CN104460747A - Cooling device of displayer and displayer - Google Patents
Cooling device of displayer and displayer Download PDFInfo
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- CN104460747A CN104460747A CN201410798816.3A CN201410798816A CN104460747A CN 104460747 A CN104460747 A CN 104460747A CN 201410798816 A CN201410798816 A CN 201410798816A CN 104460747 A CN104460747 A CN 104460747A
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Abstract
The invention relates to a cooling device of a displayer and the displayer provided with the cooling device. The cooling device of the displayer comprises a driving chip and a plurality of cooling units, and the driving chip is used for receiving temperature signals of the external displayer and carrying out data processing. Each cooling unit comprises a switch module and a cooling assembly. The driving chip drives each cooling assembly to work through the corresponding switch module. According to the cooling device and the displayer, after receiving the temperature signals fed back by the outside, the driving chip processes and judges an area needing cooling and controls the cooling units to selectively work in a progressive scanning mode; when making contact with a screen body, the cooling units can dissipate heat of the screen body, and therefore the screen body can be cooled selectively.
Description
Technical field
The present invention relates to technical field of flat panel display, particularly relate to a kind of display heat sink and display.
Background technology
Compare traditional liquid crystal panel, AMOLED (Active Matrix/Organic Light EmittingDiode, active matrix organic light-emitting diode (AMOLED) panel) has the features such as reaction velocity is very fast, contrast is higher, visual angle is wider.Therefore it widely uses in various fields, as fields such as flat pannel display, display backlight sources.
The luminescent device of displayer part limits due to developing material, and the life-span of luminescent device, particularly blue lifetime was lower, and accelerated deterioration under the higher environment of working temperature, the life-span is shorter.And the difference that the device degradation in displayer exists can cause display screen subregion first can occur problem of aging, affect the display effect of monoblock screen, even cause screen body to be scrapped in advance.
The impact of luminescent material mainly by steam and oxygen of AMOLED is comparatively large, so conventional solution constantly promotes encapsulation technology to avoid deteriorated difference, but current encapsulation technology has been difficult to improve again.And the interface position encapsulated under the environment that temperature is higher expands physical reactions and can accelerate water oxygen and enter, and accelerated deterioration, causes light-emitting device life period shorter.
Summary of the invention
Based on this, be necessary to provide a kind of display heat sink realizing selective brain cooling.
Technical scheme provided by the invention is:
A kind of display heat sink, comprise and receive and judge the driving chip of the display temperature signal of external transmission and multiple temperature reducing unit, wherein each temperature reducing unit cooling assembly of comprising switch module, being driven by switch module, described driving chip drives described cooling component operation by described switch module.
Wherein in an embodiment, described cooling assembly comprises the temperature lowering board of N-type semiconductor sheet, P-type semiconductor sheet, connection N-type semiconductor sheet and P-type semiconductor sheet, and connects two radiating pieces of N-type semiconductor sheet and P-type semiconductor sheet respectively.
Wherein in an embodiment, described switch module is triode, and the base stage of described triode is connected with described driving chip, and described two radiating pieces are all connected with the collector of described triode or emitter.
Wherein in an embodiment, described switch module is mos field effect transistor, the grid of described mos field effect transistor is connected with described driving chip, and described two radiating pieces are all connected with the drain electrode of described mos field effect transistor or source electrode.
Wherein in an embodiment, between described cooling assembly and described switch module, be also provided with accumulate electric capacity.
Wherein in an embodiment, described display heat sink also comprises flexible PCB, and described driving chip is arranged on described flexible PCB.
Wherein in an embodiment, also comprise substrate, multiple cooling assembly is placed on substrate, and described flexible PCB nation is due to described substrate.
A kind of display is also proposed, comprise screen body, also comprise the display heat sink being placed in described screen body side, described display heat sink comprises reception external display temperature signal and carries out the driving chip of data processing and multiple temperature reducing unit, wherein each temperature reducing unit comprises switch module, cooling assembly, described driving chip drives described cooling component operation by described switch module, and described cooling assembly contacts with described screen body.
Wherein in an embodiment, described cooling assembly comprises N-type semiconductor sheet, P-type semiconductor sheet, connects the temperature lowering board of N-type semiconductor sheet and P-type semiconductor sheet, is connected two radiating pieces of N-type semiconductor sheet and P-type semiconductor sheet, and described temperature lowering board contacts with described screen body.
Wherein in an embodiment, described switch module is triode, and the base stage of described triode is connected with described driving chip, and collector or the emitter of described radiating piece and described triode are connected; Or, described switch module is mos field effect transistor, the grid of described mos field effect transistor is connected with described driving chip, and drain electrode or the source electrode of described cooling assembly and described mos field effect transistor are connected.
In aforementioned display device heat sink and display, after driving chip receives the temperature signal information of external feedback, driving chip process judges the region needing cooling, the work of temperature reducing unit selectivity is controlled by the mode of lining by line scan, when temperature reducing unit contacts with screen body, heat on screen body can be distributed, thus screen body can be made to realize selective brain cooling.
Accompanying drawing explanation
Fig. 1 is the system framework figure of inventive display heat sink;
Fig. 2 is the schematic diagram of temperature reducing unit of the present invention;
Fig. 3 is the schematic diagram of assembly of lowering the temperature in temperature reducing unit of the present invention;
Fig. 4 is the workflow diagram of inventive display heat sink.
Embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Preferred embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the understanding of disclosure of the present invention more comprehensively thorough.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.On the contrary, when element be referred to as " directly existing " another element " on " time, there is not intermediary element.Term as used herein " vertical ", " level ", "left", "right" and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
Please refer to Fig. 1 to Fig. 3, the invention provides a kind of display heat sink, comprise and receiving and the driving chip 110 judging the display temperature signal (in Fig. 1, arrow illustrated) of external transmission and the multiple temperature reducing unit 120 driven by driving chip 110.Display heat sink of the present invention, the temperature information in each region of screen body of display is transmitted by external process devices, the region needing cooling is judged by driving chip process, utilize the mode of lining by line scan to control multiple temperature reducing unit 120 and carry out selectivity work, distributed by the heat of temperature reducing unit 120 by screen body, thus realize selective brain cooling.
In Fig. 1, multiple temperature reducing unit 120 is placed on a substrate (as glass).Driving chip 110 is placed on a flexible PCB 130.Flexible PCB 130 is tied on substrate, thus sets up signal between driving chip 110 with temperature reducing unit 120 and be connected.Driving chip 110 and temperature reducing unit 120 can be bonded to the back side (non-luminescent face) of the screen body of display by glass substrate.But need point out, driving chip 110, multiple temperature reducing unit 120 also can directly using the back sides of the screen body of display as substrate, namely also driving chip 110, multiple temperature reducing unit 120 directly can be bonded in the back side of the screen body of display.Multiple temperature reducing unit 120 is contacted with the screen body of display, guarantees to lower the temperature to the screen body of display.
Multiple temperature reducing unit 120 arranges the form in multirow, and such driving chip 110 can open the temperature reducing unit of full line by switching voltage wire 140.The cooling assembly 124 that temperature reducing unit 120 comprises switch module 122 and driven by switch module 122.Driving chip 110 drives cooling assembly 124 to work by switch module 122.
In the present invention, the principle of work of cooling assembly 124 make use of peltier effect, when its principle is the loop when consisting of different conductors electric current, except the irreversible Joule heat of generation, in the joint of different conductor along with heat absorption, exothermic phenomenon can appear in the difference of direction of current respectively.
Ginseng Fig. 3, cooling assembly 124 comprises N-type semiconductor sheet 1242, P-type semiconductor sheet 1243, connects the temperature lowering board 1244 of N-type semiconductor sheet 1242 and P-type semiconductor sheet 1243, is connected two radiating pieces 1245 of N-type semiconductor sheet 1242 and P-type semiconductor sheet 1243 respectively.Switch module 122 is utilized 125 to add voltage between two radiating pieces, when switch module 122 is opened, in the loop at cooling assembly 124 place just in add voltage, according to peltier effect, temperature lowering board 1244 place will produce endothermic thermal event, and radiating piece 1245 then produces exothermic phenomenon.Thus, temperature lowering board 1244 is utilized can to lower the temperature to screen body.Radiating piece 1245 then can also be connected with other heat abstractor further, to be distributed by heat better.
In the present embodiment, N-type semiconductor sheet 1242 has two, and one is connected with temperature lowering board 1244, and one is then connected with radiating piece 1245.Connect with wire 1246 between two N-type semiconductor sheets 1242, to reduce energy consumption.Same, P-type semiconductor sheet 1243 has two, and one is connected with temperature lowering board 1244, and one is then connected with another radiating piece 1245.Also connect with wire 1246 between two P-type semiconductor sheets 1243, to reduce energy consumption.
Ginseng Fig. 2, in the present invention, switch module 122 is mos field effect transistor, utilizes the function of its control circuit switch to control cooling assembly 124 to work.The grid of mos field effect transistor is connected with driving chip 110, two radiating pieces 1245 of cooling assembly 124 are all connected with the drain electrode of mos field effect transistor or source electrode, the loop ground connection at cooling assembly 124 place simultaneously, this loop possesses the possibility introducing voltage.Meanwhile, accumulate electric capacity 1247 is also provided with in aforementioned loop.
Switch module 122 can be also triode, and the base stage of triode is connected with driving chip 110, and two radiating pieces 1245 are then connected with the collector of triode or emitter.
Be described for mos field effect transistor for switch module 122.During work, mos field effect transistor is connected with the screen temperature supervising device in the external world.Signal conductor 150 is utilized to accept the extraneous curtage signal transmitted, driving chip 110 is given with switching voltage by switching voltage wire 140 to open the temperature reducing unit 120 of full line, according to the signal that signal conductor 150 is given, driving chip 110 judges that the temperature reducing unit 120 of signal conductor 150 correspondence is the need of cooling simultaneously, then control corresponding mos field effect transistor by switching voltage wire 140 to open, the cooling assembly 124 of corresponding temperature reducing unit 120 is worked.The existence of accumulate electric capacity 1247, can keep the operating voltage of cooling assembly 124 to be maintained to driving chip 110 scanning next time.
Ginseng Fig. 4, gives the workflow of display heat sink.During work, it first gathers each regional temperature information of screen body, is processed judge cooling region by driving chip 110.Then driving chip 110 process information input, and this information is controlled monoblock cooling substrate (i.e. the system of multiple temperature reducing unit 120 formation) by the mode that transmission voltage is lined by line scan carry out selective brain cooling, because each temperature reducing unit is equipped with the accumulate electric capacity 1247 keeping voltage, so sweep frequency is less demanding.Every N carries out a cycle, as 3 seconds second.Display heat sink of the present invention, can realize optionally lowering the temperature.
Present invention also offers a kind of display, comprise screen body and aforesaid display heat sink.Display heat sink is arranged in screen body side, and the temperature lowering board 1244 of temperature reducing unit 120 is touched with the back face of screen body.Display heat sink directly can be bonded in the back side of screen body, also first can be arranged in substrate (as glass substrate) and then be bonded to the back side of shielding body.Like this, display just possesses the function of selective brain cooling, thus can solve and there is temperature difference and cause display screen subregion first can occur problem of aging, avoids the display effect affecting monoblock screen, avoids screen body to scrap in advance.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a display heat sink, it is characterized in that, comprise and receive external display temperature signal and carry out the driving chip of data processing and multiple temperature reducing unit, wherein each temperature reducing unit comprises switch module, cooling assembly, and described driving chip drives described cooling component operation by described switch module.
2. display heat sink according to claim 1, it is characterized in that, described cooling assembly comprises the temperature lowering board of N-type semiconductor sheet, P-type semiconductor sheet, connection N-type semiconductor sheet and P-type semiconductor sheet, and connects two radiating pieces of N-type semiconductor sheet and P-type semiconductor sheet respectively.
3. display heat sink according to claim 2, is characterized in that, described switch module is triode, and the base stage of described triode is connected with described driving chip, and described two radiating pieces are all connected with the collector of described triode or emitter.
4. display heat sink according to claim 2, it is characterized in that, described switch module is mos field effect transistor, the grid of described mos field effect transistor is connected with described driving chip, and described two radiating pieces are all connected with the drain electrode of described mos field effect transistor or source electrode.
5. the display heat sink according to claim 3 or 4, is characterized in that, is also provided with accumulate electric capacity between described cooling assembly and described switch module.
6. display heat sink according to claim 2, is characterized in that, described display heat sink also comprises flexible PCB, and described driving chip is arranged on described flexible PCB.
7. display heat sink according to claim 6, is characterized in that, also comprise substrate, and multiple cooling assembly is placed on substrate, and described flexible PCB nation is due to described substrate.
8. a display, comprise screen body, it is characterized in that, also comprise the display heat sink being placed in described screen body side, described display heat sink comprises reception external display temperature signal and carries out the driving chip of data processing and multiple temperature reducing unit, wherein each temperature reducing unit comprises switch module, cooling assembly, and described driving chip drives described cooling component operation by described switch module, and described cooling assembly contacts with described screen body.
9. display according to claim 8, it is characterized in that, described cooling assembly comprises N-type semiconductor sheet, P-type semiconductor sheet, connects the temperature lowering board of N-type semiconductor sheet and P-type semiconductor sheet, is connected two radiating pieces of N-type semiconductor sheet and P-type semiconductor sheet, and described temperature lowering board contacts with described screen body.
10. display according to claim 9, is characterized in that, described switch module is triode, and the base stage of described triode is connected with described driving chip, and collector or the emitter of described radiating piece and described triode are connected; Or, described switch module is mos field effect transistor, the grid of described mos field effect transistor is connected with described driving chip, and drain electrode or the source electrode of described cooling assembly and described mos field effect transistor are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410798816.3A CN104460747B (en) | 2014-12-19 | 2014-12-19 | Cooling device of displayer and displayer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410798816.3A CN104460747B (en) | 2014-12-19 | 2014-12-19 | Cooling device of displayer and displayer |
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| CN104460747A true CN104460747A (en) | 2015-03-25 |
| CN104460747B CN104460747B (en) | 2017-01-18 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068039A (en) * | 2017-01-12 | 2017-08-18 | 张新民 | LED single pixel RGB display devices and LED show bar |
| CN108572035A (en) * | 2018-04-25 | 2018-09-25 | 京东方科技集团股份有限公司 | A kind of temperature control device and its control method, display device |
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| CN2870159Y (en) * | 2006-01-16 | 2007-02-14 | 彩虹集团电子股份有限公司 | Plasma display screen burn-in device |
| CN201084029Y (en) * | 2007-06-13 | 2008-07-09 | 惠州市康力电子有限公司 | Display radiation control device |
| CN201622482U (en) * | 2010-01-20 | 2010-11-03 | 安徽华东光电技术研究所 | Temperature control system for reinforced liquid crystal display |
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| KR20050049665A (en) * | 2003-11-22 | 2005-05-27 | 삼성에스디아이 주식회사 | Plasma display apparatus |
| CN2870159Y (en) * | 2006-01-16 | 2007-02-14 | 彩虹集团电子股份有限公司 | Plasma display screen burn-in device |
| CN201084029Y (en) * | 2007-06-13 | 2008-07-09 | 惠州市康力电子有限公司 | Display radiation control device |
| US20110019126A1 (en) * | 2009-07-24 | 2011-01-27 | Byungjin Choi | Apparatus for radiating heat of light emitting diode and liquid crystal display using the same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107068039A (en) * | 2017-01-12 | 2017-08-18 | 张新民 | LED single pixel RGB display devices and LED show bar |
| CN108572035A (en) * | 2018-04-25 | 2018-09-25 | 京东方科技集团股份有限公司 | A kind of temperature control device and its control method, display device |
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| CN104460747B (en) | 2017-01-18 |
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Effective date of registration: 20201208 Address after: No.146 Tianying Road, high tech Zone, Chengdu, Sichuan Province Patentee after: Chengdu CHENXIAN photoelectric Co.,Ltd. Address before: 215300, 188, Feng Feng Road, Kunshan hi tech Zone, Suzhou, Jiangsu, Kunshan Patentee before: Kunshan New Flat Panel Display Technology Center Co.,Ltd. Patentee before: KunShan Go-Visionox Opto-Electronics Co.,Ltd. |
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