CN104409265A - Backlight module, manufacture method of backlight module, and luminescence keyboard - Google Patents
Backlight module, manufacture method of backlight module, and luminescence keyboard Download PDFInfo
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- CN104409265A CN104409265A CN201410589040.4A CN201410589040A CN104409265A CN 104409265 A CN104409265 A CN 104409265A CN 201410589040 A CN201410589040 A CN 201410589040A CN 104409265 A CN104409265 A CN 104409265A
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- Prior art keywords
- light guide
- hole
- backlight module
- reflection layer
- light
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/88—Processes specially adapted for manufacture of rectilinearly movable switches having a plurality of operating members associated with different sets of contacts, e.g. keyboards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/06—Reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2219/00—Legends
- H01H2219/054—Optical elements
- H01H2219/062—Light conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2231/00—Applications
- H01H2231/002—Calculator, computer
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- Planar Illumination Modules (AREA)
Abstract
The invention relates to a backlight module, a manufacture method of a backlight module, and a luminescence keyboard. The backlight module comprises a light guide substrate which is provided with a first surface for emitting light, a second surface opposite to the first surface, and a side surface, a transparent medium layer is arranged on the second surface of the light guide substrate, a light reflection layer is arranged below the transparent medium layer and is provided with a plurality of penetrating holes formed therein, a light guide material layer is arranged below the light reflection layer, a part of the light guide material layer fills the penetrating holes of the light reflection layer, a light source is adjacent to the side surface of the light guide substrate, and the light guide material layer filling the penetrating holes guides light to the light emitting first surface. According to the invention, the light reflection layer is provided with penetrating hole structures corresponding to key caps for guiding the light, such that good light distribution is obtained, and compared to a conventional backlight module, at least about 40% of the thickness can also be decreased, thus the thickness of the luminescence keyboard can be smaller, and the demand of a computer periphery device for miniaturization is satisfied.
Description
Technical field
The present invention relates to a kind of backlight module, be particularly to the slimming backlight module being applied to illuminated keyboard, and the manufacture method of slimming backlight module.
Background technology
The use of computer is quite universal in recent years, and keyboard is then one of the input unit as computer, in response to the demand of user, has developed illuminated keyboard to provide user operating computer in the occasion of insufficient light.
Illuminated keyboard comprises the keypad portion with multiple button usually, and is arranged on the back lighting device below keypad portion, and back lighting device can allow the button of keypad portion have illumination effect.In known illuminated keyboard, back lighting device is normally by mask layer, light guide plate and reflector plate formed, adhesion coating is utilized to bond together between light guide plate and reflector plate, and be also utilize adhesion coating bonding between light guide plate with mask layer, due to light guide plate, reflector plate and mask layer thickness separately has certain restriction, cannot reduce too many, and be positioned at light guide plate, two-layer adhesion coating between reflector plate and mask layer has more thickeied the integral thickness of back lighting device, therefore, in illuminated keyboard, the thickness of known back lighting device cannot reduce, cause illuminated keyboard cannot reach the requirement of thinning.
Summary of the invention
In view of this, the invention provides structural design and the manufacture method thereof of slimming backlight module, this slimming backlight module can be applicable to illuminated keyboard, makes illuminated keyboard reach the requirement of thinning.
In order to achieve the above object, the present invention proposes a kind of backlight module, and this backlight module comprises light guide base plate, transparent dielectric layer, reflection layer, the light guide bed of material and light source.Wherein light guide base plate has for the first surface of bright dipping, side and the second surface contrary with this first surface; Transparent dielectric layer is arranged on this second surface of this light guide base plate; Reflection layer is arranged at below this transparent dielectric layer, and this reflection layer has a plurality of through hole; The light guide bed of material is arranged at below this reflection layer, and the some of this light guide bed of material fills up this plurality of through hole of this reflection layer; This side that light source is adjacent to this light guide base plate is arranged, and light leads this first surface by this light guide bed of material wherein filling up this plurality of through hole.
As optional technical scheme, the refractive index of this transparent dielectric layer is 1.3 to 1.5.
As optional technical scheme, the material of this transparent dielectric layer comprises optical cement, and the thickness of this transparent dielectric layer is 1 μm to 2 μm.
As optional technical scheme, the material of this light guide base plate comprises Merlon, polymethyl methacrylate, acryl resin or acrylonitrile-butadiene-styrene copolymer, and the thickness of this light guide base plate is 0.2mm to 0.3mm.
As optional technical scheme, the material of this reflection layer comprises silver, aluminium, titanium, chromium or gold, and the thickness of this reflection layer is 0.1 μm to 1 μm.
As optional technical scheme, the material of this light guide bed of material comprises light guide ink, and the thickness of this light guide bed of material is 5 μm to 10 μm.
As optional technical scheme, a surface of this reflection layer fits tightly with this transparent dielectric layer, and this part of filling up this light guide bed of material in this plurality of through hole directly contacts with this transparent dielectric layer.
As optional technical scheme, this a plurality of through hole comprises a plurality of point-like through hole, one of them comprising in semicircle, half elliptic and triangle of the section shape of this plurality of point-like through hole is planted, and is less than area away from the through hole of this light source and distribution density close to the area of the through hole of this light source and distribution density.
In addition, the present invention also proposes a kind of illuminated keyboard, and this illuminated keyboard also comprises keypad portion and above-mentioned backlight module, and this backlight module is arranged at below this keypad portion.
As optional technical scheme, this keypad portion comprises a plurality of Key element, each Key element comprises keycap, thin film switch, scissor supporting construction and flexible member, this thin film switch is arranged at below this keycap, this scissor supporting construction and this flexible member are all arranged between this keycap and this thin film switch, wherein this keycap has transparent area, the position of this plurality of through hole in this reflection layer of this backlight module corresponds to this keycap, and this transparent area of this keycap of light penetration that this backlight module sends.
In addition, the present invention also proposes a kind of manufacture method of backlight module, and the manufacture method of this backlight module comprises: provide light guide base plate, and this light guide base plate has for the first surface of bright dipping, the second surface contrary with this first surface and side; Form transparent dielectric layer on this second surface of this light guide base plate; Form reflection layer below this transparent dielectric layer; A plurality of through hole is formed in this reflection layer; Form the light guide bed of material below this reflection layer, and the some of this light guide bed of material fills up this plurality of through hole of this reflection layer; This side being adjacent to this light guide base plate arranges light source, and light leads this first surface by this light guide bed of material wherein filling up this plurality of through hole.
As optional technical scheme, the material of this transparent dielectric layer comprises optical cement, and the step forming this transparent dielectric layer comprises coating process, and the thickness of this transparent dielectric layer is 1 μm to 2 μm.
As optional technical scheme, the material of this reflection layer comprises, aluminium, titanium, chromium or gold, and the step forming this reflection layer comprises sputter process, and the thickness of this reflection layer is 0.1 μm to 1 μm.
As optional technical scheme, the step forming this plurality of through hole in this reflection layer comprises use laser engraving processing procedure.
As optional technical scheme, the material of this light guide bed of material comprises light guide ink, and the step forming this light guide bed of material comprises printing process, and the thickness of this light guide bed of material is 5 μm to 10 μm.
As optional technical scheme, a surface of this reflection layer fits tightly with this transparent dielectric layer, and this part of filling up this light guide bed of material of this plurality of through hole directly contacts with this transparent dielectric layer.
As optional technical scheme, this a plurality of through hole comprises a plurality of point-like through hole, the section shape of this plurality of point-like through hole comprise semicircle, half elliptic and leg-of-mutton one of them plant, and be greater than area close to the through hole of this light source and distribution density away from the area of the through hole of this light source and distribution density.
According to embodiments of the invention, the integral thickness of backlight module can be determined by the summation of light guide base plate, transparent dielectric layer, reflection layer and the light guide bed of material, and in certain embodiments, the integral thickness of backlight module is about between 0.30mm to 0.32mm.The present invention owing to arranging the through hole of corresponding keycap on reflection layer, to arrange in pairs or groups again the light guide bed of material that is arranged at below reflection layer, making the light that sends from light source in through hole position via the guiding directive first surface of the light guide bed of material, not needing to arrange traditional mask layer and the adhesive layer for mask layer and light guide plate being carried out binding again.In known illuminated keyboard, its backlight module is by mask layer, light guide plate and reflector plate, and the adhesion coating between these elements formed, the integral thickness of the backlight module of known illuminated keyboard is about between 0.45mm to 0.5mm, the integral thickness of backlight module of the present invention then can be reduced by least about 40% compared to the backlight module of known illuminated keyboard, reaching under good light distribution condition, also can reduce the thickness of illuminated keyboard by this further, reach the requirement of thinning.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is the generalized section of the illuminated keyboard according to one embodiment of the invention;
Fig. 2 is the generalized section of the backlight module according to one embodiment of the invention;
Fig. 3 A to Fig. 3 E is the generalized section in each interstage of the backlight module of the shop drawings 2 of foundation one embodiment of the invention.
Embodiment
Structural design and the manufacture method of some embodiments of backlight module of the present invention are below described in detail in detail, and comprise some embodiments of illuminated keyboard of backlight module of the present invention, but, be understandable that, inventive concept provided by the invention can be implemented in various background widely, at this specific embodiment discussed only for illustration of the manufacture of some embodiments of the present invention and the ad hoc fashion of use, be not intended to limit scope of the present invention.
Consult Fig. 1, it is the generalized section of the illuminated keyboard 100 according to one embodiment of the invention, illuminated keyboard 100 comprises keypad portion 110, and the backlight module 120 be arranged on below keypad portion 110, by the light that backlight module 120 sends towards keypad portion 110, keypad portion 110 can be allowed to have illumination effect, only draw a Key element 101 of illuminated keyboard 100 in FIG representatively, in fact illuminated keyboard 100 comprises a plurality of Key element 101, illuminated keyboard 100 can help user to carry out the input operation of instruction to computer in the occasion of insufficient light.
Each Key element 101 of keypad portion 110 comprises keycap 103, and keycap 103 can have one or more transparent area 103T, and the light that backlight module 120 sends can penetrate the transparent area 103T of keycap 103, allows the Key element 101 of keypad portion 110 have illumination effect.Thin film switch 105 is also provided with in the below of keycap 103, thin film switch 105 comprises upper and lower contact and the barrier film between upper and lower contact (not illustrating), have the position that opening corresponds to upper and lower contact in barrier film, each is organized upper and lower contact and corresponds to a Key element 101.
In addition, also there is scissor supporting construction 107 and flexible member 109 between keycap 103 and thin film switch 105, one end of scissor supporting construction 107 is linked to the side of keycap 103 in the mode of rotatably sliding, the other end of scissor supporting construction 107 is then linked in the mode of rotatably sliding on the base plate of thin film switch 105, scissor supporting construction 107 can allow keycap 103 do vertical movement relative to thin film switch 105, allows keycap 103 move between non-pressing position and pressing position.
Flexible member 109 is arranged on thin film switch 105, flexible member 109 has certain height, when user is by when being pressed on keycap 103, flexible member 109 can produce distortion along with the movement of keycap 103, the direction of the downward contact of the upper contact of thin film switch 105 is moved, upper and lower contact is contacted with each other by the opening of barrier film, and then opens thin film switch 105; When user unclamps keycap 103, scissor supporting construction 107 can allow keycap 103 be returned to position when originally not pressing, and now the upper and lower contact of thin film switch 105 can not contact with each other, and then closes thin film switch 105.
The outline generalized section of keypad portion 110 is only drawn out in Fig. 1, in fact all parts of keypad portion 110, the thin portion structural design comprising the parts such as keycap 103, scissor supporting construction 107, flexible member 109 and thin film switch 105 can also have many changes, and except above-mentioned parts, keypad portion 110 also can comprise other for reaching the parts of the functional requirement of illuminated keyboard 100, user can arrange the concrete structure of each parts according to actual needs, is not limited with above-mentioned.
Consult Fig. 2, it is the generalized section of the backlight module 120 according to one embodiment of the invention, backlight module 120 comprises light guide base plate 121, light guide base plate 121 has first surface 121F, the side 121S of bright dipping and the second surface 121B contrary with first surface 121F, in the present embodiment, side 121S connects first surface 121F and second surface 121B.In certain embodiments, the material of light guide base plate 121 can select Merlon (polycarbonate; Be called for short PC), polymethyl methacrylate (polymethyl methacrylate; Be called for short PMMA), acryl resin (acrylic resin), acrylonitrile-butadiene-styrene copolymer (acrylonitrile-butadine-styrene; Be called for short ABS) or other be suitable for the material of light guide base plate.In certain embodiments, the thickness range of light guide base plate 121 can be about 0.2mm to about 0.3mm, that is the thickness range of light guide base plate 121 is [0.2mm, 0.3mm].
Backlight module 120 also comprises light source 129, and its side 121S being adjacent to light guide base plate 121 is arranged, and in certain embodiments, light source 129 can be light-emittingdiode (light-emitting diode; Be called for short LED), as shown in Figure 2, the light that light source 129 sends enters light guide base plate 121 by the side 121S of light guide base plate 121, and light conducts via multiple reflections in light guide base plate 121, as shown in the arrow 130 in Fig. 2, arrow 130 represents the path of light in light guide base plate 121 internal reflection.
In addition, according to embodiments of the invention, backlight module 120 also comprises transparent dielectric layer 123, transparent dielectric layer 123 is arranged on the second surface 121B of light guide base plate 121, the refractive index of transparent dielectric layer 123 is lower than the refractive index of light guide base plate 121, in certain embodiments, the refractive index of transparent dielectric layer 123 can be about 1.3 to about 1.5, that is the ranges of indices of refraction of transparent dielectric layer 123 is [1.3, 1.5], it makes the light of conduction in light guide base plate 121 when arriving the interface between light guide base plate 121 and transparent dielectric layer 123, the light of part can refract in transparent dielectric layer 123, as shown in the arrow 132 in Fig. 2, arrow 132 represents that light enters the path of transparent dielectric layer 123 from light guide base plate 121 refraction.
Interface between light guide base plate 121 and transparent dielectric layer 123, the light of nearly 50% to 60% can reflex in light guide base plate 121, remaining light then refracts in transparent dielectric layer 123, therefore between light guide base plate 121 and transparent dielectric layer 123, does not have total reflection phenomenon.In certain embodiments, the material of transparent dielectric layer 123 can be optical cement (optical clear adhesive; Be called for short OCA), and the thickness range of transparent dielectric layer 123 can be about 1 μm to about 2 μm, that is the thickness range of transparent dielectric layer 123 is [1 μm, 2 μm].
According to embodiments of the invention, backlight module 120 also comprises reflection layer 125, and reflection layer 125 is arranged on below transparent dielectric layer 123, and the upper surface 125F of reflection layer 125 and transparent dielectric layer 123 fit tightly.As shown in Figure 2, after light enters transparent dielectric layer 123 from light guide base plate 121 refraction, some light can reflect in the upper surface 125F of reflection layer 125, and then enter light guide base plate 121 through superrefraction, thus lifting light utilization.In addition, as shown in Figure 2, have a plurality of through hole 126 in reflection layer 125, these through holes 126 can be the through holes of point-like, and the section shape of point-like through hole can be semicircle, half elliptic, triangle or other suitable shapes.In addition, the area of these through holes 126 in reflection layer 125 and distribution density can adjust according to the distance between through hole 126 and light source 129, in certain embodiments, be less than area away from the through hole of light source 129 and distribution density close to the area of the through hole 126 of light source 129 and distribution density, make each Key element 101 be positioned on illuminated keyboard 100 diverse location have consistent luminosity.
In certain embodiments, the material of reflection layer 125 can select silver, aluminium, titanium, chromium, gold or other suitable light reflecting materials, and the thickness range of reflection layer 125 can be about 0.1 μm to about 1 μm, that is the thickness range of reflection layer 125 is [0.1 μm, 1 μm].Meanwhile, the depth bounds of through hole 126 also arrange in pairs or groups reflection layer 125 thickness and be about 0.1 μm to about 1 μm, that is the thickness range of through hole 126 is [0.1 μm, 1 μm].
In addition, according to embodiments of the invention, backlight module 120 also comprises the light guide bed of material 127, the light guide bed of material 127 is arranged at below reflection layer 125, as shown in Figure 2, the light guide bed of material 127 is not only arranged at below reflection layer 125, and the some of the light guide bed of material 127 also fills up the through hole 126 in reflection layer 125, and those parts of filling up the light guide bed of material 127 of through hole 126 directly contact with transparent dielectric layer 123.
As shown in Figure 2, after light enters transparent dielectric layer 123 from light guide base plate 121 refraction, those parts of filling up the light guide bed of material 127 of the through hole 126 in reflection layer 125 can by the first surface 121F of the bright dipping of some light (refracting to the light in the transparent dielectric layer 123) light guide base plate that leads 121, as shown in the arrow 140 in Fig. 2, arrow 140 represents that light is led by the light guide bed of material 127 in through hole 126 the first surface 121F of bright dipping, then from first surface 121F directive keycap 103, thus make the position of corresponding through hole 126 on first surface 121F have light injection.
Consult Fig. 1 and Fig. 2 simultaneously, the position of the through hole 126 in the reflection layer 125 of backlight module 120 may correspond in the position of keycap 103 and arranges, again because the position of through hole 126 corresponding on first surface 121F has light injection, the light that backlight module 120 is sent may correspond to the transparent area 103T penetrating keycap 103, and the design of the area of through hole 126 and distribution density also can adjust according to the distance between through hole 126 and light source 129, the brightness that sends from each keycap 103 of illuminated keyboard 100 so can be made more consistent.In addition, the reflection layer 125 of backlight module 120 can allow and refract to the light in transparent dielectric layer 123 and reflect towards the direction of the first surface 121F of bright dipping, contributes to the light utilization promoting light source 129.
In certain embodiments, the material of the light guide bed of material 127 can select light guide ink, and the thickness range of the light guide bed of material 127 can be about 5 μm to about 10 μm, that is the thickness range of the light guide bed of material 127 is [5 μm, 10 μm].
According to embodiments of the invention, the integral thickness of backlight module 120 can be determined by the summation of light guide base plate 121, transparent dielectric layer 123, reflection layer 125 and the light guide bed of material 127, in certain embodiments, the integral thickness of backlight module 120 is about 0.30mm to 0.32mm, that is the thickness range of backlight module 120 is [0.3mm, 0.32mm].The present invention owing to arranging the through hole 126 of corresponding keycap 103 on reflection layer 125, to arrange in pairs or groups again the light guide bed of material 127 that is arranged at below reflection layer 125, make the light that sends from light source 129 in through hole 126 position via the guiding directive first surface 121F of the light guide bed of material 127, making the position of corresponding through hole 126 on the first light face 121F have light injection, not needing to arrange traditional mask layer and the adhesive layer for mask layer and light guide plate being carried out binding again.In known illuminated keyboard, its backlight module is by mask layer, light guide plate and reflector plate, and the adhesion coating between these elements formed, the integral thickness of the backlight module of known illuminated keyboard is about 0.45mm to 0.5mm, the integral thickness of backlight module of the present invention then can be reduced by least about 40% compared to the backlight module of known illuminated keyboard, reaching under good light distribution condition, also can reduce the thickness of illuminated keyboard by this further, reaching the requirement of thinning.
Fig. 3 A to Fig. 3 E is the generalized section in each interstage of the backlight module 120 of the shop drawings 2 of foundation one embodiment of the invention.As shown in Figure 3A, first light guide base plate 121 is provided, as previously mentioned, light guide base plate 121 has first surface 121F, the second surface 121B contrary with first surface 121F and side 121S (label see in Fig. 1) of bright dipping for the material of light guide base plate 121 and thickness.
Refer to Fig. 3 B, the second surface 121B of light guide base plate 121 forms transparent dielectric layer 123, in one embodiment, transparent dielectric layer 123 can utilize coating process to be made up of optical cement, the thickness range of transparent dielectric layer 123 can be about 1 μm to about 2 μm, that is the thickness range of transparent dielectric layer 123 is [1 μm, 2 μm].In other embodiments, transparent dielectric layer 123 also can select refractive index be about 1.3 to about 1.5 other transparent dielectric materials, and utilize other processing procedure modes to be formed.
Refer to Fig. 3 C, reflection layer 125 is formed below transparent dielectric layer 123, in one embodiment, reflection layer 125 can utilize sputter (sputtering) processing procedure to be made from silver, the thickness range of reflection layer 125 can be about 0.1 μm to about 1 μm, that is the thickness range of reflection layer 125 is [0.1 μm, 1 μm].In other embodiments, reflection layer 125 also can be made up of aluminium, titanium, chromium or gold.
Refer to Fig. 3 D, form a plurality of through hole 126 running through reflection layer 125, in one embodiment, laser engraving (laser engraving) processing procedure 150 can be used, according to the some parts of predetermined pattern removing reflection layer 125, in reflection layer 125, form through hole 126 by this.In other embodiments, also can use other modes, such as micro-shadow and etch process, form through hole 126 in reflection layer 125, the associated description of the shape of through hole 126, setting position, area and distribution density as previously mentioned.According to embodiments of the invention, except through hole 126, upper surface and the transparent dielectric layer 123 of reflection layer 125 fit tightly.
Refer to Fig. 3 E, the light guide bed of material 127 is formed below reflection layer 125, and the some parts of the light guide bed of material 127 is filled with the through hole 126 in reflection layer 125, those parts being wherein filled in the light guide bed of material 127 in through hole 126 directly contact with transparent dielectric layer 123.In one embodiment, the light guide bed of material 127 can utilize printing (printing) processing procedure to be made up of light guide ink, the thickness of the light guide bed of material 127 can be about 5 μm to about 10 μm, that is the thickness range of the light guide bed of material 127 is [5 μm, 10 μm].
Afterwards, arrange light source 129 at the 121S place, side being adjacent to light guide base plate 121, to complete the backlight module 120 shown in Fig. 2, in certain embodiments, light source 129 is such as light-emittingdiode (LED).
According to embodiments of the invention, do not need to arrange mask layer and the mucigel for binding mask layer and light guide plate again, and carry out light guiding by the through hole structure arranging corresponding keycap on reflection layer, when obtaining good light and distributing, can also obtain integral thickness compared to known illuminated keyboard backlight module reduce at least about 40% slimming backlight module, allow the thickness of illuminated keyboard can thinning more by this, to meet the slimming demand of computer peripheral device.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art can make various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection range that all should belong to the claim appended by the present invention.
Claims (17)
1. a backlight module, is characterized in that comprising:
Light guide base plate, has for the first surface of bright dipping, side and the second surface contrary with this first surface;
Transparent dielectric layer, is arranged on this second surface of this light guide base plate;
Reflection layer, be arranged at below this transparent dielectric layer, this reflection layer has a plurality of through hole;
The light guide bed of material, is arranged at below this reflection layer, and the some of this light guide bed of material fills up this plurality of through hole of this reflection layer; And
Light source, this side being adjacent to this light guide base plate is arranged;
Wherein, light leads this first surface by this light guide bed of material filling up this plurality of through hole.
2. backlight module according to claim 1, is characterized in that: the refractive index of this transparent dielectric layer is 1.3 to 1.5.
3. backlight module according to claim 1, is characterized in that: the material of this transparent dielectric layer comprises optical cement, and the thickness of this transparent dielectric layer is 1 μm to 2 μm.
4. backlight module according to claim 1, it is characterized in that: the material of this light guide base plate comprises Merlon, polymethyl methacrylate, acryl resin or acrylonitrile-butadiene-styrene copolymer, and the thickness of this light guide base plate is 0.2mm to 0.3mm.
5. backlight module according to claim 1, is characterized in that: the material of this reflection layer comprises silver, aluminium, titanium, chromium or gold, and the thickness of this reflection layer is 0.1 μm to 1 μm.
6. backlight module according to claim 1, is characterized in that: the material of this light guide bed of material comprises light guide ink, and the thickness of this light guide bed of material is 5 μm to 10 μm.
7. backlight module according to claim 1, is characterized in that: a surface of this reflection layer fits tightly with this transparent dielectric layer, and this part of filling up this light guide bed of material in this plurality of through hole directly contacts with this transparent dielectric layer.
8. backlight module according to claim 1, it is characterized in that: this plurality of through hole comprises a plurality of point-like through hole, one of them comprising in semicircle, half elliptic and triangle of the section shape of this plurality of point-like through hole is planted, and is less than area away from the through hole of this light source and distribution density close to the area of the through hole of this light source and distribution density.
9. an illuminated keyboard, is characterized in that comprising:
Keypad portion; And
Backlight module as claimed in any of claims 1 to 8 in one of claims, this backlight module is arranged at below this keypad portion.
10. illuminated keyboard according to claim 9, it is characterized in that: this keypad portion comprises a plurality of Key element, each Key element comprises keycap, thin film switch, scissor supporting construction and flexible member, this thin film switch is arranged at below this keycap, this scissor supporting construction and this flexible member are all arranged between this keycap and this thin film switch, wherein this keycap has transparent area, the position of this plurality of through hole in this reflection layer of this backlight module corresponds to this keycap, and this transparent area of this keycap of light penetration that this backlight module sends.
The manufacture method of 11. 1 kinds of backlight modules, is characterized in that comprising:
There is provided light guide base plate, this light guide base plate has for the first surface of bright dipping, side and the second surface contrary with this first surface;
Form transparent dielectric layer on this second surface of this light guide base plate;
Form reflection layer below this transparent dielectric layer;
A plurality of through hole is formed in this reflection layer;
Form the light guide bed of material below this reflection layer, and the some of this light guide bed of material fills up this plurality of through hole of this reflection layer; And
This side being adjacent to this light guide base plate arranges light source;
Wherein, light leads this first surface by this light guide bed of material filling up this plurality of through hole.
The manufacture method of 12. backlight modules according to claim 11, is characterized in that: the material of this transparent dielectric layer comprises optical cement, and the step forming this transparent dielectric layer comprises coating process, and the thickness of this transparent dielectric layer is 1 μm to 2 μm.
The manufacture method of 13. backlight modules according to claim 11, is characterized in that: the material of this reflection layer comprises, aluminium, titanium, chromium or gold, and the step forming this reflection layer comprises sputter process, and the thickness of this reflection layer is 0.1 μm to 1 μm.
The manufacture method of 14. backlight modules according to claim 11, is characterized in that: the step forming this plurality of through hole in this reflection layer comprises use laser engraving processing procedure.
The manufacture method of 15. backlight modules according to claim 11, is characterized in that: the material of this light guide bed of material comprises light guide ink, and the step forming this light guide bed of material comprises printing process, and the thickness of this light guide bed of material is 5 μm to 10 μm.
The manufacture method of 16. backlight modules according to claim 11, it is characterized in that: a surface of this reflection layer fits tightly with this transparent dielectric layer, and this part of filling up this light guide bed of material of this plurality of through hole directly contacts with this transparent dielectric layer.
The manufacture method of 17. backlight modules according to claim 11, it is characterized in that: this plurality of through hole comprises a plurality of point-like through hole, the section shape of this plurality of point-like through hole comprise semicircle, half elliptic and leg-of-mutton one of them plant, and be greater than area close to the through hole of this light source and distribution density away from the area of the through hole of this light source and distribution density.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410589040.4A CN104409265A (en) | 2014-10-28 | 2014-10-28 | Backlight module, manufacture method of backlight module, and luminescence keyboard |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410589040.4A CN104409265A (en) | 2014-10-28 | 2014-10-28 | Backlight module, manufacture method of backlight module, and luminescence keyboard |
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| CN104409265A true CN104409265A (en) | 2015-03-11 |
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| CN201410589040.4A Pending CN104409265A (en) | 2014-10-28 | 2014-10-28 | Backlight module, manufacture method of backlight module, and luminescence keyboard |
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| Country | Link |
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| CN (1) | CN104409265A (en) |
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| CN105513870A (en) * | 2015-09-11 | 2016-04-20 | 苏州达方电子有限公司 | Backlight module applicable to keyboard and keyboard |
| CN111029198A (en) * | 2019-12-30 | 2020-04-17 | 冯杰 | Intelligent keyboard light guide film system |
| CN114415426A (en) * | 2022-02-17 | 2022-04-29 | 深圳创维－Rgb电子有限公司 | Mini LED module and display device thereof |
| CN114765098A (en) * | 2021-01-15 | 2022-07-19 | 精元电脑股份有限公司 | Backlight module for keyboard keys |
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| US20120318656A1 (en) * | 2011-06-17 | 2012-12-20 | Primax Electronics Ltd. | Membrane circuit board and luminous keyboard using same |
| TW201418803A (en) * | 2012-11-09 | 2014-05-16 | Darfon Electronics Corp | Light guide plate structure and light-guide-plate manufacturing method thereof |
| CN203631381U (en) * | 2013-12-11 | 2014-06-04 | 源曜光电股份有限公司 | Lighting module of lighting keyboard |
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| CN101853746A (en) * | 2009-04-02 | 2010-10-06 | 梁徽湖 | Luminous keyboard combining scissors bridging and light guide plate |
| US20120318656A1 (en) * | 2011-06-17 | 2012-12-20 | Primax Electronics Ltd. | Membrane circuit board and luminous keyboard using same |
| TW201418803A (en) * | 2012-11-09 | 2014-05-16 | Darfon Electronics Corp | Light guide plate structure and light-guide-plate manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105513870A (en) * | 2015-09-11 | 2016-04-20 | 苏州达方电子有限公司 | Backlight module applicable to keyboard and keyboard |
| CN105513870B (en) * | 2015-09-11 | 2017-07-28 | 苏州达方电子有限公司 | Suitable for the backlight module and keyboard of keyboard |
| CN111029198A (en) * | 2019-12-30 | 2020-04-17 | 冯杰 | Intelligent keyboard light guide film system |
| CN111029198B (en) * | 2019-12-30 | 2020-09-29 | 冯杰 | Intelligent keyboard light guide film system |
| CN114765098A (en) * | 2021-01-15 | 2022-07-19 | 精元电脑股份有限公司 | Backlight module for keyboard keys |
| CN114415426A (en) * | 2022-02-17 | 2022-04-29 | 深圳创维－Rgb电子有限公司 | Mini LED module and display device thereof |
| CN114415426B (en) * | 2022-02-17 | 2022-11-29 | 深圳创维－Rgb电子有限公司 | Mini LED module and display device thereof |
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