CN104451809B - Surface ceramic deposition device and surface ceramic deposition processing method - Google Patents
Surface ceramic deposition device and surface ceramic deposition processing method Download PDFInfo
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- CN104451809B CN104451809B CN201410621140.0A CN201410621140A CN104451809B CN 104451809 B CN104451809 B CN 104451809B CN 201410621140 A CN201410621140 A CN 201410621140A CN 104451809 B CN104451809 B CN 104451809B
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Abstract
The invention discloses a kind of surface ceramic deposition device and surface ceramic deposition processing method, wherein, described device includes electrolytic cell (1), the minus plate (2) and power supply (5) being arranged in the electrolytic cell, the positive pole of the power supply is connected with the minus plate, and negative pole is connected with workpiece to be added (4).Methods described uses above-mentioned surface ceramic deposition device, and methods described includes：1) positive source is connected with minus plate, negative pole is connected with workpiece to be added, and is positioned in the electrolytic cell for filling electrolyte；2) power supply is powered, by workpiece surface ceramic to be added.The present invention includes the electrolytic cell of electrolyte by setting, and workpiece to be added and minus plate are placed in the electrolytic solution, workpiece to be added and minus plate are connected with the two poles of the earth of power supply respectively simultaneously, so that equably plating last layer oxidation-resistant film on workpiece to be added, the antioxygenic property of inner alloy material is considerably increased.
Description
Technical field
The present invention relates to alloy surface ceramic field, in particular it relates to a kind of surface ceramic deposition device and surface ceramic
Change processing method.
Background technology
The alloy materials such as magnesium alloy are widely used in daily production and living, and many products are to use such alloy material
Prepared, but in actual use, because such alloy material such as magnesium alloy be positioned over for a long time in air easily with sky
Oxygen, water seal in gas etc. react, so that product easily turns into waster because of long-term place, so as to greatly increase
Storage cost, and conventional surface treatment method is often extremely complex when applied to the alloy type material such as magnesium alloy, and it is raw
The finished product in postpartum is often different, thus is difficult that batch is surface-treated to it.
Therefore it provides it is a kind of easy to operate, applied widely and with low cost, greatly improve the alloy material table such as magnesium alloy
The problem of surface ceramic deposition device and surface ceramic deposition processing method of face oxidation resistance are urgent need to resolve of the present invention.
The content of the invention
For above-mentioned prior art, it is an object of the invention to overcome in the prior art the alloy material surface such as magnesium alloy it is easy
Oxidation, and because shape of product is different, it is difficult to the problem of batch is handled its surface, so as to provide a kind of easy to operate, suitable
It is wide and with low cost with scope, greatly improve the surface ceramic deposition device and table of the alloy material surface oxidation resistance such as magnesium alloy
Face ceramic processing method.
To achieve these goals, the invention provides a kind of surface ceramic deposition device, wherein, described device includes electrolysis
Groove, the minus plate and power supply being arranged in the electrolytic cell, the positive pole of the power supply are connected with the minus plate, negative pole with
Workpiece to be added is connected.
Preferably, multiple through holes are provided with the minus plate.
Preferably, the minus plate is rectangular slab, and the through hole is circle, and a diameter of negative electrode of the through hole
The 1/1500-1/100 on the long side of plate.
Preferably, described device also includes insulation board, and the insulation board is arranged between the minus plate and workpiece to be added.
Preferably, the voltage of the power supply is 400-500V, and electric current is 60-85A.
Preferably, the minus plate is copper coin.
Preferably, the copper content of the copper coin is not less than 58%.
Present invention also offers a kind of surface ceramic deposition processing method, wherein, methods described uses above-mentioned surface ceramic deposition
Device, methods described includes：
1) positive source is connected with minus plate, negative pole is connected with workpiece to be added, and is positioned over the electrolysis for filling electrolyte
In groove；
2) power supply is powered, by workpiece surface ceramic to be added.
Preferably, step 1) in be additionally included between the minus plate and the workpiece to be added and place insulation board, it is and described
The flowing of the electrolyte of the endless fully blocking insulation board both sides of insulation board.
Preferably, step 2) in conduction time be 5-30min.
According to above-mentioned technical proposal, the present invention includes the electrolytic cell of electrolyte by setting, and placement is treated in the electrolytic solution
Workpiece and minus plate, while workpiece to be added and minus plate are connected with the two poles of the earth of power supply respectively, so that treating
Last layer oxidation-resistant film is equably plated on workpiece, meanwhile, the oxidation-resistant film that this mode is plated is not only uniform, and can be according to reality
Border needs to adjust its thickness, considerably increases the antioxygenic property of inner alloy material.
Other features and advantages of the present invention will be described in detail in subsequent embodiment part.
Brief description of the drawings
Accompanying drawing is, for providing a further understanding of the present invention, and to constitute a part for specification, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is a kind of structural representation for surface ceramic deposition device that the present invention is provided.
Description of reference numerals
1- electrolytic cell 2- minus plates
3- insulation boards 4- workpiece to be added
5- power supply 6- through holes.
Embodiment
The embodiment of the present invention is described in detail below in conjunction with accompanying drawing.It should be appreciated that this place is retouched
The embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
The invention provides a kind of surface ceramic deposition device, wherein, as shown in figure 1, described device includes electrolytic cell 1, set
The minus plate 2 and power supply 5 being placed in the electrolytic cell 1, the positive pole of the power supply 5 are connected with the minus plate 2, negative pole with
Workpiece 4 to be added is connected.
Above-mentioned design includes the electrolytic cell 1 of electrolyte by setting, and places workpiece 4 to be added and minus plate in the electrolytic solution
2, while by workpiece 4 to be added and minus plate 2, the two poles of the earth respectively with power supply 5 are connected, so that on workpiece 4 to be added
Last layer oxidation-resistant film is plated evenly, meanwhile, the oxidation-resistant film that this mode is plated is not only uniform, and can adjust according to actual needs
Its thickness, considerably increases the antioxygenic property of inner alloy material.
The minus plate can be conventional platy structure, certainly, in order that obtaining the coating effects on the top layer of workpiece 4 to be added more
It is good, the present invention it is a kind of preferred embodiment in, multiple through holes 6 are also provided with the minus plate 2.
The minus plate 2 can have any shape, certainly, in order that the coating effects for obtaining the surface of workpiece 4 to be added are more preferable,
In a kind of embodiment being more highly preferred to of the present invention, the minus plate 2 could be arranged to rectangular slab, and the through hole 6 also may be used
Think arbitrary shape, for example, the present invention it is a kind of preferred embodiment in, the through hole 6 is circle, and the through hole 6
A diameter of minus plate 2 long side 1/1500-1/100.The through hole 6 can be arranged in minus plate 2 in any way
On, it is, of course, preferable to be also generally evenly distributed on minus plate 2 and be advisable.
In order to avoid being contacted between minus plate 2 and workpiece to be added 4, so as to result in path, its top layer is caused not plate
Film, the present invention it is a kind of preferred embodiment in, described device can also include insulation board 3, and the insulation board 3 be arranged at
Between the minus plate 2 and workpiece to be added 4.By this set, so as to realize the effect for separating minus plate 2 and workpiece to be added 4.
The power supply 5 can be power supply commonly used in the art, certainly, in order to obtain more preferable coating effects, at this
In a kind of embodiment being more highly preferred to of invention, the voltage of the power supply 5 could be arranged to 400-500V, and electric current is 60-
85A。
The minus plate 2 is minus plate type commonly used in the art, for example, in a kind of preferred implementation of the present invention
In mode, the minus plate 2 can be selected as copper coin.
The copper coin can be that the content of copper in conventional use of copper coin type, copper coin can not be further qualified, when
So, in order to obtain more preferable using effect, the present invention it is a kind of preferred embodiment in, the copper content of the copper coin is preferential
Select to be not less than 58%.
Present invention also offers a kind of surface ceramic deposition processing method, wherein, methods described uses surface described above
Ceramic device, methods described includes：
1) positive source is connected with minus plate 2, negative pole is connected with workpiece 4 to be added, and is positioned over the electricity for filling electrolyte
Solve in groove 1；
2) power supply is powered, by the top layer ceramic of workpiece 4 to be added.
In order to ensure in actual use, it will not be touched between the minus plate 2 and the workpiece to be added,
The present invention it is a kind of preferred embodiment in, step 1) in be additionally included between the minus plate 2 and the workpiece to be added 4 and put
Put insulation board 3, and the flowing of the electrolyte of the endless fully blocking both sides of insulation board 3 of the insulation board 3.The insulation board 3 is
Insulating materials commonly used in the art, therefore not to repeat here.
In order to reach the coating effects of needs, in a kind of embodiment being more highly preferred to of the present invention, step 2) in
Conduction time could be arranged to 5-30min.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, still, the present invention is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the present invention, a variety of letters can be carried out to technical scheme
Monotropic type, these simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (7)
1. a kind of surface ceramic deposition device, it is characterised in that described device includes electrolytic cell (1), is arranged at the electrolytic cell (1)
In minus plate (2) and power supply (5), the positive pole of the power supply (5) is connected with the minus plate (2), negative pole with it is to be processed
Part (4) is connected；
Wherein, multiple through holes (6) are provided with the minus plate (2)；Described device also includes insulation board (3), the insulation board
(3) it is arranged between the minus plate (2) and workpiece to be added (4)；The minus plate (2) is rectangular slab, and the through hole (6) is
Circle, and the 1/1500-1/100 on the long side of a diameter of minus plate (2) of the through hole (6).
2. device according to claim 1, it is characterised in that the voltage of the power supply (5) is 400-500V, electric current is
60-85A。
3. device according to claim 1 or 2, it is characterised in that the minus plate (2) is copper coin.
4. device according to claim 3, it is characterised in that the copper content of the copper coin is not less than 58%.
5. a kind of surface ceramic deposition processing method, it is characterised in that methods described is made pottery using surface according to claim 4
Porcelain makeup is put, and methods described includes：
1) positive source is connected with minus plate (2), negative pole is connected with workpiece to be added (4), and is positioned over the electricity for filling electrolyte
Solve in groove (1)；
2) power supply is powered, by workpiece to be added (4) top layer ceramic.
6. method according to claim 5, it is characterised in that step 1) in be additionally included in the minus plate (2) with it is described
Insulation board (3), and the electrolysis of endless fully blocking insulation board (3) both sides of the insulation board (3) are placed between workpiece (4) to be added
The flowing of liquid.
7. method according to claim 6, it is characterised in that step 2) in conduction time be 5-30min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410621140.0A CN104451809B (en) | 2014-11-05 | 2014-11-05 | Surface ceramic deposition device and surface ceramic deposition processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410621140.0A CN104451809B (en) | 2014-11-05 | 2014-11-05 | Surface ceramic deposition device and surface ceramic deposition processing method |
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| Publication Number | Publication Date |
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| CN104451809A CN104451809A (en) | 2015-03-25 |
| CN104451809B true CN104451809B (en) | 2017-10-20 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106801241A (en) * | 2017-02-13 | 2017-06-06 | 广东飞翔达科技有限公司 | The device and method of a kind of ceramic protective coating of generation on metal parts |
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| JP2004107680A (en) * | 2002-09-13 | 2004-04-08 | Central Res Inst Of Electric Power Ind | Method for depositing carbon thin film on ceramic |
| CN101092730A (en) * | 2007-06-25 | 2007-12-26 | 大连海事大学 | Oxidation method and equipment of element of arc under low energy consumption |
| CN101368286A (en) * | 2008-07-31 | 2009-02-18 | 镁联科技（芜湖）有限公司 | Large area light alloy micro-arc oxidization surface processing method and apparatus |
| KR100927196B1 (en) * | 2009-08-25 | 2009-11-18 | 주식회사 세미유 | Plasma electrolysing oxcidation device for mg alloys goods |
| CN101724879A (en) * | 2009-12-16 | 2010-06-09 | 中国科学院力学研究所 | Brush-plating and film-forming device for ceramic coating through plasma electrolytic oxidation (PEO) and method thereof |
| CN201915159U (en) * | 2010-12-07 | 2011-08-03 | 江阴职业技术学院 | ZA43 high alimunium-zinc base alloy micro-arc oxidation device |
| CN203754837U (en) * | 2013-12-18 | 2014-08-06 | 西安理工大学 | Workpiece surface micro-arc oxidation treatment device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104073861A (en) * | 2014-07-23 | 2014-10-01 | 哈尔滨工业大学 | High-speed electroplating rotary hull cell |
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2014
- 2014-11-05 CN CN201410621140.0A patent/CN104451809B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004107680A (en) * | 2002-09-13 | 2004-04-08 | Central Res Inst Of Electric Power Ind | Method for depositing carbon thin film on ceramic |
| CN101092730A (en) * | 2007-06-25 | 2007-12-26 | 大连海事大学 | Oxidation method and equipment of element of arc under low energy consumption |
| CN101368286A (en) * | 2008-07-31 | 2009-02-18 | 镁联科技（芜湖）有限公司 | Large area light alloy micro-arc oxidization surface processing method and apparatus |
| KR100927196B1 (en) * | 2009-08-25 | 2009-11-18 | 주식회사 세미유 | Plasma electrolysing oxcidation device for mg alloys goods |
| CN101724879A (en) * | 2009-12-16 | 2010-06-09 | 中国科学院力学研究所 | Brush-plating and film-forming device for ceramic coating through plasma electrolytic oxidation (PEO) and method thereof |
| CN201915159U (en) * | 2010-12-07 | 2011-08-03 | 江阴职业技术学院 | ZA43 high alimunium-zinc base alloy micro-arc oxidation device |
| CN203754837U (en) * | 2013-12-18 | 2014-08-06 | 西安理工大学 | Workpiece surface micro-arc oxidation treatment device |
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| CN104451809A (en) | 2015-03-25 |
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Effective date of registration: 20180416 Address after: 241000 Wuhu high tech Industrial Development Zone, Anhui Patentee after: Gu Chengying Address before: The high-tech industry in Anhui province 241000 Wuhu Matang District Development Zone Patentee before: M-Union (Wuhu) Co., Ltd. |
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Effective date of registration: 20191114 Address after: 233400 Building 1, sunshine garden, durcheng Town, Huaiyuan County, Bengbu City, Anhui Province 107 Patentee after: Huaiyuan shuoguo Intellectual Property Service Co., Ltd Address before: Wuhu High-tech Industrial Development Zone Patentee before: Gu Chengying |
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Effective date of registration: 20211123 Address after: 256100 west side of the intersection of Hongjing road and Yimeng Road, Yiyuan County, Zibo City, Shandong Province Patentee after: YIYUAN XUGUANG MACHANICAL CO.,LTD. Address before: 233400 room 107, building 1, sunshine garden, Liucheng Town, Huaiyuan County, Bengbu City, Anhui Province Patentee before: Huaiyuan shuoguo Intellectual Property Service Co.,Ltd. |