CN104497497A - Thermally conductive epoxy resin and preparation method thereof - Google Patents
Thermally conductive epoxy resin and preparation method thereof Download PDFInfo
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- CN104497497A CN104497497A CN201410739699.3A CN201410739699A CN104497497A CN 104497497 A CN104497497 A CN 104497497A CN 201410739699 A CN201410739699 A CN 201410739699A CN 104497497 A CN104497497 A CN 104497497A
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Abstract
The invention discloses a thermally conductive epoxy resin and a preparation method thereof. The thermally conductive epoxy resin comprises the following components in parts by weight: 0.5 to 3.0 parts of a carbon nanotube grafted with polyurethane prepolymer on the surface, 60 to 80 parts of epoxy resin, and 10 to 30 parts of an aromatic amine curing agent. According to the method provided by the invention, the addition amount of used thermally conductive filler is few, and a coupling agent and a toughening agent are not needed; the obtained epoxy resin material has thermal conductivity and good product stability, and can be used in heat dissipation and other aspects of electronic appliances.
Description
Technical field
The present invention relates to a kind of polymer composite and preparation method thereof, specifically a kind of heat-conduction epoxy resin and preparation method thereof, belongs to technical field of polymer composite materials.
Background technology
Epoxy resin has high crosslinking structure, and thermal conductivity is 0.2 W.m
-1.K
-1left and right, is the poor conductor of heat, has good processing performance and workability, is applicable to the filling of high fill-ratio filler, is therefore used widely in heat-conducting resin field.But epoxy resin exists the shortcoming that easily crisp, shock resistance is poor, it is made to need dissipation from electronic devices at some and the application of the occasion that has certain requirements to mechanical property is restricted.
Carbon nanotube tensile strength reaches 50 ~ 200GPa, is the strongest fiber; Having excellent axial conductivity, is good One-dimensional Quantum wire; Carbon nanotube has very large length-to-diameter ratio, and thus its heat exchange performance is alongst very high, and heat conductivility is far superior to metallic substance, if the room temperature thermal conductivity of Single Walled Carbon Nanotube is in theory up to 6600W.m
-1.K
-1.Therefore, select the filler of carbon nanotube as epoxy resin of high thermoconductivity, not only can improve the thermal conductivity of epoxy resin significantly, also likely utilize the intensity that carbon nanotube is high and Young's modulus to improve the mechanical property of composites.
Application number is that the Chinese patent of CN201010155479.8 discloses " a kind of isotropic high-performance thermal conductive adhesive for filling carbon nano tube ", this patent is in order to improve the performance of epoxy resin, with the addition of the epoxy resin toughness properties-correcting agent of 15 ~ 25%, but adding of toughner will inevitably have an impact to other performances of material; Application number is that the Chinese patent of CN201110329520.3 discloses " a kind of carbon nano-tube filled type great power LED high heat-conductivity conducting crystal-bonding adhesive stick ", the method is in order to strengthen the combination of carbon nanotube and matrix resin, employ the coupling agent of 1 ~ 2%, but hydrolysis can occur silane coupling agent separates out low-molecular material, thus increase porosity, reduce effective bond area; Simultaneously because the polymerization etc. of the residual of water molecules and coupling agent itself also can constituent material defect occur, produce internal stress, the strength of materials is reduced.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, provide a kind of with the carbon nanotube of surface grafting base polyurethane prepolymer for use as heat conductive filler, epoxy resin is heat-conduction epoxy resin of matrix and preparation method thereof.
Technical scheme of the present invention is as follows: a kind of heat-conduction epoxy resin, by polyvalent alcohol, tolylene diisocyanate, carbon nanotube, chloride reagent, quadrol, epoxy resin, aromatic amine solidifying agent, prepared by employing following steps, described raw material number, except specified otherwise, is mass fraction:
(1) polyvalent alcohol of dehydration and tolylene diisocyanate (TDI) are joined in there-necked flask according to the ratio of OH:NCO=1:2, pass into nitrogen, reactant is stirred, at temperature is 80 DEG C, reacts 4 ± 0.5h, obtains base polyurethane prepolymer for use as;
(2) 0.5 ~ 3.0 part of carbon nanotube is put into dense H
2sO
4and HNO
3mixed solution in, under ultra-sonic oscillation and mechanical agitation, process 2 ~ 6h, then uses a large amount of deionized water wash to neutral; Dense H
2sO
4and HNO
3mixed solution in H
2sO
4and HNO
3volume ratio is 3:1;
(3) carbon nanotube after step (2) being processed adds in 20 ~ 60 parts of chloride reagents, is heated to 60 DEG C under sonic oscillation, backflow 24h, and underpressure distillation afterwards removes unnecessary chloride reagent;
(4) add in the quadrol of 30 ~ 60 parts by the carbon nanotube that step (3) obtains, 120 DEG C of magnetic agitation reaction 96h, filter, wash away excessive quadrol with dehydrated alcohol, 70 DEG C of vacuum-dryings, obtain amidized carbon nanotube;
(5) added by the carbon nanotube that step (4) obtains in the polyurethane prepolymer that step (1) obtains, sonic oscillation is heated to 80 DEG C, and reaction 8 ~ 12h, filters, by washing with alcohol, obtain the carbon nanotube of surface grafting base polyurethane prepolymer for use as;
(6) 60 ~ 80 parts of epoxy resin are heated to 100 DEG C, then the carbon nanotube that step (5) obtains is added, high-speed stirring 10 ~ 30min, add 8 ~ 30 parts of aromatic amine solidifying agent again, continue high-speed stirring 5min, be cast in mould, 80 ~ 100 DEG C of solidification 2h, 130 ~ 150 DEG C of solidification 4h, obtain heat-conduction epoxy resin material after shaping.
Described carbon nanotube is particle diameter 50 ~ 200nm, the multi-walled carbon nano-tubes that length is 10 ~ 50 μm.
Described epoxy resin is liquid bisphenol A type epoxy resin, can be at least one in epoxy resin E-51, E-44, E-42, E-54.
Described aromatic amine solidifying agent is at least one in two amido sulfobenzides, two amido ditanes, mphenylenediamine.
Described polyvalent alcohol can be at least one in polyether glycol N210, N220, N303.
Described tolylene diisocyanate can be at least one in TDI-80/20, TDI-100, TDI-65/35.
Described chloride reagent is at least one in sulfur oxychloride, oxalyl chloride.
The present invention is as follows relative to the beneficial effect of prior art: the present invention uses the carbon nanotube of surface grafting base polyurethane prepolymer for use as heat conductive filler, dispersion in the epoxy, preparation has the epoxide resin material of heat conductivility, the urethane of grafting on carbon nanotube can be utilized on the one hand to improve the toughness of epoxy resin, the heat conductivility of material can be ensured on the other hand.The addition of the functional stuffing that the inventive method uses is few, does not need to use coupling agent and toughner, and the good stability of product, can be used for the aspect such as electrical equipment, electronic radiation.
Embodiment
Be described in further details the present invention below by embodiment, these embodiments are only used for the present invention is described, do not limit the scope of the invention.
Embodiment 1 adopts following steps to realize the preparation of heat-conduction epoxy resin of the present invention:
(1) polyether glycol N210 and TDI-100 is joined in there-necked flask according to OH:NCO=1:2 ratio, pass into nitrogen, reactant is stirred, at temperature is 80 DEG C, reacts 4h, obtains base polyurethane prepolymer for use as;
(2) 1.0 parts of carbon nanotubes are put into dense H
2sO
4and HNO
3mixed solution (dense H
2sO
4and HNO
3volume ratio is 3:1) in, under ultra-sonic oscillation and mechanical agitation, process 3h, then uses a large amount of deionized water wash to neutral;
(3) added in 20 parts of sulfur oxychlorides by carbon nanotube obtained above, be heated to 60 DEG C under sonic oscillation, backflow 24h, underpressure distillation afterwards removes unnecessary sulfur oxychloride;
(4) add in the quadrol of 50 parts by the carbon nanotube that step (3) obtains, 120 DEG C of magnetic agitation reaction 96h, filter, wash away excessive quadrol with dehydrated alcohol, 70 DEG C of vacuum-dryings, obtain amidized carbon nanotube;
(5) added by amidized carbon nanotube in the polyurethane prepolymer that step (1) obtains, sonic oscillation is heated to 80 DEG C, and reaction 9h, filters, by washing with alcohol, obtain the carbon nanotube of surface grafting base polyurethane prepolymer for use as;
(6) 65 parts of E-54 epoxy resin are heated to 100 DEG C, then the carbon nanotube of 1.5 parts of surface grafting base polyurethane prepolymer for use as is added, high-speed stirring 25min, add 10 part of two amido diphenyl sulfone curing agent again, continue high-speed stirring 5min, be cast in mould, 80 ~ 100 DEG C of solidification 2h, 130 ~ 150 DEG C of solidification 4h, obtain heat-conduction epoxy resin material after shaping.
Embodiment 2 adopts following steps to realize the preparation of heat-conduction epoxy resin of the present invention:
(1) polyether glycol N220 and TDI-65/35 is joined in there-necked flask according to OH:NCO=1:2 ratio, pass into nitrogen, reactant is stirred, at temperature is 80 DEG C, reacts 4.5h, obtains base polyurethane prepolymer for use as;
(2) 1.5 parts of carbon nanotubes are put into dense H
2sO
4and HNO
3mixed solution (dense H
2sO
4and HNO
3volume ratio is 3:1) in, under ultra-sonic oscillation and mechanical agitation, process 4h, then uses a large amount of deionized water wash to neutral;
(3) carbon nanotube obtained above is added 30 parts of oxalyl chlorides, be heated to 60 DEG C under sonic oscillation, backflow 24h, underpressure distillation afterwards removes unnecessary oxalyl chloride;
(4) add in the quadrol of 55 parts by the carbon nanotube that step (3) obtains, 120 DEG C of magnetic agitation reaction 96h, filter, wash away excessive quadrol with dehydrated alcohol, 70 DEG C of vacuum-dryings, obtain amidized carbon nanotube;
(5) added by amidized carbon nanotube in the polyurethane prepolymer that step (1) obtains, sonic oscillation is heated to 80 DEG C, and reaction 10h, filters, by washing with alcohol, obtain the carbon nanotube of surface grafting base polyurethane prepolymer for use as;
(6) 60 parts of E-44 epoxy resin are heated to 100 DEG C, then the carbon nanotube of 1.0 parts of surface grafting base polyurethane prepolymer for use as is added, high-speed stirring 20min, add 20 parts of mphenylenediamine solidifying agent again, continue high-speed stirring 5min, be cast in mould, 85 DEG C of solidification 2h, 140 DEG C of solidification 4h, obtain heat-conduction epoxy resin material after shaping.
Embodiment 3 adopts following steps to realize the preparation of heat-conduction epoxy resin of the present invention:
(1) polyether glycol N303 and TDI-80/20 is joined in there-necked flask according to OH:NCO=1:2 ratio, pass into nitrogen, reactant is stirred, at temperature is 80 DEG C, reacts 3.5h, obtains base polyurethane prepolymer for use as;
(2) 2.0 parts of carbon nanotubes are put into dense H
2sO
4and HNO
3mixed solution (dense H
2sO
4and HNO
3volume ratio is 3:1) in, under ultra-sonic oscillation and mechanical agitation, process 6h, then uses a large amount of deionized water wash to neutral;
(3) carbon nanotube obtained above is added 50 parts of oxalyl chlorides, be heated to 60 DEG C under sonic oscillation, backflow 24h, underpressure distillation afterwards removes unnecessary oxalyl chloride;
(4) add in the quadrol of 60 parts by the carbon nanotube that step (3) obtains, 120 DEG C of magnetic agitation reaction 96h, filter, wash away excessive quadrol with dehydrated alcohol, 70 DEG C of vacuum-dryings, obtain amidized carbon nanotube;
(5) added by amidized carbon nanotube in the polyurethane prepolymer that step (1) obtains, sonic oscillation is heated to 80 DEG C, and reaction 8h, filters, by washing with alcohol, obtain the carbon nanotube of surface grafting base polyurethane prepolymer for use as;
(6) 75 parts of E-51 epoxy resin are heated to 100 DEG C, then the carbon nanotube of 2.0 parts of surface grafting base polyurethane prepolymer for use as is added, high-speed stirring 20min, add 18 part of two amido ditane solidifying agent again, continue high-speed stirring 5min, be cast in mould, 100 DEG C of solidification 2h, 130 DEG C of solidification 4h, obtain heat-conduction epoxy resin material after shaping.
Embodiment 4 adopts following steps to realize the preparation of heat-conduction epoxy resin of the present invention:
(1) polyether glycol N210 and TDI-65/35 is joined in there-necked flask according to OH:NCO=1:2 ratio, pass into nitrogen, reactant is stirred, at temperature is 80 DEG C, reacts 4h, obtains base polyurethane prepolymer for use as;
(2) 2.5 parts of carbon nanotubes are put into dense H
2sO
4and HNO
3mixed solution (dense H
2sO
4and HNO
3volume ratio is 3:1) in, under ultra-sonic oscillation and mechanical agitation, process 5h, then uses a large amount of deionized water wash to neutral;
(3) added in 45 parts of sulfur oxychlorides by carbon nanotube obtained above, be heated to 60 DEG C under sonic oscillation, backflow 24h, underpressure distillation afterwards removes unnecessary sulfur oxychloride;
(4) add in the quadrol of 45 parts by the carbon nanotube that step (3) obtains, 120 DEG C of magnetic agitation reaction 96h, filter, wash away excessive quadrol with dehydrated alcohol, 70 DEG C of vacuum-dryings, obtain amidized carbon nanotube;
(5) added by amidized carbon nanotube in the polyurethane prepolymer that step (1) obtains, sonic oscillation is heated to 80 DEG C, and reaction 9h, filters, by washing with alcohol, obtain the carbon nanotube of surface grafting base polyurethane prepolymer for use as;
(6) 80 parts of E-54 epoxy resin are heated to 100 DEG C, then the carbon nanotube of 2.5 parts of surface grafting base polyurethane prepolymer for use as is added, high-speed stirring 20min, add 25 parts of mphenylenediamine solidifying agent again, continue high-speed stirring 5min, be cast in mould, 95 DEG C of solidification 2h, 135 DEG C of solidification 4h, obtain heat-conduction epoxy resin material after shaping.
Embodiment 5 adopts following steps to realize the preparation of heat-conduction epoxy resin of the present invention:
(1) polyether glycol N303 and TDI-100 is joined in there-necked flask according to OH:NCO=1:2 ratio, pass into nitrogen, reactant is stirred, at temperature is 80 DEG C, reacts 4h, obtains base polyurethane prepolymer for use as;
(2) 3.0 parts of carbon nanotubes are put into dense H
2sO
4and HNO
3mixed solution (dense H
2sO
4and HNO
3volume ratio is 3:1) in, under ultra-sonic oscillation and mechanical agitation, process 2h, then uses a large amount of deionized water wash to neutral;
(3) added in 20 parts of oxalyl chlorides by carbon nanotube obtained above, be heated to 60 DEG C under sonic oscillation, backflow 24h, underpressure distillation afterwards removes unnecessary oxalyl chloride;
(4) add in the quadrol of 55 parts by the carbon nanotube that step (3) obtains, 120 DEG C of magnetic agitation reaction 96h, filter, wash away excessive quadrol with dehydrated alcohol, 70 DEG C of vacuum-dryings, obtain amidized carbon nanotube;
(5) added by amidized carbon nanotube in the polyurethane prepolymer that step (1) obtains, sonic oscillation is heated to 80 DEG C, and reaction 12h, filters, by washing with alcohol, obtain the carbon nanotube of surface grafting base polyurethane prepolymer for use as;
(6) 70 parts of E-42 epoxy resin are heated to 100 DEG C, then the carbon nanotube of 3.0 parts of surface grafting base polyurethane prepolymer for use as is added, high-speed stirring 30min, add 30 part of two amido diphenyl sulfone curing agent again, continue high-speed stirring 5min, be cast in mould, 85 DEG C of solidification 2h, 130 DEG C of solidification 4h, obtain heat-conduction epoxy resin material after shaping.
Embodiment 6 adopts following steps to realize the preparation of heat-conduction epoxy resin of the present invention:
(1) polyether glycol N210 and TDI-80/20 is joined in there-necked flask according to OH:NCO=1:2 ratio, pass into nitrogen, reactant is stirred, at temperature is 80 DEG C, reacts 4h, obtains base polyurethane prepolymer for use as;
(2) 0.5 part of carbon nanotube is put into dense H
2sO
4and HNO
3mixed solution (dense H
2sO
4and HNO
3volume ratio is 3:1) in, under ultra-sonic oscillation and mechanical agitation, process 3h, then uses a large amount of deionized water wash to neutral;
(3) added in 25 parts of sulfur oxychlorides by carbon nanotube obtained above, be heated to 60 DEG C under sonic oscillation, backflow 24h, underpressure distillation afterwards removes unnecessary sulfur oxychloride;
(4) add in the quadrol of 45 parts by the carbon nanotube that step (3) obtains, 120 DEG C of magnetic agitation reaction 96h, filter, wash away excessive quadrol with dehydrated alcohol, 70 DEG C of vacuum-dryings, obtain amidized carbon nanotube;
(5) added by amidized carbon nanotube in the polyurethane prepolymer that step (1) obtains, sonic oscillation is heated to 80 DEG C, and reaction 11h, filters, by washing with alcohol, obtain the carbon nanotube of surface grafting base polyurethane prepolymer for use as;
(6) 80 parts of E-51 epoxy resin are heated to 100 DEG C, then the carbon nanotube of 0.5 part of surface grafting base polyurethane prepolymer for use as is added, high-speed stirring 25min, add 28 part of two amido ditane solidifying agent again, continue high-speed stirring 5min, be cast in mould, 95 DEG C of solidification 2h, 140 DEG C of solidification 4h, obtain heat-conduction epoxy resin material after shaping.
The performance test data that the heat-conduction epoxy resin material that the various embodiments described above obtain is corresponding is as shown in the table.Test result shows, and the heat-conduction epoxy resin material that the inventive method obtains has good heat conductivility, tensile strength and shock strength.
Claims (8)
1. a heat-conduction epoxy resin, is characterized in that: by polyvalent alcohol, tolylene diisocyanate, carbon nanotube, chloride reagent, quadrol, epoxy resin, aromatic amine solidifying agent, and adopt following steps preparation, described raw material number is mass fraction:
(1) polyvalent alcohol of dehydration and tolylene diisocyanate (TDI) are joined in there-necked flask according to the ratio of OH:NCO=1:2, pass into nitrogen, reactant is stirred, at temperature is 80 DEG C, reacts 4 ± 0.5h, obtains base polyurethane prepolymer for use as;
(2) 0.5 ~ 3.0 part of carbon nanotube is put into dense H
2sO
4and HNO
3mixed solution in, under ultra-sonic oscillation and mechanical agitation, process 2 ~ 6h, then uses a large amount of deionized water wash to neutral; Described dense H
2sO
4and HNO
3mixed solution in H
2sO
4and HNO
3volume ratio is 3:1;
(3) carbon nanotube after step (2) being processed adds in 20 ~ 60 parts of chloride reagents, is heated to 60 DEG C under sonic oscillation, backflow 24h, and underpressure distillation afterwards removes unnecessary chloride reagent;
(4) add in the quadrol of 30 ~ 60 parts by the carbon nanotube that step (3) obtains, 120 DEG C of magnetic agitation reaction 96h, filter, wash away excessive quadrol with dehydrated alcohol, 70 DEG C of vacuum-dryings, obtain amidized carbon nanotube;
(5) added by the carbon nanotube that step (4) obtains in the polyurethane prepolymer that step (1) obtains, sonic oscillation is heated to 80 DEG C, and reaction 8 ~ 12h, filters, by washing with alcohol, obtain the carbon nanotube of surface grafting base polyurethane prepolymer for use as;
(6) 60 ~ 80 parts of epoxy resin are heated to 100 DEG C, then the carbon nanotube that step (5) obtains is added, high-speed stirring 10 ~ 30min, add 8 ~ 30 parts of aromatic amine solidifying agent again, continue high-speed stirring 5min, be cast in mould, 80 ~ 100 DEG C of solidification 2h, 130 ~ 150 DEG C of solidification 4h, obtain heat-conduction epoxy resin material after shaping.
2. heat-conduction epoxy resin according to claim 1, is characterized in that: described carbon nanotube is particle diameter 50 ~ 200nm, the multi-walled carbon nano-tubes that length is 10 ~ 50 μm.
3. heat-conduction epoxy resin according to claim 1, is characterized in that: described polyvalent alcohol is at least one in polyether glycol N210, N220, N303.
4. heat-conduction epoxy resin according to claim 1, is characterized in that: described tolylene diisocyanate is at least one in TDI-80/20, TDI-100, TDI-65/35.
5. heat-conduction epoxy resin according to claim 1, is characterized in that: described epoxy resin is liquid bisphenol A type epoxy resin.
6. heat-conduction epoxy resin according to claim 1 or 5, is characterized in that: described epoxy resin is at least one in E-51, E-44, E-42, E-54.
7. heat-conduction epoxy resin according to claim 1, is characterized in that: described aromatic amine solidifying agent is at least one in two amido sulfobenzides, two amido ditanes, mphenylenediamine.
8. heat-conduction epoxy resin according to claim 1, is characterized in that: described chloride reagent is at least one in sulfur oxychloride, oxalyl chloride.
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| CN108300398A (en) * | 2017-12-27 | 2018-07-20 | 天长市墨缘玻璃建材有限公司 | A kind of water-fast weather-resistant pu glass cement of antibacterial |
| CN111303728A (en) * | 2020-04-26 | 2020-06-19 | 莫少平 | Carbon nano tube modified polyurethane toughened epoxy resin conductive material and preparation method thereof |
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| US20100255279A1 (en) * | 2004-05-24 | 2010-10-07 | Hontek Corporation | Abrasion resistant coatings |
| CN101914264A (en) * | 2009-12-18 | 2010-12-15 | 华中科技大学 | Electric-insulation heat-conduction epoxy resin composite material and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108300398A (en) * | 2017-12-27 | 2018-07-20 | 天长市墨缘玻璃建材有限公司 | A kind of water-fast weather-resistant pu glass cement of antibacterial |
| CN111303728A (en) * | 2020-04-26 | 2020-06-19 | 莫少平 | Carbon nano tube modified polyurethane toughened epoxy resin conductive material and preparation method thereof |
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| CN104497497B (en) | 2018-01-23 |
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