CN104449511A - Preparation method of adhesive resin composition of H-grade multi-rubber powder mica tape - Google Patents
Preparation method of adhesive resin composition of H-grade multi-rubber powder mica tape Download PDFInfo
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- CN104449511A CN104449511A CN201410740812.XA CN201410740812A CN104449511A CN 104449511 A CN104449511 A CN 104449511A CN 201410740812 A CN201410740812 A CN 201410740812A CN 104449511 A CN104449511 A CN 104449511A
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- Insulation, Fastening Of Motor, Generator Windings (AREA)
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Abstract
The invention provides a preparation method of an adhesive resin composition of an H-grade multi-rubber powder mica tape. The preparation method comprises the following step: weighing the following raw materials in percentage by mass: 25%-40% of tung oil, 5%-15% of maleic anhydride, 15%-28% of BMI bismaleimide, 3%-8% of E51 epoxy resin, 5%-15% of E44 epoxy resin, 2%-7% of E12 epoxy resin, 4%-12% of F51 epoxy resin, 4%-10% of F44 epoxy resin, 0.3%-0.5% of an accelerant and 35%-50% of an organic solvent. According to the prepared adhesive resin composition prepared by the method, the raw material source is convenient; the preparation method is simple and easy to operate; and the H-grade multi-rubber powder mica tape prepared by using the method is used for preparing an H-grade 6kV main insulator of a high-voltage motor stator coil. The tooling and process of a building user do not need to be changed; the use is convenient; the mica tape is good in use manufacturability; the mechanical and electrical properties of the main insulator are good; especially, the average loss value of a hot medium is the superior product index of the motor industry; and the adhesive resin composition becomes an ideal insulating material of the H-grade high-voltage motor stator main insulator.
Description
Technical field
The present invention relates to high-tension electric motor stator coil major insulation Material Field, be specifically related to the preparation method of the adhesive resin composition that the many adhesive-contented mica tapes of a kind of H level adopt.
Background technology
Now, the dielectric level of the large and medium-sized motor of domestic high pressure is commonly F level (Long-term service temperature is 155 DEG C).Along with the development of power industry, more and more higher to the heat resistant requirements of insulating material is inexorable trend.
, start development in the eighties abroad, the high-voltage motor of the occasion requiring heatproof high in Special high-voltage motor, in fire proof motor, wind-power electricity generation, traction electric machine, steel melting furnace, chemical industry etc. in domestic nearly ten years.Require H level major insulation material----mica tape, insulation mode need mold pressing or vacuum impregnation shaping.But, the domestic mica tape that can reach H class B insulation, the mica tape being tackiness agent with silicone resin and modification diphenyl ether.These two kinds of tackiness agent have fatal shortcoming: the former can not compression moulding; The latter's " dielectric loss " index is too high, does not reach the requirement of high-voltage motor to " dielectric loss ".Therefore, above two kinds of tackiness agent are not suitable for doing high-voltage H level generator stator winding insulation material.
Summary of the invention
For above-mentioned defect or deficiency, the invention provides the preparation method of the adhesive resin composition that the many adhesive-contented mica tapes of a kind of H level adopt.
For reaching above object, technical scheme of the present invention is:
A preparation method for the adhesive resin composition of the many adhesive-contented mica tapes of H level, comprises the following steps:
1) raw material is taken according to mass ratio: tung oil 25% ~ 40%, MALEIC ANHYDRIDE 5% ~ 15%, BMI bismaleimides 15% ~ 28%, E51 epoxy resin 3% ~ 8%, E44 epoxy resin 5% ~ 15%, E12 epoxy resin 2% ~ 7%, F51 epoxy resin 4% ~ 12%, F44 epoxy resin 4% ~ 10%, promotor 0.3% ~ 0.5%, organic solvent 35% ~ 50%;
2) tung oil is added in reactor I, stir and add MALEIC ANHYDRIDE after heating, being then warming up to 140 DEG C ~ 180 DEG C, and stirring insulation;
3) in reactor II, add organic solvent and BMI bismaleimides, at 105 DEG C ~ 110 DEG C stirring and refluxing reaction pour in reactor I after BMI bismaleimides dissolves completely, and in reactor I stirring reaction;
4) in reactor II, add E51 epoxy resin, E44 epoxy resin, E12 epoxy resin, F51 epoxy resin and F44 epoxy resin epoxy resin, start and to stir and after heating, add promotor, be stirred to transparent after, put in reactor I, stir, obtain the adhesive resin composition that the many adhesive-contented mica tapes of H level adopt.
Described promotor is subsidence feed.
Described subsidence feed is YC-1 subsidence feed or FXQ latent.
Described organic solvent is toluene.
Described step 2) in tung oil is added in reactor I, stir and be heated to 40 DEG C ~ 80 DEG C.
Described step 2) stir soaking time be not less than 20 minutes.
Described step 4) in be heated to 90 DEG C ~ 100 DEG C.Compared with the prior art, beneficial effect of the present invention is:
The invention provides the preparation method of the adhesive resin composition of the many adhesive-contented mica tapes of a kind of H level, this processing method makes simple, raw material is easy to obtain, be convenient to produce, in addition, prepared adhesive resin composition can be used in preparing insulating material, adopts the many adhesive-contented mica tapes of H level manufactured by the present invention, can be used for manufacturing the high-voltage motor stator coil major insulation of H level 6kV level.Without the need to changing frock and the technique of applying unit, easy to use, mica tape operation is good, major insulation mechanical, electrical functional, and especially hot (180 DEG C) dielectric loss mean value is the premium grads index of electromechanics trade.Become the desired insulation material of H level high voltage motor stator major insulation.
Embodiment
Below the present invention is described in detail.
Embodiment 1
The invention provides the preparation method of the adhesive resin composition of the many adhesive-contented mica tapes of a kind of H level, comprise the following steps:
1) raw material is taken according to mass ratio: tung oil 35%, MALEIC ANHYDRIDE 10%, BMI bismaleimides 17%, E51 epoxy resin 7%, E44 epoxy resin 12%, E12 epoxy resin 4%, F51 epoxy resin 8%, F44 epoxy resin 7%, YC-1 subsidence feed 0.45%, organic solvent 40%;
2) added in reactor I by tung oil, stir and add MALEIC ANHYDRIDE after being heated to 40 DEG C, being then warming up to 140 DEG C, and stirring insulation, soaking time is not less than 20 minutes;
3) in reactor II, add organic solvent and BMI bismaleimides, at 105 DEG C stirring and refluxing reaction pour in reactor I after BMI bismaleimides dissolves completely, and in reactor I stirring reaction;
4) in reactor II, add E51 epoxy resin, E44 epoxy resin, E12 epoxy resin, F51 epoxy resin and F44 epoxy resin epoxy resin, start and to stir and after being heated to 90 DEG C, add promotor, be stirred to transparent after, put in reactor I, stir, obtain the adhesive resin composition that the many adhesive-contented mica tapes of H level adopt.
Embodiment 2
The invention provides the preparation method of the adhesive resin composition of the many adhesive-contented mica tapes of a kind of H level, comprise the following steps:
1) raw material is taken according to mass ratio: tung oil 38%, MALEIC ANHYDRIDE 12%, BMI bismaleimides 15%, E51 epoxy resin 5%, E44 epoxy resin 5%, E12 epoxy resin 5%, F51 epoxy resin 12%, F44 epoxy resin 8%, YC-1 subsidence feed 0.48%, organic solvent 40%;
2) added in reactor I by tung oil, stir and add MALEIC ANHYDRIDE after being heated to 60 DEG C, being then warming up to 160 DEG C, and stirring insulation, soaking time is not less than 20 minutes;
3) in reactor II, add organic solvent and BMI bismaleimides, at 110 DEG C stirring and refluxing reaction pour in reactor I after BMI bismaleimides dissolves completely, and in reactor I stirring reaction;
4) in reactor II, add E51 epoxy resin, E44 epoxy resin, E12 epoxy resin, F51 epoxy resin and F44 epoxy resin epoxy resin, start and to stir and after being heated to 100 DEG C, add promotor, be stirred to transparent after, put in reactor I, stir, obtain the adhesive resin composition that the many adhesive-contented mica tapes of H level adopt.
Embodiment 3
The invention provides the preparation method of the adhesive resin composition of the many adhesive-contented mica tapes of a kind of H level, comprise the following steps:
1) raw material is taken according to mass ratio: tung oil 40%, MALEIC ANHYDRIDE 9%, BMI bismaleimides 21%, E51 epoxy resin 8%, E44 epoxy resin 5%, E12 epoxy resin 5%, F51 epoxy resin 7%, F44 epoxy resin 5%, FXQ subsidence feed 0.5%, organic solvent 40%;
2) added in reactor I by tung oil, stir and add MALEIC ANHYDRIDE after being heated to 70 DEG C, being then warming up to 180 DEG C, and stirring insulation, soaking time is not less than 20 minutes;
3) in reactor II, add organic solvent and BMI bismaleimides, at 105 DEG C stirring and refluxing reaction pour in reactor I after BMI bismaleimides dissolves completely, and in reactor I stirring reaction;
4) in reactor II, add E51 epoxy resin, E44 epoxy resin, E12 epoxy resin, F51 epoxy resin and F44 epoxy resin epoxy resin, start and to stir and after being heated to 100 DEG C, add promotor, be stirred to transparent after, put in reactor I, stir, obtain the adhesive resin composition that the many adhesive-contented mica tapes of H level adopt.
Performance test:
By above-described embodiment glue, the H level mica tape produced, after surveying its normality and solidification, mechanical, electrical performance is as table 1:
Table 1H level mica tape, surveys its normality and the rear mechanical, electrical performance of solidification
Heat-resistance index is evaluated:
A. the heat-resistance index (secant method calorimetric weightless and draw) of invention adhesive
| Embodiment 1 | Embodiment 2 | Embodiment 3 |
| 180℃ | 182℃ | 181℃ |
B. the H level mica tape made of glue of the present invention, by standard-required----surveyed by thermogravimetric point slope method:
| Embodiment 1 | Embodiment 2 | Embodiment 3 |
| 190℃ | 192℃ | 191℃ |
Embodiment 4
A preparation method for the adhesive resin composition of the many adhesive-contented mica tapes of H level, comprises the following steps:
1) raw material is taken according to mass ratio: tung oil 25%%, MALEIC ANHYDRIDE 15%, BMI bismaleimides 28%, E51 epoxy resin 3%, E44 epoxy resin 5%, E12 epoxy resin 2%, F51 epoxy resin 4%, F44 epoxy resin 8, promotor 0.3%, organic solvent 35%;
2) tung oil is added in reactor I, stir and add MALEIC ANHYDRIDE after being heated to 140 DEG C, being then warming up to 140 DEG C, and stirring insulation;
3) in reactor II, add organic solvent and BMI bismaleimides, at 105 DEG C stirring and refluxing reaction pour in reactor I after BMI bismaleimides dissolves completely, and in reactor I stirring reaction;
4) in reactor II, add E51 epoxy resin, E44 epoxy resin, E12 epoxy resin, F51 epoxy resin and F44 epoxy resin epoxy resin, start and to stir and after heat hot to 90 DEG C, add promotor, be stirred to transparent after, put in reactor I, stir, obtain the adhesive resin composition that the many adhesive-contented mica tapes of H level adopt.
Embodiment 5
A preparation method for the adhesive resin composition of the many adhesive-contented mica tapes of H level, comprises the following steps:
1) raw material is taken according to mass ratio: tung oil 30%, MALEIC ANHYDRIDE 12%, BMI bismaleimides 18%, E51 epoxy resin 8%, E44 epoxy resin 15%, E12 epoxy resin 5%, F51 epoxy resin 4%, F44 epoxy resin 4%, YC-1 subsidence feed 0.4%, organic solvent 50%;
2) added in reactor I by tung oil, stir and add MALEIC ANHYDRIDE after being heated to 70 DEG C, being then warming up to 180 DEG C, and stirring insulation, soaking time is not less than 20 minutes;
3) in reactor II, add organic solvent and BMI bismaleimides, at 110 DEG C stirring and refluxing reaction pour in reactor I after BMI bismaleimides dissolves completely, and in reactor I stirring reaction;
4) in reactor II, add E51 epoxy resin, E44 epoxy resin, E12 epoxy resin, F51 epoxy resin and F44 epoxy resin epoxy resin, start and to stir and after being heated to 100 DEG C, add promotor, be stirred to transparent after, put in reactor I, stir, obtain the adhesive resin composition that the many adhesive-contented mica tapes of H level adopt.
Embodiment 6
A preparation method for the adhesive resin composition of the many adhesive-contented mica tapes of H level, comprises the following steps:
1) raw material is taken according to mass ratio: tung oil 35%, MALEIC ANHYDRIDE 10%, BMI bismaleimides 18%, E51 epoxy resin 5%, E44 epoxy resin 10%, E12 epoxy resin 5%, F51 epoxy resin 12%, F44 epoxy resin 10%, YC-1 subsidence feed 0.35%, organic solvent 45%;
2) added in reactor I by tung oil, stir and add MALEIC ANHYDRIDE after being heated to 70 DEG C, being then warming up to 180 DEG C, and stirring insulation, soaking time is not less than 20 minutes;
3) in reactor II, add organic solvent and BMI bismaleimides, at 110 DEG C stirring and refluxing reaction pour in reactor I after BMI bismaleimides dissolves completely, and in reactor I stirring reaction;
4) in reactor II, add E51 epoxy resin, E44 epoxy resin, E12 epoxy resin, F51 epoxy resin and F44 epoxy resin epoxy resin, start and to stir and after being heated to 100 DEG C, add promotor, be stirred to transparent after, put in reactor I, stir, obtain the adhesive resin composition that the many adhesive-contented mica tapes of H level adopt.
Claims (7)
1. a preparation method for the adhesive resin composition of the many adhesive-contented mica tapes of H level, is characterized in that, comprise the following steps:
1) raw material is taken according to mass ratio: tung oil 25% ~ 40%, MALEIC ANHYDRIDE 5% ~ 15%, BMI bismaleimides 15% ~ 28%, E51 epoxy resin 3% ~ 8%, E44 epoxy resin 5% ~ 15%, E12 epoxy resin 2% ~ 7%, F51 epoxy resin 4% ~ 12%, F44 epoxy resin 4% ~ 10%, promotor 0.3% ~ 0.5%, organic solvent 35% ~ 50%;
2) tung oil is added in reactor I, stir and add MALEIC ANHYDRIDE after heating, being then warming up to 140 DEG C ~ 180 DEG C, and stirring insulation;
3) in reactor II, add organic solvent and BMI bismaleimides, at 105 DEG C ~ 110 DEG C stirring and refluxing reaction pour in reactor I after BMI bismaleimides dissolves completely, and in reactor I stirring reaction;
4) in reactor II, add E51 epoxy resin, E44 epoxy resin, E12 epoxy resin, F51 epoxy resin and F44 epoxy resin epoxy resin, start and to stir and after heating, add promotor, be stirred to transparent after, put in reactor I, stir, obtain the adhesive resin composition that the many adhesive-contented mica tapes of H level adopt.
2. the preparation method of the adhesive resin composition of the many adhesive-contented mica tapes of H level according to claim 1, described promotor is subsidence feed.
3. the preparation method of the adhesive resin composition of the many adhesive-contented mica tapes of H level according to claim 2, described subsidence feed is YC-1 subsidence feed or FXQ latent.
4. the preparation method of the adhesive resin composition of the many adhesive-contented mica tapes of H level according to claim 1, is characterized in that, described organic solvent is toluene.
5. the preparation method of the adhesive resin composition of the many adhesive-contented mica tapes of H level according to claim 1, is characterized in that, described step 2) in tung oil is added in reactor I, stir and be heated to 40 DEG C ~ 80 DEG C.
6. the preparation method of the adhesive resin composition of the many adhesive-contented mica tapes of H level according to claim 1, is characterized in that, described step 2) stir soaking time be not less than 20 minutes.
7. the preparation method of the adhesive resin composition of the many adhesive-contented mica tapes of H level according to claim 1, is characterized in that, described step 4) in be heated to 90 DEG C ~ 100 DEG C.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410740812.XA CN104449511A (en) | 2014-12-05 | 2014-12-05 | Preparation method of adhesive resin composition of H-grade multi-rubber powder mica tape |
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| CN201410740812.XA CN104449511A (en) | 2014-12-05 | 2014-12-05 | Preparation method of adhesive resin composition of H-grade multi-rubber powder mica tape |
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| CN104449511A true CN104449511A (en) | 2015-03-25 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106497491A (en) * | 2016-11-24 | 2017-03-15 | 株洲时代新材料科技股份有限公司 | Refrigerant adhesive and preparation method thereof and refrigerant composite flexible material and preparation method thereof |
| CN113897028A (en) * | 2021-10-22 | 2022-01-07 | 中国林业科学研究院林产化学工业研究所 | Tung oil-based interpenetrating network type shape memory polymer and preparation method thereof |
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| CN103122190A (en) * | 2013-02-01 | 2013-05-29 | 陕西宏业电工电子新材料有限公司 | Class-H insulation dry-type air-core reactor wire epoxy polyester low-solvent bonding paint and production method thereof |
| CN103497693A (en) * | 2013-09-18 | 2014-01-08 | 中国西电集团公司 | Adhesive resin composite for preparing F-level multi-gelatine powder mica and preparation method thereof |
| CN104112554A (en) * | 2014-07-21 | 2014-10-22 | 吴江固德电材系统股份有限公司 | Preparation method of high-performance mica tapes for taping machine |
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2014
- 2014-12-05 CN CN201410740812.XA patent/CN104449511A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103122190A (en) * | 2013-02-01 | 2013-05-29 | 陕西宏业电工电子新材料有限公司 | Class-H insulation dry-type air-core reactor wire epoxy polyester low-solvent bonding paint and production method thereof |
| CN103497693A (en) * | 2013-09-18 | 2014-01-08 | 中国西电集团公司 | Adhesive resin composite for preparing F-level multi-gelatine powder mica and preparation method thereof |
| CN104112554A (en) * | 2014-07-21 | 2014-10-22 | 吴江固德电材系统股份有限公司 | Preparation method of high-performance mica tapes for taping machine |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106497491A (en) * | 2016-11-24 | 2017-03-15 | 株洲时代新材料科技股份有限公司 | Refrigerant adhesive and preparation method thereof and refrigerant composite flexible material and preparation method thereof |
| CN106497491B (en) * | 2016-11-24 | 2019-12-31 | 株洲时代电气绝缘有限责任公司 | Refrigerant-resistant adhesive and preparation method thereof, and refrigerant-resistant soft composite material and preparation method thereof |
| CN113897028A (en) * | 2021-10-22 | 2022-01-07 | 中国林业科学研究院林产化学工业研究所 | Tung oil-based interpenetrating network type shape memory polymer and preparation method thereof |
| CN113897028B (en) * | 2021-10-22 | 2024-04-16 | 中国林业科学研究院林产化学工业研究所 | Tung oil-based interpenetrating network shape memory polymer and preparation method thereof |
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Application publication date: 20150325 |
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