CN104527153A - Insulated electronic plug-in unit - Google Patents
Insulated electronic plug-in unit Download PDFInfo
- Publication number
- CN104527153A CN104527153A CN201410801112.7A CN201410801112A CN104527153A CN 104527153 A CN104527153 A CN 104527153A CN 201410801112 A CN201410801112 A CN 201410801112A CN 104527153 A CN104527153 A CN 104527153A
- Authority
- CN
- China
- Prior art keywords
- insulation
- electronic package
- accounts
- unit
- material layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Insulating Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses an insulated electronic plug-in unit. The insulated electronic plug-in unit comprises a thermosetting plastic layer at the uppermost layer, a plasticizing agent at the middle layer and an insulated material layer at the bottommost layer, wherein the thermosetting plastic layer comprises a glass fiber or charcoal powder; the insulated material layer is a phenolic plastic; the component of the a thermosetting plastic layer accounts for 57%-62% of the total component of the insulated electronic plug-in unit; the component of the plasticizing agent accounts for 5%-9% of the total component of the insulated electronic plug-in unit; the component of the insulated material layer accounts for 31%-36% of the total component of the insulated electronic plug-in unit. The insulated electronic plug-in unit provided by the invention has the advantages of light weight, high mechanical intensity, easy processing and molding, high-temperature resistance and insulation.
Description
Technical field
The present invention relates to a kind of electronic package of insulation.
Background technology
Ambroin can be divided into substantially according to purposes: generally use ambroin; Injection-type ambroin; High electrical performance ambroin; High frequency tolerant ambroin; Resistance to chemical attack ambroin; Humidity ambroin; Shock-resistant ambroin; The ambroin of resistance to electric arc; The trace of resistance to leakage ambroin; High-temperature insulation plastics; Without ammonia ambroin; Resistance to combustion pressure ambroin etc.General ambroin is made up of phenolic resins, wood powder, hexamethylenetetramine (methenamine), additive, pigment, lubricant, can present black or brown.The insulating part of employing die pressing manufacture electrician, radio, instrument or structural member.Metal insert can be added when making molding.Injection-type ambroin, except containing except above-mentioned composition, also contains special additive or special phenolic resins, as high adjacent position phenolic resin.It can make ambroin in injector, carry out processing (90 ~ 130 DEG C) time to be located in viscous state for a long time, and at 160 ~ 170 DEG C rapid solidification.High electrical performance ambroin is made up of the phenolic resins of modification, wood powder, hexamethylenetetramine (methenamine), pigment, lubricant, mica powder.For radio, the electronic component of mold pressing high electrical performance, as coil rack, terminal plate, support etc.
Summary of the invention
The invention provides a kind ofly have that quality is light, mechanical strength is high, easy machine-shaping is outer, the electronic package of the insulation of high temperature resistant and insulation benefits.
Technical scheme of the present invention is: a kind of electronic package of insulation, the electronic package of described insulation comprises the thermosetting plastic layer of the superiors, the plasticizer in intermediate layer and undermost insulation material layer and combines, described thermosetting plastic layer comprises glass fibre or charcoal powder, described insulation material layer is phenoplasts, described thermosetting plastic layer accounts for the 57%-62% of the overall component of electronic package of insulation, described plasticizer accounts for the 5%-9% of the overall component of electronic package of insulation, and described insulation material layer accounts for the 31%-36% of the overall component of electronic package of insulation.
In a preferred embodiment of the present invention, described plasticizer is epoxidized soybean oil plasticiser.
In a preferred embodiment of the present invention, described insulation material layer is phenoplasts, described thermosetting plastic layer accounts for 59% of the overall component of electronic package of insulation, described plasticizer accounts for 7% of the overall component of electronic package of insulation, and described insulation material layer accounts for 34% of the overall component of electronic package of insulation.
The electronic package of a kind of insulation of the present invention, has that quality is light, mechanical strength is high, easy machine-shaping is outer, an advantage of high temperature resistant and insulation.
Detailed description of the invention
Below preferred embodiment of the present invention is described in detail, can be easier to make advantages and features of the invention be readily appreciated by one skilled in the art, thus more explicit defining is made to protection scope of the present invention.
Wherein, the electronic package of described insulation comprises the thermosetting plastic layer of the superiors, the plasticizer in intermediate layer and undermost insulation material layer and combines, described thermosetting plastic layer comprises glass fibre or charcoal powder, described insulation material layer is phenoplasts, described thermosetting plastic layer accounts for the 57%-62% of the overall component of electronic package of insulation, described plasticizer accounts for the 5%-9% of the overall component of electronic package of insulation, and described insulation material layer accounts for the 31%-36% of the overall component of electronic package of insulation.
Further illustrate, described plasticizer is epoxidized soybean oil plasticiser, described insulation material layer is phenoplasts, described thermosetting plastic layer accounts for 59% of the overall component of electronic package of insulation, described plasticizer accounts for 7% of the overall component of electronic package of insulation, and described insulation material layer accounts for 34% of the overall component of electronic package of insulation.Thermosetting plastics refers to and is being heated or can solidifying or have the plastics of insoluble (melting) characteristic under other conditions, as phenoplasts, epoxy plastics etc.Thermosetting plastics divides again formaldehyde crosslinking type and other cross-linking type two types.Formed after thermo forming and cannot not have moltenly insoluble solidfied material, its molecular resin is cross-linked into network structure by linear structure.Add heat-flash again and then can decompose destruction.Typical thermosetting plastics has the materials such as phenolic aldehyde, epoxy, amino, unsaturated polyester (UP), furans, poly(silicon aether), also has newer polyphenyl dioctyl phthalate two propylene plastics etc.They have, and heat resistance is high, the advantage such as not yielding of being heated.Shortcoming is that mechanical strength is general not high, but can by adding filler, makes laminated material or moulding material to improve its mechanical strength.
Further illustrate, the electrical insulation capability of phenolic resins is consistent with the tendency that mechanical strength reduces again.The insulating capacity of plastics can reflect mechanical strength indirectly.But the volume resistance of plastics does not observe time rule, and often mechanical strength reduces by 50%, and volume resistance does not also occur downward trend.Test proves, the phenolic aldehyde plastic of asbestos and glass filler, the electrical property that in the high temperature more than 150 DEG C, energy long term maintenance is stable and mechanical performance.The hygroscopic capacity of phenoplasts is directly relevant with the kind of filler.Various phenolic aldehyde plastic is placed in 24 DEG C of water and floods, water absorption is respectively: asbestos packing 1.2%, flock 5.4%, cloth bits filler 6.8%, wood meal 8.4%.When moisture content is between 2 ~ 3%, not too greatly, if when reaching more than 5%, then electrical property declines rapidly in electrical property change.Although the good stability of the dimension of phenolic aldehyde plastic, creep is atomic little, and with other plastics comparatively speaking this only refer to.But it also some change in size can occur after affecting by humidity and temperature, this, concerning high-precision machine components, must understand the relation of its environment for use with change in size.The invention provides a kind of electronic package of insulation, have that quality is light, mechanical strength is high, easy machine-shaping is outer, the advantage of high temperature resistant and insulation.
The specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; any those of ordinary skill in the art are in the technical scope disclosed by the present invention, and the change can expected without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should limit with claims is as the criterion.
Claims (3)
1. the electronic package of an insulation, it is characterized in that: the electronic package of described insulation comprises the thermosetting plastic layer of the superiors, the plasticizer in intermediate layer and undermost insulation material layer and combines, described thermosetting plastic layer comprises glass fibre or charcoal powder, described insulation material layer is phenoplasts, described thermosetting plastic layer accounts for the 57%-62% of the overall component of electronic package of insulation, described plasticizer accounts for the 5%-9% of the overall component of electronic package of insulation, and described insulation material layer accounts for the 31%-36% of the overall component of electronic package of insulation.
2. the electronic package of insulation according to claim 1, is characterized in that: described plasticizer is epoxidized soybean oil plasticiser.
3. the electronic package of insulation according to claim 1, it is characterized in that: described insulation material layer is phenoplasts, described thermosetting plastic layer accounts for 59% of the overall component of electronic package of insulation, described plasticizer accounts for 7% of the overall component of electronic package of insulation, and described insulation material layer accounts for 34% of the overall component of electronic package of insulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410801112.7A CN104527153A (en) | 2014-12-22 | 2014-12-22 | Insulated electronic plug-in unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410801112.7A CN104527153A (en) | 2014-12-22 | 2014-12-22 | Insulated electronic plug-in unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104527153A true CN104527153A (en) | 2015-04-22 |
Family
ID=52842873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410801112.7A Pending CN104527153A (en) | 2014-12-22 | 2014-12-22 | Insulated electronic plug-in unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104527153A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB674551A (en) * | 1950-06-02 | 1952-06-25 | John Scott Cattell | Dress-coat and like hanger |
| CN102582183A (en) * | 2011-12-29 | 2012-07-18 | 铜陵浩荣电子科技有限公司 | Preparation method of halogen-free flame-retardant paper-based copper-clad plate |
| CN103612443A (en) * | 2013-11-19 | 2014-03-05 | 常熟市一心无纺制品有限公司 | Non-woven fabric free of supporting combustion |
-
2014
- 2014-12-22 CN CN201410801112.7A patent/CN104527153A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB674551A (en) * | 1950-06-02 | 1952-06-25 | John Scott Cattell | Dress-coat and like hanger |
| CN102582183A (en) * | 2011-12-29 | 2012-07-18 | 铜陵浩荣电子科技有限公司 | Preparation method of halogen-free flame-retardant paper-based copper-clad plate |
| CN103612443A (en) * | 2013-11-19 | 2014-03-05 | 常熟市一心无纺制品有限公司 | Non-woven fabric free of supporting combustion |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102173157A (en) | Antistatic composite material, electronic device shell and electronic device | |
| JPS6311780B2 (en) | ||
| CN103509439A (en) | Low-temperature curing epoxy polyester powdery paint used on surface of bakelite and preparation method thereof | |
| CN1392892A (en) | Polyphenyleneoxide-based composite resin composition for IC tray | |
| CN101458983A (en) | Insulation laminated paper board and preparation thereof | |
| TW201141951A (en) | Polyarylene sulfide resin composition | |
| CN103724971A (en) | Transparent halogen-free low smoke antiflaming polycarbonate composite material and preparation method thereof | |
| CN102863926A (en) | Conductive sealant and application thereof | |
| CN104497542B (en) | A kind of preparation technology of power capacitor casing | |
| JP6057216B2 (en) | Insert molding method and insert molded product | |
| KR102175291B1 (en) | Polyester resin composition, and molded artice manufactured therefrom | |
| CN104497544B (en) | A kind of power capacitor casing | |
| CN104527153A (en) | Insulated electronic plug-in unit | |
| KR101581499B1 (en) | Heat radiating macromolecular resin material, heat radiating resin composition, plastic heat radiating material, and method for preparing thereof | |
| CN206685223U (en) | Over-current protecting element with protection shell | |
| CN105199309A (en) | High performance insulated bakelite | |
| KR20120017760A (en) | Heating element | |
| CN105017653A (en) | Impact resistant engineering plastic for electrical equipment and preparation method thereof | |
| CN103264561A (en) | Insulated plastic cement | |
| CN104227930A (en) | Metal-resin composite molded body and method for making same | |
| JP2014148636A (en) | Resin composition and insert molded article | |
| CN104212121A (en) | Acid-alkaline-resistant thermosetting plastic | |
| CN105934452B (en) | Compositions of thermosetting resin, its solidfied material, electrical and electronic parts | |
| CN101527178B (en) | Heat shrinkage film interwoven fabric insulating protection belt | |
| KR102076961B1 (en) | Encapsulated Electrical Device and Manufacturing Method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150422 |