CN104526766B - A kind of nanometer cutter for processing nano material and using method thereof - Google Patents

A kind of nanometer cutter for processing nano material and using method thereof Download PDF

Info

Publication number
CN104526766B
CN104526766B CN201410730289.2A CN201410730289A CN104526766B CN 104526766 B CN104526766 B CN 104526766B CN 201410730289 A CN201410730289 A CN 201410730289A CN 104526766 B CN104526766 B CN 104526766B
Authority
CN
China
Prior art keywords
cnt
metallic copper
copper cap
metal probe
piezoelectric ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410730289.2A
Other languages
Chinese (zh)
Other versions
CN104526766A (en
Inventor
贺龙兵
连瑞雪
孙立涛
于涵
王禹欣
姜程程
申畅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Southeast University
Original Assignee
Southeast University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Southeast University filed Critical Southeast University
Priority to CN201410730289.2A priority Critical patent/CN104526766B/en
Publication of CN104526766A publication Critical patent/CN104526766A/en
Application granted granted Critical
Publication of CN104526766B publication Critical patent/CN104526766B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Carbon And Carbon Compounds (AREA)

Abstract

The invention discloses a kind of nanometer cutter for processing nano material and using method thereof, it is U-shaped shell that these cutter comprise cross section, be located at the circuit master control of U-shaped shell aperture end, if the Piezoelectric Ceramic cylinder of one end in the enclosure, metallic copper cap and the metal probe of metallic copper cap can be loaded into, if four electrode connecting lines of other one end in the enclosure, first supports potsherd, spring compression module, second supports potsherd, four electrode connecting piece and CNT, the accurate movement of metallic copper cap and metal probe is controlled by Piezoelectric Ceramic cylinder, CNT is fixed on any two electrodes of four electrode connecting piece, by master control circuit module to CNT two ends load voltage, carbon nanometer produces Joule heat, is moved by Piezoelectric Ceramic cylinder control metallic copper cap and metal probe, namely carries out nanometer cutting needing the nano wire of cutting to be placed on CNT.

Description

A kind of nanometer cutter for processing nano material and using method thereof
Technical field
The present invention relates to for nano material micro-nano technology field of nanometer devices, particularly relate to a kind of design of the nanotube cutter for nano material cutting processing.
Background technology
Along with the development of micro-nano electronics, the size of electronic device is done less and less, integrated level is more and more higher, and traditional MEMS also develops to nano electromechanical systems gradually.Build micro-nano device to need to use various nano material, comprise one-dimensional nano line, nano particle, two-dimensional nano sheet etc.Preparation nano material has the method for top-down micro fabrication and self assembly from bottom to top usually, and two kinds of methods have their own characteristics each.But, because top-down micro fabrication is applicable to carry out structure fabrication usually in substrate, be difficult to obtain unsettled, can the nanostructured of high crystalline quality of free operant, and the nano material of self-assembled growth has the advantages such as high-purity, high-crystallinity, excellent electricity, mechanical characteristic usually from bottom to top, thus the nano material of self-assembled growth is the important materials that nano-device manufactures and designs middle meeting and uses.
The nano material of self-assembled growth, as metal nanometer line, its diameter, degree of crystallinity can be carried out Effective Regulation by chemical means, but is usually difficult to accurate control to its length usually.In addition, for two-dimensional nano sheet, owing to being difficult to control its geometry in growth course, thus current still cannot prepare to have specify the two-dimentional lamellar structure of geometry.These restraining factors all limit the application of nano material on nano-device.Explore a kind of method effectively can cut out nano material, design a kind of device that can carry out cutting processing to nano material, to the great significance for design of applications to nanostructures and nano-device.
In addition, in the research process of nano material, researcher finds that the properity of nano material can be closely related with its geometry.Such as, nanocatalyst, Graphene, molybdenum sulfide etc., their character is by the multifactor impact such as its structure, edge pattern.In order to be familiar with contacting between the different geometry states of nano material and its character, performance further, researcher needs optionally to process these nano materials, cut.And current still shortage can carry out processing to nano material the effective ways cut, the cutting tool thus exploring a kind of nanoscale is significant too for the stuctures and properties of further investigation nano material.
Summary of the invention
Technical problem solved by the invention is:
Design a kind of nanometer cutter that can be used for cutting nano material.Utilize the nanometer cutter designed by the present invention can carry out geometry to structures such as nano wire, nano particle, nanometer sheet to cut out, thus promote the further investigation of nano material and promote the application of nano material in nano-device.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is:
The invention provides a kind of nanometer cutter for processing nano material, comprising cross section is U-shaped shell, be located at the circuit master control of U-shaped shell aperture end, if the Piezoelectric Ceramic cylinder of one end, metallic copper cap and the metal probe of metallic copper cap can be loaded in the enclosure, if four contact conductors, first of one end support potsherd in addition in the enclosure, spring compression module, second supports potsherd, four electrode connecting piece of four electrodes compositions and CNT; Piezoelectric Ceramic wound packages to be assigned in U-shaped shell and to be connected with circuit master control, and metallic copper cap is fixed on Piezoelectric Ceramic cylinder front end, and metal probe is dismountable to be fixed on metallic copper cap; First supports potsherd to be fixed in U-shaped shell and to be connected with four contact conductors, four contact conductors are by U-shaped outer casing inner wall lead-in wire connecting circuit master control, second supports potsherd is fixed in U-shaped shell, utilize spring compression module pressing and connect the first support potsherd and second and support potsherd, four electrode connecting piece are fixed on the second piezoelectric ceramic piece; Controlled the accurate movement of metallic copper cap and metal probe by Piezoelectric Ceramic cylinder, CNT is fixed on any two electrodes of four electrode connecting piece.
Preferably, described first support potsherd and second supports on potsherd and has four apertures, and in aperture and aperture both sides deposit gold or platinum electrode, four electrodes independent not conducting mutually separately on each potsherd.
Preferably, the base material that described four electrode connecting piece use is aluminium oxide or silicon nitride, and four electrode materials are gold, platinum or nickel gold.
Preferably, described four electrodes are close between two in substrate one end, and two width between electrode are 2 μm ~ 20 μm, and two groups of close electrodes have part to be suspended on outside substrate, and electrode pendulous tank is 0.1 μm ~ 20 μm, shown in Fig. 2.
Preferably, the material of described metal probe is tungsten, gold, copper or aluminium.
Preferably, the on-load voltage of described circuit master control is 0.1V ~ 5V.
For processing a using method for the nanometer cutter of nano material, it uses step as follows:
1. take off metallic copper cap and metal probe, in carbon nanotube powder, adhere to CNT with tweezers grip probe;
2. the metal probe being stained with CNT is fixed back on metallic copper cap, then metallic copper cap is fixed back on Piezoelectric Ceramic cylinder;
3. the structure assembled being loaded in transmission electron microscope, by controlling Piezoelectric Ceramic cylinder moving metal copper cap and metal probe, the CNT on metal probe being snapped on the overhanging portion of four electrodes;
4. retract Piezoelectric Ceramic cylinder, assembly structure is taken out from transmission electron microscope, take off metallic copper cap and metal probe;
5. take off the metal probe with CNT from metallic copper cap, get a new metal probe and glue the material got and need cutting, the metal probe being stained with material to be cut is reinstalled on metallic copper cap;
6. assembly structure is loaded transmission electron microscope, made the CNT of nano silver wire on four electrodes on metal probe by mobile Piezoelectric Ceramic cylinder;
7. carry out on-load voltage electric current by circuit master control to the CNT in four electrode connecting piece, mobile Piezoelectric Ceramic cylinder makes the material to be cut on metal probe cost CNT, is cut nano silver wire by the joule heat of CNT.
The invention has the beneficial effects as follows: the present invention proposes a kind of nanometer cutter for processing nano material, this invention effectively can make up the current deficiency to nano material processing cutting means.Resistant to elevated temperatures CNT is adopted to snap into the overhanging portion of the electrode of four electrode connecting piece, be connected with circuit master control after supporting potsherd, spring compression module, the first support potsherd, four electrode connecting lines connections by second, make CNT forms current loop, carbon nanotube loaded upper electric current is allowed by circuit master control, carbon pipe is made to have very high-temperature, when needing the nano material of cutting to be positioned on the CNT of heating, can cut nano material.The CNT cutter of the present invention's design, not only can repair and cut out nano material and be beneficial to nano-device and manufacture and design, can also repair and cut out nano material for studying the corresponding relationship of its Structure and Properties.
Accompanying drawing explanation
Fig. 1: a kind of device schematic diagram that can be used for the nanometer cutter cutting nano material.
Fig. 2: four electrode connecting piece schematic diagrames of CNT are carried in the present invention.
Fig. 3: the present invention is for cutting nano silver wire instance graph.
Reference numeral: 1-circuit master control; 2-U type shell; 3-Piezoelectric Ceramic cylinder; 4-metallic copper cap; 5-metal probe; 6-tetra-electrode connecting piece; 7-second supports potsherd; 8-spring compression module; 9-first supports potsherd; 10-tetra-contact conductor; 11-metal four electrode connecting line; 12-CNT
Detailed description of the invention
The operation principle of the present invention's design is: overhanging portion CNT being snapped into the electrode of four electrode connecting piece, be connected with circuit master control after supporting potsherd, spring compression module, the first support potsherd, four electrode connecting lines connections by second, make CNT forms current loop, carbon nanotube loaded upper electric current (size of current is between 1 μ A-1mA) is allowed by circuit master control, now carbon pipe has very high-temperature, needing the nano material of cutting to be positioned on the CNT of heating, nano material is cut.
Below in conjunction with Figure of description, the present invention is further illustrated.
To cut nano silver wire, illustrate and use the basic cutting process of the present invention's design to nano wire:
piezoelectric Ceramic cylinder 3, metallic copper cap 4, tungsten pin are installed respectively in U-shaped shell mechanism, four electrode connecting piece 6, second support potsherd 7, spring compression module 8, first supports potsherd 9, four contact conductor 10, circuit master control 1 in connection;
take off metallic copper cap 4 and tungsten pin, rub with tweezers grip tungsten pin melon on multi-wall carbon nano-tube pipe powder, make tungsten pin is stained with CNT 12;
the tungsten pin being stained with CNT 12 is fixed back on metallic copper cap 4, then metallic copper cap 4 is fixed back on Piezoelectric Ceramic cylinder 3;
the structure that assembles is loaded in transmission electron microscope, by controlling Piezoelectric Ceramic cylinder 3 moving metal tungsten pin, on the unsettled electrode CNT 12 on tungsten pin being snapped into four electrode connecting piece 6 and deposit amorphous carbon layers be fixed;
retract Piezoelectric Ceramic cylinder 3, assembly structure is taken out from transmission electron microscope, take off metallic copper cap 4 and tungsten pin;
take off the tungsten pin with CNT 12 from metallic copper cap 4, get a new tungsten pin and glue the nano silver wire got and need cutting, the tungsten pin being stained with nano silver wire is reinstalled metallic copper cap 4;
assembly structure is loaded in transmission electron microscope again, makes nano silver wire on tungsten pin near CNT 12 by mobile Piezoelectric Ceramic cylinder 3;
carry out loading current by circuit master control 1 to the CNT 12 in four electrode connecting piece 6, mobile Piezoelectric Ceramic cylinder 3 makes nano silver wire cost CNT 12, is cut, as shown in Figure 3 by the joule heat of CNT 12 to nano silver wire.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.

Claims (7)

1. one kind for processing the nanometer cutter of nano material, it is characterized in that: comprising cross section is U-shaped shell (2), be located at the circuit master control (1) of U-shaped shell (2) openend, if the Piezoelectric Ceramic cylinder (3) of one end in the enclosure, metallic copper cap (4) and the metal probe (5) of metallic copper cap (4) can be loaded into, if four contact conductors (10) of other one end in the enclosure, first supports potsherd (9), spring compression module (8), second supports potsherd (7), four electrode connecting piece (6) that four electrodes (11) form and CNT, Piezoelectric Ceramic cylinder (3) to be assemblied in U-shaped shell (2) and to be connected with circuit master control (1), and metallic copper cap (4) is fixed on Piezoelectric Ceramic cylinder (3) front end, and Demountable metallic probe (5) is fixed on metallic copper cap (4), first supports potsherd (9) to be fixed in U-shaped shell (2) and to be connected with four contact conductors (10), four contact conductors (10) are by U-shaped shell (2) inwall lead-in wire connecting circuit master control (1), second supports potsherd (7) is fixed in U-shaped shell (2), utilize spring compression module (8) to compress and connect the first support potsherd (9) and second and support potsherd (7), four electrode connecting piece (6) are fixed on the second piezoelectric ceramic piece (7), controlled the accurate movement of metallic copper cap (4) and metal probe (5) by Piezoelectric Ceramic cylinder (3), CNT is fixed on any two electrodes of four electrode connecting piece (6).
2. a kind of nanometer cutter for processing nano material according to claim 1, it is characterized in that described first support potsherd (9) and second supports on potsherd (7) and have four apertures, in aperture and aperture both sides deposit gold or platinum electrode, four electrodes independent not conducting mutually separately on each potsherd.
3. a kind of nanometer cutter for processing nano material according to claim 1, is characterized in that the base material that described four electrode connecting piece (6) use is aluminium oxide or silicon nitride, and four electrodes (11) material is gold, platinum or nickel gold.
4. a kind of nanometer cutter for processing nano material according to claim 3, it is characterized in that described four electrodes (11) are close between two in substrate one end, two width between electrode are 2 μm ~ 20 μm, two groups of close electrodes have part to be suspended on outside substrate, and electrode pendulous tank is 0.1 μm ~ 20 μm.
5. a kind of nanometer cutter for processing nano material according to claim 1, is characterized in that the material of described metal probe (5) is tungsten, gold, copper or aluminium.
6. a kind of nanometer cutter for processing nano material according to claim 1, is characterized in that the on-load voltage of described circuit master control is 0.1V ~ 5V.
7. the using method of a kind of nanometer cutter for processing nano material as claimed in claim 1, it uses step as follows:
1. take off metallic copper cap (4) and metal probe (5), in carbon nanotube powder, adhere to CNT with tweezers grip probe (5);
2. the metal probe (5) being stained with CNT is fixed back on metallic copper cap (4), then metallic copper cap (4) is fixed back on Piezoelectric Ceramic cylinder (3);
3. the structure assembled being loaded in transmission electron microscope, by controlling Piezoelectric Ceramic cylinder (3) moving metal copper cap (4) and metal probe (5), the CNT on metal probe (5) being snapped on the overhanging portion of four electrodes (11);
4. retract Piezoelectric Ceramic cylinder (3), assembly structure is taken out from transmission electron microscope, take off metallic copper cap (4) and metal probe (5);
5. take off the metal probe (5) with CNT from metallic copper cap (4), get that a new metal probe (5) is sticky gets the material needing cutting, the metal probe (5) being stained with material to be cut is reinstalled on metallic copper cap (4);
6. assembly structure is loaded transmission electron microscope, made the CNT of nano silver wire on four electrodes (11) on metal probe (5) by mobile Piezoelectric Ceramic cylinder (3);
7. by circuit master control (1), on-load voltage electric current is carried out to the CNT in four electrode connecting piece (6), mobile Piezoelectric Ceramic cylinder (3) makes the material to be cut on metal probe (5) cost CNT, is cut nano silver wire by the joule heat of CNT.
CN201410730289.2A 2014-12-04 2014-12-04 A kind of nanometer cutter for processing nano material and using method thereof Active CN104526766B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410730289.2A CN104526766B (en) 2014-12-04 2014-12-04 A kind of nanometer cutter for processing nano material and using method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410730289.2A CN104526766B (en) 2014-12-04 2014-12-04 A kind of nanometer cutter for processing nano material and using method thereof

Publications (2)

Publication Number Publication Date
CN104526766A CN104526766A (en) 2015-04-22
CN104526766B true CN104526766B (en) 2016-03-30

Family

ID=52842491

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410730289.2A Active CN104526766B (en) 2014-12-04 2014-12-04 A kind of nanometer cutter for processing nano material and using method thereof

Country Status (1)

Country Link
CN (1) CN104526766B (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0304623D0 (en) * 2003-02-28 2003-04-02 Univ Surrey Methods for the fabrication of nanoscale structures and semiconductor devices
JP4730686B2 (en) * 2005-03-28 2011-07-20 独立行政法人物質・材料研究機構 Carbon fiber cutting and processing methods
CN100503424C (en) * 2006-09-22 2009-06-24 北京大学 Method for accurately cutting-connecting nano material
KR20110070031A (en) * 2009-12-18 2011-06-24 동우 화인켐 주식회사 Nanoneedle tip for atomic force microscope and method for fabricating the same
CN102581460B (en) * 2012-03-09 2015-05-13 常州萨恩斯机电设备有限公司 Nanoscale resistance spot welding device and nanoscale resistance spot welding method

Also Published As

Publication number Publication date
CN104526766A (en) 2015-04-22

Similar Documents

Publication Publication Date Title
Wang et al. Ultrathin Au nanowires and their transport properties
Zhao et al. Electrical breakdown of nanowires
Dan et al. Continuous and scalable fabrication of transparent conducting carbon nanotube films
Wang et al. Bicrystalline hematite nanowires
Mazloumi et al. Fabrication of three-dimensional carbon nanotube and metal oxide hybrid mesoporous architectures
CN100543905C (en) A kind of field emission apparatus and preparation method thereof
Liu et al. Measuring the work function of carbon nanotubes with thermionic method
JP4365398B2 (en) Field emission device and manufacturing method thereof
Wang et al. Preparation and characterization of ZnO hollow spheres and ZnO− carbon composite materials using colloidal carbon spheres as templates
Chu et al. Filling of carbon nanotubes with silver, gold, and gold chloride
Zhang et al. In situ fabrication of inorganic nanowire arrays grown from and aligned on metal substrates
Al-Tabbakh et al. The Fowler− Nordheim plot behavior and mechanism of field electron emission from ZnO tetrapod structures
Li et al. Transparent, flexible heater based on hybrid 2D platform of graphene and dry-spun carbon nanotubes
Huang et al. Laser-printed in-plane micro-supercapacitors: from symmetric to asymmetric structure
Tang et al. Synthesis and photoelectrochemical property of urchin-like Zn/ZnO core− shell structures
Yasaei et al. Mapping hot spots at heterogeneities of few-layer Ti3C2 MXene sheets
Daneshvar et al. Ultralong electrospun copper–carbon nanotube composite fibers for transparent conductive electrodes with high operational stability
Barnett et al. Experimental measurement of angular and overlap dependence of conduction between carbon nanotubes of identical chirality and diameter
Kaindl et al. Aerosol jet printing of graphene and carbon nanotube patterns on realistically rugged substrates
CN101540251A (en) Field-emission electron source
Palomino et al. Ultrananocrystalline diamond-decorated silicon nanowire field emitters
Li et al. High-performance field emitters based on SiC nanowires with designed electron emission sites
US7504014B2 (en) High density interconnections with nanowiring
Zhou et al. Synthesis and field emission property of V2O5⊙ n H2O nanotube arrays
Mandal et al. Gold nanoparticle embedded paper with mechanically exfoliated graphite as flexible supercapacitor electrodes

Legal Events

Date Code Title Description
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant