CN104540322A - Semi-plugged silver melting module substrate pretreatment method - Google Patents
Semi-plugged silver melting module substrate pretreatment method Download PDFInfo
- Publication number
- CN104540322A CN104540322A CN201410796614.5A CN201410796614A CN104540322A CN 104540322 A CN104540322 A CN 104540322A CN 201410796614 A CN201410796614 A CN 201410796614A CN 104540322 A CN104540322 A CN 104540322A
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- CN
- China
- Prior art keywords
- module substrate
- silver
- semi
- plugged
- consentization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses a semi-plugged silver melting module substrate pretreatment method. The semi-plugged silver melting module substrate pretreatment method includes the steps that firstly, a copper face of a semi-lugged silver melting module substrate is polished and brushed; secondly, the surface of the semi-plugged silver melting module substrate is ungreased; thirdly, super-roughening liquid is used for conducting roughening on the copper face of the semi-plugged silver melting module substrate; fourthly, the pretreatment process before silver melting is conducted on the semi-plugged silver melting module, wherein the pretreatment process before silver melting includes primary washing, acid pickling, secondary washing and drying. The semi-plugged silver melting module substrate pretreatment method has the advantages that polishing, brushing and ungreasing are adopted so that oil stains in the semi-plugged module substrate can be effectively and thoroughly removed; an HCOOH+CuCL2 roughening system is adopted for the super-roughening liquid, a concave-convex roughed surface can be generated on the copper face, the super-roughening liquid has higher combining force compared with a common chemical agent, the super-roughening liquid is extremely likely to be volatile and is prevented from being left in a semi-plugged position, and therefore primary battery reactions can be effectively reduced; lacking of plating can be obviously improved, the roughening system is easy to clean after roughening is finished, residues are extremely few, and the semi-plugged silver melting module substrate pretreatment method is suitable for pretreatment of various chemical plating of a semi-plugged silver melting plate.
Description
Technical field
The present invention relates to a kind of module substrate pre-treating method, especially relate to a kind of half consentization silver module substrate pre-treating method.
Background technology
Aborning, meet some client sometimes, require partial hole consent, but can not gorge full completely, the back side welding resistance of consent is windowed, and has depth requirements, is popularly called " half consent ".Because the region of half consent belongs to monolateral obstructed blind hole state; therefore usually can produce semi-solid preparation in aperture or solidify bad solder mask; and the oil stain cannot thoroughly removed by conventional change silver pre-treating method in half consent; thus the effect of the silver-colored module substrate silver of impactization; easily cause and lack plating phenomenon, affect the high-frequency signal of product.
Summary of the invention
For overcoming the problems referred to above, can solve scarce plating problem better, improve the qualification rate of half consentization silver module substrate, the present invention adopts following technical scheme:
A kind of half consentization silver module substrate pre-treating method, is characterized in that, comprising:
(1) half consentization silver module substrate copper face is carried out polish-brush;
Ungrease treatment is carried out on (2) double consentization silver module substrate surface;
(3) copper face of super coarsening solution double consentization silver module substrate is adopted to carry out roughening treatment;
Pretreatment process before (4) double carrying out of consentization silver module substrate silver, its flow process comprises once washing, pickling, secondary washing, dries.
In described step (1), polish-brush adopts 2 groups (upper and lower polish-brush is one group) in front and back, and the 1st group adopts 500 order polish-brushes, and the 2nd group adopts 1200 order nylon polish-brushes.
0.3 ~ 0.5%NaOH solution is adopted to carry out degreasing to module substrate surface in described step (2).
In described step (3), super coarsening solution adopts HCOOH+CuCL2 alligatoring system.
Adopt pure water in pretreatment process before changing silver described in described step (4), pickling adopts 10 ~ 15%HCl solution, and bake out temperature controls within the scope of 80 ~ 90 DEG C.
Advantage of the present invention is: employing polish-brush, degreasing thoroughly can remove the oil stain in half consent module substrate effectively; Super coarsening solution adopts HCOOH+CuCL2 alligatoring system, copper face can be made to produce the surface of concavo-convex alligatoring, more general chemical agent can obtain higher interface binding power, and volatile, avoid residuing in half jack position, thus effectively can reduce the generation of galvanic interaction, scarce plating is improved significantly, and system is easily cleaned after alligatoring, remaining few, be applicable to the pre-treatment of the various chemical plating of half consent silver plate.
Accompanying drawing explanation
Fig. 1 is method flow diagram of the present invention.
Embodiment
As shown in Figure 1, a kind of half consentization silver module substrate pre-treating method, comprises the following steps: step one, adopts 2 groups to be respectively after 500 orders and 1200 object nylon polish-brushes carry out polish-brush process to substrate copper face; Step 2, adopts 0.3 ~ 0.5%NaOH solution to carry out degreasing to the solder mask of substrate surface; Step 3, adopts HCOOH+CuCL2 to surpass alligatoring system and carries out roughening treatment to substrate copper face; Step 4, carries out pickling to substrate liquid to substrate surface, then carries out second pure water cleaning, finally adopts 80 ~ 90 DEG C to carry out drying and processing to substrate.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (5)
1. a half consentization silver module substrate pre-treating method, is characterized in that, comprising:
(1) half consentization silver module substrate copper face is carried out polish-brush;
Ungrease treatment is carried out on (2) double consentization silver module substrate surface;
(3) copper face of super coarsening solution double consentization silver module substrate is adopted to carry out roughening treatment;
Pretreatment process before (4) double carrying out of consentization silver module substrate silver, its flow process comprises once washing, pickling, secondary washing, dries.
2. a kind of half consentization silver module substrate pre-treating method according to claim 1, it is characterized in that, in described step (1), polish-brush adopts 2 groups (upper and lower polish-brush is one group) in front and back, and the 1st group adopts 500 order polish-brushes, and the 2nd group adopts 1200 order nylon polish-brushes.
3. a kind of half consentization silver module substrate pre-treating method according to claim 1, is characterized in that, adopt 0.3 ~ 0.5%NaOH solution to carry out degreasing to module substrate surface in described step (2).
4. a kind of half consentization silver module substrate pre-treating method according to claim 1, it is characterized in that, in described step (3), super coarsening solution adopts HCOOH+CuCL2 alligatoring system.
5. a kind of half consentization silver module substrate pre-treating method according to claim 1, it is characterized in that, adopt pure water in pretreatment process before changing silver described in described step (4), pickling adopts 10 ~ 15%HCl solution, and bake out temperature controls within the scope of 80 ~ 90 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410796614.5A CN104540322A (en) | 2014-12-22 | 2014-12-22 | Semi-plugged silver melting module substrate pretreatment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410796614.5A CN104540322A (en) | 2014-12-22 | 2014-12-22 | Semi-plugged silver melting module substrate pretreatment method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104540322A true CN104540322A (en) | 2015-04-22 |
Family
ID=52855736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410796614.5A Pending CN104540322A (en) | 2014-12-22 | 2014-12-22 | Semi-plugged silver melting module substrate pretreatment method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104540322A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172824A (en) * | 2017-07-12 | 2017-09-15 | 陈志春 | Change the suppressing method that silver is climbed in silver process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR890001415B1 (en) * | 1986-03-11 | 1989-05-02 | 오석주 | Printing circuit plate and method of it which has penol resin and two sides |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN102877044A (en) * | 2012-09-13 | 2013-01-16 | 广东达志环保科技股份有限公司 | Method for producing environment-friendly lead-free electroless nickel immersion gold |
-
2014
- 2014-12-22 CN CN201410796614.5A patent/CN104540322A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR890001415B1 (en) * | 1986-03-11 | 1989-05-02 | 오석주 | Printing circuit plate and method of it which has penol resin and two sides |
| CN101808464A (en) * | 2010-03-09 | 2010-08-18 | 施吉连 | Method for manufacturing ultra-long microwave high-frequency circuit board |
| CN102877044A (en) * | 2012-09-13 | 2013-01-16 | 广东达志环保科技股份有限公司 | Method for producing environment-friendly lead-free electroless nickel immersion gold |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172824A (en) * | 2017-07-12 | 2017-09-15 | 陈志春 | Change the suppressing method that silver is climbed in silver process |
| CN107172824B (en) * | 2017-07-12 | 2019-09-10 | 陈志春 | Change the suppressing method that silver is climbed in silver process |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150422 |
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| WD01 | Invention patent application deemed withdrawn after publication |