CN104538120A - Processing method of silver tin oxide electrical contact material containing indium tin oxide - Google Patents
Processing method of silver tin oxide electrical contact material containing indium tin oxide Download PDFInfo
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- CN104538120A CN104538120A CN201410840607.0A CN201410840607A CN104538120A CN 104538120 A CN104538120 A CN 104538120A CN 201410840607 A CN201410840607 A CN 201410840607A CN 104538120 A CN104538120 A CN 104538120A
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Abstract
The invention discloses a processing method of a silver tin oxide electrical contact material containing indium tin oxide. The processing method specifically comprises the steps that the amount of needed putty powder, the amount of needed indium nitrate and the amount of silver nitrate are calculated according to the material ratio of a to-be-prepared silver tin oxide electrical contact containing the indium tin oxide, and the amount of sodium hydroxide A is calculated according to the amount of indium nitrate; the amount of sodium hydroxide B is calculated according to the amount of silver nitrate; the materials are weighted for use later; the weighted materials are prepared into solutions, the putty powder is divided into two parts including putty powder A and putty powder B; the sodium hydroxide A and the indium nitrate suspension liquid containing the putty powder A are reacted to obtain indium hydroxide and tin oxide composite powder, the composite powder is subjected to calcining and ball-milling to obtain indium tin oxide powder, the indium tin oxide powder is added to suspension liquid formed by the putty powder B and the silver nitrate solution to conduct a reaction with the sodium hydroxide B to obtain silver oxide, tin oxide and indium tin oxide composite powder; the composite powder is washed, dried and roasted and enters the forming, sintering and extruding procedures, and then the silver tin oxide electrical contact material containing the indium tin oxide is obtained.
Description
Technical field
The present invention relates to a kind of processing method of the siller tin oxide electric contact material containing stannic acid indium, belong to field of metal matrix composite.
Background technology
In recent years, siller tin oxide contact has been widely used in various low-voltage electrical apparatus as the best replacer of poisonous silver cadmium oxide contact.Sliver oxidized tin contactor materials has excellent resistance to wear, resistance fusion welding and resistance to arc erosion, but it exists the shortcomings such as contact resistance is large, temperature rise is high, has had a strong impact on the electric property of electrical equipment.
Study discovery through forefathers, the siller tin oxide electric contact material being added with one or more oxides in bismuth oxide, cupric oxide and indium oxide not only has good resistance to wear, resistance fusion welding and resistance to arc erosion, improves the electric property of electrical equipment well.Have not yet to see the relevant report of the siller tin oxide electric contact material of doping stannic acid indium.
Summary of the invention
The technical problem to be solved in the present invention is to provide the processing method of the siller tin oxide electric contact material containing stannic acid indium that a kind of technique is simple, stannic acid indium is evenly distributed in basis material, the siller tin oxide electric contact metallographic structure containing stannic acid indium obtained by this method evenly, there is excellent resistance to electric abrasioning performance.
The processing method of the siller tin oxide electric contact material containing stannic acid indium of the present invention, comprises the following steps:
1) calculate according to the material mixture ratio of the siller tin oxide electric contact containing stannic acid indium of required preparation needed for the consumption of putty powder, indium nitrate and silver nitrate, generate the consumption of the NaOH needed for indium hydroxide according to the Dosage calculation indium nitrate of indium nitrate and NaOH reaction, represent with NaOH A; Generate the consumption of the NaOH needed for silver oxide according to the Dosage calculation silver nitrate of silver nitrate and NaOH reaction, represent with NaOH B; Take above-mentioned substance, for subsequent use; Get silver nitrate is made into 20 ~ 40w/w% liquor argenti nitratis ophthalmicus by water-soluble solution, get the water-soluble solution of indium nitrate and be made into indium nitrate solution; Get the water-soluble solution wiring solution-forming of NaOH A, obtain NaOH solution A; Get NaOH B is made into 10 ~ 30w/w% solution by water-soluble solution, obtain NaOH B solution; The putty powder taken is divided into two parts, and portion is putty powder A, and its amount is for can react with indium nitrate and NaOH the amount that the indium hydroxide generated reacts completely to generate stannic acid indium, and another part is putty powder B;
2) putty powder A and indium nitrate solution are placed in reactor, stir, obtain the suspension of putty powder A and indium nitrate; In this suspension, add NaOH solution A, stirring reaction, filter, obtain the composite powder of putty powder A and indium hydroxide;
3) the putty powder A of gained and the composite powder of indium hydroxide are washed to neutrality, drying is placed on calcination in oxygen-containing atmosphere, then ball milling, obtains stannic acid indium powder;
4) putty powder B and liquor argenti nitratis ophthalmicus are placed in another reactor, stir, obtain the suspension of silver nitrate and putty powder B; Add step 3 wherein) the stannic acid indium powder of gained, then add NaOH B solution, stirring reaction, filter, obtain silver oxide, tin oxide and stannic acid indium composite powder;
5) silver oxide of gained, tin oxide and stannic acid indium composite powder are washed to neutrality, carry out roasting after drying, pulverizing, then pulverize, obtain the siller tin oxide composite powder containing stannic acid indium;
6) gained is containing the siller tin oxide composite powder isostatic compaction of stannic acid indium, and then is placed in oxygen-containing atmosphere and sinters, and obtains the siller tin oxide billet containing stannic acid indium;
7) gained containing stannic acid indium siller tin oxide billet through hot extrusion be processed into band or wire rod, after through Rolling compund or drawing, then through punch process or rivet driver processing, namely obtain sheet or the rivet type siller tin oxide electric contact material containing stannic acid indium.
Putty powder and NaOH powder are divided into two parts by the present invention, wherein a part of NaOH is obtained by reacting indium hydroxide and tin oxide composite powder with the indium nitrate suspension containing a part of putty powder, obtain stannic acid indium powder after this composite powder is carried out high-temperature calcination, ball milling, and gained stannic acid indium powder is joined suspension that another part putty powder and liquor argenti nitratis ophthalmicus formed and another part NaOH again secondary response to obtain silver oxide, tin oxide and stannic acid indium composite powder.Obtained stannic acid indium powder density and the density of reacting silver oxide and the tin oxide generated are close, and (density of wherein obtained stannic acid indium is 7.07g/cm
3, the density of tin oxide is 6.95g/cm
3, the density of silver oxide is 7.143g/cm
3), thus silver oxide, tin oxide and the stannic acid indium as additive can be made to be mixed to get evenly, stannic acid indium powder and tin oxide are more evenly distributed in silver oxide, improve the problem pockety of additive in prior art, make gained electrical contact material have uniform metallographic structure; Meanwhile, the present invention adopts NaOH as precipitation reagent, can reduce the harm to human body and environment; On the other hand, because stannic acid indium is a kind of semi-conducting material, its resistivity only has 1 × 10
-4Ω cm, and the resistivity of tin oxide is 93 Ω cm, therefore, adds appropriate stannic acid indium in siller tin oxide electric contact, effectively can reduce resistivity and the temperature rise of siller tin oxide electric contact; Again on the one hand, add stannic acid indium in siller tin oxide after, the siller tin oxide electric contact that gained contains stannic acid indium compound is subject to the effect of electric arc and Joule heat in the course of the work, part stannic acid indium is made to absorb a large amount of energy and be decomposed into tin oxide and indium oxide, thus can the arcing time be shortened, reduce the electrical wear of electrical contact.
The step 1 of said method) in, need containing in the siller tin oxide electric contact material of stannic acid indium of preparation, tin oxide content is 8 ~ 15wt%, and the content of stannic acid indium is 0.1 ~ 4wt%, and surplus is silver; The more excellent tin oxide content that is chosen as is 10 ~ 12wt%, and the content of stannic acid indium is 1 ~ 2wt%, and surplus is silver.In this step, preferably silver nitrate is mixed with the liquor argenti nitratis ophthalmicus of 30 ~ 40w/w%, be more preferably the liquor argenti nitratis ophthalmicus being mixed with 30 ~ 35w/w%, correspondingly, for NaOH B solution, be more preferably and be made into the solution that concentration is 15 ~ 25w/w%, the silver oxide that reaction can be made to generate like this has more uniform outer appearance, and a step makes the metallographic structure of gained electrical contact material more even; And for NaOH solution A and stannic acid solution of indium, their too not large being particular about of concentration, but preferably, be NaOH A is made into the solution that concentration is 10 ~ 30w/w%, indium nitrate is made into the solution that concentration is 30 ~ 40w/w%.In this step, described oxidate powder and stannic acid indium powder all preferably adopt particle mean size to be the powder of 1 ~ 10 μm.
The step 2 of said method) in, the speed that adds of described NaOH solution A is not particular about, but is preferably 0.1 ~ 1L/min; Described stirring reaction carries out usually under normal temperature condition, and the time of stirring reaction is generally 0.3 ~ 1h.
The step 3 of said method) in, operation that is dry and calcination is same as the prior art, and in the application, preferably drying is until dry the composite powder of putty powder A and indium hydroxide under 100 ~ 150 DEG C of conditions, usually needs the time of 12 ~ 18h; Normally the composite powder of dried putty powder A and indium hydroxide is placed in oxygen-containing atmosphere and calcines 8 ~ 24h under 1450 ~ 1700 DEG C of conditions, ball milling after taking out, cross 100 ~ 200 eye mesh screens, obtain stannic acid indium powder.
The step 4 of said method) in, the speed that adds of described NaOH B solution is preferably 0.1 ~ 1L/min; Described stirring reaction carries out usually under normal temperature condition, and the time of stirring reaction is generally 0.3 ~ 1h.
The step 5 of said method) in, dry, pulverize and the operation of roasting same as the prior art, in the application, preferably drying is until dry silver oxide, tin oxide and stannic acid indium composite powder under 100 ~ 150 DEG C of conditions, usually needs the time of 12 ~ 18h; Cross 100 ~ 200 eye mesh screens after normally dried silver oxide, tin oxide and stannic acid indium composite powder being pulverized, extracting screen underflow enters next process; Described roasting is roasting 2 ~ 6h under 400 ~ 500 DEG C of temperature conditions normally, then pulverizes (at least crossing 100 mesh sieves), obtains the siller tin oxide composite powder containing stannic acid indium.
The step 6 of said method) in, described isostatic compaction is identical with existing routine operation with sintering operation, and particularly, the briquetting pressure of isostatic compaction is generally 100 ~ 150MPa; Normally the pressed compact after isostatic compaction is placed in oxygen-containing atmosphere and sinters 4 ~ 8h under 880 ~ 920 DEG C of temperature conditions, to obtain the siller tin oxide billet containing stannic acid indium.
The step 7 of said method) in, the operation such as described hot extrusion is all identical with existing routine operation, and particularly, the temperature of hot extrusion is generally 750 ~ 900 DEG C, and extrusion ratio is 10 ~ 200.When by when being processed into band containing the siller tin oxide billet hot extrusion of stannic acid indium, gained band through repeatedly Rolling compund, to be annealed to after required size through punch ram, obtain the siller tin oxide electric contact material containing stannic acid indium of sheet.When by when being processed into wire rod containing the siller tin oxide billet hot extrusion of stannic acid indium, gained wire rod through repeatedly drawing, to be annealed to after required size through rivet driver processing, obtain the siller tin oxide electric contact material containing stannic acid indium of rivet type.
Compared with prior art, feature of the present invention is:
1, putty powder and NaOH powder are divided into two parts by the present invention, wherein a part of NaOH is obtained by reacting indium hydroxide and tin oxide composite powder with the indium nitrate suspension containing a part of putty powder, obtain stannic acid indium powder after this composite powder is carried out high-temperature calcination, ball milling, and gained stannic acid indium powder is joined suspension that another part putty powder and liquor argenti nitratis ophthalmicus formed and another part NaOH again secondary response to obtain silver oxide, tin oxide and stannic acid indium composite powder.Obtained stannic acid indium powder density and the density of reacting silver oxide and the tin oxide generated are close, and (density of wherein obtained stannic acid indium is 7.07g/cm
3, the density of tin oxide is 6.95g/cm
3, the density of silver oxide is 7.143g/cm
3), thus silver oxide, tin oxide and the stannic acid indium as additive can be made to be mixed to get evenly, stannic acid indium powder and tin oxide are more evenly distributed in silver oxide, improve the problem pockety of additive in prior art, make gained electrical contact material have uniform metallographic structure; Meanwhile, the present invention adopts NaOH as precipitation reagent, can reduce the harm to human body and environment; On the other hand, because stannic acid indium is a kind of semi-conducting material, its resistivity only has 1 × 10
-4Ω cm, and the resistivity of tin oxide is 93 Ω cm, therefore, adds appropriate stannic acid indium in siller tin oxide electric contact, effectively can reduce resistivity and the temperature rise of siller tin oxide electric contact; Again on the one hand, add stannic acid indium in siller tin oxide after, the siller tin oxide electric contact that gained contains stannic acid indium compound is subject to the effect of electric arc and Joule heat in the course of the work, part stannic acid indium is made to absorb a large amount of energy and be decomposed into tin oxide and indium oxide, thus can the arcing time be shortened, reduce the electrical wear of electrical contact.
2, the method for the invention technique is simple, to human body and environmental pollution little, be applicable to suitability for industrialized production.
Accompanying drawing explanation
Fig. 1 is the metallographic structure figure of the contact material that the embodiment of the present invention 1 obtains;
Fig. 2 is the metallographic structure figure of the contact material that the embodiment of the present invention 2 obtains;
Fig. 3 is the metallographic structure figure of the contact material that the embodiment of the present invention 3 obtains.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail, and to understand content of the present invention better, but the present invention is not limited to following examples.
Embodiment 1
1) first according to preparation 10kgAg-SnO
2(11.5)-In
4sn
3o
12(0.5) material mixture ratio calculates required putty powder, indium nitrate and silver nitrate consumption, take putty powder (particle mean size is 2 ~ 3 μm) 1.172kg, indium nitrate 0.06kg and silver nitrate 13.852kg, again according to the consumption weighing sodium hydroxide A0.026kg of indium nitrate, and according to the consumption weighing sodium hydroxide B 3.585kg of silver nitrate, for subsequent use; Get silver nitrate is made into 30w/w% liquor argenti nitratis ophthalmicus by water-soluble solution, get the indium nitrate solution that the water-soluble solution of indium nitrate is made into 30w/w%; Get NaOH A is made into 20w/w% solution by water-soluble solution, obtain NaOH solution A; Get NaOH B is made into 20w/w% solution by water-soluble solution, obtain NaOH B solution; The putty powder taken is divided into two parts, and portion is putty powder A, and its quality is 0.022kg; Another part is putty powder B, and its quality is 1.15kg;
2) putty powder A and indium nitrate solution are placed in reactor, stir (fully stirring 120min), obtains the suspension of putty powder A and indium nitrate; In this suspension, add NaOH solution A (drop rate is 0.1L/min), stirring reaction 0.3h, filter, obtain putty powder A and indium hydroxide (In (OH)
3) composite powder;
3) at 120 DEG C of temperature, dry 15h after the composite powder washed with de-ionized water of the putty powder A of gained and indium hydroxide is clean, then the composite powder of oven dry is placed in air with 1550 DEG C of temperature calcination 12h, obtains stannic acid indium (In
4sn
3o
12) compound, and the stannic acid indium compound after calcining is loaded high energy ball mill with ratio of grinding media to material 4:1 ball milling 1h, cross 200 eye mesh screens after taking out, obtain stannic acid indium powder;
4) putty powder B and liquor argenti nitratis ophthalmicus are placed in another reactor, stir (fully stirring 120min), obtains the suspension of silver nitrate and putty powder B; Add step 3 wherein) the stannic acid indium powder of gained, then add NaOH B solution (drop rate is 0.1L/min), stirring reaction 1h, filter, obtain silver oxide, tin oxide and stannic acid indium composite powder;
5) silver oxide of gained, tin oxide and stannic acid indium composite powder deionized water are washed till neutrality at centrigugal swing dryer supernatant, 15h is dried in an oven subsequently with 120 DEG C of temperature, then the composite powder of oven dry is placed in bipyramid blender broken (rotating speed 25r/min, time 1h); Gained powder is placed in air with 450 DEG C of temperature calcination 4h, is placed in bipyramid blender broken (rotating speed 25r/min, time 1h) again, crosses 200 mesh sieves, obtain the siller tin oxide composite powder containing stannic acid indium after taking-up;
6) gained is containing the siller tin oxide composite powder shaping on isostatic pressing machine (briquetting pressure is 120MPa) of stannic acid indium, and the pressed compact after shaping is placed in air with 880 DEG C of temperature sintering 4h, obtains the siller tin oxide billet containing stannic acid indium;
7) gained is processed into wire rod containing the siller tin oxide billet hot extrusion of stannic acid indium, and extrusion temperature is 850 DEG C, and mold preheating temperature is 150 DEG C, and extrusion ratio is 190; Gained wire rod again through repeatedly drawing, be annealed to required size after with rivet driver be processed into rivet type containing the siller tin oxide (Ag-SnO of stannic acid indium
2(11.5)-In
4sn
3o
12(0.5)) electrical contact.
Carry out metallographic structure analysis to gained contact material, as shown in Figure 1, the metallographic structure of contact product prepared of technical scheme is even as seen from the figure, is distributed in silver matrix to tiny tin oxide and stannic acid indium uniform particles.
Comparative example 1
According to preparation Ag-SnO
2(11.5)-In
4sn
3o
12(0.5) material mixture ratio calculates and takes required putty powder (particle mean size is 2 ~ 3 μm), stannic acid indium, silver powder (particle mean size is 2 ~ 3 μm), prepares contact product by the powder mixing method of existing routine.
Embodiment 2
1) first according to preparation 10kg Ag-SnO
2(8)-In
4sn
3o
12(4) material mixture ratio calculates required putty powder, indium nitrate and silver nitrate consumption, take putty powder (particle mean size is 2 ~ 3 μm) 0.98kg, indium nitrate 0.477kg and silver nitrate 13.852kg, again according to the consumption weighing sodium hydroxide A0.209kg of indium nitrate, and according to the consumption weighing sodium hydroxide B 3.585kg of silver nitrate, for subsequent use; Get silver nitrate is made into 40w/w% liquor argenti nitratis ophthalmicus by water-soluble solution, get the indium nitrate solution that the water-soluble solution of indium nitrate is made into 20w/w%; Get NaOH A is made into 10w/w% solution by water-soluble solution, obtain NaOH solution A; Get NaOH B is made into 30w/w% solution by water-soluble solution, obtain NaOH B solution; The putty powder taken is divided into two parts, and portion is putty powder A, and its quality is 0.18kg; Another part is putty powder B, and its quality is 0.8kg;
2) putty powder A and indium nitrate solution are placed in reactor, stir (fully stirring 80min), obtains the suspension of putty powder A and indium nitrate; In this suspension, add NaOH solution A (drop rate is 0.5L/min), stirring reaction 0.5h, filter, obtain the composite powder of putty powder A and indium hydroxide;
3) at 100 DEG C of temperature, 18h is dried after the composite powder washed with de-ionized water of the putty powder A of gained and indium hydroxide is clean, then the composite powder of oven dry is placed in air with 1650 DEG C of temperature calcination 24h, obtain stannic acid indium compound, and the stannic acid indium compound after calcining is loaded high energy ball mill with ratio of grinding media to material 6:1 ball milling 2h, cross 200 eye mesh screens after taking out, obtain stannic acid indium powder;
4) putty powder B and liquor argenti nitratis ophthalmicus are placed in another reactor, stir (fully stirring 120min), obtains the suspension of silver nitrate and putty powder B; Add step 3 wherein) the stannic acid indium powder of gained, then add NaOH B solution (drop rate is 0.8L/min), stirring reaction 0.5h, filter, obtain silver oxide, tin oxide and stannic acid indium composite powder;
5) silver oxide of gained, tin oxide and stannic acid indium composite powder deionized water are washed till neutrality at centrigugal swing dryer supernatant, 12h is dried in an oven subsequently with 150 DEG C of temperature, then the composite powder of oven dry is placed in bipyramid blender broken (rotating speed 25r/min, time 1h); Gained powder is placed in air with 500 DEG C of temperature calcination 6h, is placed in bipyramid blender broken (rotating speed 25r/min, time 1h) again, crosses 200 mesh sieves, obtain the siller tin oxide composite powder containing stannic acid indium after taking-up;
6) gained is containing the siller tin oxide composite powder shaping on isostatic pressing machine (briquetting pressure is 120MPa) of stannic acid indium, and the pressed compact after shaping is placed in air with 920 DEG C of temperature sintering 6h, obtains the siller tin oxide billet containing stannic acid indium;
7) gained is processed into band containing the siller tin oxide billet hot extrusion of stannic acid indium, and extrusion temperature is 850 DEG C, and mold preheating temperature is 150 DEG C, and extrusion ratio is 160; Again by band through repeatedly Rolling compund, be annealed to required size after to be processed into the siller tin oxide (Ag-SnO containing stannic acid indium of sheet with punch press
2(8)-In
4sn
3o
12(4)) electrical contact.
Carry out metallographic structure analysis to gained contact material, as shown in Figure 2, the metallographic structure of contact product prepared of technical scheme is even as seen from the figure, is distributed in silver matrix to tiny tin oxide and stannic acid indium uniform particles.
Embodiment 3
1) first according to preparation 10kg Ag-SnO
2(15)-In
4sn
3o
12(2) material mixture ratio calculates required putty powder, indium nitrate and silver nitrate consumption, take putty powder (particle mean size is 2 ~ 3 μm) 1.59kg, indium nitrate 0.238kg and silver nitrate 13.065kg, again according to the consumption weighing sodium hydroxide A0.105kg of indium nitrate, and according to the consumption weighing sodium hydroxide B 3.382kg of silver nitrate, for subsequent use; Get silver nitrate is made into 30w/w% liquor argenti nitratis ophthalmicus by water-soluble solution, get the indium nitrate solution that the water-soluble solution of indium nitrate is made into 25w/w%; Get NaOH A is made into 20w/w% solution by water-soluble solution, obtain NaOH solution A; Get NaOH B is made into 25w/w% solution by water-soluble solution, obtain NaOH B solution; The putty powder taken is divided into two parts, and portion is putty powder A, and its quality is 0.09kg; Another part is putty powder B, and its quality is 1.5kg;
2) putty powder A and indium nitrate solution are placed in reactor, stir (fully stirring 100min), obtains the suspension of putty powder A and indium nitrate; In this suspension, add NaOH solution A (drop rate is 0.3L/min), stirring reaction 0.6h, filter, obtain the composite powder of putty powder A and indium hydroxide;
3) at 120 DEG C of temperature, 15h is dried after the composite powder washed with de-ionized water of the putty powder A of gained and indium hydroxide is clean, then the composite powder of oven dry is placed in air with 1550 DEG C of temperature calcination 20h, obtain stannic acid indium compound, and the stannic acid indium compound after calcining is loaded high energy ball mill with ratio of grinding media to material 5:1 ball milling 1h, cross 200 eye mesh screens after taking out, obtain stannic acid indium powder;
4) putty powder B and liquor argenti nitratis ophthalmicus are placed in another reactor, stir (fully stirring 100min), obtains the suspension of silver nitrate and putty powder B; Add step 3 wherein) the stannic acid indium powder of gained, then add NaOH B solution (drop rate is 0.5L/min), stirring reaction 0.5h, filter, obtain silver oxide, tin oxide and stannic acid indium composite powder;
5) silver oxide of gained, tin oxide and stannic acid indium composite powder deionized water are washed till neutrality at centrigugal swing dryer supernatant, 18h is dried in an oven subsequently with 120 DEG C of temperature, then the composite powder of oven dry is placed in bipyramid blender broken (rotating speed 25r/min, time 1h); Gained powder is placed in air with 450 DEG C of temperature calcination 6h, is placed in bipyramid blender broken (rotating speed 25r/min, time 1h) again, crosses 200 mesh sieves, obtain the siller tin oxide composite powder containing stannic acid indium after taking-up;
6) gained is containing the siller tin oxide composite powder shaping on isostatic pressing machine (briquetting pressure is 150MPa) of stannic acid indium, and the pressed compact after shaping is placed in air with 920 DEG C of temperature sintering 6h, obtains the siller tin oxide billet containing stannic acid indium;
7) gained is processed into band containing the siller tin oxide billet hot extrusion of stannic acid indium, and extrusion temperature is 850 DEG C, and mold preheating temperature is 150 DEG C, and extrusion ratio is 160; Again by band through repeatedly Rolling compund, be annealed to required size after to be processed into the siller tin oxide (Ag-SnO containing stannic acid indium of sheet with punch press
2(15)-In
4sn
3o
12(2)) electrical contact.
Carry out metallographic structure analysis to gained contact material, as shown in Figure 3, the metallographic structure of contact product prepared of technical scheme is even as seen from the figure, is distributed in silver matrix to tiny tin oxide and stannic acid indium uniform particles.
Embodiment 1 and the obtained contact material of comparative example 1 are carried out Performance Detection, and compares with the contact product that existing routine mixes the siller tin oxide of the interpolation indium oxide that powder-extrusion obtains, result is as shown in following table 1 and table 2:
Table 1 embodiment 1 and comparative example 1 and existing routine mix wire product performance prepared by powder-extrusion
Table 2 embodiment 1 and comparative example 1 mix the electric life of rivet type contact prepared by powder-extrusion with existing routine
From table 1 and table 2, the performance of sliver oxidized tin contactor materials containing stannic acid indium prepared by technical scheme is better than comparative example 1 and existing routine and mixes the sliver oxidized tin contactor materials performance containing indium oxide prepared by powder-extrusion.
Claims (6)
1., containing a processing method for the siller tin oxide electric contact material of stannic acid indium, it is characterized in that comprising the following steps:
1) calculate according to the material mixture ratio of the siller tin oxide electric contact containing stannic acid indium of required preparation needed for the consumption of putty powder, indium nitrate and silver nitrate, generate the consumption of the NaOH needed for indium hydroxide according to the Dosage calculation indium nitrate of indium nitrate and NaOH reaction, represent with NaOH A; Generate the consumption of the NaOH needed for silver oxide according to the Dosage calculation silver nitrate of silver nitrate and NaOH reaction, represent with NaOH B; Take above-mentioned substance, for subsequent use; Get silver nitrate is made into 20 ~ 40w/w% liquor argenti nitratis ophthalmicus by water-soluble solution, get the water-soluble solution of indium nitrate and be made into indium nitrate solution; Get the water-soluble solution wiring solution-forming of NaOH A, obtain NaOH solution A; Get NaOH B is made into 10 ~ 30w/w% solution by water-soluble solution, obtain NaOH B solution; The putty powder taken is divided into two parts, and portion is putty powder A, and its amount is for can react with indium nitrate and NaOH the amount that the indium hydroxide generated reacts completely to generate stannic acid indium, and another part is putty powder B;
2) putty powder A and indium nitrate solution are placed in reactor, stir, obtain the suspension of putty powder A and indium nitrate; In this suspension, add NaOH solution A, stirring reaction, filter, obtain the composite powder of putty powder A and indium hydroxide;
3) the putty powder A of gained and the composite powder of indium hydroxide are washed to neutrality, drying is placed on containing calcination in oxygen atmosphere, then ball milling, obtains stannic acid indium powder;
4) putty powder B and liquor argenti nitratis ophthalmicus are placed in another reactor, stir, obtain the suspension of silver nitrate and putty powder B; Add step 3 wherein) the stannic acid indium powder of gained, then add NaOH B solution, stirring reaction, filter, obtain silver oxide, tin oxide and stannic acid indium composite powder;
5) silver oxide of gained, tin oxide and stannic acid indium composite powder are washed to neutrality, carry out roasting after drying, pulverizing, then pulverize, obtain the siller tin oxide composite powder containing stannic acid indium;
6) gained is containing the siller tin oxide composite powder isostatic compaction of stannic acid indium, and then is placed in oxygen-containing atmosphere and sinters, and obtains the siller tin oxide billet containing stannic acid indium;
7) gained containing stannic acid indium siller tin oxide billet through hot extrusion be processed into band or wire rod, after through Rolling compund or drawing, then through punch process or rivet driver processing, namely obtain sheet or the rivet type siller tin oxide electric contact material containing stannic acid indium.
2. processing method according to claim 1, is characterized in that: step 1) in, need containing in the siller tin oxide electric contact material of stannic acid indium of preparation, tin oxide content is 8 ~ 15wt%, and the content of stannic acid indium is 0.1 ~ 4wt%, and surplus is silver.
3. processing method according to claim 1, is characterized in that: step 1) in, step 1) in, the concentration of liquor argenti nitratis ophthalmicus is 30 ~ 40w/w%.
4. processing method according to claim 1, is characterized in that: step 1) in, get indium nitrate water and be made into the solution that concentration is 30 ~ 40w/w%.
5. processing method according to claim 1, is characterized in that: step 1) in, get NaOH A water and be made into the solution that concentration is 10 ~ 30w/w%.
6. processing method according to claim 1, is characterized in that: step 1) in, the concentration of NaOH B solution is 15 ~ 25w/w%.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410840607.0A CN104538120B (en) | 2014-12-30 | 2014-12-30 | A kind of processing method of the siller tin oxide electric contact material containing stannic acid indium |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410840607.0A CN104538120B (en) | 2014-12-30 | 2014-12-30 | A kind of processing method of the siller tin oxide electric contact material containing stannic acid indium |
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| Publication Number | Publication Date |
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| CN104538120A true CN104538120A (en) | 2015-04-22 |
| CN104538120B CN104538120B (en) | 2016-08-17 |
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| CN201410840607.0A Active CN104538120B (en) | 2014-12-30 | 2014-12-30 | A kind of processing method of the siller tin oxide electric contact material containing stannic acid indium |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2007020006A1 (en) * | 2005-08-12 | 2007-02-22 | Umicore Ag & Co. Kg | Use of indium-tin mixed oxide for silver-based materials |
| CN101415644A (en) * | 2006-03-31 | 2009-04-22 | 尤米科尔股份有限公司 | Process for manufacture of silver-based particles and electrical contact materials |
| CN102142325A (en) * | 2010-12-30 | 2011-08-03 | 温州宏丰电工合金股份有限公司 | Preparation method of particle direction-arrangement enhanced silver-based oxide electrical contact material |
| CN103643074A (en) * | 2013-12-06 | 2014-03-19 | 桂林电器科学研究院有限公司 | Preparation method for flaky AgSnO2 contact |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007020006A1 (en) * | 2005-08-12 | 2007-02-22 | Umicore Ag & Co. Kg | Use of indium-tin mixed oxide for silver-based materials |
| CN101415644A (en) * | 2006-03-31 | 2009-04-22 | 尤米科尔股份有限公司 | Process for manufacture of silver-based particles and electrical contact materials |
| CN102142325A (en) * | 2010-12-30 | 2011-08-03 | 温州宏丰电工合金股份有限公司 | Preparation method of particle direction-arrangement enhanced silver-based oxide electrical contact material |
| CN103643074A (en) * | 2013-12-06 | 2014-03-19 | 桂林电器科学研究院有限公司 | Preparation method for flaky AgSnO2 contact |
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Address after: 541004 Dongcheng Road, Guilin, the Guangxi Zhuang Autonomous Region 8 Patentee after: Guilin Jinge Electrotechnical Electronic Material Science & Technology Co., Ltd. Address before: 541004 Dongcheng Road, Seven Star District, Guilin, the Guangxi Zhuang Autonomous Region 8 Patentee before: Guilin Jinge Electrotechnical Electronic Material Science & Technology Co., Ltd. |