CN104485396A - Manufacturing process of electric light source conducting wire and LED lamp utilizing multiple strands of metal conducting wires - Google Patents
Manufacturing process of electric light source conducting wire and LED lamp utilizing multiple strands of metal conducting wires Download PDFInfo
- Publication number
- CN104485396A CN104485396A CN201410648511.4A CN201410648511A CN104485396A CN 104485396 A CN104485396 A CN 104485396A CN 201410648511 A CN201410648511 A CN 201410648511A CN 104485396 A CN104485396 A CN 104485396A
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- Prior art keywords
- wire
- sealing
- silk
- outer seal
- inner guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000002184 metal Substances 0.000 title abstract 6
- 238000007789 sealing Methods 0.000 claims abstract description 15
- 238000003466 welding Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 35
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 238000005491 wire drawing Methods 0.000 claims description 12
- 238000005304 joining Methods 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 238000005554 pickling Methods 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 4
- 229910000851 Alloy steel Inorganic materials 0.000 claims description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 3
- 239000000084 colloidal system Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 3
- 235000021110 pickles Nutrition 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000007517 polishing process Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 abstract description 5
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000005728 strengthening Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
The invention relates to a manufacturing process of an electric light source conducting wire and an LED lamp utilizing multiple strands of metal conducting wires. According to the manufacturing process, more than two strands of inner conducting wire lines are uniformly distributed in parallel; the inner conducting wire lines are welded to a sealing wire; and the sealing wire is welded to an outer conducting wire. The LED lamp utilizing multiple strands of metal conducting wires includes a chip, a support and metal conducting wires, wherein the metal conducting wires comprise an inner conducting wire, a sealing wire and an outer conducting wire; one end of the sealing wire is welded to the outer conducting wire, and the other end of the sealing wire is welded to the inner conducting wire; and at least two strands of metal conducting wires are uniformly distributed in parallel along a central axis so as to form the inner conducting wire. The manufacturing process and the LED lamp of the invention have the advantages of process reasonable as well as high sealing performance and significantly-improve quality of a product. With the manufacturing process and the LED lamp of the invention adopted, welding points are solid and can bear pressure from 40 to 50N, and will not be fractured after being bent by 90 degrees back and forth for three times, a pulling force being constant. When the conducting wire is in sealing connection with glass, air bubbles do not tend to be generated; when the conducting wire is adopted as a stem, material clamping occurs rarely; and therefore, production efficiency can be improved, and production cost can be decreased. With the manufacturing process and the LED lamp of the invention adopted, the electric conductivity of a light source can be enhanced, and light emission efficiency of the light source can be improved, and the service life of the light source can be prolonged, and electric energy can be saved.
Description
Technical field
The present invention relates to lighting technical field, particularly a kind of manufacturing process of electric light source wire guide and the LED of employing multiply wire guide.
Background technology
Electric light source seal wire is that outer for fluorescent tube electric energy is introduced in fluorescent tube the unique passage making lamp works, fluorescent tube internal electrode is connected with external circuit by its Main Function, conduction current, filament supports and electrode, electric light source seal wire is generally made up of three kinds of different materials, is namely made up of inner guide wire (part in fluorescent tube inside), outer conductor (with lamp bucket pin coupling part outside vitreum), sealing-in silk (with the part of vitreum sealing-in) three parts.Seal wire is the important part of light fixture, to its requirement is: have good electric conductivity, with glass sealing after to have good sealing, good stability will be had when lamp works.Existing seal wire is due to the problem of rapidoprint and manufacturing process, easily occur that pad is insecure, electric conductivity is bad, easily leak gas when sealing-in silk and glass sealing, produce bubble, the linearity of seal wire is inadequate, easily gets stuck affect production efficiency, increase production cost when doing stem stem.
Summary of the invention
For above the deficiencies in the prior art, the object of this invention is to provide a kind of electric conductivity excellent, the manufacturing process of the electric light source multiply wire guide that sealing-in good airproof performance, stability are high and the LED of employing multiply wire guide.
The object of the invention is by realize by the following technical solutions:
The electric light source manufacturing process of multiply wire guide, comprises the following steps:
Step one: inner guide wire process, by electrician's round copper rod on special wire-drawing equipment by joining mould, draw out the inner guide wire single line that diameter is 0.06mm-0.8mm;
Step 2: sealing-in silk is processed, by electrician's circle Du magnesium bar on special wire-drawing equipment by joining mould, draw out the Dumet wire single line that diameter is 0.1mm-0.8mm;
Step 3: outer seal wire processing, by outer for electrician seal wire round bar on special wire-drawing equipment by joining mould, draw out the outer seal wire single line that diameter is 0.1mm-1.2mm;
Step 4: after inner guide wire above-mentioned steps drawn, sealing-in silk and outer seal wire carry out pickling, washing respectively, dry after removing the wire drawing oil of single wire surface, pickle and impurity;
Step 5: adopt automatic flattening machine to align inner guide wire, sealing-in silk, outer seal wire respectively;
Step 6: length inner guide wire, sealing-in silk, outer seal wire being cut to regulation, uses special grinding polishing machine to carry out sanding and polishing process to cut ends, eliminate cut ends crotch and burr;
Step 7: by more than two strands or the two strands parallel uniform arrangements of inner guide wire single line, be welded to connect with sealing-in silk single line, sealing-in silk single line and outer seal wire single line are welded to connect simultaneously, and the rear inner guide wire of welding, sealing-in silk, outer seal wire three line are coaxial;
Step 8: inner guide wire above-mentioned steps welded, sealing-in silk and outer seal wire are dry after again carrying out pickling, washing, then carries out counting and packs.
As the preferred technical solution of the present invention, in described step 7, welding three economize on electricity connects the ambient temperature of seal wire is 20-25 DEG C, and humidity is less than 50%; Use oscillating plate to clamp inner guide wire, sealing-in silk and outer seal wire respectively, special seal wire bonding machine welds; Described bonding machine current settings is 30A-50A, and voltage sets is 10V-50V, and discharge time is set as 0.05s-0.18s, and discharge pressure is set as 0.1N-5N.
As the preferred technical solution of the present invention, described oscillating plate material is pottery, tungsten steel alloy or alloyed copper; Described outer seal wire comprises fuse, copper wire, nickel wire, copper facing nickel wire and nickel plating copper wire.
Adopt the LED of multiply wire guide, comprise LED chip, support, wire guide and packing colloid, described LED chip is connected with support and fixes, its surrounding adopts resin glue sealing, LED chip is connected with power supply by wire guide, described wire guide comprises inner guide wire, sealing-in silk and outer seal wire, described sealing-in silk one end and outer seal wire are welded to connect, the sealing-in silk other end and inner guide wire are welded to connect, described inner guide wire is by the centrally uniform arrangement of axis being parallel of at least two strands of wire guides, and described sealing-in silk and outer seal wire are sub-thread seal wire.
As the preferred technical solution of the present invention, described sealing-in silk is Dumet wire, and described inner guide wire is copper wire, nickel wire, nickel plating copper wire or copper facing nickel wire, and described outer seal wire comprises fuse, copper wire, nickel wire, copper facing nickel wire and nickel plating copper wire.
As the preferred technical solution of the present invention, the diameter of described Dumet wire is 0.1mm-0.8mm, and length is 6mm-25mm.
As the preferred technical solution of the present invention, described Dumet wire is red Dumet wire.
As the preferred technical solution of the present invention, the sub-thread diameter of described inner guide wire is 0.06mm-0.8mm, and length is 5mm-63mm.
As the preferred technical solution of the present invention, described outer seal wire diameter is 0.1mm-1.2mm, and length is 10mm-82mm.
The invention has the beneficial effects as follows: relative to prior art, present invention process is reasonable, and make the electric conductivity of product excellent, sealing-in good airproof performance, quality stability significantly improve.When the present invention is applied to light source, its pad is firm, bears pressure and reaches 40-50N, and 90 degree 3 continuous back and forth, and pulling force is constant.Not easily leaking gas with during glass sealing, also not easily produce bubble, seldom getting stuck when doing stem stem, production efficiency improves, and saves production cost.The present invention contributes to the electric conductivity strengthening light source, improves luminous efficiency, increases the service life, and saves electric energy.
Accompanying drawing explanation
Fig. 1 is the structural representation of wire guide of the present invention.
In figure: 1, inner guide wire, 2, sealing-in silk, 3, outer seal wire.
Embodiment
The electric light source manufacturing process of multiply wire guide, comprises the following steps:
Step one: inner guide wire process, by electrician's round copper rod on special wire-drawing equipment by joining mould, draw out the inner guide wire single line that diameter is 0.06mm-0.8mm;
Step 2: sealing-in silk is processed, by electrician's circle Du magnesium bar on special wire-drawing equipment by joining mould, draw out the Dumet wire single line that diameter is 0.1mm-0.8mm;
Step 3: outer seal wire processing, by outer for electrician seal wire round bar on special wire-drawing equipment by joining mould, draw out the outer seal wire single line that diameter is 0.1mm-1.2mm;
Step 4: after inner guide wire above-mentioned steps drawn, sealing-in silk and outer seal wire carry out pickling, washing respectively, dry after removing the wire drawing oil of single wire surface, pickle and impurity;
Step 5: adopt automatic flattening machine to align inner guide wire, sealing-in silk, outer seal wire respectively;
Step 6: length inner guide wire, sealing-in silk, outer seal wire being cut to regulation, uses special grinding polishing machine to carry out sanding and polishing process to cut ends, eliminate cut ends crotch and burr;
Step 7: by more than two strands or the two strands parallel uniform arrangements of inner guide wire single line, be welded to connect with sealing-in silk single line, sealing-in silk single line and outer seal wire single line are welded to connect simultaneously, and the rear inner guide wire of welding, sealing-in silk, outer seal wire three line are coaxial;
Step 8: inner guide wire above-mentioned steps welded, sealing-in silk and outer seal wire are dry after again carrying out pickling, washing, then carries out counting and packs.
In the present embodiment, in described step 7, welding three economize on electricity connects the ambient temperature of seal wire is 20-25 DEG C, and humidity is less than 50%; Use oscillating plate to clamp inner guide wire, sealing-in silk and outer seal wire respectively, special seal wire bonding machine welds; Described bonding machine current settings is 30A-50A, and voltage sets is 10V-50V, and discharge time is set as 0.05s-0.18s, and discharge pressure is set as 0.1N-5N.Described oscillating plate material is pottery, tungsten steel alloy or alloyed copper; Described outer seal wire comprises fuse, copper wire, nickel wire, copper facing nickel wire and nickel plating copper wire.
As shown in Figure 1, adopt the LED of multiply wire guide, comprise LED chip, support, wire guide and packing colloid, LED chip is connected with support and fixes, its surrounding adopts resin glue sealing, LED chip is connected with power supply by wire guide, described wire guide comprises inner guide wire 1, sealing-in silk 2 and outer seal wire 3, sealing-in silk 2 one end and outer seal wire 3 are welded to connect, sealing-in silk 2 other end and inner guide wire 1 are welded to connect, described inner guide wire 1 is by the centrally uniform arrangement of axis being parallel of at least two strands of wire guides, and described sealing-in silk 2 is sub-thread seal wire with outer seal wire 3.The present embodiment inner guide wire 1 is preferably three strands of wire guides, three bursts of wire guide centrally uniform arrangements of axis being parallel.
Described in the present embodiment, sealing-in silk 2 is Dumet wire, preferred red Dumet wire, and inner guide wire 1 is copper wire, nickel wire, nickel plating copper wire or copper facing nickel wire, and outer seal wire 3 comprises fuse, copper wire, nickel wire, copper facing nickel wire and nickel plating copper wire.The diameter of described Dumet wire is 0.1mm-0.8mm, and length is 6mm-25mm; Dumet wire is red Dumet wire; The sub-thread diameter of inner guide wire is 0.06mm-0.8mm, and length is 5mm-63mm; Outer seal wire diameter is 0.1mm-1.2mm, and length is 10mm-82mm.Preferably, inner guide wire 1 adopts copper wire, and its diameter is 0.42mm; The diameter of Dumet wire is 0.35mm; Outer seal wire adopts fuse or copper wire, and its diameter is 0.16mm.
The present embodiment three economize on electricity connects the inner guide wire of seal wire, sealing-in silk, and all concentric after outer seal wire welding, can bear pressure is 40-50N, and 90 degree bending 3 do not fracture back and forth, and pulling force is constant.
The present invention is mainly through improving the inner guide wire structure of electric light source wire guide and manufacturing process, the pad solving three-section guide wire is insecure, electric conductivity is bad, easily leak gas when sealing-in silk and glass sealing, produce bubble, and the problem that the linearity of seal wire is inadequate, not easily getting stuck when doing stem stem, improve production efficiency, reducing production cost.Contribute to the electric conductivity strengthening light source simultaneously, improve luminous efficiency, increase the service life, save electric energy.
Claims (9)
1. an electric light source manufacturing process for multiply wire guide, is characterized in that comprising the following steps:
Step one: inner guide wire process, by electrician's round copper rod on special wire-drawing equipment by joining mould, draw out the inner guide wire single line that diameter is 0.06mm-0.8mm;
Step 2: sealing-in silk is processed, by electrician's circle Du magnesium bar on special wire-drawing equipment by joining mould, draw out the Dumet wire single line that diameter is 0.1mm-0.8mm;
Step 3: outer seal wire processing, by outer for electrician seal wire round bar on special wire-drawing equipment by joining mould, draw out the outer seal wire single line that diameter is 0.1mm-1.2mm;
Step 4: after inner guide wire above-mentioned steps drawn, sealing-in silk and outer seal wire carry out pickling, washing respectively, dry after removing the wire drawing oil of single wire surface, pickle and impurity;
Step 5: adopt automatic flattening machine to align inner guide wire, sealing-in silk, outer seal wire respectively;
Step 6: length inner guide wire, sealing-in silk, outer seal wire being cut to regulation, uses special grinding polishing machine to carry out sanding and polishing process to cut ends, eliminate cut ends crotch and burr;
Step 7: by more than two strands or the two strands parallel uniform arrangements of inner guide wire single line, be welded to connect with sealing-in silk single line, sealing-in silk single line and outer seal wire single line are welded to connect simultaneously, and the rear inner guide wire of welding, sealing-in silk, outer seal wire three line are coaxial;
Step 8: inner guide wire above-mentioned steps welded, sealing-in silk and outer seal wire are dry after again carrying out pickling, washing, then carries out counting and packs.
2. the electric light source manufacturing process of multiply wire guide according to claim 1, it is characterized in that welding in described step 7 the ambient temperature that three economize on electricitys connect seal wire is 20-25 DEG C, and humidity is less than 50%; Use oscillating plate to clamp inner guide wire, sealing-in silk and outer seal wire respectively, special seal wire bonding machine welds; Described bonding machine current settings is 30A-50A, and voltage sets is 10V-50V, and discharge time is set as 0.05s-0.18s, and discharge pressure is set as 0.1N-5N.
3. the electric light source manufacturing process of multiply wire guide according to claim 2, is characterized in that described oscillating plate material is for pottery, tungsten steel alloy or alloyed copper; Described outer seal wire comprises fuse, copper wire, nickel wire, copper facing nickel wire and nickel plating copper wire.
4. one kind adopts the LED of multiply wire guide as claimed in claim 1, comprise LED chip, support, wire guide and packing colloid, described LED chip is connected with support and fixes, its surrounding adopts resin glue sealing, LED chip is connected with power supply by wire guide, it is characterized in that: described wire guide comprises inner guide wire, sealing-in silk and outer seal wire, described sealing-in silk one end and outer seal wire are welded to connect, the sealing-in silk other end and inner guide wire are welded to connect, described inner guide wire is by the centrally uniform arrangement of axis being parallel of at least two strands of wire guides, described sealing-in silk and outer seal wire are sub-thread seal wire.
5. the LED of employing multiply wire guide according to claim 4, it is characterized in that: described sealing-in silk is Dumet wire, described inner guide wire is copper wire, nickel wire, nickel plating copper wire or copper facing nickel wire, and described outer seal wire comprises fuse, copper wire, nickel wire, copper facing nickel wire and nickel plating copper wire.
6. the LED of employing multiply wire guide according to claim 5, is characterized in that: the diameter of described Dumet wire is 0.1mm-0.8mm, and length is 6mm-25mm.
7. the LED of employing multiply wire guide according to claim 6, is characterized in that: described Dumet wire is red Dumet wire.
8. the LED of the employing multiply wire guide according to claim 4 or 5, is characterized in that: the sub-thread diameter of described inner guide wire is 0.06mm-0.8mm, and length is 5mm-63mm.
9. the LED of the employing multiply wire guide according to claim 4 or 5, is characterized in that: described outer seal wire diameter is 0.1mm-1.2mm, and length is 10mm-82mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410648511.4A CN104485396A (en) | 2014-11-15 | 2014-11-15 | Manufacturing process of electric light source conducting wire and LED lamp utilizing multiple strands of metal conducting wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410648511.4A CN104485396A (en) | 2014-11-15 | 2014-11-15 | Manufacturing process of electric light source conducting wire and LED lamp utilizing multiple strands of metal conducting wires |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104485396A true CN104485396A (en) | 2015-04-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410648511.4A Pending CN104485396A (en) | 2014-11-15 | 2014-11-15 | Manufacturing process of electric light source conducting wire and LED lamp utilizing multiple strands of metal conducting wires |
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| Country | Link |
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| CN (1) | CN104485396A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111266805A (en) * | 2020-02-29 | 2020-06-12 | 上海亚尔光源有限公司 | Cold cathode tungsten-nickel core rod processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201238031Y (en) * | 2008-08-18 | 2009-05-13 | 湖州太箭照明有限公司 | Double-main filament type major-minor triple-helical energy-saving lamp filament |
| CN201796854U (en) * | 2010-08-24 | 2011-04-13 | 绍兴安格照明有限公司 | Double main filament triple spiral lamp filament |
| CN104143493A (en) * | 2014-06-15 | 2014-11-12 | 泰州市东兴合金材料有限公司 | Three-section electric wire for electric light source and manufacturing technology of three-section electric wire |
-
2014
- 2014-11-15 CN CN201410648511.4A patent/CN104485396A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201238031Y (en) * | 2008-08-18 | 2009-05-13 | 湖州太箭照明有限公司 | Double-main filament type major-minor triple-helical energy-saving lamp filament |
| CN201796854U (en) * | 2010-08-24 | 2011-04-13 | 绍兴安格照明有限公司 | Double main filament triple spiral lamp filament |
| CN104143493A (en) * | 2014-06-15 | 2014-11-12 | 泰州市东兴合金材料有限公司 | Three-section electric wire for electric light source and manufacturing technology of three-section electric wire |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111266805A (en) * | 2020-02-29 | 2020-06-12 | 上海亚尔光源有限公司 | Cold cathode tungsten-nickel core rod processing method |
| CN111266805B (en) * | 2020-02-29 | 2022-06-17 | 上海亚尔光源有限公司 | Cold cathode tungsten-nickel core rod processing method |
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Application publication date: 20150401 |