CN104465171B - A kind of ultrathin touch-switch manufacture method - Google Patents
A kind of ultrathin touch-switch manufacture method Download PDFInfo
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- CN104465171B CN104465171B CN201410759256.0A CN201410759256A CN104465171B CN 104465171 B CN104465171 B CN 104465171B CN 201410759256 A CN201410759256 A CN 201410759256A CN 104465171 B CN104465171 B CN 104465171B
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- heat pressure
- pressure adhesive
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- teleblem
- film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/005—Apparatus or processes specially adapted for the manufacture of electric switches of reed switches
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- Manufacturing & Machinery (AREA)
- Push-Button Switches (AREA)
Abstract
The invention discloses a kind of ultrathin touch-switch manufacture method, production flow process: PI film (or thin plate), silica gel button and PI teleblem raw material, five metals raw material feeds carry out the inspection of raw and process materials, then by counterdie, facial mask, cavity, A/B PIN punch forming, A/B PIN outgoing is electroplated, and the implantation of counterdie, A/B Pin pin, the facial mask heat pressure adhesive first step, heat pressure adhesive second step, metal clips, teleblem covering, heat pressure adhesive the 3rd step, cuts shaping, Product checking, tape package；It is simple that the present invention has technique, the advantages such as equipment occupation space is little, and production stage is few, the easy management and control of quality.
Description
Technical field
The present invention relates to electric switch technical field, particularly a kind of ultrathin touch-switch manufacture method.
Background technology
Existing touch-switch technical matters is injection mo(u)lding, and main raw material(s) is that (PA66/PA66 adds glass to plastic material
Fibre/PA4T/PA6T/PA9T/LCP etc.) graininess, remove moisture removal through high-temperature baking, recycling screw in injection molding machine is through high temperature
Extruding is injected in mould, and cooling shaping, the formed product cycle is long, and production link is many, controls loaded down with trivial details, and quality abnormal layer goes out
The poorest.There is following prominent shortcoming:
1. manufacturing cost is high, and buying plastic cement raw material carry out toasting, are molded, clean, duty cycle length, take bigger sky
Between, equipment needed thereby is more, and infusion of financial resources is many.Such as: a. needs to take bigger memory space and places injection molding apparatus；B. need
For being equipped with the equipment operation of specialty, the maintenance technique talent；C. need to increase plastic material proportioning device (for proportioning toner, look
Female)；D. the plastic inlet material remained after disintegrating apparatus processes injection mo(u)lding is increased；E. needs deposited by plastic inlet material
Memory space；F. rear end needs increase cleaning equipment to avoid the intrusion of dust, material, equipment, the talent to safeguard and all occupy ratio
More resource.
2. the production cycle is long, and production process and management and control step are more.Plastic cement raw material enter company after the assay was approved, need through
Crossing a. material mixture ratio: add toner or color masterbatch, every 100kg stirs 10 minutes；B. baking: the longer 70-of plastic material drying time
Within 12 degree/3-6 hour, it is dried；C. fastener injection: by fastener injection mo(u)lding switch pedestal together with plastic cement, the every mould of molding cycle
The 20-50PCS/30-50 second；D. product cuts shaping: product pin position cuts into required foot type, every 20-50PCS/3-5 second；
E. product cleans: Ultrasonic Cleaning, water temperature 65 degree/15 minutes, cleans greasy dirt. plastic cement bits, dust etc.；F. baking: after cleaning
Product be placed in high temperature roaster, every 40,000 pcs toast 2 hours.Said process is that plastic base+metal terminal is manufactured
Flow process, too much production link, virtually extend production fabrication cycle, add manufacturing cost and operation cost, mistake
Many production link add up errors are relatively big, cause quality process to be difficult to management and control.
3. switch size is relatively big, and traditional Shooting Technique is confined to injection-moulding device, mould and die accuracy, product yield, touches out
Close product size the biggest, although in recent years due to constantly lifting, the continuous lifting of Mold Making precision of equipment precision, gently
Tactile switch product does more accurate and more accurate the most therewith, does less and less, takes up room the least, but in terms of quality control, due to life
Product step is more, and touch-switch small size, the production yield effect of super thin product still allow of no optimist.
The most dust-proof, waterproof effect is unstable, plastic material need the most molten material, injection mo(u)lding switch pedestal, due to injection
The uncertain factor such as parameter, stabilization of equipment performance, is easily caused base and occurs that matched moulds line is substantially or with metal terminal bonding force not
By force, produce product crackle or crack phenomenon, dust and steam are easier to penetrate into, cause switch product functional deficiency, directly
Connect the use affecting end product.
Summary of the invention
In order to overcome the disadvantages mentioned above of prior art, it is an object of the invention to provide a kind of technique simple, hold facility is empty
Between little, production stage is few, the ultrathin touch-switch manufacture method of the easy management and control of quality.
The technical solution adopted for the present invention to solve the technical problems is: a kind of ultrathin touch-switch manufacture method, adopts
With hot pressing mode the most successively counterdie, A/B PIN, facial mask, cavity, metal clips, button and teleblem hot pressing；Wherein:
Described manufacture method step is as follows:
1) material prepares:
1. by PI film that counterdie is 2MIL, face mould be the PI film of 1/2MIL, cavity be that the PI film of 7MIL cuts into fixed ruler
Very little, it is fabricated to coiled material or sheet material, surface scribbles 0.01-0.1mm High temp. epoxy resins, and punch-forming mold is stand-by；
2. the PI film that teleblem is 2MIL is cut into fixed dimension, coat High temp. epoxy resins, silica gel button is incorporated height
Form entirety with PI teleblem in temperature epoxy resin, be fabricated to the sheet material of coiled material or solid shape, in order to follow-up punch-forming mold
Processing and fabricating；
Sheet material or the wire rod of the A/B Pin leg structure needed for 3. metal material being struck out switch are stand-by；
4. metal clips surface is multiple silver-colored or presses silver-colored silver-plated or gold-plated or nickel plating or tin plating；
2) the A/B Pin pin described in carries out outgoing plating, and surface is multiple silver-colored or presses silver-colored silver-plated or gold-plated or nickel plating or tin plating；
3) material feeding of step 1) is checked: use salt spray test 96H, hot and humid 96H, high/low-temperature impact 20/
Circulation, hot test 96H, low-temperature test 96H, solderability, resistance to soldering heat, plating adhesive force are tested；
4) first step heat pressure adhesive is carried out: being positioned on mould or tool by the counterdie of stamping, counterdie is by PE film
Cover faces up, and template can be fixed one or more pieces coiled materials or sheet material, removes the plastic sheeting that surface covers；To electroplate
Good A/B Pin pin sheet material or wire rod require orderly being arranged on counterdie according to correspondence, then take facial mask and remove the PE of one side
Film, by PE film remove one side be covered in A/B Pin pin surface, another side still retains, will fix counterdie, A/B Pin pin,
The mould of facial mask or tool put into the pre-heat pressure adhesive of the equipment heated, and described temperature is 100-200 degree, and the time is the 0.5-5 second,
For fixing product bed die, A/B Pin pin, three kinds of accessories of facial mask are integrally formed；The accessory forming entirety is put into temperature is
In the mould of 120-250 degree, pressure is 30-90KG/1CM2, can 1 group of counterdie of a heat pressure adhesive, A/B Pin pin, facial mask join
Part or many lens, carry out heat pressure adhesive more than 0.5 hour, take out be positioned over cool down under normal temperature stand-by；
5) second heat pressure adhesive is carried out: the assembly cooling down heat pressure adhesive step 4) is re-positioned at mould or tool
On, it is desirable to counterdie faces down, and facial mask upward, takes cavity and removes surface PE film, be covered on facial mask, by fixing heat pressure adhesive step
4) the pre-heat pressure adhesive of the equipment heated put into by assembly and the mould of cavity or tool, and described temperature is 100-200 degree, the time
For the 0.5-5 second, it is integrally formed for the assembly and two kinds of accessories of cavity fixing heat pressure adhesive step 4)；Overall accessory will be formed
Putting into the mould that temperature is 120-250 degree, pressure is 30-90KG/1CM2, can 1 group of heat pressure adhesive step of a heat pressure adhesive
4) assembly and cavity accessory or many lens, carry out heat pressure adhesive more than 0.5 hour, take out and be positioned under normal temperature cooling hour
Stand-by；
6) by metal clips implantation step 5) in the accessory of gained, once implant one or more pieces, be used for turning on A/B Pin
Pin circuit；
7) teleblem covers: teleblem and button are covered in formation confined space on cavity, and teleblem is combined into button
Semi-solid preparation high-temp epoxy glue high temperature adhesives, processing mode is: one layer of semi-solid preparation high-temp epoxy of uniform application on PI film or thin plate
Glue, keys in semi-solid preparation high-temp epoxy glue material is the most uncured when by button, is placed in baking in baking box, and temperature is 50-250
Degree, time a length of 5 minutes-15 minutes, treat that its solidification i.e. forms switch teleblem, metal clips and the cavity that has been fused into covered
Lid；
8) the 3rd step heat pressure adhesive is carried out: cover covering teleblem accessory equipped with on the cavity of metal clips, put into
In the equipment heated, pre-heat pressure adhesive temperature is 100-200 degree, and the time is the 0.5-5 second, for fixing heat pressure adhesive step 5)
Assembly and two kinds of accessories of teleblem accessory are integrally formed；The mould that temperature is 120-250 degree is put into by forming overall accessory
In, pressure is 30-90KG/1CM2, can the assembly of 1 group of heat pressure adhesive step 5) gained of a heat pressure adhesive and teleblem accessory or many
Lens, carries out heat pressure adhesive more than 0.5 hour, takes out placement the most stand-by；
9) cut shaping: the product that heat pressure adhesive step 8) is completed with cutting into blanking forming of mould, according to
Product specification and required A/B PIN distance and shape, cut shaped article；
10) finished product detection: shaped article in step 9) is delivered to inspection class, detecting electric performance, mechanical performance, size,
Outward appearance, action force, stroke, screen resilience, contact impedance, insulation impedance, proof voltage；
11) product packaging: the finished product in step 10) is carried out PE bag packaging or tape package processes.
Preferred as the present invention: described button is silica gel button；Hardness is hardness 40-90 degree.
Preferred as the present invention: described PI film uses thin plate to replace.
Preferred as the present invention: described A/B PIN uses phosphor-copper, brass, red metal, bronze, red copper, copper-nickel alloy, manganese
Steel, stainless iron, stainless steel are raw material, the multiple silver in surface or press silver-colored silver-plated or gold-plated or nickel plating or tin plating be made.
Preferred as the present invention: a width of 2-100mm*2-100mm of specification length of described product, height is 0.35mm-
10mm。
Preferred as the present invention: described implanted metal shell fragment is the most a piece of.
Preferred as the present invention: described production technique is PI material superposition 2 layers or more than 2 layers, utilizes epoxy
Resin makes through high temperature hot pressing bonding.
Preferred as the present invention: described heat pressure adhesive mode uses laser welding mode to replace.
Compared with prior art, the invention has the beneficial effects as follows: the technology of the present invention uses PI film or thin plate, sheet surface painting
Upper semi-solid preparation High temp. epoxy resins, processes through gluing, and after cooling through punch forming, high temperature hot pressing bonding can be fabricated to
Finished product；1, manufacturing process and traditional injection moulding are to fewer, and main use raw material is PI film or thin plate, through punch forming, high temperature
Baking extruding bonding is fabricated to product, and fabrication cycle is short, occupies little space, and equipment investment is less compared with traditional injection moulding, overall
Cost is relatively low；The most former material PI film or thin plate are that outsourcing piece need not use injection-moulding device, and material punching press shares the punching of A/B PIN
Press forming device；B. need not be equipped with the injection-moulding device operation of specialty and attendant；C. material need not spice and color matching,
Need not dispensing equipment；D. the direct compression packing of punching press waste material out, is sold to the regeneration of plastic cement manufacturer, is not required to
Want storage area, only need one piece of turnover space；E. the most hot-forming due to product, cut into again after being fabricated to finished product
Type, and dust-proof, classification of waterproof reaches country's (shell protection grade GB 4208) IP67 level, and rear end need not clean baking,
Manufacturing cost and quality improving are had to the lifting of matter.
2, production cycle relatively conventional production technology cycle time: raw material PI film or thin plate through after the assay was approved,
Complete, through operating procedure of the present invention, the Making programme that touch-switch finished product is whole, decrease injection, clean, baking etc.
Production link, effectively shortens processing time, it is to avoid the bad phenomenon too much produced due to technical process.
3, the present invention easily makes small volume, extra-thin touch-switch product, the counterdie of product, facial mask, cavity and
Teleblem is formed by PI film or the thin plate heat pressure adhesive of different-thickness, can adjust PI film or thin at any time according to product demand
Plate material thickness, hardness；Meeting the different product specification requirement of touch-switch, product integral manufacturing process is through experiment repeatedly
Confirm and the experimental verification of third party's reference professional standard, stable performance.
4, dust-proof, water resistance is good, product uses PI film or thin plate heat pressure adhesive to form, and PI has higher stretching,
Bending, compressive strength, mechanical performance index belongs to above the average, has the viscous energy of fabulous creep resistant, and dimensional stability is the most prominent
Go out, there is the highest vitrification point, heat decomposition temperature and use temperature continuously, can be at 250 DEG C of continuous work, electrical insulation capability
Excellent, within the scope of wider temperature, dipolar loss is fairly small, belongs to intermediate frequency dielectric material, has oils, organic solvent, diluted acid etc.
Good stability, can reach country's (shell protection grade GB 4208) IP67 level.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the partial structurtes schematic diagram of the present invention；
Fig. 3 is the partial structurtes schematic diagram of the present invention；
Fig. 4 is the partial structurtes schematic diagram of the present invention.
Detailed description of the invention
In conjunction with accompanying drawing 1 to 4 and embodiment, the present invention is further described:
1. in each parts of touch-switch, semi-finished product, finished product, plastic portions uses PI material, and PI material is the most uniformly coated with
Smear semi-solid preparation High temp. epoxy resins, use mould heat pressure adhesive technique to be made.
2. the cavity (fixing A/B Pin pin and metal clips) of heat pressure adhesive uses PI film or light sheet material, uses high temperature
120-250 degree, within 1-3 hour, heat pressure adhesive forms.
3. A/B PIN use copper material or manganese steel, surface gold-plating, silver-plated, tin plating, Nickel Plating Treatment, for turn-on power,
Reduce impedance.
4. the PI material (counterdie 1, facial mask 3, cavity 4) of composition cavity can make coiled material, thin plate, sheet material, and surface scribbles one
Layer semi-solid preparation High temp. epoxy resins.
5. button 6 uses silica gel and PI(teleblem 7) to utilize the mode of semi-solid preparation High temp. epoxy resins heat pressure adhesive to melt be one
Body, the material of button 6 is silica gel, and hardness 40-90 degree varies in color.
6. integrated artistic uses heat pressure adhesive mode, and production mode is one or more die cavity heat pressure adhesive simultaneously,
Continuous hot-press and automatic hot apparatus bonding mode can be used to make.
7. product specification can be used for making long a width of 2-100mm*2-100mm, and height is the switch of 0.35mm-10mm.
8., by PI mould regulation with in mould or model, mould or model periphery, inside can install heat-generating pipe (or heating circle etc.
Device), mould after product utilization heating or during model hot pressing semi-solid preparation High temp. epoxy resins be bonded after merging.
Embodiment one:
First require that the PI film that counterdie 1 is 2MIL is cut into fixing size by supplier, be fabricated to coiled material or fixing
The sheet material of shape, facilitates follow-up punch-forming mold processing and fabricating.May also require that supplier directly provides the coiled material processed
Or the sheet material of fixing specification, the one side of PI film contact fastener must be coated with semi-solid preparation High temp. epoxy resins, and there is plastic sheeting on surface
Protection, before not removing plastic sheeting, it is impossible to has dust or impurity to penetrate into, is fabricated to switch the required end by PI film punching press
Coiled material or the sheet material of film dimensions are stand-by.
The most secondly require that the PI film that facial mask 3 is 1/2MIL is cut into fixed dimension by supplier, be fabricated to coiled material or fixing
The sheet material of shape, facilitates follow-up punch-forming mold processing and fabricating.May also require that supplier directly provides the coiled material processed
Or the sheet material of fixing specification, PI film one side scribbles semi-solid preparation High temp. epoxy resins, and two sides has been both needed to plastic sheeting protection, is not going
Before plastic sheeting, it is impossible to have dust or impurity to penetrate into, be fabricated to switch required facial mask dimensions by PI film punching press
Coiled material or sheet material stand-by；
The most secondly require that the PI film that cavity 4 is 7MIL is cut into fixed dimension by supplier, be fabricated to coiled material or fixing shape
The sheet material of shape, facilitates follow-up punch-forming mold processing and fabricating.May also require that supplier directly provide the coiled material processed or
The sheet material of fixing specification, PI film one side scribbles semi-solid preparation High temp. epoxy resins, and two sides has been both needed to plastic sheeting protection, is not removing
Before plastic sheeting, it is impossible to have dust or impurity to penetrate into, be fabricated to switch required cavity size specification by PI film punching press
Coiled material or sheet material are stand-by；
The most secondly require that the PI film that teleblem 7 is 2MIL is cut into fixed dimension by supplier, scribble semi-solid preparation high-temp epoxy
Resin, forms entirety with PI teleblem in silica gel button incorporates semi-solid preparation High temp. epoxy resins, is fabricated to coiled material or solid shape
Sheet material, facilitate follow-up punch-forming mold processing and fabricating.May also require that supplier directly provides the coiled material processed or solid
The sheet material of set pattern lattice, the one side of PI film contact cavity need to have plastic sheeting to protect, before not removing plastic sheeting, it is impossible to has ash
Dirt or impurity penetrate into, and PI film punching press is fabricated to switch the coiled material of required teleblem dimensions or sheet material is stand-by；
E. by metal material (phosphor-copper, brass, red metal, bronze, red copper, copper-nickel alloy, manganese steel, stainless iron, stainless steel etc.) sheet material
Or wire rod strike out switch needed for A/B Pin pin 2 structure stand-by.
F. metal A/B Pin pin 2 outgoing plating, can gold-plated, silver-plated, tin plating, nickel plating etc.；
G. receiving inspection: salt spray test 96H, hot and humid 96H, high/low-temperature impact 20/ circulation, hot test 96H, low
Temperature test 96H, solderability, resistance to soldering heat, plating adhesive force etc.
H. the heat pressure adhesive first step (with reference to Fig. 1): the counterdie 1 of stamping is positioned on mould or tool, counterdie 1
By facing up that PE film covers, template can be fixed one or more pieces coiled materials or sheet material, remove the plastic sheeting that surface covers.Will
A/B Pin pin 2 sheet material electroplated or wire rod, (A/B Pin pin 2 is just to require orderly being arranged on counterdie according to correspondence
Reverse side must be distinguished one from the other), then take facial mask 3 and remove the PE film of one side, the one side that PE film is removed is covered in A/B Pin pin 2
Surface, another side still retains, and puts into, by fixing counterdie 1, A/B Pin pin 2, the mould of facial mask 3 or tool, the equipment heated
Interior pre-heat pressure adhesive temperature: 100-200 degree, time: 0.5-5 second, be used for fixing product counterdie 1, A/B Pin pin 2, facial mask 3 three
Plant accessory to be integrally formed.Put into temperature by forming overall accessory: the mould of 120-250 degree, pressure be 30-90KG/
1CM2, can 1 group of (counterdie 1, A/B Pin pin 2, facial mask 3) accessory of a heat pressure adhesive or many lens, carry out heat pressure adhesive 0.5
More than hour, take out be positioned over cool down under normal temperature stand-by.
I. heat pressure adhesive second step (with reference to Fig. 2): the assembly 123 cooling down the heat pressure adhesive first step is re-positioned at mould
On tool or tool, it is desirable to counterdie 1 faces down, and facial mask 3 upward, takes cavity 4 and removes surface PE film, be covered on facial mask 3, will be fixing
The equipment heated pre-heat pressure adhesive temperature: 100-put into by the assembly 123 of the heat pressure adhesive first step and the mould of cavity 4 or tool
200 degree, the time: 0.5-5 second, for fixing assembly 123 and the cavity 4 of the heat pressure adhesive first step) two kinds of accessories are integrally formed.Will
Form overall accessory and put into temperature: the mould of 120-250 degree, pressure is 30-90KG/1CM2, can a heat pressure adhesive 1
Group (assembly 123 of the heat pressure adhesive first step and cavity 4) accessory or many lens, carry out heat pressure adhesive more than 0.5 hour, takes out
Be positioned over cool down under normal temperature stand-by.
J. metal clips 5 is implanted (with reference to Fig. 3): metal clips 5(phosphor-copper, stainless steel) surface is multiple silver-colored or pressure is silver-colored (or plating
Silver-colored, gold-plated, nickel plating, tin plating), once implant one or more pieces, be mainly used in turning on A/B Pin pin 2 circuit.
K. teleblem covers: teleblem 7 and silica gel button 6 are covered in formation confined space, teleblem 7 on cavity 4 by teleblem
With silica gel button 6 be combined into semi-solid preparation high-temp epoxy glue high temperature adhesives, processing mode is: uniform application on PI mould or thin plate
One layer of semi-solid preparation high-temp epoxy glue, keys in silica gel button 6 semi-solid preparation high-temp epoxy glue material is the most uncured when, is placed in
Baking 50-120 degree in baking box, 5 minutes-15 minutes, treats that its solidification i.e. forms switch teleblem 7), by metal clips 5 and melted
The cavity 4 of synthesis covers；
L. heat pressure adhesive the 3rd step (Fig. 4): cover equipped with on the cavity 4 of metal clips 5 by covering teleblem 7 accessory,
Put into the equipment heated pre-heat pressure adhesive temperature: 100-200 degree, time: 0.5-5 second, be used for fixing heat pressure adhesive second step
Assembly 1234 and two kinds of accessories of teleblem 7 accessory be integrally formed.Temperature is put into: the mould of 120-250 degree by forming overall accessory
In tool, pressure is 30-90KG/1CM2, can heat pressure adhesive 1 group (assembly 1234 and the teleblem 7 of heat pressure adhesive second step are joined
Part) accessory or many lens, carry out heat pressure adhesive more than 0.5 hour, take out place cool down at normal temperatures stand-by；
M. cut shaping: the product that heat pressure adhesive the 3rd step is completed with cutting into blanking forming of mould, according to
Product specification and required A/B PIN 2 apart from and shape, make difference and cut into mould；
N. finished product detection: the product of forming is delivered to inspection class, the indices for product confirms, test electricity
Gas performance, mechanical performance, size, outward appearance, action force, stroke, screen resilience, contact impedance, insulation impedance, proof voltage etc.；
O. product packaging: PE bag packaging or tape package process.
Embodiment two:
A kind of ultrathin touch-switch manufacture method, uses hot pressing mode counterdie the most successively, A/B PIN, face
Film, cavity, metal clips, button and teleblem hot pressing；Wherein: described manufacture method step is as follows:
1) material prepares:
1. by PI film that counterdie is 2MIL, face mould be the PI film of 1/2MIL, cavity be that the PI film of 7MIL cuts into fixed ruler
Very little, it is fabricated to coiled material or sheet material, punch-forming mold is stand-by；
2. the PI film that teleblem is 2MIL is cut into fixed dimension, coat High temp. epoxy resins, silica gel button is incorporated height
Form entirety with PI teleblem in temperature epoxy resin, be fabricated to the sheet material of coiled material or solid shape, in order to follow-up punch-forming mold
Processing and fabricating；
Sheet material or the wire rod of the A/B Pin leg structure needed for 3. metal material being struck out switch are stand-by；
4. metal clips surface is multiple silver-colored or presses silver-colored silver-plated or gold-plated or nickel plating or tin plating；
2) the A/B Pin pin described in carries out outgoing plating；
3) material feeding of step 1) is checked: use salt spray test 96H, hot and humid 96H, high/low-temperature impact 20/
Circulation, hot test 96H, low-temperature test 96H, solderability, resistance to soldering heat, plating adhesive force are tested；
4) first step heat pressure adhesive is carried out: being positioned on mould or tool by the counterdie of stamping, counterdie is by PE film
Cover faces up, and template can be fixed one or more pieces coiled materials or sheet material, removes the plastic sheeting that surface covers；To electroplate
Good A/B Pin pin sheet material or wire rod require orderly being arranged on counterdie according to correspondence, then take facial mask and remove the PE of one side
Film, by PE film remove one side be covered in A/B Pin pin surface, another side still retains, will fix counterdie, A/B Pin pin,
The mould of facial mask or tool put into the pre-heat pressure adhesive of the equipment heated 100 degree/2 seconds, are used for fixing product counterdie, A/B
Pin pin, three kinds of accessories of facial mask are integrally formed；The accessory forming entirety is put into the mould of temperature 190 degree, and pressure is 40-
60KG/1CM2, can 1 group of counterdie of a heat pressure adhesive, A/B Pin pin, facial mask accessory or many lens, carry out heat pressure adhesive 2 little
Time, take out be positioned under normal temperature cooling 20 minutes stand-by；
5) second heat pressure adhesive is carried out: the assembly cooling down heat pressure adhesive step 4) is re-positioned at mould or tool
On, it is desirable to counterdie faces down, and facial mask upward, takes cavity and removes surface PE film, be covered on facial mask, by fixing heat pressure adhesive step
4) assembly and the mould of cavity or tool put into the pre-heat pressure adhesive of the equipment heated 100 degree/2 seconds, are used for fixing hot pressing
Adhesion step 4) assembly and two kinds of accessories of cavity be integrally formed；The accessory forming entirety is put into the mould of temperature 190 degree,
Pressure is 40-60KG/1CM2, can the assembly of 1 group of heat pressure adhesive step 4) of a heat pressure adhesive and cavity accessory or many lens,
Carry out heat pressure adhesive 2 hours, take out be positioned under normal temperature cooling 20 minutes stand-by；
6) by metal clips implantation step 5) in the accessory of gained, once implant one or more pieces, be used for turning on A/B Pin
Pin circuit；
7) teleblem covers: teleblem and button are covered in formation confined space on cavity, and teleblem is combined into button
Semi-solid preparation high-temp epoxy glue high temperature adhesives, processing mode is: one layer of semi-solid preparation high-temp epoxy of uniform application on PI mould or thin plate
Glue, keys in semi-solid preparation high-temp epoxy glue material is the most uncured when by button, is placed in baking box baking 60 degree, time a length of 10
Minute, treat that its solidification i.e. forms switch teleblem, metal clips and the cavity that has been fused into are covered；
8) the 3rd step heat pressure adhesive is carried out: cover covering teleblem accessory equipped with on the cavity of metal clips, put into
Pre-heat pressure adhesive 100 degree/2 seconds in the equipment heated, for fixing assembly 8 and the teleblem accessory 67 liang of heat pressure adhesive step 5)
Plant accessory to be integrally formed；The accessory forming entirety is put into the mould of temperature 190 degree, and pressure is 40-60KG/1CM2, can one
The assembly of 1 group of heat pressure adhesive step 5) gained of secondary heat pressure adhesive and teleblem accessory or many lens, carry out heat pressure adhesive 2 hours,
Take out place 20 minutes at normal temperatures stand-by；
9) cut shaping: the product that heat pressure adhesive step 8) is completed with cutting into blanking forming of mould, according to
Product specification and required A/B PIN distance and shape, cut into mould；
10) finished product detection: mould in step 9) is delivered to inspection class, detecting electric performance, mechanical performance, size,
Outward appearance, action force, stroke, screen resilience, contact impedance, insulation impedance, proof voltage；
11) product packaging: the finished product in step 10) is carried out PE bag packaging or tape package processes.
Described button is silica gel button；Hardness is hardness 40-90 degree.
Described PI film uses thin plate to replace.
Described A/B PIN uses copper material or manganese steel to be made.
The a width of 2.5-8.0mm*2.5-8.0mm of specification length of described product, height is 0.35mm-1.5mm.
Described implanted metal shell fragment is 1 ~ 3.
Described production technique is PI material superposition 2 layers or more than 2 layers, utilizes epoxy resin through high-temperature hot pressure viscosity
Close and make.
Case study on implementation three:
A kind of ultrathin touch-switch manufacture method, uses hot pressing mode counterdie the most successively, A/B PIN, face
Film, cavity, metal clips, button and teleblem hot pressing；Wherein: described manufacture method step is as follows:
1) material prepares:
1. by PI film that counterdie is 2MIL, face mould be the PI film of 1/2MIL, cavity be that the PI film of 7MIL cuts into fixed ruler
Very little, it is fabricated to coiled material or sheet material, punch-forming mold is stand-by；
2. the PI film that teleblem is 2MIL is cut into fixed dimension, coat High temp. epoxy resins, silica gel button is incorporated height
Form entirety with PI teleblem in temperature epoxy resin, be fabricated to the sheet material of coiled material or solid shape, in order to follow-up punch-forming mold
Processing and fabricating；
Sheet material or the wire rod of the A/B Pin leg structure needed for 3. metal material being struck out switch are stand-by；
4. metal clips surface is multiple silver-colored or presses silver-colored silver-plated or gold-plated or nickel plating or tin plating；
2) the A/B Pin pin described in carries out outgoing plating；
3) material feeding of step 1) is checked: use salt spray test 96H, hot and humid 96H, high/low-temperature impact 20/
Circulation, hot test 96H, low-temperature test 96H, solderability, resistance to soldering heat, plating adhesive force are tested；
4) the heat pressure adhesive first step (Fig. 1): by counterdie 1(PI film or the thin plate of stamping) it is positioned mould or tool
On, counterdie 1, by facing up that PE film covers, template can be fixed one or more pieces coiled materials or sheet material, removes moulding of surface covering
Material film.By A/B Pin pin 2 sheet material electroplated or wire rod, require orderly to be arranged in (A/B on counterdie according to correspondence
The positive and negative of Pin pin 2 must be distinguished one from the other), then take facial mask 3 and remove the PE film of one side, the one side that PE film is removed is covered in
A/B Pin pin 2 surface, another side still retains, and puts into fixing counterdie 1, A/B Pin pin 2, the mould of facial mask 3 or tool
Pre-heat pressure adhesive temperature in the equipment heated: 100-200 degree, the time: 0.5-5 second, is used for fixing product counterdie 1, A/B Pin pin
2,3 three kinds of accessories of facial mask are integrally formed.Temperature is put into: the mould of 120-250 degree, pressure is 30-by forming overall accessory
90KG /1CM2, can heat pressure adhesive 1 group (counterdie mould 1., A/B Pin pin 2, facial mask 3) accessory or many lens, carry out heat
Pressure viscosity close more than 0.5 hour, take out be positioned over cool down under normal temperature stand-by.
5) second step laser welding is carried out: the assembly cooling down heat pressure adhesive step 4) is re-positioned at mould or tool
On, it is desirable to bed die faces down, and facial mask upward, takes cavity and removes surface PE film, be covered on facial mask, by fixing heat pressure adhesive step
4) in assembly and the mould of cavity or tool, using near infrared ray laser (NIR), wavelength is in 810 to 1064 nanometers, by hot pressing
Adhesion step 4) assembly and two kinds of accessories of cavity be welded into entirety, can a laser welding 1 group of heat pressure adhesive step 4)
Assembly and cavity accessory or many lens, take out that to be positioned under normal temperature cooling 20 minutes stand-by；
6) by metal clips implantation step 5) in the accessory of gained, once implant one or more pieces, be used for turning on A/B Pin
Pin circuit；
7) teleblem covers: teleblem and button are covered in formation confined space on cavity, and teleblem is combined into button
Semi-solid preparation high-temp epoxy glue high temperature adhesives, processing mode is: one layer of semi-solid preparation high-temp epoxy of uniform application on PI mould or thin plate
Glue, keys in semi-solid preparation high-temp epoxy glue material is the most uncured when by button, is placed in baking box baking 60 degree, time a length of 30
Minute, treat that its solidification i.e. forms switch teleblem, metal clips and the cavity that has been fused into are covered；
8) the 3rd step laser welding is carried out: cover covering teleblem accessory equipped with on the cavity of metal clips, use
Near infrared ray laser (NIR), wavelength is in 810 to 1064 nanometers, for fixed laser welding step 5) assembly and teleblem accessory
Two kinds of accessories are integrally formed；Can 1 group of laser soldering process 5 of a laser welding) assembly and the teleblem accessory of gained or assemble more
Part, take out place 20 minutes at normal temperatures stand-by；
9) cut shaping: by laser soldering process 8) product that completes with cutting into blanking forming of mould, according to
Product specification and required A/B PIN distance and shape, cut into mould；
10) finished product detection: mould in step 9) is delivered to inspection class, detecting electric performance, mechanical performance, size,
Outward appearance, action force, stroke, screen resilience, contact impedance, insulation impedance, proof voltage；
11) product packaging: the finished product in step 10) is carried out PE bag packaging or tape package processes.
Described button is silica gel button；Hardness is hardness 40-90 degree.
Described PI film uses thin plate to replace.
Described A/B PIN uses copper material or manganese steel to be made.
The a width of 2-100mm*2-100mm of specification length of described product, height is 0.3mm-10mm.
Described implanted metal shell fragment is the most a piece of.
Described production technique is PI material superposition 2 layers or more than 2 layers, utilizes laser welding to make.
Case study on implementation four:
A kind of ultrathin touch-switch manufacture method, uses hot pressing mode counterdie the most successively, A/B PIN, face
Film, cavity, metal clips, button and teleblem hot pressing；Wherein: described manufacture method step is as follows:
1) material prepares:
1. by counterdie be the thin plate of 0.25mm, face mould be the thin plate of 0.1mm, cavity be that the thin plate of 0.35mm cuts into fixing
Size, is fabricated to coiled material or sheet material, and punch-forming mold is stand-by；
2. the thin plate that teleblem is 0.1mm is cut into fixed dimension, coat High temp. epoxy resins, silica gel button is incorporated height
Form entirety with PI teleblem in temperature epoxy resin, be fabricated to the sheet material of coiled material or solid shape, in order to follow-up punch-forming mold
Processing and fabricating；
Sheet material or the wire rod of the A/B Pin leg structure needed for 3. metal material being struck out switch are stand-by；
4. metal clips surface is multiple silver-colored or presses silver-colored silver-plated or gold-plated or nickel plating or tin plating；
2) the A/B Pin pin described in carries out outgoing plating；
3) material feeding of step 1) is checked: use salt spray test 96H, hot and humid 96H, high/low-temperature impact 20/
Circulation, hot test 96H, low-temperature test 96H, solderability, resistance to soldering heat, plating adhesive force are tested；
4) carrying out first step heat pressure adhesive: by the bottom mould postioning of stamping on mould or tool, counterdie is by PE film
Cover faces up, and template can be fixed one or more pieces coiled materials or sheet material, removes the plastic sheeting that surface covers；To electroplate
Good A/B Pin pin sheet material or wire rod require orderly being arranged on counterdie according to correspondence, then take facial mask and remove the PE of one side
Film, by PE film remove one side be covered in A/B Pin pin surface, another side still retains, will fix counterdie, A/B Pin pin,
The mould of facial mask or tool put into the pre-heat pressure adhesive of the equipment heated 160 degree/3.5 seconds, are used for fixing product counterdie, A/B
Pin pin, three kinds of accessories of facial mask are integrally formed；The accessory forming entirety is put into the mould of temperature 200 degree, and pressure is 50-
90KG/1CM2, can 1 group of counterdie of a heat pressure adhesive, A/B Pin pin, facial mask accessory or many lens, carry out heat pressure adhesive 2 little
Time, take out be positioned under normal temperature cooling 20 minutes stand-by；
5) second heat pressure adhesive is carried out: the assembly cooling down heat pressure adhesive step 4) is re-positioned at mould or tool
On, it is desirable to counterdie faces down, and facial mask upward, takes cavity and removes surface PE film, be covered on facial mask, by fixing heat pressure adhesive step
4) assembly and the mould of cavity or tool put into the pre-heat pressure adhesive of the equipment heated 160 degree/3.5 seconds, for fixing heat
Assembly and two kinds of accessories of cavity of pressure viscosity conjunction step 4) are integrally formed；The accessory forming entirety is put into the mould of temperature 200 degree
In, pressure is 50-90KG/1CM2, can assembly and the cavity accessory of 1 group of heat pressure adhesive step 4) of a heat pressure adhesive or assemble more
Part, carries out heat pressure adhesive 2 hours, take out be positioned under normal temperature cooling 20 minutes stand-by；
6) by metal clips implantation step 5) in the accessory of gained, once implant one or more pieces, be used for turning on A/B Pin
Pin circuit；
7) teleblem covers: teleblem and button are covered in formation confined space on cavity, and teleblem is combined into button
Semi-solid preparation high-temp epoxy glue high temperature adhesives, processing mode is: one layer of semi-solid preparation high-temp epoxy of uniform application on PI film or thin plate
Glue, keys in semi-solid preparation high-temp epoxy glue material is the most uncured when by button, is placed in baking box baking 60 degree, time a length of 30
Minute, treat that its solidification i.e. forms switch teleblem, metal clips and the cavity that has been fused into are covered；
8) the 3rd step heat pressure adhesive is carried out: cover covering teleblem accessory equipped with on the cavity of metal clips, put into
Pre-heat pressure adhesive 160 degree/3.5 seconds in the equipment heated, for fixing assembly and the teleblem accessory two of heat pressure adhesive step 5)
Plant accessory to be integrally formed；The accessory forming entirety is put into the mould of temperature 200 degree, and pressure is 50-90KG/1CM2, can one
The assembly of 1 group of heat pressure adhesive step 5) gained of secondary heat pressure adhesive and teleblem accessory or many lens, carry out heat pressure adhesive 2 hours,
Take out place 20 minutes at normal temperatures stand-by；
9) cut shaping: the product that heat pressure adhesive step 8) is completed with cutting into blanking forming of mould, according to
Product specification and required A/B PIN distance and shape, cut into mould；
10) finished product detection: mould in step 9) is delivered to inspection class, detecting electric performance, mechanical performance, size,
Outward appearance, action force, stroke, screen resilience, contact impedance, insulation impedance, proof voltage；
11) product packaging: the finished product in step 10) is carried out PE bag packaging or tape package processes.
Described button is silica gel button；Hardness is hardness 40-90 degree.
Described A/B PIN uses copper material or manganese steel to be made.
The a width of 3.5-10.0mm*3.5-10.0mm of specification length of described product, height is 1.0mm-2.5mm.
Described implanted metal shell fragment is the most a piece of.
Described production technique is thin plate superposition 4 layers or more than more than 4 layers, utilizes epoxy resin through high temperature hot pressing
Bonding makes.
In sum, after those of ordinary skill in the art reads file of the present invention, according to technical scheme and
Technology design makes other various corresponding conversion scheme without creative mental labour, belongs to the model that the present invention is protected
Enclose.
Claims (6)
1. a ultrathin touch-switch manufacture method, use hot pressing mode counterdie the most successively, A/B PIN, facial mask,
Cavity, metal clips, button and teleblem hot pressing；It is characterized in that: described manufacture method step is as follows:
1) material prepares:
1. by PI film that counterdie is 2MIL, facial mask be the PI film of 1/2MIL, cavity be that the PI film of 7MIL cuts into fixed dimension,
Being fabricated to coiled material or sheet material, surface scribbles 0.01-0.1mm High temp. epoxy resins, and punch-forming mold is stand-by；
2. the PI film that teleblem is 2MIL is cut into fixed dimension, coat High temp. epoxy resins, silica gel button is incorporated high temperature ring
Form entirety with PI teleblem in epoxy resins, be fabricated to the sheet material of coiled material or solid shape, in order to follow-up punch-forming mold is processed
Make；
Sheet material or the wire rod of the A/BPIN leg structure needed for 3. metal material being struck out switch are stand-by；
4. metal clips surface is covered silver or presses silver-colored silver-plated or gold-plated or nickel plating or tin plating；
2) the A/B PIN described in carries out outgoing plating, and surface is covered silver or presses silver-colored silver-plated or gold-plated or nickel plating or tin plating；
3) material feeding of step 1) is checked: use salt spray test 96H, hot and humid 96H, high/low-temperature impact 20/ circulation,
Hot test 96H, low-temperature test 96H, solderability, resistance to soldering heat, plating adhesive force are tested；
4) first step heat pressure adhesive is carried out: being positioned on mould or tool by the counterdie of stamping, counterdie is covered by PE film
Face up, template can fix one or more pieces coiled materials or sheet material, remove the plastic sheeting that surface covers；By electroplated
A/B PIN sheet material or wire rod require orderly being arranged on counterdie according to correspondence, then take facial mask and remove the PE film of one side, will
The one side that PE film is removed is covered in A/B PIN surface, and another side still retains, and will fix counterdie, A/B PIN, facial mask
Mould or tool put into the pre-heat pressure adhesive of the equipment heated, temperature is 100-200 degree, and the time is the 0.5-5 second, is used for fixing
Product counterdie, A/B PIN, three kinds of accessories of facial mask are integrally formed；It is 120-250 degree by form overall accessory putting into temperature
In mould, pressure is 30-90KG/1CM2, can 1 group of counterdie of a heat pressure adhesive, A/B PIN, facial mask accessory or many lens,
Carry out heat pressure adhesive more than 0.5 hour, take out be positioned over cool down under normal temperature stand-by；
5) second heat pressure adhesive is carried out: re-positioned at by the assembly cooling down heat pressure adhesive step 4) on mould or tool,
Requirement counterdie faces down, and facial mask upward, takes cavity and removes surface PE film, be covered on facial mask, by fixing heat pressure adhesive step 4)
Assembly and the mould of cavity or tool put into the pre-heat pressure adhesive of the equipment heated, temperature is 100-200 degree, and the time is 0.5-
5 seconds, it is integrally formed for the assembly and two kinds of accessories of cavity fixing heat pressure adhesive step 4)；Temperature is put into by forming overall accessory
In the degree mould for 120-250 degree, pressure is 30-90KG/1CM2, can the group of 1 group of heat pressure adhesive step 4) of a heat pressure adhesive
Part and cavity accessory or many lens, carry out heat pressure adhesive more than 0.5 hour, take out be positioned over cool down under normal temperature stand-by；
6) by metal clips implantation step 5) in the accessory of gained, once implant one or more pieces, be used for turning on A/B PIN electricity
Road；
7) teleblem covers: teleblem and button are covered in formation confined space on cavity, and teleblem is the most solid with being combined into of button
Changing high-temp epoxy glue high temperature adhesives, processing mode is: one layer of semi-solid preparation high-temp epoxy glue of uniform application on PI film or thin plate,
Button being keyed in the when that material being the most uncured semi-solid preparation high-temp epoxy glue, is placed in baking in baking box, temperature is 50-120 degree, time
A length of 5 minutes-20 minutes, treat that its solidification i.e. forms switch teleblem, metal clips and the cavity that has been fused into are covered；
8) the 3rd step heat pressure adhesive is carried out: cover covering teleblem accessory equipped with on the cavity of metal clips, put into and heat
Equipment in pre-heat pressure adhesive temperature be 100-200 degree, the time is the 0.5-5 second, for fixing the assembly of heat pressure adhesive step 5)
And two kinds of accessories of teleblem accessory are integrally formed；The mould that temperature is 120-250 degree is put into, pressure by forming overall accessory
Power is 30-90KG/1CM2, can assembly and the teleblem accessory of 1 group of heat pressure adhesive step 5) gained of a heat pressure adhesive or assemble more
Part, carries out heat pressure adhesive more than 0.5 hour, takes out placement the most stand-by；
9) shaping is cut: product heat pressure adhesive step 8) completed is with cutting into blanking forming of mould, according to product
Specification and required A/B PIN distance and shape, cut shaped article；
10) finished product detection: shaped article in step 9) is delivered to clinical laboratory, detecting electric performance, mechanical performance, size, outward appearance,
Action force, stroke, screen resilience, contact impedance, insulation impedance, proof voltage；
11) product packaging: the finished product in step 10) is carried out PE bag packaging or tape package processes.
2. according to a kind of ultrathin touch-switch manufacture method described in claim 1, it is characterised in that: described button is
Silica gel button；Hardness is 40-90 degree.
3. according to a kind of ultrathin touch-switch manufacture method described in claim 1, it is characterised in that: described PI film is adopted
Replace with thin plate.
4. according to a kind of ultrathin touch-switch manufacture method described in claim 1, it is characterised in that: described A/B
PIN uses phosphor-copper, brass, red metal, bronze, red copper, copper-nickel alloy, manganese steel, stainless iron, stainless steel to be raw material, surface cover silver or
Press silver-colored silver-plated or gold-plated or nickel plating or tin plating be made.
5. according to a kind of ultrathin touch-switch manufacture method described in claim 1, it is characterised in that: described implantation gold
Belong to shell fragment and be at least 1.
6. according to a kind of ultrathin touch-switch manufacture method described in claim 1, it is characterised in that: described hot pressing is glued
Conjunction mode uses laser welding mode to replace.
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| JP6520305B2 (en) * | 2015-03-30 | 2019-05-29 | ミツミ電機株式会社 | Push switch |
| CN105845468B (en) * | 2016-05-20 | 2018-05-29 | 浙江虹穗精密电子有限公司 | A kind of touch switch and its manufacturing method |
| CN108963710B (en) * | 2018-06-28 | 2021-02-19 | 深圳市长盈精密技术股份有限公司 | Method for manufacturing elastic sheet |
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| KR100325033B1 (en) * | 1998-06-01 | 2002-08-09 | 최동구 | Method for manufacturing dual tact switch and dual tact switch and medical electronic scalpel using dual tact switch |
| JP2002270062A (en) * | 2001-03-06 | 2002-09-20 | Citizen Electronics Co Ltd | Push switch |
| CN101673635B (en) * | 2009-09-29 | 2013-07-03 | 中兴通讯股份有限公司 | Ultrathin mobile terminal key and processing method thereof |
| KR20120011136A (en) * | 2010-07-28 | 2012-02-07 | 이수호 | A PCB tact switch |
| JP2012059432A (en) * | 2010-09-07 | 2012-03-22 | Panasonic Corp | Push switch |
| CN203659703U (en) * | 2014-01-28 | 2014-06-18 | 乐清市日精电气有限公司 | Fireproof type touch switch |
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Address after: 518100 B46, Tantou West Industrial Park, Songgang Street, Bao'an District, Shenzhen, Guangdong Patentee after: Shenzhen Dongqiang Precision Technology Co.,Ltd. Address before: 518100 B46, Tantou West Industrial Park, Songgang Street, Bao'an District, Shenzhen, Guangdong Patentee before: SHENZHEN DONGQIANG PRECISE PLASTIC & ELECTRIC Co.,Ltd. |
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