CN104497273B - A kind of high-modulus composition epoxy resin and preparation method thereof - Google Patents
A kind of high-modulus composition epoxy resin and preparation method thereof Download PDFInfo
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- CN104497273B CN104497273B CN201410705323.0A CN201410705323A CN104497273B CN 104497273 B CN104497273 B CN 104497273B CN 201410705323 A CN201410705323 A CN 201410705323A CN 104497273 B CN104497273 B CN 104497273B
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 86
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 86
- 239000000203 mixture Substances 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 5
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 42
- 150000001875 compounds Chemical class 0.000 claims abstract description 32
- 239000002994 raw material Substances 0.000 claims abstract description 29
- 238000002156 mixing Methods 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 14
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 claims description 12
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 claims description 8
- 150000002148 esters Chemical class 0.000 claims description 8
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 8
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical class CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 6
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 6
- BFHIGGJUBGXSIG-UHFFFAOYSA-N C(C1CO1)OC(C1C(C(=O)O)C=CCC1)=O Chemical compound C(C1CO1)OC(C1C(C(=O)O)C=CCC1)=O BFHIGGJUBGXSIG-UHFFFAOYSA-N 0.000 claims description 4
- JPZRPCNEISCANI-UHFFFAOYSA-N 4-(4-aminophenyl)-3-(trifluoromethyl)aniline Chemical class C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F JPZRPCNEISCANI-UHFFFAOYSA-N 0.000 claims description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 2
- XXKOQQBKBHUATC-UHFFFAOYSA-N cyclohexylmethylcyclohexane Chemical compound C1CCCCC1CC1CCCCC1 XXKOQQBKBHUATC-UHFFFAOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 20
- 239000011347 resin Substances 0.000 abstract description 20
- -1 aromatic amine compounds Chemical class 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 3
- 125000002723 alicyclic group Chemical group 0.000 abstract description 2
- 239000003085 diluting agent Substances 0.000 abstract description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 12
- 238000005452 bending Methods 0.000 description 11
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 8
- 239000002131 composite material Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- XEVRDFDBXJMZFG-UHFFFAOYSA-N carbonyl dihydrazine Chemical compound NNC(=O)NN XEVRDFDBXJMZFG-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- JGGQWILNAAODRS-UHFFFAOYSA-N n-methyl-4-[4-(methylamino)phenyl]aniline Chemical class C1=CC(NC)=CC=C1C1=CC=C(NC)C=C1 JGGQWILNAAODRS-UHFFFAOYSA-N 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000013439 planning Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Abstract
The present invention provides a kind of solvent-free liquid high-modulus composition epoxy resin and preparation method thereof, it is characterized in that described resin combination includes resin components and curing agent component two parts, wherein resin components raw material is made up of 3 degrees of functionality or 4 degree of functionality epoxy resin and diluent；Curing agent component raw material is made up of alicyclic ring aminated compounds or aromatic amine compounds.By described resin portion and curing agent part it is mixing cured after, the epoxide resin material of high-modulus can be obtained.
Description
Technical field
The present invention relates to a kind of composition epoxy resin for Material Field, in particular to a kind of high-modulus asphalt mixtures modified by epoxy resin
Oil/fat composition and preparation method thereof.
Background technology
Research shows, the compression performance of fibre resin based composites, bending property and Interlaminar shear strengths are mainly to be received
The modulus control of resin matrix.Under resin matrix lower modulus state, composite bears to compress, bends, shear stress when, tree
Aliphatic radical body first reaches surrender.Improving the modulus of resin matrix can effectively improve the combination property of fibre resin based composites,
But the resin combination of high-modulus typically has viscosity higher, often results in its moulding process applicability with composite
Difference.
In recent years, part domestic enterprise and research institution focus on to develop High Modulus Resin Matrix, to improve composite
Performance.For example, the publication number of entitled " compositions of thermosetting resin of high intensity and high-modulus "：CN102702482A is (open
Date：On October 3rd, 2012) Chinese patent disclose it is a kind of include the component of A, B two, component A raw material is cyanate ester monomer, double
Maleimide monomer, bifunctional epoxy compound He bisoxazoline compounds；B component is contracted using 3 degrees of functionality or 4 degrees of functionality
Water glyceramine epoxide, B component is used as crosslinking agent, and curing reaction occurs with other components, prepares high modulus resin material.
But the resin combination needs to use acetone, butanone, the dissolving of DMF equal solvents to be made into glue and prepare composite wood to impregnate fiber
Material, using inconvenience, need to consider the volatilization problems of solvent in composite material shaping process." High Modulus Resin Matrix and resistance to compression high are multiple
The research of condensation material " (Northwestern Polytechnical University, 2001) disclose high modulus resin formula in curing agent component be solid-state, it is necessary to
Stirred in a heated condition with epoxy resin and mixed, operability underaction.
The content of the invention
It is an object of the invention to provide a kind of relatively low liquid high-modulus composition epoxy resin of solvent-free viscosity.
It is a further object of the present invention to provide a kind of method for preparing composition epoxy resin.
The purpose of the present invention is realized with following technical scheme：
The high-modulus composition epoxy resin that the present invention is provided, the composition epoxy resin is included as mass fraction
The curing agent component of 100 parts of epoxy resin component and 20-35 part：
The epoxy resin component preparing raw material is based on following mass parts：
3 50-95 parts of degree of functionality epoxy resin
4 20-50 parts of degree of functionality epoxy resin
Diluent 5-40 parts
The curing agent component preparing raw material is based on following mass parts：
Aromatic amine compounds 40-95 parts
5-15 parts of alicyclic ring aminated compounds
Glyoxaline compound 0-10 parts
In first optimal technical scheme of the composition epoxy resin that the present invention is provided, epoxy resin is selected from 2- rings
Oxygen hexamethylene -4,5- dicarboxylic acid diglycidyl esters, the glycidyl amine of 4,4 '-MDA four, triglycidyl group pair
One or more of amino-phenol, tetrahydrophthalic acid 2-glycidyl ester.
In second optimal technical scheme of the composition epoxy resin that the present invention is provided, each thing in epoxy resin component
Matter is based on following mass parts：25-50 parts of 2- epoxide ring hex- 4,5- dicarboxylic acid diglycidyl esters, 4,4 '-MDA
Four glycidyl amine 30-50 parts, 0-20 parts of triglycidyl group para-aminophenol and tetrahydrophthalic acid 2-glycidyl ester
0-25 parts.
In 3rd optimal technical scheme of the composition epoxy resin that the present invention is provided, curing agent is selected from 2,2'-
Double (the trifluoromethyl) -4,4'- benzidines of dimethyl -4,4'- benzidines, 2,2'-, MDA, diamino
The own ring methane of base diphenyl sulphone (DPS), diethyl toluene diamine, 3,3 '-dimethyl -4,4 '-diaminourea two, one kind of m-phenylene diamine (MPD) or several
Kind.
In 4th optimal technical scheme of the composition epoxy resin that the present invention is provided, each material in curing agent component
Based on following mass parts：Double (the trifluoromethyl) -4,4'- diaminos of 20-50 parts of 2,2'- dimethyl -4,4'- benzidines, 2,2'-
0-40 parts of base biphenyl, MDA 0-20 parts, DADPS 0-30 parts, diethyl toluene diamine 30-45 parts, 3,
0-15 parts, m-phenylene diamine (MPD) 0-10 parts of 3 '-dimethyl -4,4 '-diaminourea two own ring methane.
The method for preparing composition epoxy resin provided by the present invention, comprises the following steps：
The step of preparing the epoxy resin component be：
Step 1：Epoxy resin component raw material is added in mixing apparatus, is stirred；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve；
The step of preparing the curing agent component be：
Step 1：Curing agent component raw material is added sequentially in mixing apparatus, nitrogen protection, in 65 DEG C of -125 DEG C of temperature
Under stir；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve；
Obtained epoxy resin component and curing agent component are mixed into obtain the composition epoxy resin.
With immediate prior art ratio, the present invention provide technical scheme there is following excellent effect：
1) the composition epoxy resin system that the present invention is provided does not exist solvent, can avoid in composite material shaping process
In solvent volatilization problems.
2) resin components and curing agent component in the composition epoxy resin that the present invention is provided are liquid before curing,
Suitable for various composite material process plannings, modulus value exceedes the modulus value (4.21GPa) of existing general epoxy resin after solidification.
3) the epoxy resin component and curing agent component that the present invention is provided can directly be used in mixed way in use, make
It is workable with convenient.
Specific embodiment
Embodiment 1
Prepare composition epoxy resin
The raw material of epoxy resin component is based on following mass parts：2- epoxide ring hex- 4,5- dicarboxylic acid diglycidyl esters 35
Part, 50 parts of 4,4 '-MDA, four glycidyl amine, 15 parts of tetrahydrophthalic acid 2-glycidyl ester.
The raw material of curing agent component is based on following mass parts：40 parts of 2,2'- dimethyl -4,4'- benzidines, diaminourea
5 parts of diphenyl sulphone (DPS), 45 parts of diethyl toluene diamine, 10 parts of the own ring methane of 3,3 '-dimethyl -4,4 '-diaminourea two.
The method for preparing composition epoxy resin, comprises the following steps：
1) the step of preparing epoxy resin component be：
Step 1：Epoxy resin component raw material is added in mixing apparatus, is stirred；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve.
2) the step of preparing the curing agent component be：
Step 1：Curing agent component raw material is added sequentially in mixing apparatus, nitrogen protection is stirred at a temperature of 120 DEG C
Uniformly；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve.
3) method for preparing composition epoxy resin includes：
By epoxy resin component obtained in 1) and 2) curing agent component obtained in presses 100:30 ratio uniform mixing, obtains
High-modulus composition epoxy resin product.
By composition epoxy resin product at 150 DEG C 1h, 3h at 180 DEG C, then 2h is heating and curing at 210 DEG C, survey
Obtain resin batten bending strength 130.1MPa, bending modulus 5.1GPa.
Embodiment 2
Product of the invention is to mix epoxy resin component and curing agent component.
The raw material of epoxy resin component is based on following mass parts：2- epoxide ring hex- 4,5- dicarboxylic acid diglycidyl esters 30
Part, 40 parts of 4,4 '-MDA, four glycidyl amine, 15 parts of triglycidyl group para-aminophenol, tetrahydrochysene neighbour's benzene two
15 parts of formic acid 2-glycidyl ester.
The raw material of curing agent component is based on following mass parts：45 parts of 2,2'- dimethyl -4,4'- benzidines, diaminourea
15 parts of diphenyl-methane, 40 parts of diethyl toluene diamine.
The method for preparing composition epoxy resin, comprises the following steps：
1) the step of preparing epoxy resin component be：
Step 1：Epoxy resin component raw material is added in mixing apparatus, is stirred；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve.
2) the step of preparing the curing agent component be：
Step 1：Curing agent component raw material is added sequentially in mixing apparatus, nitrogen protection is stirred at a temperature of 70 DEG C
Uniformly；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve.
3) method for preparing composition epoxy resin includes：
By epoxy resin component obtained in 1) and 2) curing agent component obtained in presses 100:28 ratio uniform mixing, obtains
High-modulus composition epoxy resin product.
By composition epoxy resin product at 140 DEG C 1h, 3h at 160 DEG C, then 2h is heating and curing at 200 DEG C, survey
Obtain resin batten bending strength 128.3MPa, bending modulus 4.9GPa.
Embodiment 3
Product of the invention is to mix epoxy resin component and curing agent component.
The raw material of epoxy resin component is based on following mass parts：2- epoxide ring hex- 4,5- dicarboxylic acid diglycidyl esters 50
Part, 30 parts of 4,4 '-MDA, four glycidyl amine, 20 parts of triglycidyl group para-aminophenol.
The raw material of curing agent component is based on following mass parts：25 parts of 2,2'- dimethyl -4,4'- benzidines, 2,2'-
Double 25 parts of (trifluoromethyl) -4,4'- benzidines, 10 parts of DADPS, 40 parts of diethyl toluene diamine.
The method for preparing composition epoxy resin, comprises the following steps：
1) the step of preparing epoxy resin component be：
Step 1：Epoxy resin component raw material is added in mixing apparatus, is stirred；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve.
2) the step of preparing the curing agent component be：
Step 1：Curing agent component raw material is added sequentially in mixing apparatus, nitrogen protection is stirred at a temperature of 100 DEG C
Uniformly；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve.
3) method for preparing composition epoxy resin includes：
By epoxy resin component obtained in 1) and 2) curing agent component obtained in presses 100:24 ratio uniform mixing, obtains
High-modulus composition epoxy resin product.
By composition epoxy resin product at 150 DEG C 1h, 3h at 170 DEG C, then 2h is heating and curing at 200 DEG C, survey
Obtain resin batten bending strength 133.2MPa, bending modulus 4.7GPa.
Embodiment 4
Product of the invention is to mix epoxy resin component and curing agent component.
The raw material of epoxy resin component is based on following mass parts：2- epoxide ring hex- 4,5- dicarboxylic acid diglycidyl esters 45
Part, 35 parts of 4,4 '-MDA, four glycidyl amine, 5 parts of triglycidyl group para-aminophenol, tetrahydrochysene O-phthalic
15 parts of sour 2-glycidyl ester.
The raw material of curing agent component is based on following mass parts：25 parts of 2,2'- dimethyl -4,4'- benzidines, 2,2'-
Double 40 parts of (trifluoromethyl) -4,4'- benzidines, 30 parts of diethyl toluene diamine, 3,3'- dimethyl -4,4'- diaminourea two
5 parts of own ring methane.
The method for preparing composition epoxy resin, comprises the following steps：
1) the step of preparing epoxy resin component be：
Step 1：Epoxy resin component raw material is added in mixing apparatus, is stirred；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve.
2) the step of preparing the curing agent component be：
Step 1：Curing agent component raw material is added sequentially in mixing apparatus, nitrogen protection is stirred at a temperature of 90 DEG C
Uniformly；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve.
3) method for preparing composition epoxy resin includes：
By epoxy resin component obtained in 1) and 2) curing agent component obtained in presses 100:26 ratio uniform mixing, obtains
High-modulus composition epoxy resin product.
By composition epoxy resin product at 155 DEG C 1h, 3h at 180 DEG C, then 2h is heating and curing at 210 DEG C, survey
Obtain resin batten bending strength 135.2MPa, bending modulus 4.8GPa.
Embodiment 5
Product of the invention is to mix epoxy resin component and curing agent component.
The raw material of epoxy resin component is based on following mass parts：2- epoxide ring hex- 4,5- dicarboxylic acid diglycidyl esters 25
Part, 40 parts of 4,4 '-MDA, four glycidyl amine, 10 parts of triglycidyl group para-aminophenol, tetrahydrochysene neighbour's benzene two
25 parts of formic acid 2-glycidyl ester.
The raw material of curing agent component is based on following mass parts：35 parts of 2,2'- dimethyl -4,4'- benzidines, diaminourea
25 parts of diphenyl sulphone (DPS), 40 parts of diethyl toluene diamine.
The method for preparing composition epoxy resin, comprises the following steps：
1) the step of preparing epoxy resin component be：
Step 1：Epoxy resin component raw material is added in mixing apparatus, is stirred；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve.
2) the step of preparing the curing agent component be：
Step 1：Curing agent component raw material is added sequentially in mixing apparatus, nitrogen protection is stirred at a temperature of 85 DEG C
Uniformly；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve.
3) method for preparing composition epoxy resin includes：
By epoxy resin component obtained in 1) and 2) curing agent component obtained in presses 100:31 ratio uniform mixing, obtains
High-modulus composition epoxy resin product.
By composition epoxy resin product at 155 DEG C 1h, 3h at 180 DEG C, then 2h is heating and curing at 220 DEG C, survey
Obtain resin batten bending strength 131.8MPa, bending modulus 5.0GPa.
The above embodiments are merely illustrative of the technical solutions of the present invention rather than its limitations, the ordinary skill people of art
Member it should be appreciated that can be modified to specific embodiment of the invention or equivalent with reference to above-described embodiment, these
Without departing from any modification of spirit and scope of the invention or equivalent apply pending claims it
It is interior.
Claims (2)
1. a kind of high-modulus composition epoxy resin, it is characterised in that modulus ＞ after the high-modulus epoxy resin composition
4.21GPa, epoxy resin and 20-35 part of the high-modulus composition epoxy resin including 100 parts as mass fraction
Curing agent；
Each material is based on following mass parts in the epoxy resin component：2- epoxide ring hex- 4,5- dicarboxylic acid diglycidyl esters
25-50 parts, glycidyl amine 30-50 parts of 4,4 '-MDA four, 0-20 parts of triglycidyl group para-aminophenol and
0-25 parts of tetrahydrophthalic acid 2-glycidyl ester；
Each material is based on following mass parts in the curing agent component：20-50 parts of 2,2'- dimethyl -4,4'- benzidines,
2,2'- double 0-40 parts of (trifluoromethyl) -4,4'- benzidines, MDA 0-20 parts, DADPS 0-30
Part, diethyl toluene diamine 30-45 parts, 3,3 '-dimethyl -4,4 ' 0-15 parts of-diaminourea dicyclohexyl-methane, m-phenylene diamine (MPD) 0-10
Part.
2. a kind of preparation method of the composition epoxy resin prepared described in claim 1, it is characterised in that methods described includes
Following steps：
The step of preparing the epoxy resin component be：
Step 1：Epoxy resin component raw material is added in mixing apparatus, is stirred；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve；
The step of preparing the curing agent component be：
Step 1：Under nitrogen protection, curing agent component raw material is added sequentially in mixing apparatus, in stirring at 65 DEG C -125 DEG C
Uniformly；
Step 2：Vacuumize the bubble eliminated in compound；
Step 3：Compound is loaded into product container, sealing preserve；
Obtained epoxy resin component and curing agent component are mixed into obtain the composition epoxy resin.
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| KR102476761B1 (en) * | 2017-05-10 | 2022-12-09 | 도레이 카부시키가이샤 | Epoxy resin composition, prepreg, fiber-reinforced composite material and manufacturing method thereof |
| CN108929519A (en) * | 2017-05-24 | 2018-12-04 | 洛阳尖端技术研究院 | A kind of basalt fiber composite material and preparation method thereof |
| CN115677622B (en) * | 2021-07-27 | 2024-10-18 | 中国石油化工股份有限公司 | Method for preparing 4, 5-epoxycyclohexane-1, 2-diglycidyl phthalate by catalytic oxidation of phosphotungstic molybdenum heteropolyacid |
| CN114773208B (en) * | 2022-04-26 | 2024-09-27 | 大连新阳光材料科技有限公司 | Preparation method of high-purity single-crystal-form 2,2 '-dimethyl-4, 4' -diaminobiphenyl |
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| CN103946264A (en) * | 2012-02-27 | 2014-07-23 | 氰特科技股份有限公司 | Curable epoxy composition and short-cure method |
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