with 22,21 pins of chip IC 1; 1st pin of described chip U1 is connected with resistance R1 and electric capacity C1 respectively, and this electric capacity C1 connects signal ground; Described electric capacity C4 is connected with the 20th pin of chip U1 with after C5 parallel connection; 1st, 4,5 pins of described ICSP interface respectively corresponding and chip U1 the 1st, 28,27 pins are connected.
Described LED display module 5 comprises LED 1, LED 2 and LED 3; Described LED 1 is connected with the 2nd pin of chip U1 through resistance R7, and described LED 2 is connected with the 3rd pin of chip U1 through resistance R8, and described LED 3 is connected with the 4th pin of chip U1 through resistance R9;
Described backlight module 6 comprises LED 4, LED 5, LED 6 and LED 7; Described LED 4 is connected with the 5th pin of chip U1 through resistance R10; Described LED 5 is connected with the 6th pin of chip U1 through resistance R11; Described LED 6 is connected with the 7th pin of chip U1 through resistance R12; Described LED 7 is connected with the 10th pin of chip U1 through resistance R13;
Described infrared transmission module 7 comprises infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3, resistance R2, resistance R3, resistance R4, resistance R5, resistance R6, electric capacity C3 and triode Q1; Described infrared transmitting tube IRD1 is connected with the collector of triode Q1 through resistance R2; Described infrared transmitting tube IRD2 is connected with the collector of triode Q1 through resistance R3; Described infrared transmitting tube IRD3 is connected with the collector of triode Q1 through resistance R4; Described electric capacity C3 is connected with infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3 respectively; Between the emitter that described resistance R6 is parallel to triode Q1 and base stage; The base stage of described triode Q1 is connected with the 13rd pin of chip U1 through resistance R5.
The foregoing is only preferred embodiment of the present invention, all equalizations done according to the present patent application the scope of the claims change and modify, and all should belong to covering scope of the present invention.
Claims (10)
1. a telepilot, is characterized in that: comprise touch key-press, close to module, microcontroller, treatment circuit, LED display module, backlight module and infrared transmission module; Describedly comprise the first capacitor shield coil and the second capacitor shield coil close to module; Described first capacitor shield coil, the second capacitor shield coil, touch key-press are all connected with treatment circuit, and described treatment circuit is connected with microcontroller, and described LED display module, backlight module, infrared transmission module are all connected with microcontroller; Described first capacitor shield coil and the second capacitor shield coil induction whether have hand or human body close, then the capacitance of the first capacitor shield coil and the second capacitor shield coil changes; Described touch key-press senses finger touch button, then capacitance sends change; Described treatment circuit detects that the capacitance of the first capacitor shield coil, the second capacitor shield coil or touch key-press changes, then treatment circuit processes signal, and its result is sent to microcontroller; Described these data of microcontroller process, response has hand to light backlight module close to function or controls corresponding LED display module and infrared transmission module operation.
2. a kind of telepilot according to claim 1, is characterized in that: described treatment circuit comprises chip IC 1, resistance R25, resistance R26, resistance R27, resistance R28, resistance R29, resistance R30, resistance R33, resistance R34, electric capacity C11, electric capacity C12, electric capacity C13 and electric capacity C14; 3rd pin of described chip IC 1 is connected with the 4th pin through resistance R33, resistance R34; The 5th of chip IC 1 is drawn foot meridian capacitor C12 and is connect signal ground; The 6th of chip IC 1 is drawn foot meridian capacitor C13 and is connect signal ground; The 7th of chip IC 1 is drawn foot meridian capacitor C14 and is connect signal ground; Described resistance R26 and resistance R25 connects and is arranged between the 23rd pin of chip IC 1 and the 24th pin; Described electric capacity C11 is connected with resistance R25; Described resistance R27, resistance R28 respectively corresponding the 22nd pin with chip IC 1, the 21st pin are connected; Described resistance R29 and resistance R30 is arranged between the 22nd pin of chip IC 1 and the 21st pin after connecting.
3. a kind of telepilot according to claim 2, is characterized in that: described touch key-press utilizes the copper mold of circuit board to be made into button disk; This touch key-press comprises button PAD1, button PAD2, button PAD3, button PAD4, button PAD6, button PAD8, button PAD9, button PAD10, button PAD11, button PAD12, button PAD13; Described button PAD1 is connected with the 19th pin of chip IC 1 through resistance R14; Described button PAD2 is connected with the 18th pin of chip IC 1 through resistance R15; Described button PAD3 is connected with the 17th pin of chip IC 1 through resistance R16; Described button PAD4 is connected with the 16th pin of chip IC 1 through resistance R17; Described button PAD6 is connected with the 15th pin of chip IC 1 through resistance R18; Described button PAD8 is connected with the 14th pin of chip IC 1 through resistance R19; Described button PAD9 is connected with the 13rd pin of chip IC 1 through resistance R20; Described button PAD10 is connected with the 12nd pin of chip IC 1 through resistance R21; Described button PAD11 is connected with the 11st pin of chip IC 1 through resistance R22; Described button PAD12 is connected with the 10th pin of chip IC 1 through resistance R23; Described button PAD13 is connected with the 20th pin of chip IC 1 through resistance R24.
4. a kind of telepilot according to claim 2, it is characterized in that: described first capacitor shield coil utilizes the copper mold of circuit board to make circle formation capacitor shield coil in the left-half of circuit board, the second capacitor shield coil utilizes the copper mold of circuit board to make circle formation capacitor shield coil at the right half part of circuit board; Described first capacitor shield coil is connected with the 1st pin of chip IC 1 through resistance R31; Second capacitor shield coil is connected with the 2nd pin of chip IC 1 through resistance R32; Described microcontroller comprises: chip U1, electric capacity C1, electric capacity C4, electric capacity C5, resistance R1 and ICSP interface; 14th, 15 pins of described chip U1 are corresponding to be respectively connected with 22,21 pins of chip IC 1; 1st pin of described chip U1 is connected with resistance R1 and electric capacity C1 respectively, and this electric capacity C1 connects signal ground; Described electric capacity C4 is connected with the 20th pin of chip U1 with after C5 parallel connection; 1st, 4,5 pins of described ICSP interface respectively corresponding and chip U1 the 1st, 28,27 pins are connected.
5. a kind of telepilot according to claim 4, is characterized in that: described LED display module comprises LED 1, LED 2 and LED 3; Described LED 1 is connected with the 2nd pin of chip U1 through resistance R7, and described LED 2 is connected with the 3rd pin of chip U1 through resistance R8, and described LED 3 is connected with the 4th pin of chip U1 through resistance R9; Described backlight module comprises LED 4, LED 5, LED 6 and LED 7; Described LED 4 is connected with the 5th pin of chip U1 through resistance R10; Described LED 5 is connected with the 6th pin of chip U1 through resistance R11; Described LED 6 is connected with the 7th pin of chip U1 through resistance R12; Described LED 7 is connected with the 10th pin of chip U1 through resistance R13; Described infrared transmission module comprises infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3, resistance R2, resistance R3, resistance R4, resistance R5, resistance R6, electric capacity C3 and triode Q1; Described infrared transmitting tube IRD1 is connected with the collector of triode Q1 through resistance R2; Described infrared transmitting tube IRD2 is connected with the collector of triode Q1 through resistance R3; Described infrared transmitting tube IRD3 is connected with the collector of triode Q1 through resistance R4; Described electric capacity C3 is connected with infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3 respectively; Between the emitter that described resistance R6 is parallel to triode Q1 and base stage; The base stage of described triode Q1 is connected with the 13rd pin of chip U1 through resistance R5.
6. a control method for remote controller, is characterized in that: described telepilot comprises touch key-press, close to module, microcontroller, treatment circuit, LED display module, backlight module and infrared transmission module; Describedly comprise the first capacitor shield coil and the second capacitor shield coil close to module; Described method is specially:
Hand or human body are when the first capacitor shield coil or the second capacitor shield coil, distance is in default D cm, first capacitor shield coil or the second capacitor shield coil respond in one's hands or human body is close, treatment circuit detects that the capacitance of the first capacitor shield coil or the second capacitor shield coil changes, treatment circuit carries out signal transacting, and its result is sent to microcontroller, microcontroller result data, response has hand or human body proximity function, then lights backlight module;
Hand or human body distance the first capacitor shield coil and the second capacitor shield coil beyond D cm time, the capacitance of the first capacitor shield coil and the second capacitor shield coil returns to original state again, treatment circuit detects that the capacitance of two capacitor shield coils returns to initial value, treatment circuit carries out signal transacting, its result is sent to microcontroller by treatment circuit, microcontroller result data, and after waiting for certain setting-up time T, backlight module is closed, enters dormant state;
When finger removes touch key-press, the capacitance of touch key-press disk changes, treatment circuit collects capacitance signal and changes, treatment circuit carries out signal transacting, its result is sent to microcontroller by treatment circuit, microcontroller is through result data, and then the corresponding LED display module of microprocessor controls and infrared transmission module operate;
Hand is overhead within distance telepilot D cm, when carrying out gesture paddling, the capacitance of the first capacitor shield coil can first change, then the capacitance of the second capacitor shield coil changes, treatment circuit detects the signal change procedure of the first capacitor shield coil and the second capacitor shield coil, this signal of processing circuit processes, and its result is sent to microcontroller by treatment circuit, microcontroller is through these data of process, and then the corresponding LED display module of microprocessor controls and infrared transmission module operate; Described gesture paddling comprises slip from left to right, gesture motion from right to left, the clockwise gesture motion through two capacitor shield coils or the counterclockwise gesture motion through two capacitor shield coils.
7. a kind of control method for remote controller according to claim 6, is characterized in that: described treatment circuit comprises chip IC 1, resistance R25, resistance R26, resistance R27, resistance R28, resistance R29, resistance R30, resistance R33, resistance R34, electric capacity C11, electric capacity C12, electric capacity C13 and electric capacity C14; 3rd pin of described chip IC 1 is connected with the 4th pin through resistance R33, resistance R34; The 5th of chip IC 1 is drawn foot meridian capacitor C12 and is connect signal ground; The 6th of chip IC 1 is drawn foot meridian capacitor C13 and is connect signal ground; The 7th of chip IC 1 is drawn foot meridian capacitor C14 and is connect signal ground; Described resistance R26 and resistance R25 connects and is arranged between the 23rd pin of chip IC 1 and the 24th pin; Described electric capacity C11 is connected with resistance R25; Described resistance R27, resistance R28 respectively corresponding the 22nd pin with chip IC 1, the 21st pin are connected; Described resistance R29 and resistance R30 is arranged between the 22nd pin of chip IC 1 and the 21st pin after connecting.
8. a kind of control method for remote controller according to claim 7, is characterized in that: described touch key-press utilizes the copper mold of circuit board to be made into button disk; This touch key-press comprises button PAD1, button PAD2, button PAD3, button PAD4, button PAD6, button PAD8, button PAD9, button PAD10, button PAD11, button PAD12, button PAD13; Described button PAD1 is connected with the 19th pin of chip IC 1 through resistance R14; Described button PAD2 is connected with the 18th pin of chip IC 1 through resistance R15; Described button PAD3 is connected with the 17th pin of chip IC 1 through resistance R16; Described button PAD4 is connected with the 16th pin of chip IC 1 through resistance R17; Described button PAD6 is connected with the 15th pin of chip IC 1 through resistance R18; Described button PAD8 is connected with the 14th pin of chip IC 1 through resistance R19; Described button PAD9 is connected with the 13rd pin of chip IC 1 through resistance R20; Described button PAD10 is connected with the 12nd pin of chip IC 1 through resistance R21; Described button PAD11 is connected with the 11st pin of chip IC 1 through resistance R22; Described button PAD12 is connected with the 10th pin of chip IC 1 through resistance R23; Described button PAD13 is connected with the 20th pin of chip IC 1 through resistance R24.
9. a kind of control method for remote controller according to claim 8, it is characterized in that: described first capacitor shield coil utilizes the copper mold of circuit board to make circle formation capacitor shield coil in the left-half of circuit board, the second capacitor shield coil utilizes the copper mold of circuit board to make circle formation capacitor shield coil at the right half part of circuit board; Described first capacitor shield coil is connected with the 1st pin of chip IC 1 through resistance R31; Second capacitor shield coil is connected with the 2nd pin of chip IC 1 through resistance R32; Described microcontroller comprises: chip U1, electric capacity C1, electric capacity C4, electric capacity C5, resistance R1 and ICSP interface; 14th, 15 pins of described chip U1 are corresponding to be respectively connected with 22,21 pins of chip IC 1; 1st pin of described chip U1 is connected with resistance R1 and electric capacity C1 respectively, and this electric capacity C1 connects signal ground; Described electric capacity C4 is connected with the 20th pin of chip U1 with after C5 parallel connection; 1st, 4,5 pins of described ICSP interface respectively corresponding and chip U1 the 1st, 28,27 pins are connected.
10. a kind of control method for remote controller according to claim 9, is characterized in that: described LED display module comprises LED 1, LED 2 and LED 3; Described LED 1 is connected with the 2nd pin of chip U1 through resistance R7, and described LED 2 is connected with the 3rd pin of chip U1 through resistance R8, and described LED 3 is connected with the 4th pin of chip U1 through resistance R9; Described backlight module comprises LED 4, LED 5, LED 6 and LED 7; Described LED 4 is connected with the 5th pin of chip U1 through resistance R10; Described LED 5 is connected with the 6th pin of chip U1 through resistance R11; Described LED 6 is connected with the 7th pin of chip U1 through resistance R12; Described LED 7 is connected with the 10th pin of chip U1 through resistance R13; Described infrared transmission module comprises infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3, resistance R2, resistance R3, resistance R4, resistance R5, resistance R6, electric capacity C3 and triode Q1; Described infrared transmitting tube IRD1 is connected with the collector of triode Q1 through resistance R2; Described infrared transmitting tube IRD2 is connected with the collector of triode Q1 through resistance R3; Described infrared transmitting tube IRD3 is connected with the collector of triode Q1 through resistance R4; Described electric capacity C3 is connected with infrared transmitting tube IRD1, infrared transmitting tube IRD2, infrared transmitting tube IRD3 respectively; Between the emitter that described resistance R6 is parallel to triode Q1 and base stage; The base stage of described triode Q1 is connected with the 13rd pin of chip U1 through resistance R5.
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