A kind of method of repair process box and the handle box after repairing
Technical field
The present invention relates to a kind of method of repair process box and the handle box after repairing.
Background technology
Generally, handle box utilizes developer (as toner or ink) to form image on the recording medium.Therefore, developer is consumed along with the formation of image, like this, make when the consumption due to developer the surplus developer in handle box be reduced to handle box can not be formed the image level that makes User Satisfaction or lower than below predetermined value time, handle box just loses its commercial value, and its serviceable life terminates.
In addition, there are the various identifiable marker districts designed by deviser in the surface of shell of handle box usually, and with handle box housing integrated molding, the convenient user buying this handle box is by observing the information understanding its handle box.Like this, when these mark zones are present in the surface of shell of handle box and do not meet deviser to the designing requirement marked, deviser generally removes mark zone by modes such as cutters and changes to satisfactory mark zone.Due to the surface of shell of handle box mark zone usually with handle box housing integrated molding, very easily the structure of handle box housing is damaged when removing mark zone by modes such as use cutters, and affects the outward appearance etc. of handle box.
According to above-mentioned situation, people need a kind of method for the handle box because having terminated serviceable life being refilled developer, and the mark zone of change handle box surface of shell, to meet the method for designing requirement.Therefore, there has been proposed a kind of so comprehensive solution at present.
As shown in Figure 1 to Figure 2, be the structural representation of handle box A in image forming apparatus body (not show).Handle box housing is made up of the first housing 10 and the second housing 20, the composition of the first housing 10 and the second housing 20 makes handle box A inside form developer collecting cavity volume 25 and developing cell host cavity 35, wherein contain developer in developer collecting cavity volume 25 and stir unit etc., and containing developing cell 50 etc. in developing cell host cavity 35.In addition, arrange a control powder unit 60 on handle box A surface of shell around developing cell 50 near surface, the effect of control powder unit 60 is the developer thickness controlling to carry on developing cell 50 surface.
As shown in Figure 3A, for handle box part A housing (the first housing 10 for handle box A), usually there are the various identifiable marker districts 100 designed by deviser in surface of shell, these mark zones 100 be arranged on surface of shell and with handle box A housing integrated molding.For avoiding damaging surface of shell, existing method is: use the soft or hard of stickiness paster 90() Mulching treatment is carried out to mark zone 100, as shown in Figure 3 B, by using stickiness paster 90 pairs of mark zones 100 to carry out Mulching treatment, the mark zone 100 after being capped substantially can be made directly not to be identified.
As shown in Figure 3 C, being handle box part A housing (the first housing 10 for handle box), after the handle box A terminated refills developer, re-using handle box A for making the life-span.Existing method is: use instrument carries out boring process at handle box A surface of shell, carries out filling developer by through hole area 110 to handle box inside (being generally developer collecting cavity volume 25).After treating developer filling, soft or the hard of same use one stickiness paster 90() encapsulation process is carried out to through hole area 110, as shown in Figure 3 D, by using stickiness paster 90 pairs of through hole areas 110 to carry out encapsulation process, avoid the developer of handle box A inside by through hole area 110 to outward leakage.
It should be noted that, by the target area of above-mentioned use one stickiness paster 90 pairs of handle box A housings (namely above-mentioned mark zone 100 or through hole area 110 cover or the method for encapsulation process), as shown in FIGURE 3 E, because stickiness paster 90 is made up of adhesive layer 93 and non-adhesive layer 91 substantially, the adhesive layer 93 of its stickiness paster 90 is very easily subject to environment, the factor impact such as temperature and time, the stickiness of its adhesive layer 93 is caused to decline gradually, when the stickiness of adhesive layer 93 becomes the surface of shell generation adhesion be not enough to handle box A, stickiness paster 90 directly departs from easy from the surface of shell of handle box A.And the covering of the above-mentioned target area to handle box A surface of shell or the disposal route of sealing will no longer work, outside the mark zone 100 of its handle box A housing or the through hole 110 for filling developer will be directly exposed to, thing followed consequence is that mark zone 100 does not meet its designing requirement or causes developer to pass through the through hole area 110 of exposure to the powder that leaks outside, contaminated environment etc.
Therefore, need a kind of easy solution, the method not only functionally can realize all functions of Existing methods: namely Mulching treatment box A surface of shell mark zone 100 and the through hole area 110 for filling developer is sealed.Meanwhile, the method needs can avoid bringing impact on sealing property or covering performance by factors such as environment, temperature and times.
Summary of the invention
The invention provides a kind of method of repair process box, the technical matters departed from occurs because being easily subject to the factor impacts such as environment, temperature and time with the method solving existing repair process box.
In order to solve above technical matters, the technical scheme that the present invention takes is:
A method for repair process box, comprises the following steps:
A (), according to handle box surface of shell target area to be repaired, selects the back side of plates can cover the plates of described target area;
B the back side of the described plates chosen is combined with the target area of described handle box surface of shell by welding by ().
Preferably, the target area of the surface of shell of described handle box is through hole area or mark zone.
Preferably, front described step (b), further comprising the steps of A: carry out the step that drill hole reason forms through hole area on described target area.
Preferably, front described step (b), after described steps A, also carry out following steps, fill developer by described through hole area to described handle box inside.
Preferably, described plates are that plastic material is made.
Preferably, when described target area being provided with the structure of interfering welding performance, front described step (b), further comprising the steps of: the structure removing the interference welding performance on target area.
Preferably, the back side of described plates is also provided with projection, described in project through welding be combined with handle box surface of shell.
Preferably, be raised with described in described plates multiple.
Preferably, described multiple projection be arranged on the described back side edge in or edge.
The present invention further provides the handle box utilizing the method for above-mentioned repair process box to obtain.
After have employed technique scheme, because the back side is make by welding the material be combined with handle box surface of shell; By the plates selecting the back side of plates described in can cover described target area, the back side of the described plates chosen is combined with the target area of described handle box surface of shell by welding.Can by the target area strong bonded of plates and handle box surface of shell, even if be subject to the Effects of Factors such as environment, temperature and time also can not depart from, there is the technical matters departed from the stickiness paster solving existing repair process box because being easily subject to the factor impacts such as environment, temperature and time.
Accompanying drawing explanation
Fig. 1 is the schematic cross-section of the composition structure of handle box;
Fig. 2 is the schematic diagram of the composition structure of handle box;
Fig. 3 A is the structural representation of the mark zone of the first housing of handle box;
Fig. 3 B is the schematic diagram that the first housing of handle box and Existing methods are implemented;
Fig. 3 C is the structural representation of the through hole area of the first housing of handle box;
Fig. 3 D is the schematic diagram that the first housing of handle box and Existing methods are implemented;
Fig. 3 E is the structural representation of the stickiness paster in Existing methods;
Fig. 4 A1 is the front schematic view of the plates in the present embodiment;
Fig. 4 A2 is the front schematic view of the plates in the present embodiment;
Fig. 4 A3 is the front schematic view of the plates in the present embodiment;
Fig. 4 B1 is the schematic rear view of the plates in the present embodiment;
Fig. 4 B2 is the schematic rear view of the plates in the present embodiment;
Fig. 4 B3 is the schematic rear view of the plates in the present embodiment;
Fig. 4 B4 is the schematic rear view of the plates in the present embodiment;
Fig. 5 is the schematic diagram before the plates in the present embodiment are combined with the target area of handle box surface of shell;
Fig. 6 A be the plates in the present embodiment with the target area of handle box surface of shell in conjunction with time schematic diagram;
Fig. 6 B is the schematic diagram after the plates in the present embodiment are combined with the target area of handle box surface of shell;
Fig. 7 A is the mark zone of the first shell of handle box and the structural representation of striped projection;
Fig. 7 B is the structural representation of the through hole area after the boring of the first shell of handle box;
Fig. 7 C is the striped projection of the first shell of handle box and the schematic diagram of interference place of plates;
Fig. 7 D is the schematic diagram removing constructive interference place of the first shell of handle box;
Fig. 7 E is the target area of handle box surface of shell and the schematic diagram of plates solder bond;
Reference numeral
A-handle box;
10-first housing; 20-second housing;
15-striped is protruding; 25-developer collecting cavity volume; 35-developing cell host cavity;
50-developing cell; 60-agitating unit;
80-plates; 81-mark zone; 82-is protruding; 85-front; The 86-back side;
90-stickiness paster; The non-adhesive layer of 91-; 93-adhesive layer;
100-mark zone; 110-through hole area;
200-handle box frock; 300-ultrasound wave Vibration Welding instrument; 500-milling cutter.
Embodiment
With reference to the accompanying drawings embodiment is described below, following embodiment is not limited only to be applied to handle box, and can extensively on the product that print cartridge, colour band, toner cartridge etc. are dissimilar, for clearly stating following invention effect and embodiment, only for handle box.
As shown in Figure 1 to Figure 2, be the structural representation of handle box A in image forming apparatus body (not show).Handle box housing is made up of the first housing 10 and the second housing 20, the composition of the first housing 10 and the second housing 20 makes handle box A inside form developer collecting cavity volume 25 and developing cell host cavity 35, wherein contain developer in developer collecting cavity volume 25 and stir unit etc., and containing developing cell 50 etc. in developing cell host cavity 35.In addition, arrange a control powder unit 60 on handle box A surface of shell around developing cell 50 near surface, the effect of control powder unit 60 is the developer thickness controlling to carry on developing cell 50 surface.
As shown in Figure 3A, for handle box part A housing (the first housing 10 for handle box A), usually there are the various identifiable marker districts 100 designed by deviser in surface of shell, these mark zones 100 be present in surface of shell and with handle box A housing integrated molding.
As shown in Figure 3 C, for handle box part A housing (the first housing 10 for handle box), handle box A is re-used after the handle box A terminated for making the life-span refills developer, use instrument carries out boring process at handle box A surface of shell, carries out filling developer by through hole area 110 to handle box A inside (being generally developer collecting cavity volume 25).
The defect of Existing methods need be made up: namely the adhesive layer 93 of stickiness paster 90 is subject to impact that the factors such as environment, temperature and time bring and departs from (with reference to figure 3E).
Be the embodiment of embodiment of the present invention below.
Plates 80 in the present embodiment are described according to Fig. 4 A1 to Fig. 4 B4 below.
As shown in Fig. 4 A1 to Fig. 4 A3, for a kind of structure is the plates 80 of flat, the back side 86 comprising front 85 and be connected with handle box.Meanwhile, for reaching good in effect, the back side 86 of plates 80 is make by welding the material be combined with handle box surface of shell.Preferred material is plastics, and simultaneously plates 80 have certain thickness, and the integral surface profile of plates 80 can be set to different shape (square etc. as in the circle in Fig. 4 A1 or Fig. 4 A2) according to the area that need cover or seal.
As shown in Fig. 4 B1 to Fig. 4 B4, the back side 86 being positioned at plates 80 can arrange protruding 82 according to demand, projection 82 and plates 80 integrated molding.The projection 82 of plates 80 is with during by ultrasound wave Vibration Welding, and melting occurs the projection 82 of plates 80 makes plates 80 together with the target area solder bond of handle box housing, is not easily separated from each other.Meanwhile, preferably, protruding 82 can be arranged in the edge, the back side 86 of plates 80 (position with reference to the projection 82 of figure 4B1, Fig. 4 B2) or to be arranged on edge (position with reference to the projection 82 of figure 4B3, Fig. 4 B4).In addition, the projection 82 of plates 80 can arrange the projection 82 of multiple protruding 82(with reference to figure 4B1 according to the requirement of sealing property or covering performance) or carry out interrupted enclosed (with reference to figure 4B2) and arrange, its interrupted enclosed is provided with that to help to carry out in demihull shape 80 and target area welding process air pressure ventilative and realize sealing property.In addition, also can carry out full enclosed (projection 82 with reference to figure 4B3, Fig. 4 B4) and arrange, the projection 82 that its enclosed is arranged realizes good sealing property after contributing to plates 80 and target area solder bond.The through hole area 110 of such as handle box A surface of shell and plates 80 in conjunction with time, the projection 82 of the enclosed at plates 80 back side 86 can surround through hole area 110 completely makes it not easily occur to leak developer.
As Fig. 4 A3, the front 85 being positioned at plates 80 can arrange the mark zone 81 of projection or indent according to the demand of user, mark zone 81 and plates 80 integrated molding.In addition, contribute to distinguishing better the distinctive points of the handle box with plates 80 by arranging mark zone 81.
In addition, if for realizing the good coverage effect in the target area of handle box A or sealing effectiveness, the area at plates 80 back side 86 need be more than or equal to the target area of handle box A, the target area of described handle box A and the through hole area 110 of handle box A surface of shell or mark zone 100.
In addition, if the back side 86 of plates 80 does not arrange the projection 82 for solder bond, the back side 86 of plates 80 can directly and the target area of handle box A carry out solder bond.
Treatment process in the present embodiment is described according to Fig. 5 to Fig. 6 B below.
As shown in Figure 5, first according to the target area that handle box surface of shell is to be repaired, the back side of plates is selected can to cover the plates of described target area; Again the back side of the plates chosen is combined with the target area of described handle box surface of shell by welding, makes not easily to be separated between the two.The target area of handle box A surface of shell (for the first housing 10) is covered to, as mark zone 100 or through hole area 110 by plates 80.
As shown in Figure 6A, first, the situation affecting performance accuracy for ensure to make target handle box A holding position fix in the process for the treatment of process, be not easily subjected to displacement etc. occurs, and can be positioned in handle box frock 200 by target handle box A in advance.Then, plates 80 are placed on the target area of handle box A surface of shell after fixing by pending box A holding position, adjustment plates 80 are also covered to the position of the target area of handle box A, make the area at plates 80 back side 86 be equal to or be greater than the target area of handle box A.Finally, by ultrasound wave Vibration Welding instrument 300 plates 80 urged and be soldered to handle box A surface of shell, make it together with the target area adhere of handle box A surface of shell even if melting occurs at the back side 86 of the back side of plates 80 protruding 82 or plates 80, finally complete the target area (as shown in Figure 6B) plates 80 being covered or are sealed to handle box A surface of shell.
In addition, as filling developer need be carried out to handle box A, instrument need be first used to carry out boring process at handle box A surface of shell, namely through hole area 110(is pre-formed with reference to figure 3C), then to carry out above-mentioned operation (treatment process) front, carry out filling developer by the through hole area 110 of aforementioned formation to handle box A inside, after to be filled, can above-mentioned operation be carried out.
In addition, the additional processing operation will illustrated according to Fig. 7 A to Fig. 7 E in this example.
As shown in Figure 7 A, for the partial shell (for the first housing 10) of handle box A, the discernible mark zone 100 that surface of shell has, is provided with striated projection 15, first housing 10 15 integrated moldings protruding with mark zone 100 and striated around mark zone 100.
As shown in Figure 7 B, if need to carry out filling developer to handle box A inside, can pay the utmost attention to and use boring 400 to form a through hole area 110 in the mark zone 100 of handle box A surface of shell.In addition, if handle box A surface of shell does not exist mark zone can carry out boring process in the plane that its surface selection one is comparatively smooth, smooth.
Simultaneously, as seen in figure 7 c, for the partial shell (for the first housing 10) of handle box A carries out the position view before soldering with plates 80, because the first housing 10 surface exists striated projection 15, in soldering process, striated protruding 15 easily produces constructive interference with plates 80, and the back side 86 of plates 80 or projection 82 are difficult to and surface of shell solder bond preferably.If handle box A first housing 10 and plates 80 can not solder bond preferably, plates 80 can not cover preferably or target seal district (i.e. mark zone 100 or through hole area 110), finally cause plates 80 to depart from from handle box A surface of shell or make through hole area 110 is exposed to completely.
Therefore, need to remove the constructive interference place on the first housing 10 surface before carrying out that plates 80 are soldered to handle box A first housing 10, all constructive interference places being about to the handle box A surface of shell affecting plates 80 covering performance or sealing property remove.Such as shown in Fig. 7 D, use the instruments such as a milling cutter 500 or file to the protruding 15(constructive interference place of the striated on the first housing 10 surface) remove, make handle box A surface of shell carry out solder bond with plates 80 better in (treatment process) step.Finally complete target area plates 80 being covered or are sealed to handle box A housing, as seen in figure 7e.
As discussed above, according to the present invention, a kind of renovate method of simple handle box can be provided.
In addition, according to the present invention, a kind of easy method can be provided to cover to the target area of handle box surface of shell or seal with carrying out solder bond, be used in the plates covered or seal and avoid the impact because the factors such as environment, temperature and time bring and depart from.
In addition, foregoing invention can be widely used on the dissimilar product such as print cartridge, colour band, toner cartridge, be clear statement its invention effect and implementation method, only for handle box herein.
Described the present invention by embodiment above, but the present invention is not limited only to this, also contains the various distortion that thought according to the present invention is done in the scope of technical scheme of the present invention.