CN104505587A - LDS (Laser Direct Structuring) antenna manufacturing method utilizing shielding template - Google Patents

LDS (Laser Direct Structuring) antenna manufacturing method utilizing shielding template Download PDF

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Publication number
CN104505587A
CN104505587A CN201410785670.9A CN201410785670A CN104505587A CN 104505587 A CN104505587 A CN 104505587A CN 201410785670 A CN201410785670 A CN 201410785670A CN 104505587 A CN104505587 A CN 104505587A
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CN
China
Prior art keywords
template
laser light
carrier
lds
laser
Prior art date
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Pending
Application number
CN201410785670.9A
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Chinese (zh)
Inventor
张为林
熊熠
吕华东
丁迎伟
翟后明
赵品军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Amphenol Airwave Communication Electronics Co Ltd
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Shanghai Amphenol Airwave Communication Electronics Co Ltd
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Priority to CN201410785670.9A priority Critical patent/CN104505587A/en
Publication of CN104505587A publication Critical patent/CN104505587A/en
Pending legal-status Critical Current

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Abstract

The invention aims to provide an LDS (Laser Direct Structuring) antenna manufacturing method utilizing a shielding template. During the laser activation process of an LDS antenna, the shielding template is utilized to shield laser energy of areas with no need for laser, so that the laser energy with sufficient area of each track can scorch a laser activation area corresponding to the preset shielding template. Accumulated metal is electrically or chemically plated on the laser activation area to form a metal circuit of the LDS antenna.

Description

Utilize the LDS antenna manufacturing method blocking template
Technical field
The present invention relates to laser direct structuring technique field, particularly, relate to a kind of LDS antenna manufacturing method utilizing shutter.
Background technology
Laser direct structuring technique (LDS-Laser Direct Structuring) is a kind of professional radium-shine processing, the 3D-MID(Three-dimensionalmouldedinterconnectdevice of injection and electroplating process) production technology, its principle gives electric interconnection function by common plastic cement element/circuit board, support the support of components and parts function and plastic casing, the functions such as protection, and the shielding being combined with conductive pattern by mechanical entities and producing, the functions such as antenna are in conjunction with what one, form so-called 3D-MID, be suitable for what ICSubstrate, HDIPCB, fine rule road, LeadFrame local makes.
This technology can be applicable to antenna for mobile phone, automobile electrical electronic circuit, ATM (automatic teller machine) shell and. medical grade hearing aids.Modal at what antenna for mobile phone at present, construction method in general common antenna for mobile phone, sheet metal is fixed on mobile phone shell on the back in the plastic cement heat mode of melting or is directly attached to by sheet metal on mobile phone shell on the back by most employing, antenna can directly be produced on phone housing by LDS, not only avoid inner mobile phone metal to disturb, more reduce mobile phone volume.
Usual LDS manufacturing technology is through after Laser machine stand accepts numerical digit circuit data, by the anti-etching resist burn off of PCB surface tin, Hou impose galvanic metallization again, the circuit of metal material can be produced at plastic surface.
And the radium-shine process of LDS common mostly at present is the radium-shine track of machine program to control product LDS polymer by the shape of activating area and precision.There is following defect in current this method:
1. make the radium-shine track program of LDS and need considerable time;
2. there is some difference for the homogeneity of product of different batches and production of machinery;
3. production speed is relatively low;
4.LDS polymer is relatively poor by the location dimension precision of radium-shine activating area.
Summary of the invention
For defect of the prior art, the object of this invention is to provide the LDS antenna manufacturing method that template is blocked in a kind of utilization, in the radium-shine activation process of LDS antenna, utilize and block template to cover the radium-shine energy not needing radium-shine region, thus make the radium-shine energy of enough areas of arbitrary trajectory calcination can go out preset to block radium-shine activating area corresponding to template.
According to a kind of LDS antenna manufacturing method utilizing shutter provided by the invention, comprise the following steps:
S1, laser source sends laser light, and what described laser light incidence one included openwork part blocks template;
S2, described laser light through described block template after, do not blocked the laser light that template blocks incide on the carrier containing metal solvent by described;
S3, is not describedly blocked the laser light that template blocks activated the irradiated area of described carrier by described, obtains the plating the changed carrier with metal crystal nuclei;
S4, electroplates describedization plating carrier or changes depositing process, based on described metal crystal nuclei, depositing some metal levels, thus form the metallic circuit of LDS antenna at described irradiation area.
As prioritization scheme, described step S1 comprises further: described laser light becomes one to preset the first angle incidence with described template of blocking.
As prioritization scheme, the described first default angle is 90 degree.
As prioritization scheme, described step S2 comprises further: described in block template become with described carrier one preset the second angle be oppositely arranged.
As prioritization scheme, the described second default angle is 0 degree.As prioritization scheme, described laser source rated power is 3-12 watt.
As prioritization scheme, described laser light frequency is 40-200KHz.
As prioritization scheme, the translational speed of described laser source is 2000-4000mm/s.
As prioritization scheme, described in block the openwork part of template corresponding with the metallic circuit of LDS antenna to be processed on carrier, and described openwork part the smooth of the edge.
As prioritization scheme, described in block template material therefor be iron or aluminium or copper.
As prioritization scheme, described carrier has any three-dimensional shape.
Compared with prior art, the present invention has following beneficial effect:
1, control product by LDS shape by the exposed region of shutter, without the need to specific radium-shine track formula, exempt the time making radium-shine track formula.
2, shutter is applicable to the LDS machine of various model, can ensure that the product that product is produced on different time and the radium-shine machine of Different L DS has better consistency.
3, the exposed region energy obviously improving product throughput rate of disposable calcination shutter is carried out by large-area radium-shine light beam.
4, the radium-shine Product Precision of precision control LDS according to shutter dimensional accuracy and product orientation has more stability and superiority.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme of the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, obviously, accompanying drawing in the following describes is only some embodiments of the present invention, for those skilled in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.In accompanying drawing:
Fig. 1 is a kind of LDS antenna manufacturing method schematic flow sheet utilizing shutter in optional embodiment;
Fig. 2 fixes laser source normal incidence schematic diagram in optional embodiment;
Fig. 3 fixes laser source to become oblique incidence schematic diagram in optional embodiment;
Fig. 4 is carrier schematic diagram to be processed in optional embodiment;
Fig. 5 blocks template schematic diagram in optional embodiment;
Fig. 6 is mobile laser source normal incidence schematic diagram in optional embodiment.
Embodiment
Hereafter in the mode of specific embodiment, the present invention is described in detail by reference to the accompanying drawings.Following examples will contribute to those skilled in the art and understand the present invention further, but not limit the present invention in any form.It should be pointed out that the embodiment that can also use other, or the amendment on 26S Proteasome Structure and Function is carried out to the embodiment enumerated herein, and can not depart from the scope and spirit of the present invention.
In the embodiment of a kind of LDS antenna manufacturing method utilizing shutter provided by the invention, as shown in Figure 1, comprise the following steps:
s1, laser source sends laser light, and what described laser light incidence one included openwork part blocks template.
As shown in Figure 2, as prioritization scheme, described step S1 comprises further: described laser light becomes one to preset the first angle incidence with described template of blocking.Described in embodiment shown in Fig. 2, the first default angle is 90 degree, and this laser light normal incidence blocks template.
As prioritization scheme, described laser source rated operating range is 3-12 watt.The present embodiment selection rated power is that the laser source of 5W is incident.
As prioritization scheme, described laser light frequency range is 40-200KHz.The present embodiment selects laser light frequency to be 80 KHz.
As prioritization scheme, described laser light velocity interval is 2000-4000mm/s.The present embodiment selects laser light speed to be 3000mm/s.
s2, described laser light through described block template after, do not blocked the laser light that template blocks incide on the carrier containing metal solvent by described.
As prioritization scheme, described step S2 comprises further: described in block template become with described carrier one preset the second angle be oppositely arranged.Described in embodiment shown in Fig. 2, Fig. 3, Fig. 6, second presets angle and is all 0 degree, namely blocks template and described supported parallel is placed.Described second default angle also can arrange and not be 0 degree, do not blocked laser light that template blocks block template hypsokinesis and be tiltedly radiated on described carrier by this by described, radium-shine activation processing can be carried out equally to this carrier, but the uneven problem of activation can be produced owing to irradiating uneven, need the irradiation time of increase laser light or the uniformity of laser light is regulated, so that irradiation area obtains uniform radium-shine activation.
Carrier of the present invention has any three-dimensional shape, can be flat board as shown in Figure 2, also can be other molded non-planars.And described in block the openwork part of template corresponding with the metallic circuit of LDS antenna to be processed on carrier, namely when the metallic circuit of the LDS antenna needing processing is circular, then adopt openwork part as shown in Figure 2 and Figure 3, when the metallic circuit of the LDS antenna needing processing is square, then adopt openwork part as shown in Figure 5.In the present embodiment, carrier is plastic parts.
s3, is not describedly blocked the laser light that template blocks activated the irradiated area of described carrier by described, obtains the plating the changed carrier with metal crystal nuclei.
s4, electroplates describedization plating carrier or changes depositing process, based on described metal crystal nuclei, depositing some metal levels, thus form the metallic circuit of LDS antenna at described irradiation area.smooth edge can obtain edge boundary clear significantly described in not by the described laser light blocking template and block, the zone boundary being conducive to subsequent activation process is clear, so that the metallic circuit finally produced has default shape.
As prioritization scheme, described in block template material therefor be the impenetrable material of the laser light such as iron or copper.Adopt the metal of the not saturating laser light such as iron, aluminium or copper to make and block template, the openwork part that edge is enough level and smooth can be processed, and adopt the materials such as the pig iron also can not reflect laser light, thus avoid impact activation processing produced because blocking mould material reflection laser light.
Embodiment as shown in Figure 3, described first presets angle also can not be 90 degree, template is blocked in laser light oblique incidence, forming an irradiation area be out of shape relative to openwork part with blocking on carrier that template be arranged in parallel, as seen from Figure 3, the mode of this oblique incidence is suitable for the radium-shine carrier activated in the position that is blocked.When processing normal incidence and cannot carrying out the carrier zones of radium-shine activation, the oblique incidence mode shown in Fig. 3 can be adopted to carry out the radium-shine activation of LDS,
Fig. 4 shows carrier to be processed in an optional embodiment, and in figure, dash area is required activation, the pending region changing plating antenna traces.Figure 5 shows that and corresponding with region pending in Fig. 4 block template, be provided with the fall through part corresponding with region pending in Fig. 4 changing to block in template.Illustrated in Fig. 6 and be placed in parallel on the carrier shown in Fig. 4 by the template of blocking shown in Fig. 5, this blocks template and has covered the carrier zones not needing activation processing.Laser source carries out activation processing along openwork part rectilinear movement.In Fig. 6, the direction of arrow is the moving direction of laser source, and the translational speed of described laser source is 2000-4000mm/s.In the embodiment shown in fig. 6, do not need to use the disposable irradiation of laser source comprehensively covered, only need to move in parallel with the laser source of enough width, can complete the radium-shine activation processing to support-activated region yet.Laser source in the present invention has diversified selection.
The foregoing is only preferred embodiment of the present invention, those skilled in the art know, without departing from the spirit and scope of the present invention, can carry out various change or equivalent replacement to these characteristic sum embodiments.In addition, under the teachings of the present invention, can modify to adapt to concrete situation and material to these characteristic sum embodiments and can not the spirit and scope of the present invention be departed from.Therefore, the present invention is not by the restriction of specific embodiment disclosed herein, and the embodiment in the right of all the application of falling into all belongs to protection scope of the present invention.

Claims (10)

1. utilize a LDS antenna manufacturing method for shutter, it is characterized in that, comprise the following steps:
S1, laser source sends laser light, and what described laser light incidence one included openwork part blocks template;
S2, described laser light through described block template after, do not blocked the laser light that template blocks incide on the carrier containing metal solvent by described;
S3, is not describedly blocked the laser light that template blocks activated the irradiated area of described carrier by described, obtains the plating the changed carrier with metal crystal nuclei;
S4, electroplates describedization plating carrier or changes depositing process, based on described metal crystal nuclei, depositing some metal levels, thus form the metallic circuit of LDS antenna at described irradiation area.
2. method according to claim 1, is characterized in that, described step S1 comprises further: described laser light becomes one to preset the first angle incidence with described template of blocking.
3. method according to claim 2, is characterized in that, the described first default angle is 90 degree.
4. method according to claim 1 and 2, is characterized in that, described step S2 comprises further: described in block template become with described carrier one preset the second angle be oppositely arranged.
5. method according to claim 4, is characterized in that, the described second default angle is 0 degree.
6. method according to claim 1, is characterized in that, described laser source rated power is 3-12 watt.
7. method according to claim 1, is characterized in that, described laser light frequency is 40-200KHz.
8. method according to claim 1, is characterized in that, described in block the openwork part of template corresponding with the metallic circuit of LDS antenna to be processed on carrier.
9. method according to claim 1, is characterized in that, described in block template material therefor be iron or aluminium or copper.
10. method according to claim 1, is characterized in that, the translational speed of described laser source is 2000-4000mm/s.
CN201410785670.9A 2014-12-18 2014-12-18 LDS (Laser Direct Structuring) antenna manufacturing method utilizing shielding template Pending CN104505587A (en)

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018209600A1 (en) * 2017-05-17 2018-11-22 广东通宇通讯股份有限公司 Radiation element, as well as antenna unit and antenna array thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101049772A (en) * 2007-05-12 2007-10-10 陈伟良 Method for fabricating nonmetallic slices by using laser
CN102164194A (en) * 2011-04-11 2011-08-24 深圳市厚泽真空技术有限公司 Mobile phone, vacuum coating surface treatment antenna and making method thereof
KR20120029063A (en) * 2010-09-16 2012-03-26 주식회사 이엠따블유 Lds plastic material and fabricating method the same
CN102610899A (en) * 2012-03-14 2012-07-25 广东欧珀移动通信有限公司 Laser forming antenna and manufacturing process thereof
CN103730720A (en) * 2013-12-20 2014-04-16 上海安费诺永亿通讯电子有限公司 Method for manufacturing antenna circuit on surface of antenna carrier with shielding structure

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101049772A (en) * 2007-05-12 2007-10-10 陈伟良 Method for fabricating nonmetallic slices by using laser
KR20120029063A (en) * 2010-09-16 2012-03-26 주식회사 이엠따블유 Lds plastic material and fabricating method the same
CN102164194A (en) * 2011-04-11 2011-08-24 深圳市厚泽真空技术有限公司 Mobile phone, vacuum coating surface treatment antenna and making method thereof
CN102610899A (en) * 2012-03-14 2012-07-25 广东欧珀移动通信有限公司 Laser forming antenna and manufacturing process thereof
CN103730720A (en) * 2013-12-20 2014-04-16 上海安费诺永亿通讯电子有限公司 Method for manufacturing antenna circuit on surface of antenna carrier with shielding structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018209600A1 (en) * 2017-05-17 2018-11-22 广东通宇通讯股份有限公司 Radiation element, as well as antenna unit and antenna array thereof

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Application publication date: 20150408

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