CN104449527A - Enameled wire binder preparation method - Google Patents

Enameled wire binder preparation method Download PDF

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Publication number
CN104449527A
CN104449527A CN201310422136.7A CN201310422136A CN104449527A CN 104449527 A CN104449527 A CN 104449527A CN 201310422136 A CN201310422136 A CN 201310422136A CN 104449527 A CN104449527 A CN 104449527A
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CN
China
Prior art keywords
enameled wire
preparation
diacid
binding agent
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310422136.7A
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Chinese (zh)
Inventor
张国生
张建清
张斌
李岩
杨胜杰
张杏荣
钱新华
姚扎西
张芬萍
张衡伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DANYANG STAR CHEMICAL Co Ltd
Original Assignee
DANYANG STAR CHEMICAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DANYANG STAR CHEMICAL Co Ltd filed Critical DANYANG STAR CHEMICAL Co Ltd
Priority to CN201310422136.7A priority Critical patent/CN104449527A/en
Publication of CN104449527A publication Critical patent/CN104449527A/en
Pending legal-status Critical Current

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Abstract

The present invention relates to an enameled wire binder preparation method, which comprises: (1) preparing a resin, wherein N-methyl pyrrolidone, diisocyanate and diacid are adopted to prepare the resin, the N-methyl pyrrolidone, the diisocyanate and the diacid are sequentially added under a stirring state, gradual heating is performed from a room temperature to a temperature of 180-190 DEG C, the reaction is performed until achieving a transparent state, and cooling is performed to achieving the room temperature; and (2) preparing a binder, wherein the resin and xylene are taken, and stirring is performed for 2-5 h at a room temperature to prepare the enameled wire binder. According to the present invention, the enameled wire binder prepared through the method of the present invention has good binding strength; and the binder adopted as the priming paint and the common enameled wire varnish adopted as the top coat are coated on the enameled wire, such that the adhesion ability of enameled wire is increased, and other performances of the enameled wire are not affected.

Description

A kind of preparation method of enameled wire binding agent
Technical field
The present invention relates to a kind of preparation method of enameled wire binding agent.
Background technology
Wire enamel is the indispensable electrical insulating coating being applied to electrical equipment, is one of critical materials controlling electric installation economic and technical norms and operation life.The insulation layer (i.e. enameled wire coat) that enameled wire is coated with, should have good heat, electricity, machinery and chemical resistance.
Have the requirement of strong adhesive force at special occasions to wire enamel, common wire enamel cannot meet this requirement, therefore needs to use wire enamel binding agent.
Summary of the invention
Technical problem to be solved by this invention is to provide the preparation method of the good enameled wire binding agent of a kind of cohesive strength.
For solving the problems of the technologies described above, the invention provides a kind of preparation method of enameled wire binding agent, comprising the steps:
(1) preparation method of resin: adopt N-Methyl pyrrolidone, vulcabond, diacid to prepare resin, wherein vulcabond comprises: diphenylmethanediisocyanate, tolylene diisocyanate, 1, one or more in hexamethylene-diisocyanate, isophorone diisocyanate, diacid comprises: one or more in terephthalic acid, m-phthalic acid, long chain diacid, the mol ratio of vulcabond and diacid is 4:5 ~ 5:4, and the mol ratio of N-Methyl pyrrolidone and vulcabond is 10:1 ~ 10:3; Concrete preparation process: add N-Methyl pyrrolidone, vulcabond, diacid successively under whipped state, is progressively raised to 180 ~ 190 DEG C from room temperature, and question response is cooled to room temperature to transparent;
(2) preparation method of binding agent: get above-mentioned resin, dimethylbenzene, at room temperature stirs and can obtain enameled wire binding agent in 2 ~ 5 hours, and wherein the mol ratio of resin and dimethylbenzene is 7:3 ~ 7:5.
A kind of enameled wire binding agent, it adopts above-mentioned preparation method to obtain.
When this enameled wire binding agent uses, binding agent makees priming paint, common polyamide imide enamelled wire varnishes does finish paint, by 2 layers, priming paint, finish paint 7 layers of overcoating on enameled wire, thus improves the sticking power of wire enamel.
Technique effect of the present invention: the enameled wire binding agent cohesive strength that the present invention prepares is good, by binding agent is made priming paint, common wire enamel does finish paint and is coated on enameled wire, improves the adhesive ability of wire enamel, and does not affect other performances of enameled wire; This enameled wire binding agent wide adaptability, can be used for the sticking power strengthening multiple wire enamel.
Embodiment
Embodiment 1
The preparation method of the enameled wire binding agent of the present embodiment, comprises the steps:
(1) preparation method of resin: get N-Methyl pyrrolidone 10 parts, diphenylmethanediisocyanate 0.5 part, 1, hexamethylene-diisocyanate 0.5 part, terephthalic acid 0.5 part, hexanodioic acid 0.5 part, N-Methyl pyrrolidone, diphenylmethanediisocyanate, 1 is added successively under whipped state, hexamethylene-diisocyanate, terephthalic acid, hexanodioic acid, progressively be raised to 190 DEG C from room temperature, question response is cooled to room temperature to transparent;
(2) preparation method of binding agent: get above-mentioned resin 70 parts, dimethylbenzene 30 parts, at room temperature stirs and can obtain enameled wire binding agent in 4 hours.
Obtained enameled wire binding agent priming paint, common polyamide imide enamelled wire varnishes (as four STAI68 reaching Chemical Co., Ltd.) are done finish paint, by 2 layers, priming paint, finish paint 7 layers of overcoating enameled wire.
Embodiment 2
(1) preparation method of resin: get N-Methyl pyrrolidone 10 parts, diphenylmethanediisocyanate 0.8 part, tolylene diisocyanate 0.2 part, terephthalic acid 0.5 part, m-phthalic acid 0.5 part, N-Methyl pyrrolidone, diphenylmethanediisocyanate, tolylene diisocyanate, terephthalic acid, m-phthalic acid is added successively under whipped state, progressively be raised to 190 DEG C from room temperature, question response is cooled to room temperature to transparent;
(2) preparation method of binding agent: get above-mentioned resin 70 parts, dimethylbenzene 40 parts, at room temperature stirs and can obtain enameled wire binding agent in 5 hours.
Obtained enameled wire binding agent priming paint, common polyamide imide enamelled wire varnishes (as four STAI68 reaching Chemical Co., Ltd.) are done finish paint, by 2 layers, priming paint, finish paint 7 layers of overcoating enameled wire.
Comparative example: with common polyamide imide enamelled wire varnishes (as four STAI68 reaching Chemical Co., Ltd.), coat enameled wire.
Comparative example and embodiment performance test as shown in the table.

Claims (4)

1. a preparation method for enameled wire binding agent, is characterized in that comprising the steps:
(1) preparation method of resin: adopt N-Methyl pyrrolidone, vulcabond, diacid to prepare resin, N-Methyl pyrrolidone, vulcabond, diacid is added successively under whipped state, progressively be raised to 180 ~ 190 DEG C from room temperature, question response is cooled to room temperature to transparent;
(2) preparation method of binding agent: get above-mentioned resin, dimethylbenzene, at room temperature stirs and can obtain enameled wire binding agent in 2 ~ 5 hours.
2. the preparation method of enameled wire binding agent as claimed in claim 1, it is characterized in that: in step (1), vulcabond comprises: diphenylmethanediisocyanate, tolylene diisocyanate, 1, one or more in hexamethylene-diisocyanate, isophorone diisocyanate, diacid comprises: one or more in terephthalic acid, m-phthalic acid, long chain diacid, the mol ratio of vulcabond and diacid is 4:5 ~ 5:4, and the mol ratio of N-Methyl pyrrolidone and vulcabond is 10:1 ~ 10:3.
3. the preparation method of enameled wire binding agent as claimed in claim 2, it is characterized in that: in step (2), the mol ratio of resin and dimethylbenzene is 7:3 ~ 7:5.
4. the enameled wire binding agent prepared of preparation method as claimed in claim 1, is characterized in that:
In the preparation method of resin, vulcabond comprises: diphenylmethanediisocyanate, tolylene diisocyanate, 1, one or more in hexamethylene-diisocyanate, isophorone diisocyanate, diacid comprises: one or more in terephthalic acid, m-phthalic acid, long chain diacid, the mol ratio of vulcabond and diacid is 4:5 ~ 5:4, and the mol ratio of N-Methyl pyrrolidone and vulcabond is 10:1 ~ 10:3;
In the preparation method of binding agent, the mol ratio of resin and dimethylbenzene is 7:3 ~ 7:5.
CN201310422136.7A 2013-09-16 2013-09-16 Enameled wire binder preparation method Pending CN104449527A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310422136.7A CN104449527A (en) 2013-09-16 2013-09-16 Enameled wire binder preparation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310422136.7A CN104449527A (en) 2013-09-16 2013-09-16 Enameled wire binder preparation method

Publications (1)

Publication Number Publication Date
CN104449527A true CN104449527A (en) 2015-03-25

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Family Applications (1)

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CN201310422136.7A Pending CN104449527A (en) 2013-09-16 2013-09-16 Enameled wire binder preparation method

Country Status (1)

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CN (1) CN104449527A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1449424A (en) * 2000-08-25 2003-10-15 施奈克泰迪国际公司 Polyamide-imide resin solution and the use thereof for producing wire enamels
US20080176072A1 (en) * 2005-02-21 2008-07-24 Lee Joon-Hee Enamel Varnish Composition For Enamel Wire And Enamel Wire Using The Same
CN102618160A (en) * 2012-03-16 2012-08-01 丹阳四达化工有限公司 Method for synthesizing C-level polyurethane wire enamel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1449424A (en) * 2000-08-25 2003-10-15 施奈克泰迪国际公司 Polyamide-imide resin solution and the use thereof for producing wire enamels
US20080176072A1 (en) * 2005-02-21 2008-07-24 Lee Joon-Hee Enamel Varnish Composition For Enamel Wire And Enamel Wire Using The Same
CN102618160A (en) * 2012-03-16 2012-08-01 丹阳四达化工有限公司 Method for synthesizing C-level polyurethane wire enamel

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Application publication date: 20150325

RJ01 Rejection of invention patent application after publication