CN104538387A - Full-spectrum panoramic-luminosity LED lamp filament - Google Patents
Full-spectrum panoramic-luminosity LED lamp filament Download PDFInfo
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- CN104538387A CN104538387A CN201410731878.2A CN201410731878A CN104538387A CN 104538387 A CN104538387 A CN 104538387A CN 201410731878 A CN201410731878 A CN 201410731878A CN 104538387 A CN104538387 A CN 104538387A
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- led chip
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Abstract
Disclosed in the invention is a full-spectrum panoramic-luminosity LED lamp filament comprising two full-transparent substrates connected side by side. A low-power warm-white-light LED chip and a low-power white-light LED chip are respectively arranged at the two substrates in a die bonding mode; and fluorescent glues covering and coating the low-power warm-white-light LED chip and the low-power white-light LED chip in a 360-degree mode are arranged at the two substrates. According to the full-spectrum panoramic-luminosity LED lamp filament, the full-transparent-material-based substrates and the novel 360-degree fluorescent glue packaging process are used, so that the high-voltage low-current driving packaging is realized; because of the normal mounting chip molding or upside-down mounting chip lattice technology of the fluorescent glues, the qualified ratio is high. The provided filament is capable of realizing 360-degree omnidirectional luminosity; the large-angle luminosity can be realized without the need of a lens, so that the three-dimensional light source is realized and the unprecedented experience is provided. The filament has two kinds of colors and the ideal color can be realized by light modulation.
Description
Technical field
The present invention relates to a kind of full spectrum period-luminosity LED silk, particularly relate to and a kind ofly realize 360 ° of full angle luminescences, wide-angle is luminous and do not need to add lens, realize the full spectrum period-luminosity LED silk of three-dimensional light source.
Background technology
The double-colored filament of LED is also LED post, and the LED light source of prior art will reach certain illuminance and illuminating area, need install the optics of lens and so on additional, affect lighting effect, can reduce the due energy-saving effect of LED.
Summary of the invention
The present invention is the defect in order to overcome prior art, object is to provide a kind of full spectrum period-luminosity LED silk, this full spectrum period-luminosity LED silk can realize 360 ° of full angle luminescences, wide-angle is luminous and do not need to add lens, realize three-dimensional light source, bring unprecedented lighting experience, possess two kinds of colors simultaneously, reach desirable color by light modulation.
The technical solution adopted for the present invention to solve the technical problems is: a kind of full spectrum period-luminosity LED silk, comprise two substrates be connected side by side of all-transparent, on two substrates, die bond has small-power warm white LED chip and small-power White-light LED chip respectively, and on two substrates, tool is provided with the fluorescent glue that 360 ° cover parcel small-power warm white LED chip and small-power White-light LED chip.This full spectrum period-luminosity LED silk adopts the substrate of all-transparent material to coordinate brand-new 360 ° of fluorescent glue packaging technologies, realizes high voltage low current and drives encapsulation, and the shaping or flip-chip dot matrix moulding process of the positive cartridge chip of fluorescent glue, acceptance rate is high.
Further, small-power warm white LED chip is by being connected in series die bond on a substrate, small-power White-light LED chip is by being connected in series die bond on another substrate, and small-power warm white LED chip and small-power White-light LED chip are that independent separate installs setting.
Further, small-power warm white LED chip and small-power White-light LED chip to be arranged between two substrates and to form the dot matrix arrangement at interval with reverse installation process.
In sum, full spectrum period-luminosity LED silk of the present invention adopts the substrate of all-transparent material to coordinate brand-new 360 ° of fluorescent glue packaging technologies, realize high voltage low current and drive encapsulation, the shaping or flip-chip dot matrix moulding process of the positive cartridge chip of fluorescent glue, acceptance rate is high; Can also realize 360 ° of full angle luminescences, wide-angle is luminous and do not need to add lens, realizes three-dimensional light source, brings unprecedented lighting experience, possess two kinds of colors simultaneously, reach desirable color by light modulation.There is high brightness, specular removal, height shows index, height believes resistance to feature, can be applicable to the LED illumination products such as crystal pendant lamp, candle lamp, bulb lamp, wall lamp, applicable situation: the room lightings such as five-star commercial hotel, high-grade mansion.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of full spectrum period-luminosity LED silk of the embodiment of the present invention 1;
Fig. 2 is the structural representation of a kind of full spectrum period-luminosity LED silk of the embodiment of the present invention 2.
Embodiment
Embodiment 1
One described by the embodiment of the present invention 1 full spectrum period-luminosity LED silk, as shown in Figure 1, comprise two substrates 1 be connected side by side of all-transparent, on two substrates, die bond has small-power warm white LED chip and small-power White-light LED chip respectively, and on two substrates, tool is provided with the fluorescent glue 2 that 360 ° cover parcel small-power warm white LED chip and small-power White-light LED chip.This full spectrum period-luminosity LED silk adopts the substrate of all-transparent material to coordinate brand-new 360 ° of fluorescent glue packaging technologies, realizes high voltage low current and drives encapsulation, and the shaping or flip-chip dot matrix moulding process of the positive cartridge chip of fluorescent glue, acceptance rate is high.
This small-power warm white LED chip is by being connected in series die bond on a substrate, and small-power White-light LED chip is by being connected in series die bond on another substrate, and small-power warm white LED chip and small-power White-light LED chip are that independent separate installs setting.
Embodiment 2
The present embodiment 2 changes on the basis of embodiment 1, is specially the positive cartridge chip moulding process adopting flip-chip moulding process to replace embodiment 1, is specially:
As shown in Figure 2, small-power warm white LED chip 3 and small-power White-light LED chip 4 to be arranged between two substrates 1 and to form the dot matrix arrangement at interval with reverse installation process.
Above-described embodiment is only some preferred embodiments of the present invention, not limits the scope of the invention according to this, therefore: all various equivalence changes done according to structure of the present invention, shape, principle, all should be encompassed within protection scope of the present invention.
Claims (3)
1. a full spectrum period-luminosity LED silk, it is characterized in that, comprise two substrates be connected side by side of all-transparent, on two substrates, die bond has small-power warm white LED chip and small-power White-light LED chip respectively, and on two substrates, tool is provided with the fluorescent glue that 360 ° cover parcel small-power warm white LED chip and small-power White-light LED chip.
2. one according to claim 1 full spectrum period-luminosity LED silk, it is characterized in that, small-power warm white LED chip is by being connected in series die bond on a substrate, small-power White-light LED chip is by being connected in series die bond on another substrate, and small-power warm white LED chip and small-power White-light LED chip are that independent separate installs setting.
3. one according to claim 1 full spectrum period-luminosity LED silk, is characterized in that, small-power warm white LED chip and small-power White-light LED chip to be arranged between two substrates and to form the dot matrix arrangement at interval with reverse installation process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410731878.2A CN104538387A (en) | 2014-12-06 | 2014-12-06 | Full-spectrum panoramic-luminosity LED lamp filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410731878.2A CN104538387A (en) | 2014-12-06 | 2014-12-06 | Full-spectrum panoramic-luminosity LED lamp filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104538387A true CN104538387A (en) | 2015-04-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410731878.2A Pending CN104538387A (en) | 2014-12-06 | 2014-12-06 | Full-spectrum panoramic-luminosity LED lamp filament |
Country Status (1)
| Country | Link |
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| CN (1) | CN104538387A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3139714U (en) * | 2007-12-10 | 2008-02-28 | 鳥海工業株式会社 | LED lamp |
| CN101701673A (en) * | 2009-11-11 | 2010-05-05 | 林信义 | Color mixing method of high color rendering index of LED |
| JP2011146187A (en) * | 2010-01-13 | 2011-07-28 | Tsutomu Seisakusho:Kk | Method for manufacturing continuous substrate for light emitting diode fluorescent lamp |
| CN102287671A (en) * | 2011-09-09 | 2011-12-21 | 福建省万邦光电科技有限公司 | Light emitting diode (LED) lamp strip for high-whiteness base plate |
| CN102705743A (en) * | 2012-06-01 | 2012-10-03 | 明基电通有限公司 | Illuminating device |
| CN103840071A (en) * | 2014-03-21 | 2014-06-04 | 苏州东山精密制造股份有限公司 | LED lamp bar manufacturing method and LED lamp bar |
-
2014
- 2014-12-06 CN CN201410731878.2A patent/CN104538387A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3139714U (en) * | 2007-12-10 | 2008-02-28 | 鳥海工業株式会社 | LED lamp |
| CN101701673A (en) * | 2009-11-11 | 2010-05-05 | 林信义 | Color mixing method of high color rendering index of LED |
| JP2011146187A (en) * | 2010-01-13 | 2011-07-28 | Tsutomu Seisakusho:Kk | Method for manufacturing continuous substrate for light emitting diode fluorescent lamp |
| CN102287671A (en) * | 2011-09-09 | 2011-12-21 | 福建省万邦光电科技有限公司 | Light emitting diode (LED) lamp strip for high-whiteness base plate |
| CN102705743A (en) * | 2012-06-01 | 2012-10-03 | 明基电通有限公司 | Illuminating device |
| CN103840071A (en) * | 2014-03-21 | 2014-06-04 | 苏州东山精密制造股份有限公司 | LED lamp bar manufacturing method and LED lamp bar |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150422 |
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| RJ01 | Rejection of invention patent application after publication |