CN104479621A - High/low-temperature-resistant organosilicon emulsion - Google Patents
High/low-temperature-resistant organosilicon emulsion Download PDFInfo
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- CN104479621A CN104479621A CN201410734332.2A CN201410734332A CN104479621A CN 104479621 A CN104479621 A CN 104479621A CN 201410734332 A CN201410734332 A CN 201410734332A CN 104479621 A CN104479621 A CN 104479621A
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- parts
- temperature
- organic silicon
- low temperature
- trimethylchlorosilane
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Abstract
The invention relates to an organosilicon emulsion, particularly a high/low-temperature-resistant organosilicon emulsion which is prepared from the following raw materials in parts by weight: 30-40 parts of trimethylchlorosilane, 10-20 parts of ethyl orthosilicate, 1-5 parts of aluminum oxide powder, 8-16 parts of emulsifier, 5-10 parts of phenyl pentane, 1-5 parts of aminoethanol and 5-10 parts of diluter. The high/low-temperature-resistant organosilicon emulsion has excellent high/low temperature resistance, and still has favorable binding property and sealability at -70-250 DEG C.
Description
Technical field
The present invention relates to organic silicon emulsion, especially high-low temperature resistant organic silicon emulsion.
Background technology
Cannot service requirements be met, such as high-low temperature test chamber for organic silicon emulsion common under the environment of high/low temperature, in the temperature range of-70 DEG C ~ 150 DEG C, the easy hardening inefficacy of organic silicon emulsion.
Summary of the invention
For solving the problem, the invention provides high-low temperature resistant organic silicon emulsion, concrete technical scheme is:
High-low temperature resistant organic silicon emulsion, is obtained according to parts by weight by following raw material,
Trimethylchlorosilane 30 ~ 40 parts;
Tetraethoxy 10 ~ 20 parts;
Aluminum oxide powder 1 ~ 5 part;
Emulsifying agent 8 ~ 16 parts;
Phenyl pentane 5 ~ 10 parts;
Monoethanolamine 1 ~ 5 part;
Thinner 5 ~ 10 parts.
The preferred scheme of technique scheme is: obtained according to parts by weight by following raw material,
Trimethylchlorosilane 35 parts;
Tetraethoxy 15 parts;
Aluminum oxide powder 3 parts;
Emulsifying agent 10 parts;
Phenyl pentane 7 parts;
Monoethanolamine 3 parts;
Thinner 7 parts.
Due to the utilization of technique scheme, the present invention compared with prior art has following advantages and effect:
High-low temperature resistant organic silicon emulsion of the present invention, has excellent resistant of high or low temperature, can keep good cohesiveness and stopping property within the scope of-70 DEG C ~ 250 DEG C.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
embodiment 1
High-low temperature resistant organic silicon emulsion, obtained after reaction according to parts by weight by following raw material:
Trimethylchlorosilane 30 parts;
Tetraethoxy 10 parts;
Aluminum oxide powder 1 part;
Emulsifying agent 8 parts;
Phenyl pentane 5 parts;
Monoethanolamine 1 part;
Thinner 5 parts.
embodiment 2
High-low temperature resistant organic silicon emulsion, obtained after reaction according to parts by weight by following raw material:
Trimethylchlorosilane 40 parts;
Tetraethoxy 20 parts;
Aluminum oxide powder 5 parts;
Emulsifying agent 16 parts;
Phenyl pentane 10 parts;
Monoethanolamine 5 parts;
Thinner 10 parts.
embodiment 3
High-low temperature resistant organic silicon emulsion, obtained after reaction according to parts by weight by following raw material:
Trimethylchlorosilane 35 parts;
Tetraethoxy 15 parts;
Aluminum oxide powder 3 parts;
Emulsifying agent 10 parts;
Phenyl pentane 7 parts;
Monoethanolamine 3 parts;
Thinner 7 parts.
The preparation method of each embodiment above:
(1) be added in temperature stirring tank by trimethylchlorosilane, tetraethoxy, aluminum oxide powder, temperature is set to 50 degrees Celsius, stirs 10 minutes;
(2) continue emulsifying agent, phenyl pentane, monoethanolamine to be added in temperature stirring tank, temperature is set to 50 degrees Celsius and stirs 10 minutes;
(3) finally add thinner, temperature is set to 60 degrees Celsius, stirs.
Claims (3)
1. high-low temperature resistant organic silicon emulsion, is characterized in that: obtained according to parts by weight by following raw material,
Trimethylchlorosilane 30 ~ 40 parts;
Tetraethoxy 10 ~ 20 parts;
Aluminum oxide powder 1 ~ 5 part;
Emulsifying agent 8 ~ 16 parts;
Phenyl pentane 5 ~ 10 parts;
Monoethanolamine 1 ~ 5 part;
Thinner 5 ~ 10 parts.
2. high-low temperature resistant organic silicon emulsion according to claim 1, is characterized in that: obtained according to parts by weight by following raw material,
Trimethylchlorosilane 40 ~ 55 parts;
Tetraethoxy 10 ~ 20 parts;
Aluminum oxide powder 1 ~ 5 part;
Emulsifying agent 8 ~ 16 parts;
Phenyl pentane 5 ~ 10 parts;
Monoethanolamine 1 ~ 5 part;
Thinner 5 ~ 10 parts.
3. high-low temperature resistant organic silicon emulsion according to claim 1 and 2, is characterized in that: preparation method comprises the following steps:
(1) be added in temperature stirring tank by trimethylchlorosilane, tetraethoxy, aluminum oxide powder, temperature is set to 50 degrees Celsius, stirs 10 minutes;
(2) continue emulsifying agent, phenyl pentane, monoethanolamine to be added in temperature stirring tank, temperature is set to 50 degrees Celsius and stirs 10 minutes;
(3) finally add thinner, temperature is set to 60 degrees Celsius, stirs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410734332.2A CN104479621A (en) | 2014-12-08 | 2014-12-08 | High/low-temperature-resistant organosilicon emulsion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410734332.2A CN104479621A (en) | 2014-12-08 | 2014-12-08 | High/low-temperature-resistant organosilicon emulsion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104479621A true CN104479621A (en) | 2015-04-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410734332.2A Pending CN104479621A (en) | 2014-12-08 | 2014-12-08 | High/low-temperature-resistant organosilicon emulsion |
Country Status (1)
| Country | Link |
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| CN (1) | CN104479621A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1894785A (en) * | 2003-12-10 | 2007-01-10 | Ge东芝硅树脂株式会社 | Silicone adhesive agent |
| CN102061142A (en) * | 2010-11-23 | 2011-05-18 | 吉林华丰有机硅有限公司 | Process for preparing organic silicon pressure-sensitive adhesive |
| CN101362932B (en) * | 2008-10-07 | 2012-05-30 | 黑龙江省科学院石油化学研究院 | Room curing and high temperature resistant silicone adhesives |
-
2014
- 2014-12-08 CN CN201410734332.2A patent/CN104479621A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1894785A (en) * | 2003-12-10 | 2007-01-10 | Ge东芝硅树脂株式会社 | Silicone adhesive agent |
| CN101362932B (en) * | 2008-10-07 | 2012-05-30 | 黑龙江省科学院石油化学研究院 | Room curing and high temperature resistant silicone adhesives |
| CN102061142A (en) * | 2010-11-23 | 2011-05-18 | 吉林华丰有机硅有限公司 | Process for preparing organic silicon pressure-sensitive adhesive |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150401 |
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| WD01 | Invention patent application deemed withdrawn after publication |